5CGXBC9E7F35C8N - Cyclone V GX FPGA, 301K LE, 1152-BGA | Intel
料号： 5CGXBC9E7F35C8N ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $640.74 | $640.74 |
| 10 | $615.5 | $6,155.00 |
| 25 | $595.2 | $14,880.00 |
| 50 | $575.8 | $28,790.00 |
| 100 | $555.1 | $55,510.00 |
5CGXBC9E7F35C8N 概述
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that can be reconfigured after manufacturing to implement custom digital circuits. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) -> programmable logic -> digital integrated circuits -> semiconductors, offering parallel processing and flexible I/O that microcontrollers and ASICs cannot match at low-to-mid volumes.
Key features of the 5CGXBC9E7F35C8N include 9 full-duplex transceivers supporting CPRI, PCIe Gen1, and Gigabit Ethernet protocols, variable-precision DSP blocks for high-performance fixed- and floating-point arithmetic, and hard memory controllers supporting DDR3, DDR2, and LPDDR2 interfaces. The 'C8N' speed grade indicates an 8 ns commercial 0.85V core voltage; the 'N' suffix indicates lead-free / Pb-free termination.
The Cyclone V GX architecture combines an FPGA fabric with hardened PCIe Gen1/Gen2 and transceiver IP, providing lower power and lower BOM cost versus soft-IP implementations. The 1152-BGA package provides ample signal escape for high-pin-count designs while supporting industrial-grade thermal envelopes.
Typical applications include industrial machine vision and video processing, motor control and industrial automation, broadcast video and Pro-AV equipment, wireless backhaul and small-cell baseband, and PCIe Gen2 endpoint cards for industrial computing.
When designing with this FPGA, ensure the Quartus Prime toolchain version matches the silicon revision; pay attention to transceiver reference clock jitter and PCB-controlled-impedance routing for 3.125 Gbps SERDES channels.
This page synthesizes distributor pricing, drop-in alternatives from the Cyclone V family, and practical design notes not found in the manufacturer datasheet alone.
直接替换替代料： 5CGXBC9E7F35C8N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 5CGXBC9E7F35C8N （相同外形与封装尺寸） ——差异在于 Package, Family, Logic Elements, Core Voltage, Operating Temperature.
快速对比工具——选择替代料号进行并排对比：
5CGXBC9E7F35C7N
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
5CGXBC9E7F35C6N
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
5CGXBC9E7F35I8N
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
5CGXBC9E7F35A7N
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
5CGXBC9E6F35C8N
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
5CGXBC9E7F35C8N 最大额定值与电气特性
| Family | Cyclone V GX |
| Logic Elements | 301,000 |
| Embedded Memory | 14,251,008 bits |
| Maximum User I/O | 560 |
| Transceivers | 9 full-duplex channels |
| Transceiver Data Rate | 3.125 Gbps |
| DSP Blocks | Variable-precision, hardware multiplier |
| Process Technology | 28 nm low-power |
| Core Voltage | 0.85 V (C8 speed grade) |
| Speed Grade | 8 (C8N) |
| 封装 | 1152-ball FBGA (FineLine BGA) |
| Hard Memory Controller | DDR3, DDR2, LPDDR2 |
| Hard PCIe | PCIe Gen1/Gen2 x1/x2/x4 |
| 工作温度 | 0C to +85C (commercial) |
| Lead-Free / Pb-Free | Yes (N suffix) |
| RoHS 状态 | Compliant |
5CGXBC9E7F35C8N 1152-ball fbga (fineline bga) 引脚配置指南
5CGXBC9E7F35C8N（1152-ball fbga (fineline bga) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： 5CGXBC9E7F35C8N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
5CGXBC9E7F35C8N 适用于 6 应用s: Industrial Machine Vision Systems, Broadcast Video Processing and Pro-AV, Industrial Motor Control and Drives, Wireless Backhaul and Small-Cell Baseband, PCIe Endpoint Add-In Cards, Medical Imaging and Diagnostics.
