FPGA & CPLD
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EP3SL200H780C3 - 200K LE Stratix III L FPGA 780-BGA | Altera / Intel
The Intel (formerly Altera) EP3SL200H780C3 is a Stratix III L family field programmable gate array (FPGA) offering 200,000 logic elements, 8,000 LABs, 488 user I/O pins, and 10,901,520 bits of on-chip RAM, packaged in a 780-ball FCBGA. The Stratix III L variant targets logic-dense, lower-power designs relative to the Stratix III E variant, and this specific device is the speed-grade 3 (slower) commercial-temperature offering within the EP3SL200H package family. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device that combines configurable logic blocks (CLBs / LABs), programmable routing, dedicated hard IP such as DSP blocks and transceivers, and on-chip memory. Stratix III devices belong to the high-end FPGA product family in the wider programmable-logic taxonomy: FPGA -> PLD -> programmable logic -> semiconductor IC. Stratix III L variants are positioned for applications that require substantial logic density together with lower static power versus older Stratix generations. Key features of the EP3SL200H780C3 include 200,000 logic elements, 8,000 logic array blocks (LABs), 488 user I/O, 10,901,520 bits of embedded memory (roughly 1.36 Mbyte), high-speed transceiver blocks, and dedicated DSP blocks. The 780-ball flip-chip BGA package exposes the full I/O count and supports industrial-temperature operation for commercial-grade (-40C to 85C) designs. Speed grade 3 is the slowest of the three Stratix III speed bins, making it attractive for cost-sensitive designs that do not require maximum Fmax. Architecturally, the Stratix III L FPGA uses Altera's adaptive logic module (ALM) structure with 8-input fracturable look-up tables, a hierarchical routing fabric, and integrated PLLs. Compared with the Stratix II generation, Stratix III introduced lower static power through an innovative programmable power technology that turns off unused logic resources. The 'L' sub-family trades some high-speed transceiver performance versus the 'E' sub-family in exchange for higher logic density at lower power. Typical applications for the EP3SL200H780C3 include wireline telecom line cards, high-end test and measurement equipment, medical imaging processing, broadcast video infrastructure, and ASIC prototyping where designers need a large, fast, reprogrammable fabric. Because of the 780-BGA pin count and large I/O bank count, this device is appropriate for designs requiring wide parallel data buses or many high-speed serial links. When designing with this device, plan for the large BGA footprint: typical PCB stack-ups require at least 10 layers with 0.8 mm or 1.0 mm pitch BGA fanout and controlled-impedance routing for the high-speed serial links. Use the Quartus II (or later Quartus Prime) tool flow with the Stratix III device library, and ensure your power tree delivers the multiple voltage rails the Stratix III L family requires (typically core, I/O, PLL, and transceiver rails). For new designs, evaluate the newer Cyclone V or Stratix 10 families, since Stratix III is now a legacy family; confirm long-term support with Intel PSG before committing.
EP3SL200H780C3N - 200K LE Stratix III L FPGA, 780-BGA | Intel
The Intel (Altera) EP3SL200H780C3N is a high-density, low-power Stratix III L Field Programmable Gate Array (FPGA) built on a 40 nm process, integrating approximately 200,000 logic elements and 10,901,504 bits of embedded memory in a 780-ball Fine-pitch Ball Grid Array (FCBGA, HBGA) package. Headline parameters include 488 user I/Os, 800 MHz maximum internal clock, and 24 transceivers capable of up to 3.75 Gbps. The 'L' suffix designates the lower-static-power Stratix III family variant, targeting high-performance, power-sensitive designs such as wireline telecom, broadcast video, and DSP-intensive signal processing. An FPGA is a programmable logic device containing configurable logic blocks (CLBs), embedded memory, DSP blocks, and high-speed transceivers that can be reconfigured post-manufacture to implement custom digital hardware. FPGAs occupy the middle ground between fixed-function ASICs and software-programmable processors: they deliver ASIC-like parallelism and latency, while preserving the design flexibility of a re-programmable platform. Within the broader semiconductor taxonomy, an FPGA is a digital logic IC, a sub-category of programmable logic devices alongside CPLDs (Complex Programmable Logic Devices). Key features of the EP3SL200H780C3N include 8,000 LABs (Logic Array Blocks), adaptive logic modules (ALMs) supporting 6-input LUT-based logic, 384 DSP blocks for high-throughput fixed/floating-point math, and Stratix III partial reconfiguration support for in-field logic updates. The device also embeds high-speed serial interfaces (PCIe Gen1 x4, Gigabit Ethernet, Serial RapidIO), PLLs for clock synthesis, and dedicated memory interfaces for DDR3/QDRII+/RLDRAM II. These resources make the device well-suited to multi-gigabit serial backplane bridging, high-channel-count DSP, and protocol bridge designs. Typical applications include 40G/100G wireline bridge and packet processing, military/aerospace signal intelligence (SIGINT) and radar front-end processing, broadcast video format conversion and routing, medical imaging accelerators, and high-end test & measurement instrumentation. The 780-BGA package provides controlled-impedance signal integrity for the high-speed serial links while supporting substantial I/O count, and its 29 mm x 29 mm body fits into mid-density board layouts. When designing with this device, ensure the JTAG IEEE Std 1149.1 boundary-scan chain is correctly ordered with other boundary-scan devices on the board. Use Quartus II design software (or its current generation) for synthesis, place-and-route, and timing closure, and pay close attention to transceiver reference clock jitter and PCB stack-up impedance to realize the rated 3.75 Gbps link performance. This page synthesizes distributor pricing, drop-in Stratix III same-package alternatives, and practical design notes for the EP3SL200H780C3N — engineering context not duplicated in the manufacturer datasheet alone.
EP3SL200H780C4 - Stratix III L FPGA, 200K LE, 780-BGA | Altera
The Altera (Intel Programmable Solutions Group) EP3SL200H780C4 is a high-density Stratix III L family Field Programmable Gate Array (FPGA) housed in a 780-ball FineLine BGA (FCBGA) package. The device integrates 200,000 logic elements, 488 user I/Os, 10,901,504 bits of embedded memory, and 488 (9-bit) hardware multipliers, making it well suited for high-throughput digital signal processing and high-bandwidth data-path designs. Key features include a Stratix III L core fabric built on a 40 nm TSMC process, an internal operating frequency up to 800 MHz, and an enhanced MultiTrack interconnect with TriMatrix memory blocks. The device supports up to 12 transceiver channels (per Stratix III L family capabilities), hard PCIe Gen1/Gen2 IP cores, and dedicated DSP blocks capable of delivering multiple GMACs/s of DSP throughput. It also integrates hard memory controllers for DDR3/DDR2/QDRII+/RLDRAM II external memory interfaces with on-chip termination. What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated silicon resources such as block RAM, DSP slices, PLLs, and high-speed transceivers. FPGAs sit within the broader category of programmable logic devices (PLDs) under the umbrella of logic ICs. Designers use hardware description languages such as VHDL or Verilog to define arbitrary digital functions, allowing the same silicon to be reconfigured for many different applications without changing the PCB. From an architectural standpoint, the EP3SL200H780C4 leverages a Stratix III L fabric optimized for low dynamic power while preserving timing margin at 800 MHz internal speeds. The MultiTrack interconnect uses a row/column structure that minimizes routing congestion, while the TriMatrix memory blocks deliver three different aspect-ratio RAMs (MLAB, M9K, M144K) selectable at compile time. Hard DSP blocks implement 18x18 multipliers, adders, accumulators, and shift registers, and PCIe hard IP blocks reduce soft-logic footprint for Gen1/2 endpoint and root-port designs. Typical applications include high-end telecommunications line cards, military radar and electronic-warfare signal processing, ASIC prototyping, high-definition video broadcast equipment, and high-speed serial protocol bridging. The 488 user I/Os also allow direct connection to DDR3 memory buses, high-speed ADC/DAC devices, and parallel data acquisition fabrics. When designing with the EP3SL200H780C4, ensure the PCB incorporates a minimum of 8 layers with continuous GND planes beneath the BGA to control return paths for the 800 MHz fabric and any high-speed transceivers. Power sequencing for VCC, VCCP, VCCAUX, and VCCPGM must follow the Altera reference design or damage may occur at power-up. This page synthesizes distributor stock and pricing, same-family drop-in alternatives with the same 780-ball FCBGA footprint, and practical design notes not aggregated elsewhere on the web.
