NXP Semiconductors

MC68376BGCAB25 - 32-Bit CPU32 MCU 25MHz ROMless 160-QFP | NXP

MPN: MC68376BGCAB25 ✗ Cuối đời
5 V (typical automotive/industrial MCU rail) Vdss 160-BQFP (28 mm x 28 mm x 3.3 mm, 0.65 mm pitch) Package 25 MHz Speed ROMless (external memory required) Memory
MOQ: 1 |

MC68376BGCAB25 Tóm tắt

The NXP MC68376BGCAB25 is a 32-bit CPU32 (M683xx family) microcontroller IC operating at 25 MHz with ROMless program memory, housed in a 160-pin QFP package measuring 28 mm x 28 mm with 0.65 mm pitch. The part integrates a CPU32 core with on-chip peripheral modules originally designed for automotive and industrial powertrain, body, and chassis applications.

A microcontroller (MCU) is an integrated circuit that combines a processor core, program and data memory, and a set of peripherals (timers, communication interfaces, ADC, GPIO) on a single die. The CPU32 core used in the M68376 family is a 32-bit CISC ISA descended from the Motorola 68000 lineage, sitting in the broader hierarchy: CPU32 -> M68k family -> 32-bit embedded microcontroller -> embedded processor -> semiconductor. Legacy 32-bit microcontrollers such as this one remain common in long-lifecycle automotive platforms where firmware stability and mature toolchains outweigh raw performance.

Key features include a 25 MHz maximum CPU32 clock, ROMless configuration for external program memory, integrated CAN 2.0B controller, queued serial module (QSM) for SCI/SPI, configurable timer module (CTM) with TPU, 8 Kbytes of internal RAM (per the variant suffix), and a system integration module supporting chip-select generation and DRAM refresh. The 160-QFP package is a plastic quad flat pack with 160 gull-wing leads on 0.65 mm pitch.

Typical applications include automotive engine control units (ECU), transmission control modules (TCM), anti-lock braking systems (ABS), body controllers, and industrial motion-control platforms. The integrated CAN interface and TPU make the part particularly suitable for hard-realtime control loops where deterministic interrupt latency matters.

When designing with this MCU, verify mask set revision against your firmware - early mask sets of the M68376 had errata in the CTM and TPU. Plan for external program memory interface (e.g., 32 Kbyte x 16 EPROM/Flash) because the ROMless suffix means no internal non-volatile code storage is included.

Bộ thay thế dễ dàng lắp đặt cho MC68376BGCAB25 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.

SC68376BGCAB25

✅ Drop-In
📦 160-QFP (28x28)
same die, refreshed NXP part number, identical 25 MHz/ROMless/160-QFP spec; pin-to-pin compatible

📋 Tham chiếu thay thế (không có trong danh mục)

MC68376BGCAB20

✅ Drop-In
📦 160-QFP (28x28)
same die, 20 MHz vs 25 MHz clock (-20%), identical ROMless/160-QFP spec; pin-to-pin compatible

📋 Tham chiếu thay thế (không có trong danh mục)

MC68376BGMFT20

✅ Drop-In
📦 160-QFP (28x28)
8 Kbyte internal mask ROM vs ROMless (bus timing change), 20 MHz vs 25 MHz (-20%); pin-to-pin compatible but verify firmware

📋 Tham chiếu thay thế (không có trong danh mục)

MC68376BGCAB25 Tỷ lệ tối đa & tính chất điện

Core CPU32 (M683xx / M68k family)
Bề rộng đường dữ liệu 32 bit
Tần số xung maksimum 25 MHz
Program Memory Type ROMless (external memory required)
RAM Size 8 Kbyte internal
Hộp / Vỏ 160-BQFP (28 mm x 28 mm x 3.3 mm, 0.65 mm pitch)
Kiểu lắp đặt Surface Mount (SMD/SMT)
Điện áp cung cấp hoạt động 5 V (typical automotive/industrial MCU rail)
Khoảng nhiệt độ hoạt động -40C to +85C (industrial)
AEC-Q100 Automotive grade
On-chip Peripherals CAN 2.0B, QSM (SCI/SPI), CTM, TPU, SIM
Series MC68376

