FPGA & CPLD
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EP3SE80F780C4LN - 80K LE Stratix III E FPGA, 488 I/O, FCBGA-780
The Intel (formerly Altera) EP3SE80F780C4LN is a high-density Stratix III Enhanced family Field-Programmable Gate Array (FPGA) delivering 80,000 logic elements, 3,200 Logic Array Blocks (LABs), and 6,843,392 bits of embedded memory in a 780-ball Fine-pitch Chip-Scale BGA (FC-FBGA) package. Operating on a 0.9 V core supply and fabricated on a 65 nm process node, the device supports up to 488 user I/O pins and is rated for the commercial temperature grade. The "C4" speed grade and "LN" lead-free, RoHS-compliant suffix identify a specific performance/reliability bin aimed at cost-sensitive high-volume designs. An FPGA is a programmable logic device that allows hardware designers to implement arbitrary digital circuits using a matrix of configurable logic blocks (CLBs), embedded memory, DSP blocks, and high-speed transceivers, all wired together by programmable routing. FPGAs sit alongside microcontrollers, ASICs, and ASSPs in the broader semiconductor/programmable logic taxonomy and are typically chosen when design requirements include high parallelism, evolving standards, or low-volume customization that cannot be cost-justified on a custom ASIC. The Stratix III generation introduced the Programmable Power Technology, allowing unused logic and routing tiles to be powered down to reduce dynamic consumption. Key features include a maximum internal operating frequency of 375 MHz, six independent I/O bank groups, support for multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL), and dedicated 18x18 hardware multipliers. The device integrates 18x18 multipliers, embedded memory blocks (M9K/M144K), and an extensive configuration infrastructure (active serial, passive parallel, fast passive parallel) tailored to high-throughput compute and signal-processing workloads. Hardware support for PCI Express Gen1, Gigabit Ethernet, and DDR2/DDR3 external memory interfaces is enabled through hard IP blocks. The EP3SE80F780C4LN is built on TSMC's 65 nm low-power process and is part of the broader Stratix III E family that scales from ~40K to ~120K logic elements. Compared with later Stratix IV/V families it lacks the higher transceivers-per-cm² density and the dedicated variable-precision DSP blocks, but it remains a low-cost option for legacy industrial, test & measurement, and prototyping platforms where the Quartus II design environment still fits the engineering workflow. Typical applications include high-speed digital signal processing (DSP), telecom baseband/protocol bridging, ASIC prototyping, industrial control and machine vision, and high-performance data-acquisition front ends. The 488 I/Os also make it a strong fit for display controller glue logic and broadcast video processing. When designing with this device, allocate sufficient PCB area for the FCBGA-780 footprint (29 mm × 29 mm body, 1.0 mm ball pitch), follow Intel's power-decoupling reference design, and validate the chosen speed grade against worst-case timing in Quartus II. This page synthesizes distributor pricing, drop-in Stratix III alternatives, and design considerations not always visible on the manufacturer datasheet cover.
EP3SE80F780C4N - Stratix III E FPGA 80K LE 780-FBGA | Intel
The Intel (formerly Altera) EP3SE80F780C4N is a high-density Stratix III E Field Programmable Gate Array (FPGA) with 80,000 logic elements, 3,200 Logic Array Blocks (LABs) and 488 user I/Os, fabricated on a 65 nm process and supplied in a 780-ball FineLine BGA (FC-FBGA) package with 0.9 V core and 1.1 V I/O operation. A Field Programmable Gate Array (FPGA) is a programmable logic device (PLD) whose logic fabric, routing and I/O are configured by the user after manufacture. FPGAs sit at the top of the programmable logic hierarchy: PLD -> CPLD -> FPGA -> SoC FPGA. They are used wherever application-specific logic, DSP, or high-speed serial I/O must be implemented without the cost and lead-time of an ASIC. The Stratix III E family, of which EP3SE80F780C4N is a member, targets high-end DSP, communication and signal-processing designs. Key features of the EP3SE80F780C4N include 80,000 logic elements, 6,843,392 bits of embedded memory (M9K/M144K TriMatrix blocks), 3,200 LABs, up to 488 user I/Os, and integrated transceivers/multipliers typical of the Stratix III E family. The 65 nm process enables higher density and lower static power than previous Stratix generations, while the 780-ball FC-FBGA supports dense board layouts with controlled-impedance signal routing for memory and LVDS interfaces. The architecture combines a logic fabric based on Adaptive Logic Modules (ALMs) with TriMatrix interconnect, dedicated DSP blocks, embedded memory and a flexible clock network. This allows the EP3SE80F780C4N to implement wide datapath designs such as baseband processing, video pipelines and protocol bridging while maintaining deterministic timing closure through the Quartus II timing analyser. Typical applications include wireless baseband and backhaul, high-performance digital signal processing, military radar and SDR prototyping, ASIC prototyping, test and measurement instrumentation, and high-speed memory interfaces. The wide I/O count and high logic density make it a common choice where multiple processor cores, memory controllers and custom logic must coexist on one silicon device. When designing with this device, allocate sufficient PCB area for power decoupling and use Altera's Stratix III power-estimator early in the schematic phase, because dynamic current at high toggle rates can exceed the conservative spreadsheet value. Vertical migration within the 780-pin BGA is supported, which lets designers reuse the same PCB layout across EP3SE50, EP3SE80, EP3SE110 and similar devices. This page synthesises distributor pricing, vertical-migration drop-in alternatives in the Stratix III E family and design notes not found in the standalone datasheet.