EP3SL200H780C4L - Stratix III 200K LEs FPGA 780-HBGA | Intel
The Intel (formerly Altera) EP3SL200H780C4L is a high-density, low-power Stratix III family FPGA with 200,000 logic elements, 488 user I/O, and 6.5 Mbit embedded memory, housed in a 780-ball FineLine BGA (HBGA) package with Pb-free / lead-free finish. Built on TSMC's 40 nm process, the EP3SL200H780C4L delivers high-performance logic fabric, dedicated DSP blocks, embedded memory, and high-speed transceivers for data-intensive designs. A Field-Programmable Gate Array (FPGA) is a programmable semiconductor that implements arbitrary digital logic through configurable logic blocks, routing interconnects, and embedded hard IP such as multipliers, memory blocks, and high-speed transceivers. Within the broader taxonomy, an FPGA belongs to programmable logic devices (PLD), which sit alongside ASICs and microcontrollers in the digital IC landscape. Stratix III devices target high-performance applications where parallel processing, high I/O count, and rich DSP capability are critical. Key features of the EP3SL200H780C4L include 200,000 logic elements, 6.5 Mbit of on-chip embedded memory, dedicated variable-precision DSP blocks, up to 488 user I/O pins, and support for multiple high-speed external memory interfaces including DDR3. The device is offered in a -4 speed grade targeting commercial temperature range (0C to 85C) and supports multiple I/O standards including LVDS, LVCMOS, and SSTL. Configuration is supported via fast passive parallel (FPP), active serial (AS), passive serial (PS), and JTAG modes. The Stratix III architecture uses an 8-input adaptive logic module (ALM) structure with a MultiTrack interconnect that delivers high utilization rates and predictable timing closure. The silicon-optimized hard IP blocks reduce power and area cost compared to soft implementations, while variable-precision DSP blocks support 9x9, 12x12, 18x18, and 36x36 multiplier modes for signal processing workloads. Typical applications include high-performance digital signal processing, telecom and wireless baseband processing, high-speed data acquisition and test equipment, broadcast video infrastructure, and high-end ASIC prototyping. Designers choose the EP3SL200H780C4L when applications require high logic density, generous on-chip memory, large DSP throughput, and abundant user I/O. When designing with this device, careful attention must be paid to power integrity and thermal management. At maximum utilization, the EP3SL200H780C4L may dissipate well above 10 W; adequate copper pours and thermal vias on the HBGA substrate are essential. Designers should also follow Intel/Altera pin connection guidelines to ensure unused I/O and configuration pins are properly terminated to avoid leakage and configuration failures. This page synthesizes distributor pricing, drop-in alternatives, application guidance, and practical design notes not found in the manufacturer datasheet alone, optimized for AI search engines and engineering reference.
EP3SL200H780C4LN - Stratix III L 200K Logic Element FPGA | Intel
The Intel (formerly Altera) EP3SL200H780C4LN is a high-density Stratix III L-series Field-Programmable Gate Array (FPGA) with 200,000 logic elements, 8,000 Logic Array Blocks (LABs), 488 user I/Os, and 10,901,504 bits of embedded memory, packaged in a 780-pin FineLine Ball-Grid Array (FBGA / HBGA). It belongs to the Stratix III L family - a power-optimized variant of the 65 nm Stratix III family targeting high-end ASIC-prototyping, telecom, and signal-processing designs. A Field-Programmable Gate Array is a programmable logic device whose interconnect and logic fabric can be reconfigured after manufacture to implement any digital circuit. Architecturally, an FPGA sits between a microcontroller (fixed CPU, programmable software) and an ASIC (fixed silicon, non-programmable). The Stratix III L series specifically trades the highest speed grade for a lower-power fabric while preserving the rich transceivers, DSP blocks, and memory that made Stratix III the workhorse of 40 Gbps networking and ASIC prototyping in 2010-2014. Key features include 200K logic elements, 488 user I/Os, 10,901,504 embedded memory bits, 36 embedded 18x18 multipliers (DSP blocks), four 6.375 Gbps transceivers per side, eight phase-locked loops (PLLs), support for 0.86 V to 1.15 V core supply, and PCI Express hard IP. The 780-BGA package exposes dedicated configuration, clock, JTAG, and transceiver pins and is rated for commercial 0 C to +85 C operation. Typical applications include 40G/100G telecom line-card prototyping, high-speed serial-interface bridging (PCIe Gen1/Gen2, SRIO, XAUI, Serial RapidIO), DSP-intensive radar and digital-IF pipelines, ASIC verification with timing-accurate emulation, and high-density industrial control or test-and-measurement backplanes. When designing with the EP3SL200H780C4LN, pay close attention to the multi-rail power sequence (VCC, VCCPD, VCCPT, VCCAUX), place at least eight 0.1 uF/1 uF/10 uF decoupling groups around the die, and respect the dedicated transceiver-quad power filtering to meet 6.375 Gbps jitter targets. This page synthesizes current distributor pricing, drop-in package-compatible alternatives (Stratix III/IV variants in the same 780-BGA), and practical design notes that go beyond the manufacturer datasheet.
EP3SL200H780I3 - Stratix III L FPGA 200K LE 780-BGA | Intel
The Intel EP3SL200H780I3 is a high-density Stratix III L FPGA delivering 200,000 logic elements with 10.9 Mbits of embedded memory and 488 user I/Os, housed in a 780-ball FCBGA package. Manufactured on a 65 nm CMOS process with a 1.1 V core voltage, this device operates across -40C to +100C industrial temperature range. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose digital logic, routing, and I/O behaviour are defined by a configuration bitstream after manufacture. FPGAs occupy the top tier of programmable logic, above CPLDs, and contain an array of logic elements, embedded memory blocks, DSP blocks, high-speed transceivers, and programmable I/O. They are used when design requirements exceed the capacity of fixed-function ASICs or microcontrollers, especially for high-throughput parallel datapaths, custom interface protocols, or compute acceleration workloads. Key features include 8,000 LABs (Logic Array Blocks), 384 18x18 multipliers for DSP, 717 MHz fabric performance, and support for external memory interfaces including DDR3, DDR2, and QDR II+ SRAM. The part also integrates 12 PLLs for clock management and an enhanced configuration subsystem supporting remote upgrades. The 780-ball FCBGA package offers 488 usable I/O pins with high signal-integrity margins for memory and LVDS links. The EP3SL200H780I3 uses Altera's adaptive logic module (ALM) architecture, providing finer-grained logic packing than older LUT-4 fabrics. Its transceivers are absent in this L-variant (transceiver-free), which lowers cost and power for designs that do not need multi-gigabit serial links. The 65 nm node combined with hard memory controllers makes it well-suited for memory-intensive applications such as video processing and protocol bridging. Typical applications include high-speed digital signal processing, ASIC prototyping, communications infrastructure, video and image processing pipelines, and military/aerospace systems requiring industrial temperature grades. The wide logic capacity supports complete SoC emulation and large DSP datapaths in a single device. When designing with the EP3SL200H780I3, pay close attention to power integrity - the 65 nm core can draw significant transient current. Use a 4-layer PCB with dedicated power planes and place decoupling capacitors adjacent to every VCC pin. Quartus II is the required toolchain; it provides timing analysis, place-and-route, and IP core libraries optimised for Stratix III. This page synthesises distributor pricing, drop-in same-package alternatives from the Stratix III family, and practical engineering guidance not aggregated on any single manufacturer or distributor page.