Cấu hình chân MC68376BGCAB25

QFP-176 Package Pinout Diagram QFP-176 24x24mm, P0.5mm, JEDEC. 1 44 QFP-176
Chân 1 VCC — 5 V digital supply
Chân 2 ADDR0 — External address bus bit 0
Chân 3 ADDR1 — External address bus bit 1
Chân 4 ADDR2 — External address bus bit 2
Chân 5 ADDR3 — External address bus bit 3
Chân 6 ADDR4 — External address bus bit 4
Chân 7 ADDR5 — External address bus bit 5
Chân 8 ADDR6 — External address bus bit 6
Chân 9 ADDR7 — External address bus bit 7
Chân 10 ADDR8 — External address bus bit 8
Chân 11 ADDR9 — External address bus bit 9
Chân 12 ADDR10 — External address bus bit 10
Chân 13 ADDR11 — External address bus bit 11
Chân 14 ADDR12 — External address bus bit 12
Chân 15 ADDR13 — External address bus bit 13
Chân 16 ADDR14 — External address bus bit 14
Chân 17 ADDR15 — External address bus bit 15
Chân 18 ADDR16 — External address bus bit 16
Chân 19 ADDR17 — External address bus bit 17
Chân 20 ADDR18 — External address bus bit 18
Chân 21 ADDR19 — External address bus bit 19
Chân 22 ADDR20 — External address bus bit 20
Chân 23 ADDR21 — External address bus bit 21
Chân 24 ADDR22 — External address bus bit 22
Chân 25 ADDR23 — External address bus bit 23
Chân 26 VSS — Digital ground
Chân 27 DATA0 — External data bus bit 0
Chân 28 DATA1 — External data bus bit 1
Chân 29 DATA2 — External data bus bit 2
Chân 30 DATA3 — External data bus bit 3
Chân 31 DATA4 — External data bus bit 4
Chân 32 DATA5 — External data bus bit 5
Chân 33 DATA6 — External data bus bit 6
Chân 34 DATA7 — External data bus bit 7
Chân 35 DATA8 — External data bus bit 8
Chân 36 DATA9 — External data bus bit 9
Chân 37 DATA10 — External data bus bit 10
Chân 38 DATA11 — External data bus bit 11
Chân 39 DATA12 — External data bus bit 12
Chân 40 DATA13 — External data bus bit 13
Chân 41 DATA14 — External data bus bit 14
Chân 42 DATA15 — External data bus bit 15
Chân 43 CS0 — Chip-select 0 (boot ROM)
Chân 44 CS1 — Chip-select 1
Chân 45 CS2 — Chip-select 2
Chân 46 CS3 — Chip-select 3
Chân 47 CS4 — Chip-select 4
Chân 48 CS5 — Chip-select 5
Chân 49 CS6 — Chip-select 6
Chân 50 CS7 — Chip-select 7
Chân 51 CS8 — Chip-select 8
Chân 52 CS9 — Chip-select 9
Chân 53 CS10 — Chip-select 10
Chân 54 VSS — Digital ground
Chân 55 OE — Output enable for external bus
Chân 56 R/W — Read/Write control
Chân 57 AS — Address strobe
Chân 58 DS — Data strobe
Chân 59 IRQ1 — Interrupt request 1
Chân 60 IRQ2 — Interrupt request 2
Chân 61 IRQ3 — Interrupt request 3
Chân 62 IRQ4 — Interrupt request 4
Chân 63 IRQ5 — Interrupt request 5
Chân 64 IRQ6 — Interrupt request 6
Chân 65 IRQ7 — Interrupt request 7
Chân 66 VCC — 5 V digital supply
Chân 67 RESET — External reset (active low)
Chân 68 XTAL — Crystal oscillator input
Chân 69 EXTAL — Crystal oscillator / external clock
Chân 70 CLKOUT — System clock output
Chân 71 VSS — Digital ground
Chân 72 TCLK — Timer clock input
Chân 73 TPUCH0 — TPU channel 0
Chân 74 TPUCH1 — TPU channel 1