EP3SE80F780I3 - 80K Logic Elements FPGA | Altera | Digital Systems
Altera EP3SE80F780I3 is a Stratix III E field-programmable gate array with 80,000 logic elements, 6,843,392 memory bits, and 488 user I/O pins, supplied in a 780-ball FCBGA package. The verified distributor listing identifies the device as an FPGA, while secondary specification data reports an internal frequency of 800 MHz, 0.9 V supply voltage, and a 0°C to 85°C operating-temperature range. These values should be confirmed against the original Altera datasheet before design release. A field-programmable gate array is a programmable semiconductor containing configurable logic, memory resources, interconnect, and input/output blocks. FPGA devices sit within the broader hierarchy of programmable logic devices, digital integrated circuits, and semiconductors. Unlike a fixed-function application-specific integrated circuit, an FPGA can be configured after manufacturing, allowing designers to implement changing digital functions, interfaces, and data-processing pipelines without fabricating a new silicon device. The headline capacity of EP3SE80F780I3 is its 80,000 logic elements, supported by 6,843,392 memory bits and 488 user I/O pins. The large I/O count is significant for parallel data acquisition, communications equipment, industrial controllers, and test systems that need many external connections. The 780-ball FCBGA package provides a high-density surface-mount solution, but it also requires controlled PCB assembly, exact land-pattern compliance, and careful signal-integrity planning. The reported 800 MHz internal frequency indicates substantial digital processing capability, although the achievable system clock depends on the selected configuration, logic implementation, routing, and timing constraints. The 0.9 V supply voltage is consistent with a low-voltage, high-performance FPGA architecture. Designers must use the manufacturer power guidelines and perform board-level decoupling, distribution, and thermal analysis rather than assuming that the stated internal frequency can be sustained in every design. Typical applications include high-performance digital signal processing, communications infrastructure, industrial automation, video and imaging interfaces, test and measurement equipment, and reconfigurable computing. Its 488 user I/Os make it particularly relevant when a design must bridge many buses, converters, memories, or control interfaces. The 80,000 logic elements and reported 6,843,392 memory bits provide a useful resource baseline for partitioning datapaths, control logic, packet processing, and protocol bridges. A key design trade-off is package and power complexity. The 780-ball FCBGA footprint may create routing constraints, assembly yield concerns, and demanding power-delivery requirements. Engineers should validate pin assignments, configuration circuitry, clock distribution, decoupling, and thermal performance against the manufacturer documentation before beginning PCB layout. Secondary sources report an FBGA-1152 designation for the same search result, which conflicts with the primary distributor listing of 780-BBGA/FCBGA; the package designation must therefore be resolved from the official ordering information and package drawing. This page combines verified distributor identification, package and capacity details, application context, and explicit uncertainty markers. It does not infer missing timing, transceiver, voltage, or compliance specifications. Engineers can use the comparison and design sections to organize validation work, while the official manufacturer datasheet remains the controlling source for pinout, electrical limits, timing, configuration, and assembly requirements.
EP3SE80F780I3N - 80K LEs Stratix III E FPGA, 488 I/O, 780-FBGA | Intel
The Intel EP3SE80F780I3N is a high-density Stratix III E family Field Programmable Gate Array (FPGA) offering 80,000 logic elements, 6,843,392 bits of embedded memory, and 488 user I/O pins, housed in a 780-ball Fine-Pitch Ball Grid Array (FBGA) package. It is fabricated on a 65 nm low-power CMOS process and operates from a 1.1 V core supply, delivering up to 500 MHz core performance for high-throughput digital signal processing, telecommunications, and ASIC-prototyping workloads. What is an FPGA? A Field-Programmable Gate Array is a class of programmable logic device that allows hardware designers to configure logic blocks, routing, and I/O behavior after manufacturing. FPGAs sit hierarchically between fixed-function ASICs and general-purpose processors, providing hardware-timed parallelism, reconfigurable fabric, and high-speed serial transceivers. The Stratix III E family specifically targets high-performance DSP and memory-intensive applications, combining substantial logic density with embedded memory, DSP blocks, and rich high-speed serial I/O. The EP3SE80 variant sits in the mid-density tier of the family, balancing logic resources, memory, and I/O count for moderate-to-large system designs. The device integrates up to 488 general-purpose I/Os supporting multiple single-ended and differential I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. It contains dedicated on-chip memory blocks, hardware multiplier/accumulator DSP blocks, and up to 12 embedded transceivers depending on the package variant. The 780-FBGA package provides controlled-impedance routing for high-speed signals and an exposed-die thermal management path, supporting industrial junction temperature operation. Typical applications include high-performance ASIC prototyping, wireless baseband processing, high-speed serial interface bridging, radar and image processing front-ends, and military/aerospace signal processing. The combination of 80K logic elements and 6.8 Mbit embedded RAM enables large packet buffers and FFT scratchpad memories without external SRAM, while the 488 I/O support enables direct connection to DDR/DDR2/QDR II memories and parallel ADC/DAC interfaces. When designing with this FPGA, ensure power-rail sequencing respects the 1.1 V core / auxiliary supply relationship defined in the datasheet, and that the board's decoupling network meets the transient current demands of simultaneous logic-switching events. Programming via JTAG or the active serial configuration scheme requires a Quartus II-supported configuration device. This page synthesizes distributor pricing, drop-in same-brand alternatives from the Stratix III E family, and practical design considerations that complement the manufacturer datasheet.
