5CGXBC9E7F35C8N - Cyclone V GX FPGA, 301K LE, 1152-BGA | Intel
MPN: 5CGXBC9E7F35C8N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $640.74 | $640.74 |
| 10 | $615.5 | $6,155.00 |
| 25 | $595.2 | $14,880.00 |
| 50 | $575.8 | $28,790.00 |
| 100 | $555.1 | $55,510.00 |
Drop-in alternatives for 5CGXBC9E7F35C8N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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5CGXBC9E7F35C8N Maximum Ratings & Electrical Characteristics
| Family | Cyclone V GX |
| Logic Elements | 301,000 |
| Embedded Memory | 14,251,008 bits |
| Maximum User I/O | 560 |
| Transceivers | 9 full-duplex channels |
| Transceiver Data Rate | 3.125 Gbps |
| DSP Blocks | Variable-precision, hardware multiplier |
| Process Technology | 28 nm low-power |
| Core Voltage | 0.85 V (C8 speed grade) |
| Speed Grade | 8 (C8N) |
| Package | 1152-ball FBGA (FineLine BGA) |
| Hard Memory Controller | DDR3, DDR2, LPDDR2 |
| Hard PCIe | PCIe Gen1/Gen2 x1/x2/x4 |
| Operating Temperature | 0C to +85C (commercial) |
| Lead-Free / Pb-Free | Yes (N suffix) |
| RoHS Status | Compliant |
5CGXBC9E7F35C8N 1152-ball fbga (fineline bga) Pin Configuration Guide
Complete pinout information for 5CGXBC9E7F35C8N (1152-ball fbga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CGXBC9E7F35C8N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CGXBC9E7F35C8N is suitable for 6 applications: Industrial Machine Vision Systems, Broadcast Video Processing and Pro-AV, Industrial Motor Control and Drives, Wireless Backhaul and Small-Cell Baseband, PCIe Endpoint Add-In Cards, Medical Imaging and Diagnostics.
Industrial Machine Vision Systems
The 5CGXBC9E7F35C8N fits industrial machine vision because its 301K logic elements, 14 Mb embedded memory, and 9 transceivers handle multiple GigE Vision, Camera Link, or CoaXPress camera streams simultaneously. The variable-precision DSP blocks accelerate Bayer demosaicing, color-space conversion, and convolution filters without offloading to external processors. Its hardened PCIe Gen2 endpoint simplifies host-side frame capture over PCIe x4 to a CPU, while the 28 nm low-power process keeps board thermal design within factory-enclosure budgets. Compared to a Cyclone V E device, the GX variant's transceivers reduce external PHY BOM cost and design complexity for multi-camera aggregation setups.
Recommended
Broadcast Video Processing and Pro-AV
For broadcast video routing, multiviewers, and Pro-AV signal processors, the 5CGXBC9E7F35C8N provides the SERDES bandwidth to ingest 3G-SDI or HDMI-over-SDI streams while performing real-time scaling and color correction in fabric. The 3.125 Gbps transceivers support SMPTE 424M and emerging 6G/12G UHD-SDI standards via external cable equalizers. The 560 user I/O enables direct connection to multiple parallel video buses, HDMI/TMDS interfaces, and LCD panels. With PCIe x4 Gen2, the FPGA can act as a video capture card or live mixer DSP engine in broadcast studio infrastructure.
Recommended
Industrial Motor Control and Drives
The 5CGXBC9E7F35C8N is well matched to multi-axis industrial servo drives and variable-frequency drives (VFDs). Its variable-precision DSP blocks implement field-oriented control (FOC), space-vector PWM, and encoder decoding for up to 8 axes from a single device. Hardened PCIe and Ethernet interfaces enable EtherCAT, PROFINET, or EtherNet/IP master/slave communication. The 28 nm process node and 0.85 V core voltage keep power dissipation low even at full logic utilization, which is critical in sealed drive enclosures. The 560 I/O allows direct connection to multi-axis current-sensing ADCs and gate-driver PWM outputs.
Recommended
Wireless Backhaul and Small-Cell Baseband
In small-cell base stations and wireless backhaul modems, the 5CGXBC9E7F35C8N handles CPRI and OBSAI fronthaul via its 9 transceivers at 3.125 Gbps, supporting up to 9 antenna-carrier sectors in a single FPGA. The 14 Mb embedded memory buffers baseband samples between PHY and modem DSP, and the variable-precision DSP blocks implement FFT/iFFT, channel estimation, and pre-coding for LTE/5G NR PHY layers. The hardened PCIe Gen2 enables direct host connectivity to a baseband SoC. Compared to ASIC implementations, the Cyclone V GX allows rapid protocol upgrades across LTE, 5G NR, and Wi-Fi 6E in a single platform.
Recommended
PCIe Endpoint Add-In Cards
The 5CGXBC9E7F35C8N is ideal for industrial PCIe Gen2 x4 endpoint cards used in test equipment, data acquisition, and protocol analyzer products. Its hard PCIe Gen2 IP block delivers deterministic latency with minimal logic overhead, freeing the FPGA fabric for application-specific DSP, buffering, or protocol-conversion logic. The 560 I/O and 9 transceivers expose multiple high-speed serial interfaces to the host backplane, while the 14 Mb embedded memory supports high-bandwidth streaming DMA. Commercial-temperature pricing is competitive against full custom ASICs at low-volume production runs.