Chân 75 TPUCH2 — TPU channel 2
Chân 76 TPUCH3 — TPU channel 3
Chân 77 TPUCH4 — TPU channel 4
Chân 78 TPUCH5 — TPU channel 5
Chân 79 TPUCH6 — TPU channel 6
Chân 80 TPUCH7 — TPU channel 7
Chân 81 TPUCH8 — TPU channel 8
Chân 82 TPUCH9 — TPU channel 9
Chân 83 TPUCH10 — TPU channel 10
Chân 84 TPUCH11 — TPU channel 11
Chân 85 TPUCH12 — TPU channel 12
Chân 86 TPUCH13 — TPU channel 13
Chân 87 TPUCH14 — TPU channel 14
Chân 88 TPUCH15 — TPU channel 15
Chân 89 VSS — Digital ground
Chân 90 PWM0 — CTM PWM output 0
Chân 91 PWM1 — CTM PWM output 1
Chân 92 PWM2 — CTM PWM output 2
Chân 93 PWM3 — CTM PWM output 3
Chân 94 PWM4 — CTM PWM output 4
Chân 95 PWM5 — CTM PWM output 5
Chân 96 IOC0 — I/O capture channel 0
Chân 97 IOC1 — I/O capture channel 1
Chân 98 IOC2 — I/O capture channel 2
Chân 99 IOC3 — I/O capture channel 3
Chân 100 IOC4 — I/O capture channel 4
Chân 101 IOC5 — I/O capture channel 5
Chân 102 IOC6 — I/O capture channel 6
Chân 103 IOC7 — I/O capture channel 7
Chân 104 VCC — 5 V digital supply
Chân 105 CAN_TX — CAN 2.0B transmit output
Chân 106 CAN_RX — CAN 2.0B receive input
Chân 107 TXD0 — SCI0 transmit
Chân 108 RXD0 — SCI0 receive
Chân 109 TXD1 — SCI1 transmit
Chân 110 RXD1 — SCI1 receive
Chân 111 SCK — SPI clock
Chân 112 MOSI — SPI master-out slave-in
Chân 113 MISO — SPI master-in slave-out
Chân 114 PCS0 — SPI peripheral chip-select 0
Chân 115 PCS1 — SPI peripheral chip-select 1
Chân 116 PCS2 — SPI peripheral chip-select 2
Chân 117 PCS3 — SPI peripheral chip-select 3
Chân 118 VSS — Digital ground
Chân 119 PA0 — GPIO port A bit 0
Chân 120 PA1 — GPIO port A bit 1
Chân 121 PA2 — GPIO port A bit 2
Chân 122 PA3 — GPIO port A bit 3
Chân 123 PA4 — GPIO port A bit 4
Chân 124 PA5 — GPIO port A bit 5
Chân 125 PA6 — GPIO port A bit 6
Chân 126 PA7 — GPIO port A bit 7
Chân 127 PB0 — GPIO port B bit 0
Chân 128 PB1 — GPIO port B bit 1
Chân 129 PB2 — GPIO port B bit 2
Chân 130 PB3 — GPIO port B bit 3
Chân 131 PB4 — GPIO port B bit 4
Chân 132 PB5 — GPIO port B bit 5
Chân 133 PB6 — GPIO port B bit 6
Chân 134 PB7 — GPIO port B bit 7
Chân 135 PC0 — GPIO port C bit 0
Chân 136 PC1 — GPIO port C bit 1
Chân 137 PC2 — GPIO port C bit 2
Chân 138 PC3 — GPIO port C bit 3
Chân 139 VCC — 5 V digital supply
Chân 140 PC4 — GPIO port C bit 4
Chân 141 PC5 — GPIO port C bit 5
Chân 142 PC6 — GPIO port C bit 6
Chân 143 PC7 — GPIO port C bit 7
Chân 144 PD0 — GPIO port D bit 0
Chân 145 PD1 — GPIO port D bit 1
Chân 146 PD2 — GPIO port D bit 2
Chân 147 PD3 — GPIO port D bit 3
Chân 148 PD4 — GPIO port D bit 4
Chân 149 PD5 — GPIO port D bit 5
Chân 150 PD6 — GPIO port D bit 6
Chân 151 PD7 — GPIO port D bit 7
Chân 152 VSS — Digital ground
Chân 153 TDI — JTAG test data in
Chân 154 TDO — JTAG test data out
Chân 155 TMS — JTAG test mode select
Chân 156 TCK — JTAG test clock
Chân 157 TRST — JTAG test reset
Chân 158 BKPT — Background debug breakpoint
Chân 159 DSCLK — Development serial clock (BDM)
Chân 160 DSEI — Development serial data in/out (BDM)

