A3PE1500-2FGG676 - ProASIC3E FPGA 1.5M Gates | Microchip
部品番号: A3PE1500-2FGG676 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $54.32 | $54.32 |
| 10 | $49.85 | $498.50 |
| 100 | $44.1 | $4,410.00 |
| 500 | $39.2 | $19,600.00 |
| 1,000 | $33.5 | $33,500.00 |
A3PE1500-2FGG676 概要
What is an FPGA? A field-programmable gate array is an integrated circuit whose logic fabric can be configured after manufacturing to implement arbitrary digital logic, from simple state machines to complex system-on-chip functions. FPGAs occupy a layer between fixed-function ASICs and software-defined microprocessors, allowing parallel hardware execution and deterministic I/O timing. In the digital system hierarchy, FPGAs are configurable logic devices with programmable interconnect replacing hardwired gate arrays. The ProASIC3E family is unique in using flash-based configuration cells rather than SRAM LUTs, giving secure, live-at-power-up operation with no boot firmware and eliminating external configuration memory.
Key features of the A3PE1500-2FGG676 include 310 MHz system performance, 444 user I/O pins, 276480 bits of true dual-port RAM, and a -2 speed grade that supports high toggle rates for datapath-intensive logic. The flash architecture provides AES-based design security, low total cost of ownership, and reprogrammability through JTAG or the Libero SoC design suite. The 676-ball FBGA package offers a compact 27×27 mm footprint with 1.0 mm ball pitch, allowing dense board assembly while preserving routing access for high-pin-count interfaces.
Technically, the ProASIC3E family uses a flash switch fabric that retains its configuration in non-volatile cells. This gives instant-on availability, immunity to bitstream readback attacks, and secure key handling. The device also includes on-chip PLLs and clock conditioning resources, programmable I/O standards, and support for an optional soft ARM Cortex-M1 processor, enabling mixed microcontroller-plus-FPGA designs in a single component.
Typical applications include communications infrastructure such as line cards and routers, industrial automation and motor control, aerospace and defense processing platforms, medical imaging equipment, and edge computing systems. The large I/O count and embedded memory suit parallel bus interfacing, frame buffering, and high-speed control logic, while flash-based security is attractive for IP protection.
Designers should decouple all VCC and VCCPLL balls with high-frequency ceramic capacitors, route the 1.5 V core supply with a solid power plane, and use Microchip's Libero SoC tool chain for synthesis, place-and-route, and programming. Because the device is flash-based, configuration is retained after power cycling, simplifying production programming and reducing BOM cost.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, helping engineers evaluate A3PE1500-2FGG676 against A3PE1500-2FGG676I, A3PE1500-1FGG676I, and other ProASIC3E package variants.
ドロップイン代替品: A3PE1500-2FGG676 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: A3PE1500-2FGG676 （同一形状・フットプリント） — 相違点: Core Supply Voltage, System Gates, Configuration, Package, Process Technology.
クイック比較ツール — 並列比較する代替部品を選択:
A3PE1500-2FGG676I
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →A3PE1500-1FGG676I
✅ ドロップイン✓ 在庫あり
$59.6 / 個
データシートを見る →A3PE1500-FGG676I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
A3PE1500-FG676I
✅ ドロップイン✓ 在庫あり
$60.2 / 個
データシートを見る →A3PE1500-FGG676
✅ ドロップイン📋 参考代替品（カタログ未掲載）
M1A3PE1500-1FGG676I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
M1A3PE1500-1FG676I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
M1A3PE1500-1FGG676
✅ ドロップイン📋 参考代替品（カタログ未掲載）
A3PE1500-2FGG676 最大定格＆電気的特性
| Product Family | ProASIC3E |
| System Gates | 1,500,000 |
| Logic Elements | 16KLEs |
| User I/O | 444 |
| Total RAM Bits | 276,480 |
| Core Supply Voltage | 1.425 V to 1.575 V |
| 動作温度 | 0°C to 85°C (TJ) |
| Speed Grade | -2 |
| System Performance | 310 MHz |
| Process Technology | 130 nm |
| パッケージ | 676-BGA (FBGA) |
| 実装タイプ | Surface Mount |
| Terminal Pitch | 1.000 mm |
| Configuration | Flash-based, reprogrammable |
| Security | AES-based design security |
| Packaging | Tray |
| Lead Free Status | Lead Free |
| RoHS ステータス | RoHS Compliant |
A3PE1500-2FGG676 676-bga (fbga) ピン配置ガイド
A3PE1500-2FGG676 (676-bga (fbga) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: A3PE1500-2FGG676.
