EPM3512AFC256-22 - MAX 3000A CPLD, 512 Macrocells, BGA-256 | Intel
部品番号: EPM3512AFC256-22 ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.2 | $252.00 |
| 100 | $21.75 | $2,175.00 |
| 500 | $18.4 | $9,200.00 |
| 1,000 | $16.1 | $16,100.00 |
EPM3512AFC256-22 概要
A CPLD is a non-volatile programmable logic device that sits in the broader hierarchy between discrete logic gates (74xx) and large FPGAs. CPLDs are characterized by instant-on (no external boot PROM), predictable routing delays, and high-drive I/O capable of directly driving buses. The MAX 3000A family in particular implements multiple Logic Array Blocks (LABs) interconnected by a programmable switch matrix (PIA), with on-chip EEPROM configuration cells that retain bitstream without external memory. The 512-macrocell density places the EPM3512 in the upper end of the MAX 3000A family, suitable for medium-complexity bus bridges and peripheral controllers.
Key features of the EPM3512AFC256-22 include 512 macrocells across 16 Logic Array Blocks, programmable I/O standards (2.5V, 3.3V, or 5.0V VCCIO), IEEE Std. 1532-compliant in-system programmability (ISP), and JTAG boundary-scan test support. The FC256 package (FineLine BGA, 256 balls, 1.0 mm pitch) maximizes board density while the A-grade denotes the commercial/industrial process with 5.0V tolerant I/O. The device operates from a 3.3V VCCINT supply and supports hot-socketing for live insertion.
Typical applications include bus decoding and address mapping in embedded processor boards, peripheral glue logic between microcontrollers and ASICs, board-level signal conditioning and voltage translation, and replacement of multiple 74-series TTL packages with one programmable device. The instant-on EEPROM-based architecture makes the MAX 3000A family especially valuable in safety-critical or industrial systems where a long FPGA configuration time would be unacceptable.
When designing with the EPM3512AFC256-22, ensure that your I/O bank VCCIO is wired correctly for 2.5V, 3.3V, or 5.0V interfaces, and use the Altera/Intel Quartus design suite for synthesis and fitting. For a lower-density drop-in option in the same package, consider the EPM3256AFC256 family (256 macrocells), or for higher density, the EPM3512AFC256 variants with faster speed grades (-15, -10).
ドロップイン代替品: EPM3512AFC256-22 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EPM3512AFC256-22 （同一形状・フットプリント） — 相違点: Package, Logic Array Blocks (LABs), In-System Programmability, Usable Gates, Configuration Memory.
クイック比較ツール — 並列比較する代替部品を選択:
EPM3512AFC256-10N
✅ ドロップイン✓ 在庫あり
$43.22 / 個
データシートを見る →EPM3512AFC256-10
✅ ドロップイン✓ 在庫あり
$17.5 / 個
データシートを見る →EPM3512AFC256-21
✅ ドロップイン✓ 在庫あり
$18.75 / 個
データシートを見る →EPM3512AFC256-20
✅ ドロップイン✓ 在庫あり
$9.75 / 個
データシートを見る →EPM3256AFC256-10
✅ ドロップイン✓ 在庫あり
$19.95 / 個
データシートを見る →EPM3512AFC256-22 最大定格＆電気的特性
| Family | MAX 3000A |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Macrocells | 512 |
| Logic Array Blocks (LABs) | 16 |
| Maximum User I/O Pins | 208 (typical for FC256 package) |
| Speed Grade | -22 (tPD ~22 ns) |
| Propagation Delay (tPD) | 22 ns |
| Supply Voltage VCCINT | 3.3 V |
| I/O Standards Supported | 2.5 V, 3.3 V, 5.0 V (VCCIO selectable) |
| In-System Programming | IEEE Std. 1532-compliant ISP via JTAG |
| Configuration Memory | On-chip EEPROM (non-volatile) |
| パッケージ | FC-256 (FineLine BGA, 256 balls, 1.0 mm pitch) |
| 実装タイプ | Surface Mount (BGA) |
EPM3512AFC256-22 fc-256 (fineline bga, 256 balls, 1.0 mm pitch) ピン配置ガイド
EPM3512AFC256-22 (fc-256 (fineline bga, 256 balls, 1.0 mm pitch) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EPM3512AFC256-22.
詳細は データシート をご参照ください。
主な用途
EPM3512AFC256-22 の用途: 6 件s: Bus Address Decoding and Mapping, Peripheral Glue Logic Consolidation, Board-Level Voltage Translation Bridge, Industrial Control State Machine, Legacy Peripheral Emulation and Replacement, Test and Measurement Fixture Logic.