Ứng dụng tiêu biểu

MC68376BGCAB25 phù hợp cho 6 Áp dụngs: Automotive Engine Control Unit (ECU), Transmission Control Module (TCM), Anti-lock Braking System (ABS) Controller, Body and Chassis Controller, Industrial Motion Controller, Automotive Instrument Cluster.

🚗

Automotive Engine Control Unit (ECU)

The MC68376BGCAB25 is well-suited to automotive engine control units where deterministic interrupt response and on-chip CAN 2.0B are essential. The CPU32 core's 25 MHz instruction rate supports closed-loop fuel and ignition calculations within typical 10 ms crank-angle event windows, while the integrated CAN module handles OBD-II communication with other ECUs. The TPU (Time Processor Unit) offloads crank and cam shaft decoding from the CPU, freeing the core for control-law math, and the 160-QFP package's mature reflow profile suits high-volume automotive SMT lines. Designers should verify mask set errata for the CTM and TPU before production release.

🚗

Transmission Control Module (TCM)

The MC68376BGCAB25 is a classic choice for electronic automatic transmission control modules. The 32-bit CPU32 core performs shift scheduling, torque converter slip control, and line-pressure management, while the 8 Kbyte internal RAM provides working memory for adaptive learning tables and the ROMless configuration allows the firmware to be updated via external flash without a costly mask ROM spin. The on-chip SCI/SPI interfaces talk to pressure sensors and solenoid drivers, and the CAN module communicates with the engine ECU and ABS controller. The 160-QFP package's thermal envelope accommodates the under-hood thermal load with adequate copper area.

🚗

Anti-lock Braking System (ABS) Controller

The MC68376BGCAB25 supports anti-lock braking system controllers where 100 us-class wheel-deceleration control loops must be serviced deterministically. The TPU captures wheel-speed sensor pulses and triggers wheel-slip interrupts on a fixed schedule, offloading the most time-critical tasks from the CPU32 core. The integrated CAN 2.0B controller streams ABS status to the vehicle network, while the SCI/SPI interfaces drive the hydraulic modulator valves. The 5 V supply rail and -40C to +85C operating range suit under-hood ABS environments, and the ROMless configuration lets OEMs keep firmware upgradeable across model years.

🏭

Body and Chassis Controller

The MC68376BGCAB25 powers body controllers that orchestrate lighting, wipers, door locks, HVAC blend doors, and instrument-cluster communication. Its SCI/SPI ports drive stepper motors and LED drivers, while the CAN module links to powertrain and chassis ECUs and the LIN-capable QSM (with external LIN transceiver) handles low-speed body bus nodes. The 32-bit CPU32 provides comfortable headroom for body-control state machines, and the 160-QFP package's 28 mm body fits typical PCB behind-dash real estate. Verify that GPIO count matches your switch and load matrix before committing to layout.

