10AS066K3F35I2LG - Arria 10 SX SoC FPGA 660K LE 1152-FCBGA | Intel
部品番号: 10AS066K3F35I2LG ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $5302.94 | $5,302.94 |
| 10 | $4772.65 | $47,726.50 |
| 100 | $4242.35 | $424,235.00 |
| 500 | $3977.21 | $1,988,605.00 |
| 1,000 | $3712.06 | $3,712,060.00 |
10AS066K3F35I2LG 概要
What is an SoC FPGA? A System-on-Chip FPGA is a hybrid device that integrates a microprocessor subsystem (typically ARM Cortex-A) with programmable logic on a single die. The hierarchy runs: SoC FPGA -> FPGA & SoC -> programmable logic + processor -> semiconductor. SoC FPGAs accelerate parallel DSP/IO workloads in the FPGA fabric while running OS and control stacks (Linux, RTOS) on the hard CPU cores, eliminating the need for a discrete host processor and reducing board area, latency, and BOM cost in embedded designs.
Key differentiating specifications include 660K logic elements, integrated transceivers up to 28.05 Gbps, 1.5 GHz dual-core ARM Cortex-A9 MPCore, hard memory controllers, and PCIe Gen3 hard IP. The F35 package variant uses Intel's flip-chip BGA technology with 35x35mm body, optimized for high-speed serial link signal integrity at multi-gigabit rates. Power architecture targets mid-range compute workloads below the highest-end Arria 10 GX 115 variants.
The Arria 10 architecture separates the FPGA fabric and HPS into independent power domains, enabling power gating of unused cores. Per Intel documentation, the HPS supports DDR4/DDR3/LPDDR3 with hardware ECC, dual GbE MAC, USB OTG, NAND/NOR flash controllers, and CoreSight debug. The FPGA fabric includes 20nm adaptive logic modules (ALMs), M20K block memory, and variable-precision DSP blocks supporting IEEE 754 single-precision floating point at >1 TFLOPS for the 660K variant.
Typical applications include wireless baseband processing (5G/LTE small cells, RRH), radar and electronic warfare signal processing, medical imaging pipelines (ultrasound beamforming, CT reconstruction), industrial machine vision, broadcast video processing, and military/aerospace secure communications. The HPS accelerates ARM-targeted workloads (protocol stacks, security, OS) while the FPGA fabric handles latency-critical DSP.
When designing with this device, plan the PCB for the F35 BGA escape routing, supply at least 0.9V/1.0V/1.8V/2.5V/3.3V rails, and use Intel's Quartus Prime toolchain for synthesis, place-and-route, and HPS firmware development (DS-5, SoC EDS). Thermal design is critical: estimate 25-45W typical SoC FPGA dissipation depending on logic utilization and transceiver activity.
This page synthesizes distributor pricing, F35 package drop-in alternatives within the Arria 10 SX family, and practical PCB/HPS design notes not consolidated on any single manufacturer page.
ドロップイン代替品: 10AS066K3F35I2LG — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: 10AS066K3F35I2LG （同一形状・フットプリント） — 相違点: Package, Speed Grade, Mounting Type, Process Node, Logic Elements.
クイック比較ツール — 並列比較する代替部品を選択:
10AS066K3F35I2SG
✅ ドロップイン✓ 在庫あり
$3405 / 個
データシートを見る →10AS066K3F35E2LG
✅ ドロップイン✓ 在庫あり
$2310 / 個
データシートを見る →10AS066K3F35E2SG
✅ ドロップイン✓ 在庫あり
$2950 / 個
データシートを見る →10AS066K2F35I2LG
✅ ドロップイン✓ 在庫あり
$5650.15 / 個
データシートを見る →10AS066K2F35I2SG
✅ ドロップイン✓ 在庫あり
$5750 / 個
データシートを見る →10AS066K2F35E2SG
✅ ドロップイン✓ 在庫あり
$2890 / 個
データシートを見る →10AS066K2F35E2LG
✅ ドロップイン✓ 在庫あり
$3360 / 個
データシートを見る →10AS066K3F35I2LG 最大定格＆電気的特性
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 660,000 |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| HPS Clock Speed | 1.5 GHz |
| パッケージ | 1152-ball FCBGA (F35), 35x35 mm |
| Process Node | TSMC 20 nm |
| 動作温度 | -40C to +100C (Industrial) |
| Speed Grade | K3 (mid-speed) |
| Logic Voltage | 0.9 V core |
| Transceiver Data Rate (max) | 28.05 Gbps |
| PCIe Hard IP | PCIe Gen3 x8 hard IP |
| External Memory Support | DDR4, DDR3, LPDDR3, QDR IV, RLDRAM III |
| RoHS ステータス | Compliant |
| 実装タイプ | Surface Mount (FCBGA) |
10AS066K3F35I2LG 1152-ball fcbga (f35), 35x35 mm ピン配置ガイド
10AS066K3F35I2LG (1152-ball fcbga (f35), 35x35 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: 10AS066K3F35I2LG.