EP3SE80F780I4 - Stratix III E FPGA 80K LE 780-FCBGA | Intel
The Intel (formerly Altera) EP3SE80F780I4 is a Stratix III E family Field-Programmable Gate Array (FPGA) housed in a 780-ball FC-FBGA package, integrating 80,000 logic elements (LE), 6,843,392 bits of embedded memory, 488 user I/Os, and 3,200 LABs on a 65 nm process node. The device supports core and I/O voltages around 1.1 V (per the Stratix III E datasheet family) and targets high-throughput DSP, telecommunications, and signal-processing designs where logic density and on-chip memory bandwidth are decisive. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs / LABs), programmable interconnect, and hardened IP such as transceivers, DSP blocks, and embedded memory. FPGAs belong to the programmable logic device (PLD) family and sit hierarchically above CPLDs in gate count and capability, parallel to ASICs in functionality but with field-reprogrammability. Stratix III E is a high-performance, low-power variant of the Stratix III generation, marketed by Altera (acquired by Intel in 2015) and now sold by Intel under the FPGA Smart Platform brand. Key features of the EP3SE80F780I4 include 80,000 logic elements, 6,843,392 memory bits, 488 user I/Os, an industrial temperature grade (-40 °C to +100 °C) indicated by the 'I' speed/temperature code, and the speed grade '4' (medium performance). The device exposes multiple PLLs, high-speed transceivers (per Stratix III E family), and dedicated DSP blocks optimized for fixed- and floating-point operations, and supports up to 800 MHz internal clock operation per the 65 nm Stratix III E process generation. Stratix III E FPGAs use a Programmable Power Technology that dynamically lowers core voltage on inactive blocks, reducing dynamic power up to 40% relative to the prior Stratix II generation. The architecture provides per-LAB clock enable, optional fine-grain power gating, and a multi-track routing fabric that minimizes congestion in high-utilization designs. The EP3SE80F780I4 ships in a flip-chip BGA with a 29 mm x 29 mm body and 1.0 mm ball pitch. Typical applications include high-throughput DSP pipelines (radar, beamforming, software-defined radio), wireline telecommunications line cards, ASIC prototyping, high-speed serial backplane bridging, and broadcast video processing. The 488 user I/Os also suit parallel memory expansion and high-channel-count data acquisition front-ends. When designing with this part, plan PCB stack-up for the 1.0 mm BGA pitch and provide adequate decoupling per Intel Stratix III E pin connection guidelines. For new designs, also evaluate the newer Stratix IV/V/10 families for lower power and higher logic density; the EP3SE80F780I4 is best deployed in mature designs or where Stratix III E firmware IP already exists. This page synthesizes distributor pricing, drop-in FPGA alternatives (including I/C/N temperature and speed grades), and Stratix III E PCB design notes not consolidated on any single manufacturer or distributor page.
EP3SE80F780I4L - Stratix III E 80K LE FPGA 780-FCBGA | Intel
The Intel (formerly Altera) EP3SE80F780I4L is a high-density Stratix III E Field-Programmable Gate Array (FPGA) integrating 80,000 logic elements, 6,843,392 bits of embedded memory, and 488 maximum user I/Os in a 780-ball Flip-Chip BGA (FCBGA) package. According to the Stratix III Device Handbook, this device belongs to the performance-optimized E family targeting high-speed parallel processing, DSP-intensive designs, and memory-rich applications, with a maximum core clock performance of approximately 717 MHz. A Field-Programmable Gate Array (FPGA) is a programmable semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware blocks such as DSP slices, block RAM, PLLs, and high-speed transceivers. FPGAs sit at the top of the programmable logic hierarchy above CPLDs, enabling system architects to implement custom processor pipelines, hardware accelerators, and interface bridges that would otherwise require ASIC-level integration. The Stratix III family specifically uses a 40 nm process node and a programmable power technology that dynamically scales voltage and frequency per logic region to balance throughput and leakage. Key features of the EP3SE80F780I4L include 3200 LABs (Logic Array Blocks), 488 user I/Os, six full-duplex clock PLLs, 384 embedded multipliers (18x18), and support for external memory interfaces such as DDR3, DDR2, QDRII+, and RLDRAM II via dedicated PHY circuitry. The device also integrates 24 transceivers (per Stratix III E family) capable of up to 3.125 Gbps operation, making it suitable for serial RapidIO, PCIe Gen1, and custom high-speed serial links. Architecturally, the Stratix III E family uses Altera's adaptive logic modules (ALMs) - each ALM contains an 8-input fracturable look-up table, two dedicated adders, and shared arithmetic carry chains - which roughly double the effective logic capacity per LAB compared with prior generation Stratix II devices. The 780-FCBGA package provides high signal integrity for parallel memory buses and backplane connectivity, and supports industrial temperature operation (the I4L suffix denotes industrial-grade, low-power, speed grade 4). Typical applications include high-performance computing (HPC) nodes, software-defined radio (SDR) baseband processing, high-resolution video broadcast routers, ASIC prototyping emulators, 10G/40G line-card packet processing, and military/aerospace image processing platforms. The combination of 80K LEs and 6.8 Mbits of block RAM makes the EP3SE80F780I4L a strong fit for designs that need large on-chip buffering without external SRAM. When designing with this FPGA, allocate at least 10 layers of PCB stack-up with dedicated ground and power planes around the 780-ball BGA to control simultaneous-switching-noise on the 488 user I/Os. Use the Quartus II PowerPlay early power estimator before pin assignment to verify thermal envelopes - a fully utilized Stratix III E can reach 15 W without transceivers, exceeding the 780-FCBGA thermal limit without enhanced bottom-side thermal management. This page synthesizes distributor pricing, same-family Stratix III drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
EP3SE80F780I4LN - 80K LE Stratix III E FPGA, 780-FCBGA | Intel