Industrial Machine Vision Systems
The 5CGXBC9E7F35C8N fits industrial machine vision because its 301K logic elements, 14 Mb embedded memory, and 9 transceivers handle multiple GigE Vision, Camera Link, or CoaXPress camera streams simultaneously. The variable-precision DSP blocks accelerate Bayer demosaicing, color-space conversion, and convolution filters without offloading to external processors. Its hardened PCIe Gen2 endpoint simplifies host-side frame capture over PCIe x4 to a CPU, while the 28 nm low-power process keeps board thermal design within factory-enclosure budgets. Compared to a Cyclone V E device, the GX variant's transceivers reduce external PHY BOM cost and design complexity for multi-camera aggregation setups.
推荐
Broadcast Video Processing and Pro-AV
For broadcast video routing, multiviewers, and Pro-AV signal processors, the 5CGXBC9E7F35C8N provides the SERDES bandwidth to ingest 3G-SDI or HDMI-over-SDI streams while performing real-time scaling and color correction in fabric. The 3.125 Gbps transceivers support SMPTE 424M and emerging 6G/12G UHD-SDI standards via external cable equalizers. The 560 user I/O enables direct connection to multiple parallel video buses, HDMI/TMDS interfaces, and LCD panels. With PCIe x4 Gen2, the FPGA can act as a video capture card or live mixer DSP engine in broadcast studio infrastructure.
推荐
Industrial Motor Control and Drives
The 5CGXBC9E7F35C8N is well matched to multi-axis industrial servo drives and variable-frequency drives (VFDs). Its variable-precision DSP blocks implement field-oriented control (FOC), space-vector PWM, and encoder decoding for up to 8 axes from a single device. Hardened PCIe and Ethernet interfaces enable EtherCAT, PROFINET, or EtherNet/IP master/slave communication. The 28 nm process node and 0.85 V core voltage keep power dissipation low even at full logic utilization, which is critical in sealed drive enclosures. The 560 I/O allows direct connection to multi-axis current-sensing ADCs and gate-driver PWM outputs.
推荐
Wireless Backhaul and Small-Cell Baseband
In small-cell base stations and wireless backhaul modems, the 5CGXBC9E7F35C8N handles CPRI and OBSAI fronthaul via its 9 transceivers at 3.125 Gbps, supporting up to 9 antenna-carrier sectors in a single FPGA. The 14 Mb embedded memory buffers baseband samples between PHY and modem DSP, and the variable-precision DSP blocks implement FFT/iFFT, channel estimation, and pre-coding for LTE/5G NR PHY layers. The hardened PCIe Gen2 enables direct host connectivity to a baseband SoC. Compared to ASIC implementations, the Cyclone V GX allows rapid protocol upgrades across LTE, 5G NR, and Wi-Fi 6E in a single platform.
推荐
PCIe Endpoint Add-In Cards
The 5CGXBC9E7F35C8N is ideal for industrial PCIe Gen2 x4 endpoint cards used in test equipment, data acquisition, and protocol analyzer products. Its hard PCIe Gen2 IP block delivers deterministic latency with minimal logic overhead, freeing the FPGA fabric for application-specific DSP, buffering, or protocol-conversion logic. The 560 I/O and 9 transceivers expose multiple high-speed serial interfaces to the host backplane, while the 14 Mb embedded memory supports high-bandwidth streaming DMA. Commercial-temperature pricing is competitive against full custom ASICs at low-volume production runs.
推荐
Medical Imaging and Diagnostics
In medical imaging modalities such as ultrasound, endoscopy, and X-ray detectors, the 5CGXBC9E7F35C8N provides the parallel processing density to manage multi-channel analog front-end digitization and beamforming in real time. Its variable-precision DSP blocks accelerate finite-impulse-response (FIR) filters, image reconstruction, and Doppler processing at ultrasound frame rates. The transceivers aggregate data from probe-head ADCs over LVDS or serial LVDS at low latency, while the hard memory controller drives DDR3 buffers for raw frame storage. Industrial-grade variants (5CGXBC9E7F35I8N) extend operating range to -40C for portable imaging carts.