詳細は データシート をご参照ください。
主な用途
10AS066K3F35I2LG の用途: 6 件s: 5G/LTE Wireless Baseband Processing, Radar and Electronic Warfare Signal Processing, Medical Imaging and Ultrasound Beamforming, Industrial Machine Vision and Inspection, Broadcast Video Processing and Encoding, Military Secure Communications and SDR.
5G/LTE Wireless Baseband Processing
The 10AS066K3F35I2LG's 660K logic elements combined with variable-precision DSP blocks exceed 1 TFLOPS single-precision throughput, making it ideal for 5G small-cell and LTE baseband processing where latency-sensitive PHY-layer operations must complete within microsecond budgets. The dual-core ARM Cortex-A9 HPS at 1.5 GHz runs the MAC scheduler, RRC protocol stack, and OAM telemetry, freeing the FPGA fabric for turbo decoding, FFT/iFFT, and channel estimation. The 28.05 Gbps transceivers support CPRI and eCPRI fronthaul links common in C-RAN radio architectures, eliminating external PHY chips. Place-and-route timing typically closes at 300-400 MHz on DSP-heavy paths in the K3 mid-speed grade.
おすすめ
Radar and Electronic Warfare Signal Processing
The 10AS066K3F35I2LG delivers the computational density required for phased-array radar beamforming, pulse compression, and Doppler processing at sub-microsecond latencies. Its 28.05 Gbps transceivers stream ADC samples directly into the FPGA fabric, while the variable-precision DSP blocks perform complex FFTs and matched filtering in real time. The ARM Cortex-A9 HPS handles track management, target classification, and Ethernet/1553 interfaces to higher-level command systems. For electronic warfare applications, the wide FPGA fabric enables simultaneous multiband digital down-conversion and threat-signal characterization within a single SoC, reducing board area and BOM versus discrete architectures.
おすすめ
Medical Imaging and Ultrasound Beamforming
The 10AS066K3F35I2LG is widely deployed in ultrasound beamforming carts and portable imaging systems because its 660K logic elements and high-speed DSP throughput align with 64-256 channel beamformer pipelines. The HPS runs the user interface, DICOM stack, and patient database connectivity, while the FPGA fabric handles receive-side delay-and-sum beamforming at kHz channel-update rates. The 1.5 GHz Cortex-A9 cores accelerate post-processing algorithms (speckle reduction, harmonic imaging) and JPEG2000 compression for archival. Industrial temperature grade and RoHS compliance make it suitable for clinical equipment requiring long product lifecycles.
おすすめ
Industrial Machine Vision and Inspection
In factory-floor inspection systems, the 10AS066K3F35I2LG's parallel fabric accelerates image preprocessing (filtering, edge detection, FFT-based texture analysis) at line-rate speeds while the ARM Cortex-A9 HPS coordinates with PLCs via EtherCAT or PROFINET, manages the inspection database, and runs anomaly-detection machine-learning inference. The PCIe Gen3 x8 hard IP interfaces to frame grabbers or CoaXPress cameras, and the DDR4 controller handles multi-megapixel image buffering. Industrial temperature grade (-40C to +100C) ensures reliable operation in unconditioned factory environments with thermal cycling and vibration.
おすすめ
Broadcast Video Processing and Encoding
The 10AS066K3F35I2LG powers broadcast-grade video processing appliances for HEVC/H.265 encoding, deinterlacing, color-space conversion, and SDI/HDMI/DisplayPort bridging. The FPGA fabric handles real-time video pipelines at 4K60 resolutions, while the HPS runs the web management interface, REST API, and stream multiplexing logic. The 28.05 Gbps transceivers support 12G-SDI for uncompressed 4K video transport, eliminating external serializer/deserializer chips. Broadcast deployments benefit from long Arria 10 product lifecycle support and Intel's FPGA toolchain stability for professional video workflows.