詳細は データシート をご参照ください。
主な用途
A3PE1500-2FGG676 の用途: 6 件s: Communications Infrastructure, Industrial Automation, Aerospace and Defense, Medical Electronics, Data Processing and Storage, IoT Edge Computing.
Communications Infrastructure
The A3PE1500-2FGG676 fits communications line cards, routers, and Ethernet switches that require wide parallel interfaces, packet buffering, and deterministic processing. Its 444 user I/O support multiple parallel buses and control-plane bridging, while the 276,480 bits of dual-port RAM handle small frame buffers and FIFO queues. The 1.5M-gate fabric is sufficient for packet classification, CRC generation, and traffic policing logic. Flash-based instant-on is advantageous in carrier equipment that must begin forwarding shortly after power is applied. Designers can use the high I/O count to attach physical-layer transceivers, PHY devices, and memory subsystems without external CPLD glue logic.
おすすめ
Industrial Automation
In industrial control, PLCs, motor drives, and vision systems benefit from the ProASIC3E's deterministic I/O and flash reprogrammability. The A3PE1500-2FGG676 can implement high-speed encoder interfaces, PWM generation, and parallel sensor acquisition with stable timing that is not subject to software jitter. Its 310 MHz system performance supports fast combinational logic, and the 1.5M gates allow multiple control loops to run in parallel hardware. The commercial temperature range suits indoor cabinets, while the industrial I variant is recommended for washdown or unheated areas. Flash configuration also enables field upgrades through JTAG without changing system boot firmware.
おすすめ
Aerospace and Defense
The A3PE1500-2FGG676 is attractive for avionics data concentrators, radar preprocessing, and secure communication modules because it is a single-chip flash FPGA. Its non-volatile configuration prevents bitstream loss after power transients and provides AES-based design security to protect IP. The 676-BGA package with 444 I/O supports wide sensor busses, MIL-STD-1553 interfaces, or parallel DSP connections. For elevated temperature environments, the -2FGG676I or -1FGG676I variants are better choices. Designers should screen devices for environmental compliance and consider conformal coating because the package is a standard commercial FBGA.
おすすめ
Medical Electronics
Medical imaging and patient monitoring equipment require FPGAs that provide deterministic real-time processing and long-term availability. The A3PE1500-2FGG676 can handle ultrasound beamforming data paths, optical coherence tomography engines, or parallel sensor multiplexing. Its 276,480 bits of RAM are useful for scan-line buffers, and the 444 I/O enable connection to high-speed ADCs, displays, and motor controllers. Flash-based configuration is particularly beneficial for medical devices where secure, field-reliable boot is critical. Designers should follow IEC 60601-1 EMC guidance but the device itself does not include medical certification; system-level compliance is required at the equipment level.
おすすめ
Data Processing and Storage
The A3PE1500-2FGG676 is well suited to storage controllers, NVMe bridges, and data aggregation cards where wide parallel datapaths and buffering are common. Its 1.5M gates can implement DMA engines, memory-mapped register blocks, and protocol control state machines. The embedded 276,480 bits of true dual-port RAM allow asynchronous clock-domain crossing FIFOs, which are essential in mixed-clock storage designs. The 444 I/O provide enough pins for a DDR2/DDR3 bus, multiple SPI/I2C interfaces, and status LEDs. Flash-based configuration reduces boot code complexity and improves system reliability in always-on storage appliances.