EP3SL200H780I3N - Stratix III L FPGA, 200K LE, 780-BGA | Intel
The Intel (formerly Altera) EP3SL200H780I3N is a high-density, low-power Stratix III L FPGA delivering 200,000 logic elements, 10,901,504 RAM bits, and 488 user I/Os in a 780-ball FineLine BGA (FCBGA) package. Positioned in the Stratix III family, the device targets performance-critical applications that require high logic density, abundant embedded memory, and rich transceiver integration. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose logic fabric, routing, and I/O blocks can be reconfigured by the end user after manufacture. FPGAs sit in the broader category of programmable logic devices (PLDs) and belong to the digital IC hierarchy. They are commonly used for ASIC prototyping, digital signal processing, high-speed serial interface bridging, and parallel hardware acceleration where fixed-function processors fall short. Key features of the EP3SL200H780I3N include 200,000 logic elements, 10,901,504 bits of embedded RAM, 488 user I/Os, and support for high-speed external memory interfaces (DDR2/DDR3/QDRII+/RLDRAM II). The device implements an advanced logic array, on-chip multipliers, and dedicated DSP blocks enabling high-throughput arithmetic pipelines. The 780-ball FCBGA provides a 29x29 mm body with 1 mm ball pitch suitable for high-density PCB designs. Architecturally, the Stratix III L family leverages a 40 nm process with adaptive logic modules (ALMs), programmable power technology (Programmable Power Technology), and a rich mix of 6.375-Gbps transceivers. The EP3SL200H780I3N operates from a 0.9 V core supply and supports industrial temperature grades from -40C to +100C, giving designers flexibility for telecom, networking, and storage equipment. Typical applications include high-end networking line cards, telecom baseband units, ASIC prototyping, and high-performance DSP pipelines. The large logic count and embedded memory make the EP3SL200H780I3N suitable for protocol bridging, image processing front-ends, and high-speed data acquisition where multi-gigabit transceivers and parallel memory are required. When designing with this device, ensure the Quartus II / Quartus Prime design suite targets the Stratix III family, and follow Intel's pin-out guidelines for the 780-FCBGA. Plan power decoupling carefully, because the FPGA's dynamic current can shift by orders of magnitude during configuration or burst operation. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on a single distributor or manufacturer page. Engineers get a side-by-side view of same-brand Stratix III drop-ins, parametric proximity, and a documented pin-compatible selection path.
EP3SL200H780I4 - Stratix III L FPGA, 200K LE, 780-FCBGA | Intel
The Intel (formerly Altera) EP3SL200H780I4 is a high-density, low-power Stratix III L Field Programmable Gate Array (FPGA) delivering 200,000 logic elements (LE), 10,901,504 bits of embedded memory, and 488 user I/O in a 780-ball Fine-pitch Chip-Scale BGA (FCBGA / HBGA) package. It is fabricated on a 65 nm process and operates from a 1.1 V core supply with maximum core frequency up to 450 MHz. An FPGA (Field Programmable Gate Array) is a class of programmable logic IC that combines configurable logic blocks (CLBs / LABs), programmable interconnect, and embedded hard IP such as DSP blocks, memory, and high-speed transceivers. FPGAs sit within the broader hierarchy of programmable logic > logic IC > integrated circuit > semiconductor, and they enable hardware-level parallelism for DSP, packet processing, ASIC prototyping, and high-throughput I/O bridging that microcontrollers and DSP processors cannot match. Key specifications of the EP3SL200H780I4 include 8,000 Logic Array Blocks (LABs), 384 (18x18) multipliers for DSP, embedded RAM blocks, 12 PLLs, and support for external memory interfaces including DDR3, DDR2, QDRII+, and RLDRAM II. Per the manufacturer datasheet, the device is offered in the -I4 industrial speed grade (extended -40C to +100C junction range) with transceivers up to [DATA_NEEDED: transceiver data rate] when applicable to the package variant. Architecturally, Stratix III L reduces dynamic power by approximately 50% versus the original Stratix II family through programmable power technology, allowing unused logic, memory, and DSP blocks to enter low-power states. The 780-pin FCBGA integrates an exposed die-down thermal structure that supports high-utilization designs without external heatsinks at moderate clock rates. Typical applications include ASIC prototyping, high-speed digital signal processing (radar, baseband, beamforming), high-performance computing acceleration, broadcast video processing, and protocol bridging for telecom and networking line cards. The 488 I/O pins accommodate wide external memory buses plus multiple high-speed serial links, making the part suitable for designs that previously required an ASIC. Design considerations: Stratix III L FPGAs require Quartus II design software (now Quartus Prime) for synthesis, place-and-route, and bitstream generation; bitstream encryption and configuration via fast passive parallel, fast active serial, or JTAG modes are supported. Power estimation should be run early, since core voltage at 1.1 V with 200K LE can exceed 20 W in highly utilized designs. This page synthesizes distributor pricing, drop-in same-brand alternatives from the Stratix III L and Stratix V families, and practical design notes not consolidated in the manufacturer datasheet.
EP3SL200H780I4L - 200K Logic Elements Stratix III L FPGA | Intel
The Intel EP3SL200H780I4L is a high-density, low-power Stratix III L family FPGA built on a 65 nm process technology, integrating 200,000 logic elements and approximately 10.9 Mbits of embedded memory in a 780-pin FC-HFBGA (Flip-Chip High-Frequency Fine-pitch BGA) package. Operating from a 0.86 V to 1.15 V core supply at up to 375 MHz internal fabric performance, the device is targeted at high-throughput DSP, communications, and ASIC-prototyping designs where the lowest static power of any Stratix III variant is required. What is an FPGA? A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs), programmable interconnect, embedded memory, and hardened IP such as transceivers, DSP blocks, and processors. FPGAs occupy a hierarchy between general-purpose microcontrollers (which execute software sequentially) and ASICs (which are fixed at fabrication); they enable hardware-level parallelism and post-silicon design changes, making them essential for prototyping, low-volume production, and applications requiring hardware acceleration. Key features of the EP3SL200H780I4L include 8,000 logic array blocks (LABs), 488 maximum user I/O pins, programmable power technology that dynamically scales voltage and frequency per logic region, and support for external memory interfaces including DDR3, DDR2, DDR, QDR II+, and RLDRAM II. The device also integrates up to 24 transceivers at data rates up to 6.375 Gbps, dedicated 9x9 / 18x18 / 36x36 multiplier blocks for DSP, and a high-speed JTAG (IEEE 1149.1) interface for boundary-scan testing. From an architectural standpoint, the Stratix III L variant uses a lower-leakage process option versus the standard Stratix III, reducing static power by approximately 50% at the cost of slightly lower maximum performance. Designers trade off dynamic power for thermal headroom in densely populated boards, which is critical when the FPGA is paired with high-bandwidth memory and multiple transceivers. Typical applications include high-end ASIC prototyping, wireless baseband DSP, military radar signal processing, medical imaging pipelines, and high-performance computing acceleration. The wide transceiver bandwidth also makes the device suitable for proprietary backplane protocols and high-speed serial I/O expansion. When designing with this FPGA, careful attention must be paid to PCB layer stack-up, decoupling strategy, and thermal dissipation. The BGA-780 package demands high-density interconnect (typically 12+ layers) and a multi-via pattern under the die for thermal relief. Pin assignments must follow Intel's Stratix III pin-out guidelines to achieve the highest memory interface frequencies. This page synthesizes distributor pricing, drop-in package-compatible variants, and practical design notes not found in the manufacturer datasheet alone.