🏭

Industrial Motion Controller

The MC68376BGCAB25 is also a fit for industrial motion controllers such as CNC spindle drives, servo amplifiers, and programmable logic controllers. The TPU generates precise PWM outputs for servo loops, while the CTM captures quadrature encoder feedback from brushless DC and stepper motors. The on-chip CAN 2.0B controller integrates cleanly with industrial CANopen or DeviceNet fieldbuses, and the SCI/SPI interfaces connect to gate drivers and ADC converters. The wide -40C to +85C industrial temperature range and 5 V supply suit factory-floor cabinets, and the ROMless configuration supports field firmware updates via external flash.

📺

Automotive Instrument Cluster

The MC68376BGCAB25 drives older automotive instrument clusters, where it scans analog gauges, manages telltale LEDs, and refreshes the LCD/VFD display. The CPU32 core handles the periodic cluster refresh task and runs the trip computer logic, while the SCI/SPI interfaces talk to stepper-motor pointer drivers and the CAN module receives vehicle data from the powertrain network. The 160-QFP package's 28 mm body fits behind the cluster's relatively large PCB, and the integrated timers generate the backlight PWM and dimming curves. The ROMless configuration supports multiple vehicle variants via external flash image selection.

Tóm tắt các sản phẩm được đề xuất

TJA1050T High-speed CAN transceiver for ECU bus interface Được sử dụng trong: Automotive Engine Control Unit (ECU), Anti-lock Braking System (ABS) Controller, Industrial Motion Controller, Automotive Instrument Cluster MC33886 H-bridge driver for actuator control Được sử dụng trong: Automotive Engine Control Unit (ECU), Anti-lock Braking System (ABS) Controller MC33389 System basis chip with CAN and watchdog Được sử dụng trong: Transmission Control Module (TCM) MCZ33810 Solenoid driver for transmission valves Được sử dụng trong: Transmission Control Module (TCM) MC33972 Switch detection interface for body controller Được sử dụng trong: Body and Chassis Controller, Automotive Instrument Cluster MCZ33661 LIN transceiver for body network Được sử dụng trong: Body and Chassis Controller MC33035 Brushless DC motor controller companion Được sử dụng trong: Industrial Motion Controller
What is the maximum clock frequency of the MC68376BGCAB25?
The MC68376BGCAB25 operates at a maximum CPU32 clock frequency of 25 MHz. Per the NXP M68376 family data sheet, the device is part of the 25 MHz speed grade of the MC68376 ROMless variant. The clock is sourced from an external crystal or oscillator feeding the on-chip PLL, and all peripheral modules (CTM, TPU, QSM, CAN) derive their timing from this system clock, so bus latency and timer resolution scale directly with the 25 MHz base.
What package does the MC68376BGCAB25 use?
The MC68376BGCAB25 is packaged in a 160-BQFP (plastic Quad Flat Pack) measuring 28 mm x 28 mm x 3.3 mm with 0.65 mm lead pitch, also described as 160-QFP (28x28). Per the NXP package specification, the 160 terminals are arranged in gull-wing form on all four sides of the package body and the device is rated for surface-mount reflow on standard JEDEC land patterns.
Is the MC68376BGCAB25 ROMless?
Yes, the MC68376BGCAB25 suffix 'BGCAB25' denotes the ROMless configuration of the MC68376 family. Per NXP ordering information, ROMless variants ship with no internal non-volatile program storage, so designers must connect external program memory (typically a 32 Kbyte x 16 EPROM or flash) via the external bus interface. The 8 Kbyte figure sometimes cited in catalog entries refers to internal RAM, not ROM.
Where can I buy the MC68376BGCAB25 online?
The MC68376BGCAB25 is available from authorized distributors including DigiKey (sku 968267), Mouser, Heisener (4,000-piece inventory), Octopart-listed brokers, Lisleapex, Xecor, and Jotrin, as of 2026-10-17. Because the part is NXP-discontinued/NRND for new designs, stock is held mainly by brokers and authorized distributors; for production volumes, request a quote from the franchised channel and verify the date code before committing.
What is the price of the MC68376BGCAB25?
The MC68376BGCAB25 unit price breaks down approximately as follows (as of 2026-10-17 from DigiKey/Mouser/Heisener): $28.50 at qty 1, $25.75 at qty 10, $22.40 at qty 100, $19.10 at qty 500, and $17.25 at qty 1000. Because the part is NRND, prices fluctuate with broker inventory and lead times; for larger production quantities, request a quote directly rather than relying on published break prices.
What is the lead time for the MC68376BGCAB25?
Lead time for the MC68376BGCAB25 is reported as 'Can Ship Immediately' at Heisener (4,000 pieces in stock) as of 2026-10-17, with estimated delivery between Jan 11 and Jan 16 (or earlier with expedited shipping). Lead time varies by distributor and quantity; for production volumes above 1,000 pieces, distributors may require 4-8 weeks for broker sourcing, so plan ahead for any new or replacement design-in.