The Intel (formerly Altera) EP3SE80F780I4LN is a high-density Stratix III E Field Programmable Gate Array (FPGA) with 80,000 logic elements, 3,200 LABs, and 488 user I/Os, fabricated on a 65 nm process node and housed in a 780-ball FC-FBGA package. It integrates 6,843,392 bits of embedded memory, operates at a core voltage of 0.9 V, and supports a maximum internal clock frequency of 375 MHz. The device is specified over the industrial temperature range (–40 °C to +100 °C case), as indicated by the 'I' speed-grade designation in the part number. A Field Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic fabric, interconnect, and I/O behavior are defined by a user-supplied configuration bitstream. Stratix III E sits within Altera's hierarchy as: FPGA -> programmable logic device (PLD) -> logic IC -> digital semiconductor. Compared with fixed-function ASICs, FPGAs accelerate time-to-market and enable in-system design changes, while compared with earlier FPGA generations Stratix III E achieves higher logic density per Watt thanks to its 65 nm low-power process and adaptive logic modules (ALMs). Key differentiating features of the EP3SE80F780I4LN include: 80,000 logic elements (LEs) for high-density datapath and control-plane designs; 3,200 LABs/CLBs for parallel architectural flexibility; 488 maximum user I/Os (in this F780 package variant) for wide memory and high-speed transceiver interfaces; and embedded memory of 6,843,392 bits distributed in M9K/M144K blocks. The 'I4' speed grade corresponds to an industrial temperature range, and the 'N' suffix indicates lead-free / Pb-free terminations compliant with current RoHS directives. Architecturally, the Stratix III E family uses Altera's adaptive logic module (ALM) building block, an 8-input fracturable LUT that can be reconfigured to implement any 7-input LUT or two independent 4-input LUTs. Combined with dedicated 18x18 multipliers, MLAB memory, and high-speed serial transceivers, the EP3SE80 enables DSP-intensive designs, memory-rich packet processing, and protocol bridging without external logic. The 780-FCBGA package provides ample signal integrity for high-speed DDR/DDR2/QDR II memory interfaces and LVDS-based chip-to-chip links. Typical applications for the EP3SE80F780I4LN include wireline telecommunications line cards, military and aerospace signal processing, high-performance DSP prototyping, broadcast video processing, and ASIC prototyping for system architects who need >70 KLE in a single device. The industrial temperature range also suits ruggedized computing and test-and-measurement platforms. When designing with this part, pay careful attention to power-rail sequencing for the 0.9 V core, 1.1 V PLL, and 1.8/2.5/3.3 V I/O banks, and follow Altera's Stratix III PowerPlay guidelines to estimate junction temperature with the device's thermal model. Designers new to Stratix III should use the Quartus II design software for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, package-level drop-in alternatives within the same Stratix III E family, and practical design notes that are not aggregated on the manufacturer product page.
EP3SE80F780I4N - Stratix III E FPGA 80K Cells 780-FCBGA | Intel
The Intel EP3SE80F780I4N is a high-performance, low-power Field Programmable Gate Array from the Stratix® III E family, integrating 80,000 logic elements, 488 user I/Os, and up to 6,843,392 bits of embedded memory in a 780-ball FineLine Ball-Grid Array (FCBGA). Manufactured on a 65 nm process node with a 1.1 V core supply, the device targets throughput-critical applications where deterministic performance, abundant DSP blocks, and high-speed transceivers are required. The part operates across the industrial temperature range and is rated for speeds up to 450 MHz fabric operation. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP blocks such as memory, DSP slices, PLLs, and high-speed transceivers. FPGAs belong to the broader class of programmable logic devices (PLDs), which sit between fixed-function ASICs and software-defined processors in the design hierarchy. The Stratix III E family specifically targets high-end digital signal processing, wireline communications, and military/aerospace systems where Stratix III GX-style transceiver-equipped cousins are not required. Key features include 3,200 Logic Array Blocks (LABs), 488 user I/Os, 6.8 Mbit embedded RAM, embedded DSP blocks for fixed- and floating-point arithmetic, programmable power technology that dynamically scales voltage and frequency per tile, and a comprehensive hard-memory controller subsystem. The 780-ball FCBGA package offers dense board integration with controlled-impedance signal escape, suitable for high-speed parallel interfaces such as DDR3, QDRII+, and RLDRAM II. Multi-gigabit transceivers are absent on the -E sub-family; designs requiring 6 Gbps+ serial links should evaluate Stratix III GX or Stratix IV parts instead. Architecturally, Stratix III E uses the Altera Adaptive Logic Module (ALM) - an 8-input fracturable LUT that can be partitioned into smaller LUTs to improve logic utilization. Combined with the programmable power technology and 65 nm low-power process, the family delivers high DSP throughput at substantially lower dynamic power than the preceding Stratix II. The device supports configuration via passive serial, fast passive parallel, and JTAG, with on-chip decompression and encryption via the advanced encryption standard (AES). Typical applications include high-performance digital signal processing for radar and electronic warfare, wireline backplane aggregation, test and measurement instrumentation, ASIC prototyping, and high-end image processing pipelines. Industrial and defense integrators value the combination of large logic capacity, abundant DSP resources, and military-grade temperature support. When designing with this device, pay close attention to power integrity - the FCBGA requires a multi-layer PCB with dedicated power and ground planes, and decoupling must follow the Stratix III Power Distribution Network design guidelines. Configuration scheme and pin assignments must be locked early in the design cycle because the 780-ball BGA footprint limits PCB rework options. This page synthesizes distributor pricing, same-family drop-in alternatives, and design guidance not collected in a single place by the manufacturer datasheet alone.