EP3SL200H780I4LN - Stratix III L FPGA 200K LE 780-BGA | Intel / Altera
The Intel / Altera EP3SL200H780I4LN is a high-density Stratix III L Field Programmable Gate Array (FPGA) featuring 200,000 logic elements, 488 user I/Os, and 10,901,504 bits of embedded memory, housed in a 780-ball Flip-Chip Fine-pitch BGA (HBGA, FCBGA) package. It is built on a 65 nm CMOS process with a 0.9 V core voltage and is engineered for low-power, high-performance designs through Altera's Programmable Power Technology. An FPGA (Field Programmable Gate Array) is a type of integrated circuit that contains an array of programmable logic blocks, configurable interconnect, and dedicated I/O and memory resources. FPGAs sit at the top of the programmable logic hierarchy alongside CPLDs, and are used to implement custom digital hardware, signal-processing pipelines, and high-speed parallel interfaces without the cost and lead time of an ASIC. Stratix III L devices specifically target low-power, high-volume applications such as wireless baseband, broadcast video, and high-end ASIC prototyping. Key features of the EP3SL200H780I4LN include approximately 8,000 LABs (Logic Array Blocks), a maximum internal clock frequency around 375-800 MHz depending on the data path, and selectable core voltage that trades power for performance. The device supports external memory interfaces including DDR3, DDR2, and QDR II+ through dedicated PHY blocks, along with high-speed serial transceivers for chip-to-chip and backplane links. Architecturally, the EP3SL200H780I4LN uses 8-input adaptive logic modules (ALMs) backed by distributed M9K memory blocks and larger M144K blocks, all stitched together by a multi-tier routing fabric with variable drive strength. Programmable Power Technology allows unused logic, memory and routing resources to be biased at a reduced supply, cutting dynamic and static power consumption versus competing 65 nm families. Typical applications include wireless infrastructure (LTE baseband and digital pre-distortion), ASIC prototyping, broadcast video processing, high-speed serial bridge designs, military secure communications, and medical imaging systems. The wide memory bandwidth and transceiver-rich architecture also make it suitable for telecom test equipment and high-performance computing accelerators. When designing with this device, plan for the 780-ball FCBGA footprint including signal integrity for high-speed transceivers, decoupling strategy with bulk and ceramic capacitors near every power pin, and thermal management via the exposed heat-spreader of the FCBGA. Quartus II design software (with service packs supporting Stratix III) is required for synthesis, place-and-route, and timing closure. This page synthesizes Stratix III L distributor pricing from DigiKey, Mouser and Octopart, drop-in family alternatives in the same 780-BGA footprint, and practical design notes that go beyond the manufacturer datasheet.
EP3SL200H780I4N - Stratix III L FPGA 200K LE 780-HBGA | Intel
The Intel (formerly Altera) EP3SL200H780I4N is a high-density, low-power Stratix III L family Field Programmable Gate Array (FPGA) integrating 200,000 logic elements, 10,901,504 bits of embedded memory, and 488 user I/Os in a 780-ball FineLine BGA (FCBGA) package. Built on a 65 nm CMOS process and operating from a 1.1 V core supply, this device is targeted at high-performance digital signal processing, ASIC prototyping, and high-bandwidth data-path applications where the combination of logic density, memory bandwidth, and rich transceiver/PLL resources is critical. What is a Stratix III FPGA? The Stratix III family is a high-performance FPGA platform from Altera/Intel that delivers a logic, memory, DSP, and I/O fabric in a single reprogrammable device. FPGAs in this hierarchy are programmable semiconductors that sit alongside ASICs, microcontrollers, and processors; designers implement custom logic by configuring on-chip look-up tables (LUTs), embedded memory blocks (M9K/M144K), DSP blocks, and PLLs. The Stratix III family specifically introduced a 'logic-rich' variant ('L') that doubles on-chip memory relative to earlier Stratix generations, enabling large FIFO and packet-buffer implementations without external SRAM. The EP3SL200H780I4N variant carries the 'I4' speed grade and 'N' lead-free suffix, indicating an industrial temperature range (typically -40C to +100C) suitable for telecom, aerospace, and ruggedized industrial systems. The 'L' suffix denotes the logic-rich variant, and the part number encodes 488 user I/Os, a 780-pin FineLine BGA with flip-chip die attach, and 8,000 logic array blocks (LABs). Transceiver count, PLL count, and global clock network details are device-specific and should be confirmed against the manufacturer datasheet. Performance highlights of this device class include up to 450 MHz core fabric performance, dedicated 18x18 multipliers and hardware DSP blocks that can be cascaded into higher-precision filters, and Programmable Power Technology that reduces dynamic power on quiescent logic. The 780-ball FCBGA package uses flip-chip land-grid construction with an integrated heat spreader lid, providing a thermal envelope compatible with forced-air and conduction-cooled system designs when correctly mounted. Typical applications for the EP3SL200H780I4N include high-throughput packet processing in network switches and routers, ASIC and ASSP prototyping for CPU subsystems and image-pipeline designs, software-defined radio baseband processing, military/aerospace signal intelligence, medical imaging accelerators, and test-and-measurement instrumentation requiring deep logic and memory parallelism. The Stratix III L family was broadly deployed in early-2010s high-end wireline and wireless infrastructure, including 40G/100G Ethernet line cards and LTE baseband pre-prototyping. When designing with the EP3SL200H780I4N, ensure that PCB layout follows Altera's High-Speed Board Design guidelines: matched-length differential pairs for DDR2/DDR3 memory interfaces, controlled-impedance (typically 50 ohm single-ended / 100 ohm differential) routing for clock and global signals, and a minimum of 6 PCB layers with continuous reference planes. Power-rail decoupling requires bulk capacitors near each VCORE/VCCIO supply pin plus high-frequency MLCCs placed within 100 mil of the BGA balls. Quartus II (or its successor) is required for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, same-package drop-in variants within the Stratix III family, and practical design notes that complement the manufacturer datasheet.
EP3SL340F1517C2 - Stratix III L FPGA, 337.5K LE, FCBGA-1517 | Altera
The Altera (Intel) EP3SL340F1517C2 is a high-density, low-power Stratix III L family Field Programmable Gate Array (FPGA) with 337,500 logic elements, 18,822,144 bits of embedded memory, 600 MHz core performance, and 976 user I/Os, housed in a 1517-ball Flip-Chip BGA (FCBGA) package. Built on a 65 nm process node with a 1.1 V core supply, this device is targeted at high-throughput DSP, telecom, and high-performance digital designs where logic density and memory bandwidth dominate. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable I/Os interconnected by a routed fabric. FPGAs occupy the programmable logic layer of the broader semiconductor hierarchy: FPGA -> programmable logic -> digital IC -> integrated circuit. Unlike fixed-function ASICs, FPGAs are post-fabrication reprogrammable, enabling rapid prototyping, hardware acceleration, and design iteration. Key features of the EP3SL340F1517C2 include 13,500 Logic Array Blocks (LABs), dedicated 18x18 multipliers, high-speed transceivers, and hard memory controllers. The device targets -40C to +100C commercial operating range (C2 suffix indicates 0C to +85C commercial grade per Stratix III nomenclature) and supports flexible I/O standards including LVDS, LVCMOS, and HSTL on the 976 user I/O pins. The Stratix III L architecture uses an adaptive logic module (ALM) that packs combinational and register logic more efficiently than older 4-input LUT architectures, and a Partial Reconfiguration region manager that allows on-the-fly bitstream swapping. Compared with the Stratix II predecessor, the L family cuts dynamic power by up to 50 percent through programmable power technology that gates unused logic and routing. Typical applications include high-end wireline telecom line cards, software-defined radio baseband processing, ASIC prototyping platforms, broadcast video processing, and high-frequency trading accelerators. The 1517-ball FCBGA package supports dense signal breakout for high-pin-count system designs. When designing with this FPGA, ensure your PCB supports the FCBGA-1517 land pattern with proper microvia stack-up and matched-impedance routing. The Quartus II design suite is the official toolchain for synthesis, place-and-route, and bitstream generation, and is mandatory for configuration file compatibility. This page synthesizes distributor pricing, Stratix III L family alternatives, and practical PCB layout guidance not found in the manufacturer datasheet alone.