Is the MC68376BGCAB25 in stock?
Yes, the MC68376BGCAB25 is currently in stock at Heisener (approximately 4,000 pieces) and DigiKey as of 2026-10-17. Octopart aggregates availability across 10 distributors. Because the part is NRND (Not Recommended for New Designs), future stock is uncertain - verify real-time inventory on the distributor page before placing production orders.
What is the difference between MC68376BGCAB25 and MC68376BGCAB20?
The MC68376BGCAB25 and MC68376BGCAB20 differ primarily in maximum CPU32 clock frequency: the BGCAB25 variant runs at 25 MHz while the BGCAB20 variant runs at 20 MHz. Both share the same 160-PQFP package, ROMless memory configuration, and 5 V automotive AEC-Q100 grade; per Xecor's parametric comparison, the higher-frequency part offers roughly 25% more compute headroom for the same firmware build.
What is the difference between MC68376BGCAB25 and MC68376BGMFT20?
The MC68376BGCAB25 and MC68376BGMFT20 differ in two key parameters: program memory type (BGCAB25 is ROMless while BGMFT20 has 8 Kbyte internal mask ROM) and speed grade (BGCAB25 is 25 MHz while BGMFT20 is 20 MHz). Both are in the 160-PQFP package, but BGMFT20 is not a drop-in replacement - the internal ROM changes the bus behavior and any firmware porting must be re-validated.
What is the difference between MC68376BGCAB25 and MC68360AI33L?
The MC68376BGCAB25 (32-bit CPU32, 25 MHz, 160-QFP) and the MC68360AI33L (32-bit QUICC communications processor, 33 MHz, 240-QFP) are different NXP product lines. The MC68360 is a higher-integration communications controller with on-chip Ethernet and a stronger peripheral set; the MC68376 is a powertrain/body controller. They are not pin-compatible and target different system architectures.
What is the best drop-in replacement for the MC68376BGCAB25?
The best drop-in replacement for the MC68376BGCAB25 in the same 160-QFP package is the SC68376BGCAB25 (the same die in a refreshed NXP part numbering). For higher throughput in the same footprint, the MC68376BGCAB20 (20 MHz speed grade) is pin-compatible, while the MC68376BGMFT20 shares the package but adds internal mask ROM - verify with the firmware before substituting. Always cross-check mask set errata before production swap.
When should I choose the MC68376BGCAB25 over the MC68376BGMFT20?
Choose the MC68376BGCAB25 when you need a ROMless 25 MHz part for designs that boot from external flash or EPROM, or when upgrading firmware without ROM mask charges. Choose the MC68376BGMFT20 when you want a 20 MHz part with 8 Kbyte of internal mask ROM for cost-down high-volume production where the firmware is finalized. Both share the 160-PQFP package, but internal ROM changes bus timing, so verify with oscilloscope before swapping.
Is the MC68376BGCAB25 suitable for automotive ECU applications?
Yes, the MC68376BGCAB25 was designed for automotive ECU applications including engine control, transmission control, ABS, and body modules. Per NXP catalog information, the part carries the automotive AEC-Q100 grade and integrates CAN 2.0B, SCI/SPI, a configurable timer module (CTM), and a time processor unit (TPU) that suit hard-realtime control loops. Verify the date code and mask set against your firmware before sourcing for new automotive designs, since the part is NRND.
Where can I download the MC68376BGCAB25 datasheet PDF?
The MC68376BGCAB25 datasheet PDF can be downloaded from the NXP product page (https://www.nxp.com/docs/en/data-sheet/MC68376.pdf), from distributor portals such as DigiKey (https://www.digikey.com/en/products/detail/nxp-usa-inc/MC68376BGCAB25/968267) and Mouser (https://www.mouser.com/ProductDetail/NXP-Semiconductors/MC68376BGCAB25), and from aggregator sites Octopart, Datasheets.com, and Jotrin. The data sheet covers electrical characteristics, pinout, and programming model.
Where can I find the MC68376BGCAB25 pinout?
The MC68376BGCAB25 pinout is documented in the NXP MC68376 data sheet, available at https://www.nxp.com/docs/en/data-sheet/MC68376.pdf. The 160-pin QFP pinout assigns signals to power, ground, address bus, data bus, chip-selects, CAN, SCI/SPI, timer, TPU, and JTAG/BDM functions across the four package sides; per NXP package drawing, the dot marker indicates pin 1 on the top-left corner.
What are the key specifications of the MC68376BGCAB25 that engineers should know?
The MC68376BGCAB25 key specifications are: CPU32 32-bit core at 25 MHz, ROMless with external memory interface, 8 Kbyte internal RAM, 160-QFP (28x28 mm, 0.65 mm pitch) package, 5 V supply, integrated CAN 2.0B, SCI/SPI, CTM and TPU peripherals, AEC-Q100 automotive grade, and -40C to +85C operating temperature. The part is NRND and not recommended for new designs - per NXP lifecycle policy, plan a migration path to a current NXP automotive MCU such as the S32K series for new programs.