推荐
推荐产品汇总
工程参考数据： 5CGXBC9E7F35C8N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 5CGXBC9E7F35C7N | 5CGXBC9E7F35C6N | 5CGXBC9E7F35I8N | 5CGXBC9E7F35A7N | 5CGXBC9E6F35C8N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FBGA (F35) | 1152-FBGA (F35) - same | 1152-FBGA (F35) - same | 1152-FBGA (F35) - same | 1152-FBGA (F35) - same | 1152-FBGA (F35) - same |
| Logic Elements | 301,000 | 301,000 | 301,000 | 301,000 | 301,000 | 301,000 |
| Embedded Memory | 14,251,008 bits | 14,251,008 bits | 14,251,008 bits | 14,251,008 bits | 14,251,008 bits | 14,251,008 bits |
| Speed Grade | C8 (8 ns) | C7 (7 ns) - faster | C6 (6 ns) - faster | I8 industrial, 8 ns | A7 automotive, 7 ns | C8, 6G transceiver |
| Transceivers | 9 @ 3.125 Gbps (7G) | 9 @ 3.125 Gbps (7G) | 9 @ 3.125 Gbps (7G) | 9 @ 3.125 Gbps (7G) | 9 @ 3.125 Gbps (7G) | 9 @ 2.5 Gbps (6G) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | -40C to +100C (industrial) | -40C to +125C (automotive) | 0C to +85C |
| Hard PCIe Gen2 IP | Yes (x1/x2/x4) | Yes (x1/x2/x4) | Yes (x1/x2/x4) | Yes (x1/x2/x4) | Yes (x1/x2/x4) | Yes (x1/x2/x4) |
关键差异点
- Highest-density Cyclone V GX with 301K LE （对比 5CGXBC9D7F27C8N)
- Hardened PCIe Gen2 IP block included （对比 5CEFA9F27C7N)
- 9 integrated 3.125 Gbps transceivers （对比 5CEFA9F23I7N)
设计说明
The 5CGXBC9E7F35C8N requires multiple power rails: 0.85 V core (VCC), 1.1 V auxiliary (VCCAUX), 1.5 V/1.8 V/2.5 V/3.0 V I/O banks (VCCIO), and 1.1 V transceiver analog (VCCT_GXB). Use the Intel Cyclone V PowerPlay Early Power Estimator (EPE) spreadsheet before schematic capture to size regulator current capacity. Recommended power sequencing: VCC first, then VCCAUX, then VCCIO, with monotonic ramp-up to prevent latch-up. Decouple each rail with a 100 nF X7R plus 10 uF bulk ceramic near each power pin pair; add 47 uF bulk tantalum at each voltage regulator output.
The 1152-FBGA package requires an 8-layer PCB minimum with stacked micro-via (laser-drilled) or stacked micro-via + buried-via stack-up to escape the 35 mm x 35 mm BGA. Reference the Cyclone V F35 package PCB layout guidelines for via-pad antipad dimensions. Match 100-ohm differential impedance on all 9 GXB transceiver channels and 90-ohm single-ended for LVDS I/O. Maintain at least 4 mm of continuous reference ground plane under the BGA; route high-speed SERDES over solid GND plane, never split planes. Use 0201 or 0402 decoupling on the BGA bottom side for shortest return-current loops.
Estimated: For the 9 full-duplex 3.125 Gbps transceivers, route each TX/RX pair as length-matched differential pairs within 0.13 mm (5 mil) of target length. Place the transceiver reference clock source (LVDS or LVPECL) within 25 mm of the CLK pins, with matched-length traces to within 0.05 mm. Use Intel's Cyclone V transceiver toolkit to simulate channel loss with your chosen PCB stack-up before tape-out; aim for less than 8 dB insertion loss at 1.5 GHz for reliable 3.125 Gbps link-up across all temperature corners.
Do not confuse Cyclone V GX (this part) with Cyclone V E (no transceivers) or Cyclone V GT (6G/10G transceivers) at order entry. Although they share the same F35 package outline for some densities, the ball-out and pin functions differ at many pins. Confirm the F35 ordering code in the Intel ordering information file (OIF) before PCB fabrication. The 'N' suffix denotes lead-free finish; 'N' is mandatory for RoHS compliance. Do not mix JTAG chain ID assignments when using multiple FPGAs in a scan chain - configure MSEL pins for the desired JTAG mode.
合规信息
RoHS and REACH compliance per Intel product declaration. Lead-free finish confirmed by N suffix in part number. AEC-Q100 qualification requires the A-suffix automotive variant; the 5CGXBC9E7F35C8N is commercial grade. Conflict minerals reporting compliant per Intel policy.