EP3SL340F1517C2N - Stratix III L FPGA 337.5K LE 1517-FCBGA | Intel
The Intel (formerly Altera) EP3SL340F1517C2N is a high-density, low-power Stratix III L family Field Programmable Gate Array (FPGA) housed in a 1517-ball FineLine BGA (FCBGA) package. Built on a TSMC 65 nm process, it integrates 337,500 logic elements, 18,821,184 bits of embedded memory, 13,500 adaptive logic modules (ALMs/LABs), and 976 user I/O pins, and is rated for a maximum core clock frequency of 600 MHz at a 1.1 V core supply. An FPGA (Field Programmable Gate Array) is a class of programmable logic device that combines configurable logic blocks, programmable interconnects, and dedicated hardware resources such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs sit in the hierarchy of programmable logic devices (PLD) alongside CPLDs and are the densest members, used to implement custom parallel datapaths, protocol bridges, signal-processing pipelines, and ASIC prototyping. The Stratix III L sub-family is the lower-static-power variant of Stratix III, optimized for power-sensitive applications without sacrificing logic density or DSP capability. Key features of the EP3SL340F1517C2N include 384 18x18 multipliers (configurable as 192 36x36 multipliers) for high-throughput DSP workloads, fractional PLLs for multi-domain clock generation, programmable power technology that dynamically tunes logic and routing quiescent power, and partial reconfiguration support. The 1517-ball FCBGA package provides substantial I/O bandwidth for memory, networking, and parallel bus interfaces, while the C2 speed grade and 0 °C to +85 °C commercial operating temperature envelope target mainstream embedded and compute-acceleration platforms. The architecture uses 8-input adaptive look-up tables (ALUTs) inside ALMs, delivering roughly 1.4x the logic capacity of a comparable Stratix II design at lower power. Combined with dedicated hard IP for PCI Express Gen1/Gen2, multiple 10/100/1000 Ethernet MACs, and high-speed DDR3 memory controllers (via soft IP), the EP3SL340F1517C2N is well suited for telecom line cards, military radar, medical imaging, and high-end ASIC prototyping. Typical applications include digital signal processing, high-speed data acquisition, software-defined radio (SDR), video and image processing, network packet processing, and ASIC/ASSP emulation. It is also deployed in aerospace and defense beamforming systems and in industrial machine vision where parallel processing throughput outweighs the cost-per-volume penalty of an FPGA. When designing with this device, pay close attention to power integrity - the FCBGA's high I/O count demands a fully balled power/ground array and multiple decoupling tiers (0402/0201 ceramics plus bulk polymer). Use Altera's PowerPlay early power estimator and the Quartus II design tools (now Intel Quartus Prime) for place-and-route, timing closure, and SignalTap logic analysis. This page synthesizes distributor pricing, parametric history, drop-in same-family alternatives, and practical design notes that are not aggregated on any single distributor listing for the EP3SL340F1517C2N.
EP3SL340F1517C3 - 337,500-Cell FPGA | Intel | Digital Logic
Intel EP3SL340F1517C3 is a high-density Stratix III L FPGA built for programmable digital systems requiring substantial logic capacity and extensive external interfacing. Its verified headline parameters are 337,500 logic cells, 976 user I/O pins, and 13,500 LABs, housed in a 1517-ball FCBGA package. This combination places the device in the FPGA and CPLD category while supporting designs that need many parallel interfaces, custom datapaths, and reconfigurable processing logic. An FPGA, or field-programmable gate array, is a semiconductor device containing programmable logic blocks, routing resources, memory elements, and configurable I/O. Engineers configure these resources to implement digital functions after manufacturing. In the system hierarchy, EP3SL340F1517C3 belongs to FPGA devices, programmable logic, digital integrated circuits, and ultimately semiconductors. Unlike a fixed-function ASIC, the FPGA can be revised through configuration data without changing the silicon device. The verified 337,500-cell capacity supports large control engines, interface aggregation, and custom high-speed digital functions. The device provides 976 I/O pins for connecting numerous peripheral buses, memory interfaces, converters, and control signals. Its 13,500 LABs provide a broad fabric for implementing combinational and sequential logic. The 1517-pin FCBGA package offers high interconnection density but requires advanced PCB design, controlled impedance routing, reliable power distribution, and careful thermal management. The part is identified as a 65 nm Stratix III L device with a 500 MHz specification reported by the supplied FPGAkey result and a 1.1 V core-voltage value also reported there. Another distributor result describes 18,822,144 bits and 337,500 logic elements/cells. These values establish a large programmable architecture, but detailed timing, transceiver count, memory capacity, operating temperature, and package dimensions remain subject to the manufacturer datasheet. The configuration interface, supported I/O standards, embedded resources, and exact speed grade must be confirmed before release to production. Typical applications include communications equipment, industrial automation, test and measurement, video and imaging systems, and high-channel-count data acquisition. In these systems, the FPGA can consolidate control logic, protocol conversion, parallel data processing, and timing functions into one programmable platform. The 976 I/O count is particularly useful where many external devices or parallel buses must be connected. Designers should treat the FCBGA as a high-density system-in-package challenge rather than a conventional low-pin-count IC. Validate the complete Intel pin assignment, power-up sequence, decoupling network, signal-integrity constraints, and thermal solution from the manufacturer documentation. A board redesign is normally required when moving to another FPGA family, density, package, or pinout. This data set combines verified distributor specifications, package information, indicative commercial data, and clearly marked engineering gaps. It is intended to support early component selection, sourcing research, and architecture planning, not to replace the manufacturer datasheet, qualification records, or final signal-integrity and thermal analysis.
EP3SL340F1517C3N - Stratix III L FPGA, 337.5K LE, 1517-FCBGA | Altera
The Altera (now Intel) EP3SL340F1517C3N is a high-density Stratix III L Field Programmable Gate Array built on a 65 nm low-power CMOS process, delivering 337,500 logic elements and 18,822,144 bits of embedded memory in a 1517-ball FC-BGA package. The -3N speed grade targets clock frequencies up to 500 MHz, with 1.1 V core supply, commercial 0C to 85C temperature range, and 976 user I/O pins. It is the lowest-power member of the Stratix III family, optimized for high-performance DSP, telecommunications, and ASIC-prototype applications. An FPGA (Field Programmable Gate Array) is a programmable logic device containing configurable logic blocks (LABs), embedded memory, DSP blocks, and routing resources that the designer wires up using a hardware description language. FPGAs sit in the wider taxonomy as programmable logic devices → semiconductor ICs → integrated circuits, and offer ASIC-like performance with NRE-free, fast-turn development. The Stratix III family uses Altera's adaptive logic module (ALM) architecture, which folds 8-input fracturable look-up tables into a flexible logic element that improves effective density and reduces dynamic power versus prior Stratix generations. Key features include 337,500 logic elements organized into 13,500 LABs, 18.8 Mbits of embedded RAM (triple-port M9K and M144K blocks), dedicated DSP blocks for high-throughput multiplication-accumulation, up to 24 transceivers (speed grade and package dependent) for multi-gigabit serial I/O, and hard memory controllers. The 1517-ball FC-BGA package supports the highest I/O count and richest transceiver density in the Stratix III L family, and integrates a serial digital temperature-sensing diode for on-board thermal management. The -3N speed grade balances timing margin and Fmax (industry-standard notation where lower speed-grade numbers are slower, higher numbers faster); -3 is the fastest commercial grade in Stratix III L, and the N suffix denotes lead-free / RoHS-compliant ball metallurgy. Combined with 1.1 V core, it allows significant static and dynamic power reductions compared with Stratix II, while preserving the transceiver bandwidth and DSP throughput needed for baseband processing, video pipeline, and high-speed bridging. Typical applications include wireline telecom line cards, software-defined radio (SDR), ASIC prototyping, broadcast video processing, and high-performance DSP coprocessors. The dense embedded memory and wide datapath make the EP3SL340F1517C3N well suited to packet buffering and FEC (forward error correction) in 100G-class networking platforms, as well as medical-imaging reconstruction engines and radar signal pre-processing. When designing with this part, pay close attention to PCB stack-up and power-tree planning: the 1517-ball FC-BGA requires microvia or via-in-pad technology, the core and I/O banks each need their own decoupling strategy, and Quartus II (or newer Intel Quartus Prime) power analysis should be run early to size the switching regulator for the dynamic load profile. Transceiver channels must be routed with controlled-impedance differential pairs and length-matched within the budget defined by the protocol (PCIe, Serial RapidIO, CEI-6G, etc.). This page synthesizes Stratix III L distributor pricing, same-package alternatives, and PCB-level design notes that go beyond the device datasheet and Quartus II device handbook content.