Bus Address Decoding and Mapping
The EPM3512AFC256-22 fits bus address decoding because its 512 macrocells comfortably handle wide-address decoders (24-32 bits) and chip-select generation for multiple peripherals. The 22 ns tPD is fast enough to provide stable chip selects within a single memory or peripheral access cycle of common microcontrollers and DSPs. According to the MAX 3000A datasheet, the device supports 5.0V VCCIO so it can directly interface with legacy TTL peripherals while running its core from 3.3V VCCINT. The non-volatile EEPROM configuration also means the decoder powers up active with valid chip selects before the host processor even begins its boot ROM fetch.
おすすめ
Peripheral Glue Logic Consolidation
The EPM3512AFC256-22 consolidates dozens of 74-series TTL packages (latches, muxes, encoders, shift registers) into one programmable device, reducing PCB area and BOM cost in legacy industrial designs. With 16 Logic Array Blocks and 512 macrocells, the device can replace 20-30 discrete logic chips while maintaining the deterministic timing that made the original TTL design work. Per the MAX 3000A family datasheet, the JTAG boundary-scan (IEEE 1149.1) support lets you keep board-level test coverage after consolidation. The instant-on EEPROM configuration also preserves the fail-safe behavior of pure combinational TTL, which is critical for safety interlocks.
おすすめ
Board-Level Voltage Translation Bridge
The EPM3512AFC256-22 acts as a voltage translation bridge between 5.0V legacy buses and 3.3V or 2.5V modern peripherals because the MAX 3000A family supports mixed-voltage I/O banks via separate VCCIO pins. According to the datasheet, each I/O bank can be powered independently at 2.5V, 3.3V, or 5.0V, so the device can sit physically between a 5V microcontroller bus and a 3.3V FPGA or DSP without external level shifters. With 512 macrocells, the bridge can also perform bus width conversion (e.g., 16-bit legacy to 32-bit modern) in the same device, simplifying board stack-up.
おすすめ
Industrial Control State Machine
The EPM3512AFC256-22 is well suited to industrial control state machines because its non-volatile EEPROM configuration eliminates the FPGA-style boot delay that could be hazardous in motor-control or process-control loops. With 512 macrocells, the device can implement multi-state FSMs with 32-64 states plus parallel datapath logic for sensor debouncing, encoder decoding, and PWM generation. The 22 ns tPD is more than adequate for sub-microsecond control loop response at typical PLC scan rates (1-10 ms). Per the MAX 3000A datasheet family, the industrial temperature grade option supports -40C to +85C operation.
おすすめ
Legacy Peripheral Emulation and Replacement
The EPM3512AFC256-22 is used to emulate obsolete or end-of-life peripherals (custom ASICs, vintage I/O controllers) in legacy system sustainment programs. Because the FC-256 BGA matches other MAX 3000A family members, sustainment engineers can drop in a faster speed grade or lower-density variant when the original -22 is out of stock. The Quartus design suite retains backward compatibility across the family, so legacy HDL designs can be re-targeted without HDL rewrite. According to the Alldatasheet listing, the EPM3512A family datasheet (42 pages) covers all package variants and dedicated pin-outs needed for emulation work.
おすすめ
Test and Measurement Fixture Logic
The EPM3512AFC256-22 provides programmable pattern generation and timing control in test and measurement fixtures (ICT bed-of-nails, functional testers) because its JTAG and ISP interfaces let engineers re-program the device in seconds between test runs. With 208+ user I/O pins in the FC-256 package, one EPM3512AFC256-22 can drive a full parallel test bus plus handshake logic. The 22 ns tPD is appropriate for sub-50 MHz test vectors typical of boundary-scan and cluster test systems. Per the MAX 3000A datasheet, IEEE Std. 1532 ISP compliance means the device can be re-programmed in-circuit without removing it from the fixture.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EPM3512AFC256-22 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EPM3512AFC256-10N | EPM3512AFC256-10 | EPM3512AFC256-21 | EPM3512AFC256-20 | EPM3256AFC256-10 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FC-256 (256-ball BGA, 1.0 mm pitch) | FC-256 (256-ball BGA) - same | FC-256 (256-ball BGA) - same | FC-256 (256-ball BGA) - same | FC-256 (256-ball BGA) - same | FC-256 (256-ball BGA) - same |
| Family | MAX 3000A | MAX 3000A - same | MAX 3000A - same | MAX 3000A - same | MAX 3000A - same | MAX 3000A - same |
| Macrocells | 512 | 512 - same | 512 - same | 512 - same | 512 - same | 256 (-50%) |