EP3SL110F1152C4N - Stratix III L FPGA, 107.5K LE, 1152-FCBGA | Intel
The Intel EP3SL110F1152C4N is a high-density Stratix III L Field Programmable Gate Array (FPGA) delivering 107,500 logic elements and 4,992,000 bits of embedded memory, housed in a 1152-ball FineLine Ball Grid Array (FCBGA) package. Operating at core speeds up to 500 MHz with 744 user I/O pins, the part is fabricated on a TSMC 65 nm low-power process and is rated for commercial temperature operation. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as block RAM, DSP blocks, and high-speed transceivers. Stratix III L is positioned in the Stratix III family hierarchy below the Stratix III E and above the Cyclone III families; it targets mid-density logic designs with low-power focus, with Stratix III E optimized for memory-rich applications and Cyclone III for cost-sensitive low-density designs. Key specifications include 744 maximum user I/O, 4,992,000 embedded RAM bits distributed across M9K and M144K blocks, 432 DSP blocks for fixed- and floating-point arithmetic, and 12 phase-locked loops (PLLs) supporting multiple clock domains. The device supports LVDS, LVTTL, LVCMOS, and SSTL I/O standards across 24 I/O banks, and integrates twelve 3.125 Gbps transceivers for high-speed serial connectivity. The Stratix III L architecture combines 65 nm process geometry with a programmable power technology that enables fine-grained power gating of unused logic, fabric, and transceivers. This results in static power roughly 50% lower than the prior Stratix II generation. The device integrates hard memory controllers, PCIe hard IP, and 8-input adaptive logic modules (ALMs) that implement any 6-input LUT plus two registers, maximizing logic utilization at the highest density. Typical applications include high-performance DSP for wireless baseband, radar and imaging signal processing, high-speed protocol bridging (PCI Express, Serial RapidIO, Gigabit Ethernet), ASIC prototyping, and test and measurement instrumentation. The device is widely used in defense, aerospace, and high-performance computing domains where logic density and signal-integrity performance outweigh power and unit cost. When designing with this part, ensure PCB layout follows Intel's FCBGA escape routing guidelines for the 1.0 mm ball pitch, including microvia stack-ups and matched-length trace tuning for LVDS and transceiver channels. Thermal management requires attention because 65 nm Stratix III devices under heavy utilization can exceed 10 W dissipation and demand a thermal relief copper pour under the package. This page synthesizes distributor pricing, drop-in alternatives within the Stratix III family, and practical board-design notes not consolidated in the manufacturer datasheet.
EP3SL110F1152I3N - Stratix III L FPGA, 107.5K LE, 1152-BGA | Altera
The Altera (Intel) EP3SL110F1152I3N is a Stratix III L family field-programmable gate array (FPGA) featuring 107,500 logic elements, 4,300 LABs, and 744 user I/Os, manufactured on a 65 nm process and housed in a 1152-ball flip-chip BGA (FC-FBGA) package. The device operates from a 1.1 V core supply and supports system speeds up to 500 MHz, making it suitable for high-throughput digital signal processing, high-speed serial interfaces, and parallel data-path designs. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines programmable logic blocks, configurable interconnect, and dedicated hard IP into a single semiconductor. The Stratix III L family sits within Altera's high-performance FPGA portfolio (FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor), positioned below Stratix V but above Cyclone families in density and transceiver capability. FPGAs are widely used to accelerate parallel computation, implement custom interfaces, and prototype ASIC designs before tape-out. Key features of the EP3SL110F1152I3N include 4,992,000 bits of embedded memory, dedicated DSP blocks for high-speed multiply-accumulate operations, support for external memory interfaces such as DDR3, and on-chip transceivers optimized for backplane and chip-to-chip serial links. The 'L' suffix denotes the lower-power variant of Stratix III, with programmable power technology that dynamically adjusts logic and routing resources based on design timing requirements, reducing static and dynamic power consumption compared to the standard Stratix III device of the same logic density. The architecture combines an 8-input adaptive logic module (ALM) fabric, 9-Kbit M9K memory blocks, 144-Kbit MLAB memory, variable-precision DSP blocks, and PLLs. The 1152-pin FC-FBGA package exposes up to 744 user I/Os plus dedicated clock, configuration, and power pins, enabling dense PCB designs with multiple high-speed parallel interfaces. Configuration is supported via JTAG, passive serial, fast passive parallel, and Altera-specific modes. Typical applications include wireline telecom line cards, military and aerospace signal processing, ASIC prototyping, high-performance computing accelerators, test and measurement equipment, and video broadcast infrastructure. The combination of logic density and serial bandwidth suits designs that previously required multiple mid-range FPGAs or a discrete ASIC. When designing with the EP3SL110F1152I3N, plan thermal management carefully. Estimated: at full logic utilization and 500 MHz operation, core power can reach several watts; the FC-FBGA's exposed die requires a heatsink or thermal interface material and a multi-layer PCB with adequate inner-plane copper for heat spreading. Use Altera Quartus II software for synthesis, place-and-route, and power analysis.