おすすめ
Military Secure Communications and SDR
The 10AS066K3F35I2LG integrates programmable logic with a hard ARM Cortex-A9 HPS, making it suitable for software-defined radio platforms running encryption, waveform processing, and protocol stacks in tactical communication systems. The wide FPGA fabric supports wideband channelization, polyphase filter banks, and cryptographic accelerators, while the HPS handles key management and secure boot. The 28.05 Gbps transceivers cover L-band through Ku-band IF sampling and high-speed ADC/DAC interfacing. Industrial temperature grade and long product lifecycle support meet MIL-STD-810G environmental requirements for deployed military systems.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: 10AS066K3F35I2LG — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | 10AS066K3F35I2SG | 10AS066K3F35E2LG | 10AS066K3F35E2SG | 10AS066K2F35I2LG | 10AS066K2F35I2SG |
|---|---|---|---|---|---|---|
| Package | 1152-FCBGA (F35, 35x35 mm) | 1152-FCBGA (F35, 35x35 mm) - same | 1152-FCBGA (F35, 35x35 mm) - same | 1152-FCBGA (F35, 35x35 mm) - same | 1152-FCBGA (F35, 35x35 mm) - same | 1152-FCBGA (F35, 35x35 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 |
| HPS Clock Speed | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.0 GHz (K2 speed grade) | 1.0 GHz (K2 speed grade) |
| Speed Grade | K3 (mid) | K3 | K3 + E2 sub-grade | K3 + E2 sub-grade | K2 (slower) | K2 (slower) |
| Operating Temperature | Industrial -40C to +100C | Commercial 0C to +85C | Industrial -40C to +100C | Commercial 0C to +85C | Industrial -40C to +100C | Commercial 0C to +85C |
| Transceiver Rate | 28.05 Gbps | 28.05 Gbps | 28.05 Gbps | 28.05 Gbps | 28.05 Gbps | 28.05 Gbps |
| Process Node | TSMC 20 nm | TSMC 20 nm | TSMC 20 nm | TSMC 20 nm | TSMC 20 nm | TSMC 20 nm |
主な差別化要因
- Highest-density Arria 10 SX SoC in F35 package with mid-speed K3 grade （vs 10AS066H3F34I2LG)
- Industrial temperature grade with full RoHS/lead-free compliance （vs 10AS066K3F35I2SG)
- F35 1152-FCBGA package optimized for 28 Gbps transceiver signal integrity （vs 10AS066K2F35I2LG (K2 speed grade))
設計ノート
Estimated: Arria 10 SX SoC FPGAs at 660K LE with active transceivers typically dissipate 25-45 W depending on logic utilization, transceiver lane count, and toggle rate. The F35 1152-ball FCBGA exposes a thermal pad requiring an enclosure-top heatsink or board-mounted heat spreader; per Intel Arria 10 thermal guidelines theta_JA is approximately 0.8-1.5 C/W with optimal thermal interface material. Designers must perform application-specific thermal simulation using the Arria 10 PowerPlay early power estimator before committing to PCB stack-up and cooling solution.
The 1152-ball F35 FCBGA requires a high-density PCB stack-up with microvia build-up layers (typically 8-12 layers). Per Intel's Arria 10 pin connection guidelines, route at least 4 PCB layers for the core fabric power rails (0.9V VCC, 1.0V VCCPT), 2-3 layers for transceiver supply filtering, and keep DDR4/3 memory traces length-matched within 25 mils for the HPS hard memory controller. Use 1-oz copper on outer layers and 0.5-oz on inner layers with low-Dk/Df materials for transceiver signal integrity at 28 Gbps.
Common pitfalls when designing with the 10AS066K3F35I2LG include: (1) omitting the HPS reset sequencing - the HPS cold/warm reset pins must follow Intel's recommended sequence with proper POR delay; (2) leaving JTAG chain shared between HPS and FPGA fabric without configuring MSEL pins correctly for the desired boot mode; (3) underestimating power rail sequencing - VCCIO for HPS must ramp before VCC_HPS; (4) using the wrong Quartus Prime device family variant - always select 10AS066K3F35 specifically to ensure pinout correctness in the Fitter.
Per Intel's Arria 10 SX SoC design guidelines, HPS DDR traces must be routed on inner stripline layers with reference planes intact and length-matched within 0.5 ps skew per byte lane. Transceiver channels should follow Intel's recommended pad-out with continuous ground reference beneath the trace and no signal crossovers in adjacent layers. Decoupling capacitor placement must follow the Quartus Prime early pinout-assignment capacitor recommendations: 0402/0201 ceramics within 100 mils of each power pin, bulk capacitors on each rail distributed across the BGA footprint perimeter.
コンプライアンス情報
RoHS compliant per Altera/Intel product page (LG suffix indicates lead-free, RoHS-compliant industrial grade). AEC-Q100 is not applicable for SoC FPGAs. Conflict minerals compliance per Intel's Conflict-Free Smelter Program disclosures.