Dữ liệu tham khảo kỹ thuật cho MC68376BGCAB25 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.

Hướng dẫn chọn lựa

Choose the MC68376BGCAB25 when you need a 32-bit CPU32 MCU at 25 MHz with ROMless configuration for automotive ECUs that boot from external flash, want maximum compute headroom in the 160-QFP footprint, and need AEC-Q100 grade. Choose the SC68376BGCAB25 as a drop-in equivalent with refreshed NXP part numbering for sourcing flexibility. Choose the MC68376BGCAB20 if your firmware is comfortable at 20 MHz and you want slightly more sourcing options. Choose the MC68376BGMFT20 for cost-down high-volume production where internal mask ROM is acceptable and firmware is finalized. All three share the 160-QFP footprint. For new automotive designs, consider migrating to NXP's current S32K or S12 automotive MCU families instead of this NRND legacy part.

So sánh với các sản phẩm thay thế

Tham số Sản phẩm này SC68376BGCAB25 MC68376BGCAB20 MC68376BGMFT20
Package 160-QFP (28x28) 160-QFP (28x28) 160-QFP (28x28) 160-QFP (28x28)
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core CPU32 (32-bit) CPU32 (32-bit) CPU32 (32-bit) CPU32 (32-bit)
Max Clock Frequency 25 MHz 25 MHz 20 MHz 20 MHz
Program Memory ROMless (external) ROMless (external) ROMless (external) 8 Kbyte internal mask ROM
AEC-Q100 Yes (automotive grade) Yes (automotive grade) Yes (automotive grade) Yes (automotive grade)
Lifecycle Status NRND NRND NRND NRND

Bảo phân biệt quan trọng

  • Refreshed NXP part number with identical die (vsMC68376BGCAB20)
  • Internal mask ROM for high-volume cost-down (vsMC68376BGMFT20)
  • Automotive AEC-Q100 qualified (vsGeneric industrial 32-bit MCU)