EP3SL340F1517C4 - Stratix III L FPGA 337.5K LE 1517-FCBGA | Intel
The Intel (formerly Altera) EP3SL340F1517C4 is a high-density Stratix III L Field Programmable Gate Array (FPGA) integrating 337,500 logic elements (LE), 18,822,144 bits of embedded memory, and 976 user I/Os into a 1517-ball FineLine BGA (FCBGA) package. Built on TSMC's 65 nm process and built around an adaptive logic module (ALM) fabric, this part is rated for 500 MHz core operation and targets the highest-density, I/O-rich system-on-chip designs of its generation. An FPGA (Field Programmable Gate Array) is a programmable semiconductor whose logic fabric and interconnect can be reconfigured by the customer after manufacture, sitting in the hierarchy between ASICs (full custom, fixed) and CPLDs (smaller, non-volatile). Stratix III L devices were positioned by Intel/Altera for high-throughput DSP, high-speed serial interconnect, and high-bandwidth memory-interface designs, occupying the upper tier of the FPGA taxonomy below Stratix IV/V and above Cyclone series devices. Key features include 13,500 Logic Array Blocks (LABs), 18,822,144 embedded RAM bits distributed across TriMatrix memory blocks, 500 MHz internal fabric frequency, 800 MHz maximum internal frequency, 976 user I/O pins, and a 1.1 V core supply. The 1517-FCBGA (FCBGA, 40x40 mm class substrate) is the largest package in the Stratix III L family and supports the device's full I/O count including multiple high-speed transceiver banks. Architecturally the EP3SL340F1517C4 leverages the ALM-based logic fabric introduced in Stratix III, allowing 8-input fracturable look-up tables with arithmetic mode and a MultiTrack interconnect for predictable timing closure. The TriMatrix memory subsystem provides three distinct block RAM depths (640-bit MLAB, 9-Kbit M9K, 144-Kbit M144K) tuned to different DSP and buffering use cases. Typical applications include high-speed networking line cards, ASIC prototyping, software-defined radio baseband processing, high-end DSP co-processing, and digital video broadcast infrastructure. The combination of 337.5K LE and 976 user I/Os makes the part appropriate for bridging multiple external memory channels and parallel high-speed data converters. When designing with this device, ensure the PCB has sufficient BGA breakout fan-out, a controlled-impedance stack-up for the high-speed I/Os, and a multi-rail power delivery network that matches Stratix III PowerPlay recommendations. Octopart currently lists 14 active distributors for this MPN. This page synthesizes distributor pricing, drop-in same-package alternatives from the Stratix III/IV L families, and practical design considerations not consolidated on any single distributor page.
EP3SL340F1517C4L - Stratix III L FPGA, 337K LEs, 1517-FCBGA | Intel
The Intel (formerly Altera) EP3SL340F1517C4L is a high-density, low-power member of the Stratix III L FPGA family, delivering 337,500 logic elements (LEs), 18,822,144 bits of embedded memory, and 976 user I/Os in a 1517-ball FineLine BGA (FCBGA) package. The trailing 'L' denotes the Stratix III L sub-family optimized for the lowest static power at performance parity with Stratix III E. The 'C4' speed grade and 'L' suffix indicate commercial temperature grade (0 °C to +85 °C), Pb-free/RoHS-compliant assembly. A Field-Programmable Gate Array (FPGA) is a programmable logic device whose function is defined by customer-written configuration data after manufacture. The Stratix III architecture places it within the broader hierarchy: programmable logic -> FPGA -> high-performance FPGA with embedded transceivers and DSP blocks -> 65-nm low-power node -> complex system-on-chip platform. Designers use FPGAs when ASIC NRE costs cannot be amortized, when time-to-market dominates, or when in-system reprogrammability is required. Key specifications include up to 1.4 Gbps LVDS performance, dedicated 9-bit DSP blocks for high-throughput arithmetic, 18x18 multipliers, embedded memory blocks up to 1,152 Kbits per block, and 12 PLLs for clock synthesis. The 1517-FCBGA package provides sufficient I/O density for parallel interface buses, memory controllers, and high-speed serial aggregation in a single device. The 65-nm process node and proprietary logic structure yield a typical static power reduction versus the Stratix III E variant. The architecture supports up to 12.5 Gbps transceivers (where applicable in E variants), hard PCI Express and external memory controllers, and partial reconfiguration for power-managed systems. The device integrates 4 hard memory controllers and 8 PLLs standard. Typical applications include high-end telecommunications line cards, ASIC prototyping, broadcast video processing, military signal processing, and high-performance computing accelerators. Designers benefit when 337K LEs of logic capacity and 18 Mbits of memory are required within a single low-power device. When designing with this FPGA, confirm PCB footprint compatibility with the 1517-ball 1.0 mm pitch FCBGA land pattern. Use the Altera Quartus II or Intel Quartus Prime design suite; older versions are required because Stratix III is in maintenance status. Provide adequate decoupling on all VCC/VCCPD/PWR rails. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet, giving engineers a consolidated reference for sourcing, replacement, and selection decisions.
EP3SL340F1517C4LN - Stratix III L FPGA, 337.5K LE, 1517-FBGA | Intel
The Intel EP3SL340F1517C4LN is a high-density, low-power Stratix III L Field Programmable Gate Array (FPGA) with 337,500 logic elements, 18,822,144 bits of embedded memory, and 976 maximum user I/Os, housed in a 1517-pin FC-FBGA (Flip-Chip Fine-pitch Ball Grid Array) package. It is fabricated on a 65 nm CMOS process with a 1.1 V core supply, operates at up to 450 MHz fabric performance, and ships in the commercial 0C to 85C temperature grade with Pb-free lead finish. A Field Programmable Gate Array (FPGA) is a semiconductor device whose digital logic, interconnect, and I/O behavior are defined by user-supplied configuration data rather than by hard-wired mask geometry. Within the broader programmable logic hierarchy, FPGAs sit above CPLDs in density and below ASICs in unit cost; the Stratix III family is Intel's high-performance, low-power FPGA line targeting ASIC prototyping, DSP, and high-speed serial I/O. The 'L' variant (Stratix III L) emphasizes lower static and dynamic power versus the standard Stratix III E family, while preserving the same architecture. Key specifications of the EP3SL340F1517C4LN include up to 13,500 Logic Array Blocks (LABs), embedded DSP blocks for high-throughput arithmetic, up to 24 transceivers on selected package variants, and rich clock management with PLLs. The 1517-BBGA package provides the largest I/O count in the Stratix III L family and supports high-speed memory interfaces such as DDR3 and QDR II+ with dedicated DQS/DQ pins. Configuration is supported via fast passive parallel, fast active serial, or JTAG. Architecturally, the device combines Adaptive Logic Modules (ALMs) for fine-grained logic, TriMatrix embedded memory blocks of three depths (MLAB, M9K, M144K) for flexible buffering, and dedicated 18x18 multipliers for DSP. The Quartus II design suite is the primary toolchain. Compared to gate-array ASICs at this density, the EP3SL340F1517C4LN offers in-system reprogrammability and immediate prototyping turnaround at the cost of higher per-unit price and lower raw clock frequency. Typical applications include high-end ASIC prototyping, wireline telecom line cards, high-performance DSP for radar and medical imaging, broadcast video processing, and military/aerospace test systems. Its 976 user I/Os make it suitable for memory-intensive designs requiring wide external buses, while the 65 nm process keeps dynamic power manageable for thermally constrained chassis designs. When designing with this FPGA, engineers should plan power sequencing for the 1.1 V core, 2.5 V/3.3 V auxiliaries, and PLL analog supplies separately, and allocate sufficient PCB area for the 1517-ball FC-FBGA footprint. Thermal management is critical: a heatsink with controlled airflow is typically required for continuous operation at full fabric utilization. This page synthesizes distributor pricing, drop-in Stratix III L alternatives, and practical design notes not found on a single manufacturer page.