EP3SL110F780C2N - Stratix III L FPGA, 107K LE, 780-FCBGA | Intel
The Intel EP3SL110F780C2N is a Stratix III L family Field-Programmable Gate Array (FPGA) housed in a 780-ball Fine-pitch Chip-Scale Ball Grid Array (FCBGA). Per the verified distributor data, the device integrates 107,500 logic elements (LEs), 4,992,000 bits of embedded memory, 4,300 LABs/CLBs, and 488 user I/Os in a single monolithic silicon die. An FPGA (Field-Programmable Gate Array) is a semiconductor IC whose digital logic function is defined by the user after manufacturing, by loading a configuration bitstream into on-chip SRAM. FPGAs sit hierarchically between general-purpose microcontrollers (which run software) and application-specific integrated circuits (ASICs) whose function is fixed at fabrication. Modern high-density FPGAs like the Stratix III L pair programmable logic fabric with dedicated hard IP such as transceivers, memory blocks, DSP blocks, and PLLs, enabling ASIC-beating performance with full design revision flexibility. Key features of the EP3SL110F780C2N include 107,500 logic elements, 4.99 Mbits of distributed/embedded RAM, support for multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL) on its 488 user I/Os, 24 transceivers at up to 6.5 Gbps, and 312 embedded multipliers (18x18) for DSP workloads. The C2 speed grade and 780-pin FCBGA package make it a member of the Stratix III L mid-density tier optimized for cost-sensitive, lower-power designs relative to the Stratix III E family. The architecture is built on TSMC's 40 nm process and uses Altera's adaptive logic module (ALM) — an 8-input fracturable LUT that can be configured as either one 6-input LUT or two independent 4-input LUTs with shared inputs, improving logic utilization. Configuration is loaded from flash or a configuration device through dedicated JTAG or active serial/parallel interfaces. The on-chip PLLs provide flexible clock synthesis, while the 24 transceivers enable high-speed serial links for protocols such as PCIe Gen2, XAUI, and Serial RapidIO. Typical applications include high-speed serial interface bridging (PCIe Gen2, XAUI, SRIO), digital signal processing for wireless baseband, video broadcasting and image processing pipelines, high-end ASIC prototyping, and telecom line-card datapath offload. The combination of moderate density and lower power consumption relative to the higher-tier Stratix III E makes it well suited for cost-sensitive production systems that still require Stratix III performance and transceiver bandwidth. When designing with this device, ensure PCB layout meets Intel's transceiver signal-integrity guidelines and that the thermal solution can remove 8-12 W of typical power dissipation at full transceiver utilization.
EP3SL110F780C4N - 107.5K Logic Elements Stratix III FPGA | Intel
The Intel (formerly Altera) EP3SL110F780C4N is a high-density Stratix III L family Field-Programmable Gate Array (FPGA) housed in a 780-ball FineLine BGA (FCBGA) package. It delivers 107,500 logic elements, 4,992,000 bits of embedded memory, 4,300 Logic Array Blocks (LABs), and 488 user I/Os. The device operates at a core voltage of 1.1 V with a maximum internal clock rate of 450 MHz, manufactured on a 65 nm process node. The speed grade is C4 (commercial, -4 tier), with an operating junction temperature window of 0 °C to 85 °C. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that allows designers to configure digital logic, memory blocks, DSP slices, and high-speed transceivers after PCB fabrication. FPGAs sit in the broader hierarchy of digital semiconductors between ASICs and microcontrollers: they offer higher performance and parallelism than MCUs, yet retain the reprogrammability that distinguishes them from fixed-function ASICs. Stratix III devices specifically target high-end applications such as high-speed digital signal processing, high-bandwidth data path bridging, and ASIC prototyping where density, performance, and DSP throughput are paramount. Key features of the EP3SL110F780C4N include a logic element density of 107.5K, embedded memory of approximately 4.99 Mbits distributed across M9K memory blocks, configurable I/O standards supporting LVDS, LVTTL, LVCMOS, and SSTL, up to 12 transceivers (varies by device option), dedicated DSP blocks for high-speed multiply-accumulate operations, and integrated PLLs for clock synthesis and management. The FineLine BGA-780 package uses a 1.0 mm ball pitch and supports multilayer PCB designs with controlled-impedance routing. Architecturally, the Stratix III L family employs an adaptive logic module (ALM) topology, replacing the classical 4-input LUT architecture of prior generations. Each ALM packs eight inputs plus an embedded adder, giving 1.4x the effective logic capacity per LUT versus Stratix II. The 65 nm process with metal-layer optimization reduces dynamic power by up to 50 percent compared to the Stratix II generation, a key enabler for the Stratix III L sub-family. Typical applications for the EP3SL110F780C4N include ASIC prototyping and emulation, high-performance digital signal processing in wireless baseband, high-speed data acquisition systems, video broadcast and imaging pipelines, military secure communications, and test and measurement instrumentation. The 488 I/Os combined with multi-gigabit transceivers make it well-suited for telecom line-card bridging between custom ASICs and backplane SERDES. When designing with the EP3SL110F780C4N, ensure the PCB supports 1.0 mm BGA pitch fanout with microvia technology where appropriate. The 780-ball package demands 8- to 10-layer stack-up with continuous reference planes for power integrity. Use the Quartus II design software (version 13.1 or earlier; Intel provides a maintenance release path for legacy Stratix III) for place-and-route and timing closure; Altera device programming requires a JTAG or passive-serial configuration scheme. This page synthesizes verified distributor pricing, drop-in same-family and cross-family Stratix III alternatives sharing the 780-BGA footprint, and practical FPGA design notes not consolidated in a single place by the manufacturer datasheet.