おすすめ
IoT Edge Computing
IoT gateways and edge processors need energy-efficient, secure logic that can bridge sensors, radios, and external hosts. The A3PE1500-2FGG676 provides enough gates to implement protocol conversion, sensor fusion, and lightweight deep-learning pre-processing in programmable hardware. Flash configuration makes the device ready instantly on power-up, which is important for low-power edge nodes. The commercial temperature range fits residential and indoor industrial IoT. With 444 I/O, the FPGA can interface to multiple ADC/DAC devices, displays, and radios while leaving room for future flexibility. Use the M1 variant when IP security is critical for edge inference models.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: A3PE1500-2FGG676 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | A3PE1500-2FGG676I | A3PE1500-1FGG676I | A3PE1500-FG676I | M1A3PE1500-1FGG676I | A3PE1500-FGG676I |
|---|---|---|---|---|---|---|
| Package | 676-BGA (FBGA) | 676-BGA (FBGA) | 676-BGA (FBGA) | 676-BGA (FBGA) | 676-BGA (FBGA) | 676-BGA (FBGA) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Device Family | ProASIC3E | ProASIC3E | ProASIC3E | ProASIC3E | ProASIC3E M1 (secure) | ProASIC3E |
| Operating Temperature | 0°C to 85°C (TJ) | -40°C to 100°C (TJ) | -40°C to 100°C (TJ) | -40°C to 100°C (TJ) | -40°C to 100°C (TJ) | -40°C to 100°C (TJ) |
| System Gates | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 |
| Total RAM Bits | 276,480 | 276,480 | 276,480 | 276,480 | 276,480 | 276,480 |
| User I/O | 444 | 444 | 444 | 444 | 444 | 444 |
| Core Supply Voltage | 1.425V to 1.575V | 1.425V to 1.575V | 1.425V to 1.575V | 1.425V to 1.575V | 1.425V to 1.575V | 1.425V to 1.575V |
主な差別化要因
- Lower-cost commercial temperature option （vs A3PE1500-2FGG676I)
- Higher speed grade for demanding datapaths （vs A3PE1500-1FGG676I)
- Standard security without M1 premium （vs M1A3PE1500-1FGG676I)
設計ノート
The A3PE1500-2FGG676 core supply must be maintained between 1.425V and 1.575V. Use a dedicated 1.5V regulator capable of the FPGA's estimated current demand, and place at least one 0.1uF ceramic capacitor near every VCC and VCCPLL ball. A 4.7uF bulk capacitor per power ball group is recommended. Monitor the core voltage with a sense trace and avoid sharing the 1.5V rail with high-current switching loads. Estimated: total core current can approach several amperes in a fully utilized 1.5M-gate design, so size the regulator accordingly.
The 676-ball FBGA has 1.0mm ball pitch. Use microvias or via-in-pad to escape inner balls when routing to inner layers. For power and ground balls, connect directly to the internal plane with a low-impedance via. The exposed center pad should be connected to the ground plane for mechanical reliability, though this package is primarily a ball-attach part. Follow Microchip's layout guidelines for PLL pins, keeping VCCPLL traces short and shielded by ground pour.
Do not leave I/O pins floating in production designs; assign pull-ups or drive them from logic. Because the ProASIC3E is flash-based, remember that the device is secure by default; if you need to read back or update configuration, understand the JTAG security lock options and fuse behavior. Always program the device through Libero SoC and verify the checksum. Also ensure the correct bank voltage is applied before configuring I/O standards - applying 3.3V to a bank set to 2.5V can damage the output drivers.
コンプライアンス情報
Digchip cross-reference listing states Lead Free Status: Lead Free and RoHS Status: RoHS Compliant. AEC-Q100 is not applicable to this FPGA product family. Additional REACH/halogen/conflict mineral information was not present in the verified web data.