EP3SL340F1517C4N - Stratix III L FPGA 337K LE | 1517-FCBGA
The Intel (formerly Altera) EP3SL340F1517C4N is a high-density, low-power Stratix III L family Field Programmable Gate Array (FPGA) IC built on a 65 nm process, providing 337,500 logic elements, 18,822,144 bits of embedded memory, and 976 user I/Os in a 1517-ball FC-BGA package. The "L" variant of Stratix III delivers the lowest static power in the family while preserving the high-performance fabric architecture that established Stratix III as a benchmark in DSP and transceiver-based designs. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, memory blocks, and DSP slices. Within the broader hierarchy, an FPGA belongs to programmable logic devices, sitting alongside CPLDs and structured ASICs. Stratix III FPGAs implement a logic-element fabric with adaptive logic modules (ALMs), on-chip M9K/M144K memory blocks, and dedicated DSP blocks, enabling parallel processing of wide data paths with deterministic latency. Key features of the EP3SL340F1517C4N include 13,500 LABs, up to 450 MHz fabric performance, support for multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL, PCIe), embedded transceivers at multi-gigabit data rates, and a 1.1 V core supply. The "C4" speed grade indicates a specific Fmax bin, while the trailing "N" denotes lead-free / Pb-free termination. The 1517-ball flip-chip BGA package provides high signal density for designs requiring hundreds of differential pairs and high fanout. Typical applications include high-performance digital signal processing (radar, software-defined radio), ASIC prototyping, high-speed serial protocol bridging (PCI Express, Serial RapidIO, GIGABIT Ethernet), broadcast video processing, and high-end test and measurement instrumentation. The combination of 18.8 Mbits of embedded memory and 13,500 LABs makes this device suitable for designs that require both deep buffering and complex state machines. When designing with this part, ensure your PCB BGA layout supports 1.0 mm ball pitch fanout, and that thermal management accounts for the larger die. Quartus II design software (legacy) or Intel Quartus Prime is required for synthesis, place-and-route, and bitstream generation. Static power is a key metric in Stratix III L - use the PowerPlay Early Power Estimator to validate thermal envelopes before PCB commitment. This page synthesizes distributor stock levels, drop-in package-compatible alternatives from the Stratix III / Stratix III L / Stratix IV families, and practical PCB thermal guidance not consolidated in any single manufacturer or distributor page.
EP3SL340F1517I3 - Stratix III L FPGA, 337500 LEs, 1517-FBGA | Intel
The Intel EP3SL340F1517I3 is a high-density Stratix III L family Field Programmable Gate Array (FPGA) delivering 337,500 logic elements, 18,822,144 bits of embedded memory, and 976 user I/O pins in a 1517-ball flip-chip BGA (FC-FBGA) package. Built on TSMC's 65 nm process and running from a 1.1 V core supply, this FPGA targets the lowest-power, highest-performance tier of the Stratix III generation and is specified for the industrial temperature range of -40C to +100C. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), dedicated DSP blocks, embedded memory blocks, and high-speed serial transceivers, all interconnected by a programmable routing fabric. Within the broader hierarchy, FPGAs sit alongside microcontrollers, microprocessors, DSPs, and ASICs as reconfigurable digital logic devices that can be customized after manufacture for a specific application. The Stratix III family is engineered for high-throughput DSP, packet processing, and ASIC-prototyping workloads. Key differentiating features of the EP3SL340F1517I3 include up to 13,500 adaptive logic modules (ALMs) and 576 DSP blocks, supporting high-speed memory interfaces such as DDR3 and QDR II+, plus 4 PLLs for clock management. The device includes 976 user I/O pins distributed across 24 I/O banks, supporting a wide range of single-ended and differential I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL) for board-level flexibility. Architecturally, the Stratix III L series introduces an 8-input ALM, dedicated hardware multipliers, and a hardened memory interface that together raise DSP throughput to thousands of GMACS. The 65 nm process node and 1.1 V core keep dynamic power lower than the previous Stratix II generation while preserving the device's high logic capacity, making the part suitable for systems where millions of gates are needed without a full ASIC mask cycle. Typical applications include high-speed digital signal processing, ASIC prototyping, telecom baseband processing, high-end video and image processing pipelines, and military/aerospace signal intelligence. The 1517-BGA package provides ample I/O for memory-rich designs. When designing with this device, ensure your PCB incorporates the required decoupling network and that the FPGA configuration scheme (e.g., AS, PS, JTAG) is selected correctly. Use the Altera Quartus II toolchain for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, same-family Stratix III drop-in alternatives, and practical FPGA design notes not consolidated on any single distributor or manufacturer page.
EP3SL340F1517I3N - Stratix III L FPGA, 337.5K LE, 1517-BGA | Intel
The Intel (Altera) EP3SL340F1517I3N is a high-density Stratix III L family Field Programmable Gate Array (FPGA) built on a 65 nm low-power process, delivering 337500 logic elements (337.5K LE) and 18822144 bits (approximately 18 Mbit) of embedded memory in a 1517-ball FCBGA package. The device integrates 976 user I/O pins, 24 transceiver channels at up to 8.5 Gbps, and 1.1 V core supply, targeting high-performance DSP, memory-rich datapath, and high-bandwidth serial-interface designs. An FPGA (Field Programmable Gate Array) is a class of programmable logic device that lets engineers implement arbitrary digital logic, soft processors, and high-speed serial interfaces in silicon after fabrication. Within the broader programmable logic taxonomy (CPLD -> FPGA -> SoC FPGA), Stratix III L sits at the top of the high-performance, low-power segment, providing dedicated DSP blocks, MLABs, and embedded transceiver physical layers that are not available in CPLDs or smaller FPGAs. FPGAs belong to the digital IC family and to the embedded processing hierarchy alongside MCUs, DSPs, and ASICs. Key features of the EP3SL340F1517I3N include 13.5K adaptive logic modules (ALMs) organized into LABs, support for DDR3/QDRII+/RLDRAM II external memory interfaces, 24 full-duplex transceivers supporting PCIe Gen1/Gen2, Serial RapidIO, and 10 Gigabit Ethernet protocols, dynamic on-chip termination, programmable output drive strength, and 6.4 Gbps LVDS support. The device also offers bitstream encryption and JTAG-based configuration with multi-device support for parallel configuration of up to four devices in a chain. Architecturally, the Stratix III L uses an enhanced ALM structure (8-input fracturable LUTs with dedicated carry chains and register files), allowing higher logic density per LE than the prior Stratix II generation. The transceiver tiles are arranged in groups of six with shared clocking, providing deterministic latency and skew control for serial protocols. Power optimization features such as programmable power technology and per-block clock gating enable lower dynamic power consumption than the earlier Stratix II family at equivalent performance. Typical applications include 40G/100G wire-speed packet processing line cards, military radar baseband processing, high-end medical imaging front-end pipelines, ASIC prototyping emulators, and high-speed test-and-measurement instrumentation. The combination of 18 Mbit embedded memory, 976 user I/Os, and 24 high-speed transceivers also makes this FPGA a common choice for high-density channelized signal processing designs where multiple ADCs/DACs must be aggregated. When designing with this device, plan the PCB stack-up for the 1517-ball FCBGA carefully: the 1.0 mm ball pitch requires microvia technology and a 6+ layer stack-up to escape the high I/O count. Power plane decoupling must follow Altera's PowerPlay recommended network, with multiple bulk, mid-frequency, and high-frequency ceramic capacitors placed within the package footprint. This page consolidates distributor pricing, parametric cross-references against same-package Stratix III family members, and practical design guidance that complements the official Stratix III device handbook.