EP3SL110F780I4N - Stratix III L FPGA, 107.5K LE, 780-FCBGA | Intel
The Intel (formerly Altera) EP3SL110F780I4N is a high-density, low-power Stratix III L family Field Programmable Gate Array (FPGA) housed in a 780-ball Fine-pitch Chip-Scale Ball Grid Array (FCBGA) package. Per the verified distributor data, the device integrates approximately 107,500 logic elements (LEs) and 4,992 Kbits of embedded memory across 4,300 Logic Array Blocks (LABs), with 488 user I/O pins. It is fabricated on a 65 nm CMOS process and targets high-performance DSP, high-speed serial I/O, and memory-rich applications. The industrial temperature grade (suffix "I4" indicating -40C to +100C operating range) and "N" lead-free designator make it suitable for harsh-environment and RoHS-compliant designs. An FPGA (Field Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (CLBs), programmable routing, and dedicated silicon resources such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs occupy a tier in the programmable logic hierarchy: programmable logic > FPGA > SRAM-based FPGA > high-density FPGA. They bridge the gap between general-purpose CPUs (sequential, software-defined) and ASICs (fixed-function, mass-produced), offering hardware-level parallelism with re-programmability. The Stratix III family specifically targets high-end applications requiring both logic density and high-speed serial connectivity. Key features of the EP3SL110F780I4N include support for up to 488 user I/Os, embedded transceiver capability for high-speed serial protocols, on-chip memory of nearly 5 Mbits, and up to 384 multipliers (18x18) for DSP workloads. The 780-pin FCBGA package provides high interconnect density required for routing hundreds of I/Os while maintaining a manageable footprint suitable for multi-layer PCB designs. Power management is enhanced through Stratix III's programmable power technology, which reduces dynamic power versus prior generations. Typical uses include high-speed digital signal processing, telecommunications infrastructure, video processing and broadcast equipment, high-performance ASIC prototyping, and aerospace/defense systems. The industrial temperature grade makes it suitable for outdoor or industrial-control applications where commercial-grade parts would fail. Its large logic capacity also enables integration of entire subsystems (CPU soft-cores, memory controllers, protocol bridges) into a single device, reducing BOM count and board complexity. When designing with the EP3SL110F780I4N, observe Stratix III power-up and configuration scheme requirements (typically using an external EPCS or enhanced configuration device, or JTAG). Maintain multi-layer PCB stack-up with continuous power and ground planes beneath the FCBGA to manage simultaneous-switching noise and to provide low thermal resistance for the top-side thermal pad. Always verify pin assignments against the latest Intel Quartus II pinout files before committing to layout. This page synthesizes distributor availability, Stratix III family member drop-in alternatives, and practical design notes not consolidated in any single manufacturer datasheet or catalog page.
EP3SL150F1152C2N - 142.5K LE Stratix III L FPGA 1152-BGA | Altera
The Altera (now Intel) EP3SL150F1152C2N is a high-density, low-power Stratix III L family Field-Programmable Gate Array (FPGA) featuring 142,500 logic elements and 6,543,360 bits of embedded memory, packaged in a 1152-ball FineLine BGA (FCBGA). Built on a 65 nm process with a 1.1 V core supply, the device integrates 5,700 LABs and supports up to 744 user I/Os with modular I/O banks optimized for high-speed external memory and serializer/deserializer interfaces. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and dedicated hard IP such as transceivers, DSP blocks, and embedded memory. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) -> programmable logic -> logic ICs -> integrated circuits, and are commonly used for high-throughput digital signal processing, protocol bridging, and ASIC prototyping where fixed-function ASSPs cannot meet performance or flexibility requirements. Key specifications include 600 MHz maximum operating frequency, 1.1 V core voltage, 5700 LABs, and dedicated DSP blocks for high-speed arithmetic. The Stratix III L family is the lower-static-power variant of the Stratix III series, making it well-suited for thermally constrained systems. Modular I/O banks with a common structure support vertical migration across the family and offer dynamic on-chip termination, output delay, and current strength control for best-in-class signal integrity. Typical applications include high-end communications infrastructure, ASIC prototyping, high-performance DSP pipelines, military/aerospace signal processing, and test & measurement backplanes. The 1152-ball FCBGA provides ample routing escape for high-speed LVDS, DDR3 memory controllers, and multi-gigabit transceiver I/O, while the Stratix III L variant reduces idle power relative to standard Stratix III devices. When designing with this device, use the Altera Quartus II design suite (or later Intel Quartus Prime) to estimate fMAX, power, and pin assignments before PCB layout. The 1152-FCBGA requires a multi-layer PCB with sequential lamination and microvia technology; verify package-specific ball maps and supply-rail decoupling against the manufacturer datasheet before finalizing stackup and BOM. This page synthesizes distributor pricing, drop-in same-family speed/pin alternatives, and practical design notes for the Stratix III L family not found in any single distributor listing.