| Speed Grade (tPD) | 22 ns | ~10 ns (faster) | ~10 ns (faster) | ~21 ns (similar) | ~20 ns (slightly faster) | ~10 ns (faster) |
| VCCINT | 3.3 V | 3.3 V - same | 3.3 V - same | 3.3 V - same | 3.3 V - same | 3.3 V - same |
| I/O Standards (VCCIO) | 2.5V / 3.3V / 5.0V | 2.5V / 3.3V / 5.0V - same | 2.5V / 3.3V / 5.0V - same | 2.5V / 3.3V / 5.0V - same | 2.5V / 3.3V / 5.0V - same | 2.5V / 3.3V / 5.0V - same |
| Configuration Memory | EEPROM (non-volatile) | EEPROM - same | EEPROM - same | EEPROM - same | EEPROM - same | EEPROM - same |
| In-System Programming | IEEE Std. 1532 (JTAG) | IEEE Std. 1532 - same | IEEE Std. 1532 - same | IEEE Std. 1532 - same | IEEE Std. 1532 - same | IEEE Std. 1532 - same |
主な差別化要因
- Slowest speed grade in the FC-256 BGA, often cheapest on the secondary market （vs EPM3512AFC256-10N)
- Highest macrocell density available with this slow speed grade in the MAX 3000A family （vs EPM3256AFC256-10)
- Pin-compatible with all other EPM3512AFC256 speed grades for in-the-field upgrade （vs EPM3512AFC256-15)
- Non-volatile EEPROM configuration enables instant-on behavior impossible with FPGAs （vs Modern MAX II (EPM2210GF256C5N))
設計ノート
The MAX 3000A family uses a split-rail power architecture: VCCINT powers the internal logic and input buffers (always 3.3V for the EPM3512A), while VCCIO powers the I/O output drivers and can be tied to 2.5V, 3.3V, or 5.0V. Per the MAX 3000A datasheet, decoupling must include at least one 0.1 uF ceramic cap adjacent to every VCCINT and VCCIO pin pair, plus a bulk 10-100 uF tantalum or polymer cap per supply rail. Estimated: at 50 MHz toggle rate with 50% I/O utilization, the FC-256 device draws approximately 200-400 mA from VCCINT - design the 3.3V regulator with at least 25% margin.
The FC-256 FineLine BGA uses a 1.0 mm ball pitch, which requires microvia PCB technology (laser-drilled vias or stacked vias) for fan-out. Per IPC-7351 and the MAX 3000A package guidelines, allow at least 4 routing layers with continuous power/ground planes beneath the BGA to control simultaneous-switching noise (SSN) on the 208+ I/O pins. Estimated: a full BGA fan-out requires approximately 4-6 PCB layers with 4-mil trace/space design rules. Use the Altera/Intel package footprint file (or download from the Intel FPGA board design resource center) to ensure your land pattern matches the recommended NSMD (non-solder mask defined) pad geometry.
Do not leave VCCIO pins floating - the EPM3512AFC256-22 has multiple VCCIO banks and each must be tied to a valid supply (2.5V, 3.3V, or 5.0V) even if the bank is unused. Per the MAX 3000A datasheet, an unpowered VCCIO bank can cause I/O pin behavior to be undefined and may increase quiescent current. Also ensure the JTAG TCK pin is pulled to a known state (typically low) during power-up to prevent unintended ISP operations. Finally, configure unused I/O pins as outputs driving low (or as inputs with internal pull-up enabled) to minimize power and reduce SSN - the Quartus fitter default handles this if you enable 'Auto implement unused pins' in the device options.
Place the EPM3512AFC256-22 with its JTAG chain accessible at a board-level test header so IEEE Std. 1532 in-system programming can be performed after PCB assembly. Per the MAX 3000A datasheet, the JTAG pins (TCK, TMS, TDI, TDO, and optional TRST) must be series-terminated with 100-200 ohm resistors if the TCK trace exceeds 50 mm to prevent ringing. Keep TCK trace length under 100 mm total and route it on an inner signal layer with ground reference. The TDO signal should be pulled up to VCCIO of the JTAG bank (typically 3.3V) through a 10 kohm resistor if the JTAG chain is breakable.
The MAX 3000A family outputs can source/sink 25 mA per pin (per datasheet), making them well-suited for direct LED drive or bus termination, but simultaneous switching of many outputs can cause ground bounce. Per the MAX 3000A datasheet, limit simultaneously-switching outputs (SSO) to roughly 16-20 pins per VCCIO/GND pair to keep ground bounce below 1V. Use chip-on-board ground inductance minimization (multiple via arrays under the BGA) and consider adding 22-33 ohm series termination on high-speed outputs that drive more than 50 mm of trace. Estimated: at 22 ns tPD, the output edge rate is approximately 2-3 ns, so treat traces longer than one-quarter of the edge-rate-length product (~150 mm at 50 MHz) as transmission lines.
コンプライアンス情報
Compliance status for the EPM3512AFC256-22 was not present in the verified web data; the MAX 3000A family is obsolete, so a current RoHS/REACH declaration may not be published by Intel. The part is not AEC-Q100 qualified (CPLDs are not typically automotive-qualified unless explicitly listed).