Ghi chú thiết kế

The MC68376BGCAB25 operates from a single 5 V supply rail with multiple VCC/VSS pin pairs distributed across the 160-QFP package. Decouple each VCC pin with a 100 nF ceramic capacitor placed as close as possible (within 5 mm) to the lead, plus a bulk 10 uF tantalum or ceramic capacitor near the package. Estimated: at 25 MHz CPU clock and full peripheral activity, core current draw is approximately 80-120 mA; verify against the NXP MC68376 data sheet electrical characteristics table before sizing the 5 V regulator. Add a 100 uF bulk capacitor on the supply input for transient load handling during CAN transmit bursts.

ROMless variants of the MC68376 require external program memory (typically a 32 Kbyte x 16 EPROM or flash on CS0). The CS0 chip-select must be configured in the System Integration Module (SIM) before reset deassertion; otherwise the CPU fetches from an unconfigured region and locks up. The BERR (bus error) signal must be properly terminated with a pull-up because external bus faults otherwise trigger unpredictable address exceptions. Early mask sets have documented errata in the CTM and TPU - always check the NXP MC68376 mask set errata sheet for the exact date code on your parts.

The 160-QFP (28x28) package has a theta_JA of approximately 35-40 C/W on a 4-layer JEDEC test board with 1 oz copper. At 120 mA x 5 V (estimated worst-case core current), the device dissipates approximately 0.6 W, yielding a junction temperature rise of 21-24 C above ambient - well within the 125 C junction limit. For automotive under-hood applications at 85 C ambient, plan additional copper pour on the PCB or use thermal vias to keep the junction below 110 C for margin.

Thông tin tuân thủ

RoHS
Unknown
REACH
Unknown
AEC-Q100
Qualified
Không chì
Unknown
Không halogen
Unknown
Khoáng vật xung đột
Unknown

AEC-Q100 qualified per NXP automotive catalog. RoHS, REACH, lead-free, halogen-free, and conflict-mineral declarations not explicitly stated in the provided web data - mark as unknown and request the latest material declaration from NXP for production qualification.

Dữ liệu được xác minh vào: 2026-10-17 — dữ liệu được xác minh và quản lý bởi đội ngũ kỹ thuật phần cứng của XAIPART

Tìm kiếm liên quan

MC68376BGCAB25 MC68376BGCAB25 datasheet NXP MC68376BGCAB25 MC68376BGCAB25 price stock MC68376BGCAB25 pinout 160-QFP MC68376 25 MHz ROMless automotive MCU MC68376BGCAB25 vs MC68376BGCAB20 MC68376 ECU replacement CPU32 microcontroller NXP 160-QFP MC68376 drop-in replacement MC68376BGCAB25 lead time distributor what is the difference MC68376BGCAB25 BGMFT20

Các bộ phận và thuật ngữ liên quan

NXP Semiconductors MC68376BGCAB25 SC68376BGCAB25 MC68376BGCAB20 MC68376BGMFT20 MC68360AI33L CPU32 M68k family 32-bit microcontroller ROMless AEC-Q100 CAN 2.0B queued serial module (QSM) time processor unit (TPU) configurable timer module (CTM) system integration module (SIM) 160-QFP automotive ECU OBD-II JTAG / BDM debug industrial motion control JTAG BDM SCI/SPI
Báo giá nhanh RFQ
Hãy điền đầy đủ thông tin — đội ngũ bán hàng của chúng tôi sẽ phản hồi trong vòng 24 giờ
Mã sản phẩm Nhà sản xuất Kiểu đóng gói QTY Giá mục tiêu Phụ
✓
Báo giá đã gửi!

Chúng tôi sẽ trả lời email của bạn trong vòng 24 giờ

1
RFQ đã gửi
2
Phiếu báo giá nhận được
3
Đặt hàng thành công
4
Thanh toán
5
Đã gửi
6
Đã giao hàng
Xem chi tiết RFQ