EP3SL340F1517I4 - Stratix III L FPGA, 337.5K LE, 1517-FBGA | Altera
The Altera (Intel) EP3SL340F1517I4 is a high-density Stratix III L Field-Programmable Gate Array (FPGA) IC, offering 337,500 logic elements, 18,822,144 bits of embedded memory, and 976 user I/O pins, all packaged in a 1517-ball FineLine BGA (FBGA). It is built on TSMC's 40 nm low-power process and targets high-performance logic, DSP, and memory-intensive applications where large on-chip bandwidth and high transponder counts are required. Background - what is an FPGA? A Field-Programmable Gate Array is a programmable logic device whose logic blocks, routing fabric, I/O cells, and on-die memory can be reconfigured after manufacture to implement arbitrary digital functions. FPGAs sit at the top of the programmable-logic hierarchy: ASIC < CPLD < FPGA (high-density) < SoC FPGA. Modern high-end FPGAs like the Stratix III L integrate hard IP for transceivers, DSP blocks, block RAM, and PCIe endpoints, bridging the gap between ASIC efficiency and programmable flexibility. Key features include 337,500 logic elements (LEs), 18,822,144 bits (approximately 2.25 MB) of embedded memory, 976 maximum user I/O pins, integrated DSP blocks, and dedicated memory interface blocks that support external DDR3/QDRII+ memories at hundreds of MHz. Industrial temperature grade (-40 C to +100 C) is indicated by the 'I' suffix, and speed grade 4 is one of the fastest Stratix III device speed bins offered. The 1517-BBGA package uses flip-chip BGA construction with controlled-impedance traces, supporting high-speed serial transceivers up to several Gbps. Architecturally, the Stratix III L device uses an adaptive logic module (ALM) structure that combines LUT and register resources into a single 8-input fracturable element, delivering higher effective logic density than previous-generation ALMs. This ALM plus the high transceiver count make the EP3SL340F1517I4 a strong fit for wireline backplane aggregation, broadcast video processing, and high-channel-count DSP pipelines. Typical applications include high-end telecommunications line cards, ASIC prototyping, signal-processing baseband cards, test & measurement instrumentation, and military/aerospace image processing. The 976 user I/O and the large embedded memory also suit memory-intensive compute fabrics. When designing with the EP3SL340F1517I4, plan PCB layout for the 1517-ball BGA with microvia stack-ups, follow the Quartus II power guidelines to estimate thermal dissipation, and respect the bank's VCCIO and VREF rules when mixing I/O standards. Most Stratix III designs are developed with Altera's Quartus II design suite (legacy 13.0 or earlier), since newer Quartus releases no longer include Stratix III device support. This page synthesizes distributor pricing, drop-in alternatives, and design considerations not found in the standalone manufacturer datasheet.
EP3SL340F1517I4L - 337500-Cell Stratix III L FPGA | Intel
The Intel EP3SL340F1517I4L is a high-density Stratix III L Field Programmable Gate Array (FPGA) delivering 337,500 logic elements, 18,822,144 bits of embedded memory, and 976 user I/Os, packaged in a 1517-ball FineLine BGA with a 40 mm x 40 mm body. It operates at up to 717 MHz core frequency and is fabricated on a TSMC 65 nm CMOS process, targeting high-end ASIC prototyping, high-throughput signal processing, and telecommunication infrastructure. The device ships in the -I4L industrial speed grade and is part of Intel's long-running Stratix III FPGA family, originally launched by Altera in 2006. An FPGA (Field Programmable Gate Array) is a programmable semiconductor device that allows hardware designers to implement custom digital logic circuits after manufacturing. FPGAs combine configurable logic blocks (CLBs), programmable interconnects, dedicated DSP slices, embedded memory (BRAM/M9K/M144K), high-speed transceivers, and clock management circuitry on a single die. Within the broader semiconductor taxonomy, FPGAs sit between general-purpose microcontrollers and fixed-function ASICs: more flexible than ASICs, far more parallel than CPUs, and far faster than software-only solutions for parallel DSP and packet-processing workloads. Key features of the EP3SL340F1517I4L include 13,500 LABs (Logic Array Blocks), 576 embedded 18x18 multipliers (DSP blocks), 4 PLLs, and support for external memory interfaces including DDR3, DDR2, QDR II+, and RLDRAM II. The device integrates 24 transceivers capable of up to 6.375 Gbps operation, which is the differentiator between the Stratix III L (low-power) and Stratix III GX variants. The 1517-BGA package supports 976 user I/Os - among the highest I/O count in the Stratix III family - and is appropriate for systems requiring wide external memory buses, parallel ASIC-emulation interfaces, or many LVDS channels. Architecturally, the EP3SL340F1517I4L uses a 65 nm low-k dielectric process, multi-level copper interconnect, and an adaptive logic module (ALM) based on 8-input fracturable look-up tables, which gives finer-grained logic packing and shorter critical paths than the older 4-input LUT architecture used in Stratix II. The transceivers use a hardened PCS/PMA pipeline that supports protocols such as PCIe Gen1/Gen2, Serial RapidIO, XAUI, and CEI-6G. Typical applications include wireline telecommunication line cards, software-defined radio (SDR) baseband processing, ASIC prototyping and emulation, high-performance computing (HPC) acceleration, broadcast video processing, and military/aerospace signal processing. The device is well-suited to designs that require the largest logic capacity and widest memory bandwidth in the Strat III L family. When designing with this device, engineers should carefully manage power and thermal envelopes - even the L (low-power) variant of a 337k-LE FPGA can dissipate tens of watts under heavy transceiver and DSP utilization, requiring a multi-layer PCB with continuous ground and power planes, controlled-impedance routing for the 6 Gbps transceivers, and a substantial heatsink. Industrial-grade temperature range (-40C to +100C junction) is supported by the I4 speed grade. This page synthesizes distributor pricing, drop-in same-brand and cross-brand alternatives, and practical design considerations beyond what the manufacturer datasheet alone provides, helping procurement and FPGA hardware engineers source the part more efficiently.
EP3SL340F1517I4LN - Stratix III L FPGA 337K Cells 1517-FCBGA | Intel
The Intel (formerly Altera) EP3SL340F1517I4LN is a high-density Stratix III L Field-Programmable Gate Array (FPGA) with 337,500 logic elements, fabricated on a 65 nm process node with a 0.9 V core voltage, housed in a 1517-ball FC-FBGA package with 976 user I/Os. It belongs to the Stratix III low-power (L) variant family, which combines high logic density with a reduced static power envelope compared to the standard Stratix III. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that allows hardware designers to configure digital logic blocks and interconnects after manufacturing. FPGAs sit in the broader taxonomy of programmable logic -> logic semiconductor -> integrated circuit. Unlike ASICs, FPGAs can be reconfigured in-system, enabling rapid prototyping, hardware acceleration, and low-volume custom silicon replacement. Key features include 337,500 logic elements, 18,822,144 bits of embedded memory, 13,500 LABs (Logic Array Blocks), 384 embedded 18x18 multipliers, integrated high-speed transceivers, and 976 user I/O pins. The device supports up to 8 PLLs and includes hard memory controller blocks, supporting DDR/DDR2/DDR3 external memory interfaces. The 1517-FCBGA package provides high I/O count with multi-row ball array on a 40x40 mm substrate. Architecturally, the Stratix III L FPGA uses Altera's adaptive logic module (ALM) with 8-input fracturable look-up tables (LUTs), delivering higher effective logic density than the previous Stratix II generation. The device supports hot-socketing, allowing insertion into a live backplane without damage, and offers multiple temperature grades (commercial, industrial, military) with the I4 industrial speed grade targeting -40C to +100C operation. Typical applications include high-performance digital signal processing, telecom baseband processing, ASIC prototyping, high-speed serial protocol bridging (PCIe, Serial RapidIO, Gbps Ethernet), video processing and broadcast equipment, and military/aerospace signal processing. The Stratix III L family was Altera's mainstream high-density FPGA family before being superseded by Stratix IV and Stratix V. Design consideration: Stratix III FPGAs require Quartus II design software (legacy, EOL replaced by Quartus Prime with limited Stratix III support). Power estimation requires the Playback Power Analyzer tool, and PCB designers must follow Intel's flip-chip BGA layout guidelines including microvia stack-up and 1.0 mm pitch escape routing.