A3PE1500-2FGG676 - ProASIC3E FPGA 1.5M Gates | Microchip
Référence : A3PE1500-2FGG676 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $54.32 | $54,32 |
| 10 | $49.85 | $498,50 |
| 100 | $44.1 | $4 410,00 |
| 500 | $39.2 | $19 600,00 |
| 1 000 | $33.5 | $33 500,00 |
A3PE1500-2FGG676 Présentation
What is an FPGA? A field-programmable gate array is an integrated circuit whose logic fabric can be configured after manufacturing to implement arbitrary digital logic, from simple state machines to complex system-on-chip functions. FPGAs occupy a layer between fixed-function ASICs and software-defined microprocessors, allowing parallel hardware execution and deterministic I/O timing. In the digital system hierarchy, FPGAs are configurable logic devices with programmable interconnect replacing hardwired gate arrays. The ProASIC3E family is unique in using flash-based configuration cells rather than SRAM LUTs, giving secure, live-at-power-up operation with no boot firmware and eliminating external configuration memory.
Key features of the A3PE1500-2FGG676 include 310 MHz system performance, 444 user I/O pins, 276480 bits of true dual-port RAM, and a -2 speed grade that supports high toggle rates for datapath-intensive logic. The flash architecture provides AES-based design security, low total cost of ownership, and reprogrammability through JTAG or the Libero SoC design suite. The 676-ball FBGA package offers a compact 27×27 mm footprint with 1.0 mm ball pitch, allowing dense board assembly while preserving routing access for high-pin-count interfaces.
Technically, the ProASIC3E family uses a flash switch fabric that retains its configuration in non-volatile cells. This gives instant-on availability, immunity to bitstream readback attacks, and secure key handling. The device also includes on-chip PLLs and clock conditioning resources, programmable I/O standards, and support for an optional soft ARM Cortex-M1 processor, enabling mixed microcontroller-plus-FPGA designs in a single component.
Typical applications include communications infrastructure such as line cards and routers, industrial automation and motor control, aerospace and defense processing platforms, medical imaging equipment, and edge computing systems. The large I/O count and embedded memory suit parallel bus interfacing, frame buffering, and high-speed control logic, while flash-based security is attractive for IP protection.
Designers should decouple all VCC and VCCPLL balls with high-frequency ceramic capacitors, route the 1.5 V core supply with a solid power plane, and use Microchip's Libero SoC tool chain for synthesis, place-and-route, and programming. Because the device is flash-based, configuration is retained after power cycling, simplifying production programming and reducing BOM cost.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, helping engineers evaluate A3PE1500-2FGG676 against A3PE1500-2FGG676I, A3PE1500-1FGG676I, and other ProASIC3E package variants.
Alternatives de remplacement direct pour A3PE1500-2FGG676 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec A3PE1500-2FGG676 (même facteur de forme et même empreinte) — différant par Core Supply Voltage, System Gates, Configuration, Package, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
A3PE1500-2FGG676I
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →A3PE1500-1FGG676I
✅ Remplacement direct✓ En stock
$59.6 / unité
Voir la fiche technique →A3PE1500-FGG676I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
A3PE1500-FG676I
✅ Remplacement direct✓ En stock
$60.2 / unité
Voir la fiche technique →A3PE1500-FGG676
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
M1A3PE1500-1FGG676I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
M1A3PE1500-1FG676I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
M1A3PE1500-1FGG676
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
A3PE1500-2FGG676 Valeurs maximales et caractéristiques électriques
| Product Family | ProASIC3E |
| System Gates | 1,500,000 |
| Logic Elements | 16KLEs |
| User I/O | 444 |
| Total RAM Bits | 276,480 |
| Core Supply Voltage | 1.425 V to 1.575 V |
| Température de fonctionnement | 0°C to 85°C (TJ) |
| Speed Grade | -2 |
| System Performance | 310 MHz |
| Process Technology | 130 nm |
| Boîtier | 676-BGA (FBGA) |
| Type de montage | Surface Mount |
| Terminal Pitch | 1.000 mm |
| Configuration | Flash-based, reprogrammable |
| Security | AES-based design security |
| Packaging | Tray |
| Lead Free Status | Lead Free |
| Statut RoHS | RoHS Compliant |
Guide de configuration des broches du A3PE1500-2FGG676 676-bga (fbga)
Configuration des broches du A3PE1500-2FGG676 (boîtier 676-bga (fbga)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour A3PE1500-2FGG676.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
A3PE1500-2FGG676 convient pour 6 applications: Communications Infrastructure, Industrial Automation, Aerospace and Defense, Medical Electronics, Data Processing and Storage, IoT Edge Computing.
Communications Infrastructure
The A3PE1500-2FGG676 fits communications line cards, routers, and Ethernet switches that require wide parallel interfaces, packet buffering, and deterministic processing. Its 444 user I/O support multiple parallel buses and control-plane bridging, while the 276,480 bits of dual-port RAM handle small frame buffers and FIFO queues. The 1.5M-gate fabric is sufficient for packet classification, CRC generation, and traffic policing logic. Flash-based instant-on is advantageous in carrier equipment that must begin forwarding shortly after power is applied. Designers can use the high I/O count to attach physical-layer transceivers, PHY devices, and memory subsystems without external CPLD glue logic.
Recommandé
Industrial Automation
In industrial control, PLCs, motor drives, and vision systems benefit from the ProASIC3E's deterministic I/O and flash reprogrammability. The A3PE1500-2FGG676 can implement high-speed encoder interfaces, PWM generation, and parallel sensor acquisition with stable timing that is not subject to software jitter. Its 310 MHz system performance supports fast combinational logic, and the 1.5M gates allow multiple control loops to run in parallel hardware. The commercial temperature range suits indoor cabinets, while the industrial I variant is recommended for washdown or unheated areas. Flash configuration also enables field upgrades through JTAG without changing system boot firmware.