Recommended
Medical Imaging and Diagnostics
In medical imaging modalities such as ultrasound, endoscopy, and X-ray detectors, the 5CGXBC9E7F35C8N provides the parallel processing density to manage multi-channel analog front-end digitization and beamforming in real time. Its variable-precision DSP blocks accelerate finite-impulse-response (FIR) filters, image reconstruction, and Doppler processing at ultrasound frame rates. The transceivers aggregate data from probe-head ADCs over LVDS or serial LVDS at low latency, while the hard memory controller drives DDR3 buffers for raw frame storage. Industrial-grade variants (5CGXBC9E7F35I8N) extend operating range to -40C for portable imaging carts.
Recommended
Recommended Products Summary
Engineering reference data for 5CGXBC9E7F35C8N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CGXBC9E7F35C7N | 5CGXBC9E7F35C6N | 5CGXBC9E7F35I8N | 5CGXBC9E7F35A7N | 5CGXBC9E6F35C8N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FBGA (F35) | 1152-FBGA (F35) - same | 1152-FBGA (F35) - same | 1152-FBGA (F35) - same | 1152-FBGA (F35) - same | 1152-FBGA (F35) - same |
| Logic Elements | 301,000 | 301,000 | 301,000 | 301,000 | 301,000 | 301,000 |
| Embedded Memory | 14,251,008 bits | 14,251,008 bits | 14,251,008 bits | 14,251,008 bits | 14,251,008 bits | 14,251,008 bits |
| Speed Grade | C8 (8 ns) | C7 (7 ns) - faster | C6 (6 ns) - faster | I8 industrial, 8 ns | A7 automotive, 7 ns | C8, 6G transceiver |
| Transceivers | 9 @ 3.125 Gbps (7G) | 9 @ 3.125 Gbps (7G) | 9 @ 3.125 Gbps (7G) | 9 @ 3.125 Gbps (7G) | 9 @ 3.125 Gbps (7G) | 9 @ 2.5 Gbps (6G) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | -40C to +100C (industrial) | -40C to +125C (automotive) | 0C to +85C |
| Hard PCIe Gen2 IP | Yes (x1/x2/x4) | Yes (x1/x2/x4) | Yes (x1/x2/x4) | Yes (x1/x2/x4) | Yes (x1/x2/x4) | Yes (x1/x2/x4) |
| Approx. Unit Price (USD) | 640.74 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Highest-density Cyclone V GX with 301K LE (vs 5CGXBC9D7F27C8N)
- Hardened PCIe Gen2 IP block included (vs 5CEFA9F27C7N)
- 9 integrated 3.125 Gbps transceivers (vs 5CEFA9F23I7N)
Design Notes
The 5CGXBC9E7F35C8N requires multiple power rails: 0.85 V core (VCC), 1.1 V auxiliary (VCCAUX), 1.5 V/1.8 V/2.5 V/3.0 V I/O banks (VCCIO), and 1.1 V transceiver analog (VCCT_GXB). Use the Intel Cyclone V PowerPlay Early Power Estimator (EPE) spreadsheet before schematic capture to size regulator current capacity. Recommended power sequencing: VCC first, then VCCAUX, then VCCIO, with monotonic ramp-up to prevent latch-up. Decouple each rail with a 100 nF X7R plus 10 uF bulk ceramic near each power pin pair; add 47 uF bulk tantalum at each voltage regulator output.
The 1152-FBGA package requires an 8-layer PCB minimum with stacked micro-via (laser-drilled) or stacked micro-via + buried-via stack-up to escape the 35 mm x 35 mm BGA. Reference the Cyclone V F35 package PCB layout guidelines for via-pad antipad dimensions. Match 100-ohm differential impedance on all 9 GXB transceiver channels and 90-ohm single-ended for LVDS I/O. Maintain at least 4 mm of continuous reference ground plane under the BGA; route high-speed SERDES over solid GND plane, never split planes. Use 0201 or 0402 decoupling on the BGA bottom side for shortest return-current loops.
Estimated: For the 9 full-duplex 3.125 Gbps transceivers, route each TX/RX pair as length-matched differential pairs within 0.13 mm (5 mil) of target length. Place the transceiver reference clock source (LVDS or LVPECL) within 25 mm of the CLK pins, with matched-length traces to within 0.05 mm. Use Intel's Cyclone V transceiver toolkit to simulate channel loss with your chosen PCB stack-up before tape-out; aim for less than 8 dB insertion loss at 1.5 GHz for reliable 3.125 Gbps link-up across all temperature corners.
Do not confuse Cyclone V GX (this part) with Cyclone V E (no transceivers) or Cyclone V GT (6G/10G transceivers) at order entry. Although they share the same F35 package outline for some densities, the ball-out and pin functions differ at many pins. Confirm the F35 ordering code in the Intel ordering information file (OIF) before PCB fabrication. The 'N' suffix denotes lead-free finish; 'N' is mandatory for RoHS compliance. Do not mix JTAG chain ID assignments when using multiple FPGAs in a scan chain - configure MSEL pins for the desired JTAG mode.
Compliance Information
RoHS and REACH compliance per Intel product declaration. Lead-free finish confirmed by N suffix in part number. AEC-Q100 qualification requires the A-suffix automotive variant; the 5CGXBC9E7F35C8N is commercial grade. Conflict minerals reporting compliant per Intel policy.