Recommandé
Aerospace and Defense
The A3PE1500-2FGG676 is attractive for avionics data concentrators, radar preprocessing, and secure communication modules because it is a single-chip flash FPGA. Its non-volatile configuration prevents bitstream loss after power transients and provides AES-based design security to protect IP. The 676-BGA package with 444 I/O supports wide sensor busses, MIL-STD-1553 interfaces, or parallel DSP connections. For elevated temperature environments, the -2FGG676I or -1FGG676I variants are better choices. Designers should screen devices for environmental compliance and consider conformal coating because the package is a standard commercial FBGA.
Recommandé
Medical Electronics
Medical imaging and patient monitoring equipment require FPGAs that provide deterministic real-time processing and long-term availability. The A3PE1500-2FGG676 can handle ultrasound beamforming data paths, optical coherence tomography engines, or parallel sensor multiplexing. Its 276,480 bits of RAM are useful for scan-line buffers, and the 444 I/O enable connection to high-speed ADCs, displays, and motor controllers. Flash-based configuration is particularly beneficial for medical devices where secure, field-reliable boot is critical. Designers should follow IEC 60601-1 EMC guidance but the device itself does not include medical certification; system-level compliance is required at the equipment level.
Recommandé
Data Processing and Storage
The A3PE1500-2FGG676 is well suited to storage controllers, NVMe bridges, and data aggregation cards where wide parallel datapaths and buffering are common. Its 1.5M gates can implement DMA engines, memory-mapped register blocks, and protocol control state machines. The embedded 276,480 bits of true dual-port RAM allow asynchronous clock-domain crossing FIFOs, which are essential in mixed-clock storage designs. The 444 I/O provide enough pins for a DDR2/DDR3 bus, multiple SPI/I2C interfaces, and status LEDs. Flash-based configuration reduces boot code complexity and improves system reliability in always-on storage appliances.
Recommandé
IoT Edge Computing
IoT gateways and edge processors need energy-efficient, secure logic that can bridge sensors, radios, and external hosts. The A3PE1500-2FGG676 provides enough gates to implement protocol conversion, sensor fusion, and lightweight deep-learning pre-processing in programmable hardware. Flash configuration makes the device ready instantly on power-up, which is important for low-power edge nodes. The commercial temperature range fits residential and indoor industrial IoT. With 444 I/O, the FPGA can interface to multiple ADC/DAC devices, displays, and radios while leaving room for future flexibility. Use the M1 variant when IP security is critical for edge inference models.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour A3PE1500-2FGG676 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | A3PE1500-2FGG676I | A3PE1500-1FGG676I | A3PE1500-FG676I | M1A3PE1500-1FGG676I | A3PE1500-FGG676I |
|---|---|---|---|---|---|---|
| Package | 676-BGA (FBGA) | 676-BGA (FBGA) | 676-BGA (FBGA) | 676-BGA (FBGA) | 676-BGA (FBGA) | 676-BGA (FBGA) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Device Family | ProASIC3E | ProASIC3E | ProASIC3E | ProASIC3E | ProASIC3E M1 (secure) | ProASIC3E |
| Operating Temperature | 0°C to 85°C (TJ) | -40°C to 100°C (TJ) | -40°C to 100°C (TJ) | -40°C to 100°C (TJ) | -40°C to 100°C (TJ) | -40°C to 100°C (TJ) |
| System Gates | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 |
| Total RAM Bits | 276,480 | 276,480 | 276,480 | 276,480 | 276,480 | 276,480 |
| User I/O | 444 | 444 | 444 | 444 | 444 | 444 |
| Core Supply Voltage | 1.425V to 1.575V | 1.425V to 1.575V | 1.425V to 1.575V | 1.425V to 1.575V | 1.425V to 1.575V | 1.425V to 1.575V |
Principaux différenciateurs
- Lower-cost commercial temperature option (vs A3PE1500-2FGG676I)
- Higher speed grade for demanding datapaths (vs A3PE1500-1FGG676I)
- Standard security without M1 premium (vs M1A3PE1500-1FGG676I)
Notes de conception
The A3PE1500-2FGG676 core supply must be maintained between 1.425V and 1.575V. Use a dedicated 1.5V regulator capable of the FPGA's estimated current demand, and place at least one 0.1uF ceramic capacitor near every VCC and VCCPLL ball. A 4.7uF bulk capacitor per power ball group is recommended. Monitor the core voltage with a sense trace and avoid sharing the 1.5V rail with high-current switching loads. Estimated: total core current can approach several amperes in a fully utilized 1.5M-gate design, so size the regulator accordingly.
The 676-ball FBGA has 1.0mm ball pitch. Use microvias or via-in-pad to escape inner balls when routing to inner layers. For power and ground balls, connect directly to the internal plane with a low-impedance via. The exposed center pad should be connected to the ground plane for mechanical reliability, though this package is primarily a ball-attach part. Follow Microchip's layout guidelines for PLL pins, keeping VCCPLL traces short and shielded by ground pour.
Do not leave I/O pins floating in production designs; assign pull-ups or drive them from logic. Because the ProASIC3E is flash-based, remember that the device is secure by default; if you need to read back or update configuration, understand the JTAG security lock options and fuse behavior. Always program the device through Libero SoC and verify the checksum. Also ensure the correct bank voltage is applied before configuring I/O standards - applying 3.3V to a bank set to 2.5V can damage the output drivers.
Informations de conformité
Digchip cross-reference listing states Lead Free Status: Lead Free and RoHS Status: RoHS Compliant. AEC-Q100 is not applicable to this FPGA product family. Additional REACH/halogen/conflict mineral information was not present in the verified web data.