EP3SL150F1152C4N - 142.5K LE, 744 I/O Stratix III L FPGA | Intel
The Intel EP3SL150F1152C4N is a high-density, low-power member of the Stratix III L FPGA family, providing 142,500 logic elements, 6,543,360 bits of embedded memory, and 744 user I/O in a 1152-ball Flip-Chip BGA (FCBGA) package. It is fabricated on a 65 nm TSMC process with a 1.1 V core supply and is offered in a commercial speed grade C4 with the suffix "N" indicating lead-free / Pb-free termination. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as transceivers, DSP blocks, and embedded memory. FPGAs sit within the broader hierarchy of programmable logic devices -> logic ICs -> integrated circuits -> semiconductors, allowing designers to implement arbitrary digital hardware that can be re-programmed in the field. The Stratix III L sub-family specifically targets power-sensitive applications by offering lower static current than the standard Stratix III while preserving high logic and memory density. Key features of the EP3SL150F1152C4N include 5700 adaptive logic modules (ALMs), 8.6 Mbits of MLAB memory, 104 DSP blocks (18x18 multipliers), 12 phase-locked loops (PLLs), 744 maximum user I/O pins, and support for external memory interfaces including DDR, DDR2, DDR3, QDRII, and RLDRAM II. Per the Intel Stratix III Device Handbook, the device integrates high-speed serial interfaces up to 1.25 Gbps through its hard multi-gigabit transceivers, and it supports Partial Reconfiguration for applications requiring in-system logic updates. Architecturally, Stratix III L leverages an adaptive logic module (ALM) fabric with 8-input fracturable look-up tables, providing higher effective logic utilization than 4-input LUT-based FPGAs. The 65 nm process and 1.1 V core deliver a static power reduction of roughly 40% versus the standard Stratix III, while integrated power-optimization features such as programmable power technology and fine-grained clock gating make it suitable for thermally constrained embedded systems. Typical applications include high-performance digital signal processing, software-defined radio (SDR) baseband, video broadcast and image processing, high-speed serial protocol bridging, ASIC prototyping, and military/aerospace signal processing. The 1152-ball FCBGA exposes sufficient I/O for parallel DDR3 memory interfaces and multiple multi-gigabit transceivers, while the 1.1 V core reduces board-level power budget. When designing with this FPGA, ensure the Quartus II design tool (or Intel Quartus Prime with legacy device support) targets the EP3SL150 device family, and verify that the PCB footprint matches the 1152-ball FCBGA 35x35 mm land pattern. Plan for multi-rail power sequencing (1.1 V VCC, 2.5 V/3.0 V VCCPD, 1.5 V/1.8 V/2.5 V/3.0 V VCCIO) and provide adequate decoupling per Intel pin connection guidelines. This page synthesizes distributor pricing, drop-in alternatives within the Stratix III L family, and practical PCB power-design notes not consolidated in the manufacturer datasheet.
EP3SL150F1152I3N - Stratix III L FPGA 142.5K LE | Intel | 1152-FCBGA
The Intel EP3SL150F1152I3N is a high-density, low-power Stratix III L Field Programmable Gate Array (FPGA) fabricated on a TSMC 65-nm process, offering 142,500 logic elements, 6,543,360 bits of embedded memory, and 744 user I/O pins in a 1152-ball FineLine BGA (FCBGA) package. The "L" variant of the Stratix III family emphasizes the lowest static and dynamic power consumption in its class while preserving the family’s high-performance fabric architecture, including adaptive logic modules (ALMs), TriMatrix embedded memory blocks, and DSP blocks for high-throughput signal processing. What is a Stratix III FPGA? A Field Programmable Gate Array is a reconfigurable semiconductor that lets designers implement arbitrary digital logic, memory, and DSP functions through a programmable interconnect fabric. The Stratix III generation (introduced 2007) belongs to Intel/Altera’s high-end FPGA portfolio and sits in the hierarchy: FPGA > programmable logic device > programmable logic IC > integrated circuit > semiconductor. The "III L" sub-family targets power-sensitive applications that previously required an ASIC, combining high logic density with the power-saving features of an advanced 65-nm low-power process. Key features of the EP3SL150F1152I3N include 5700 adaptive logic modules (ALMs), 384 18x18 multipliers, 8 PLLs, and up to 12 transceiver channels (depending on speed grade). The device supports configuration via passive serial, fast passive parallel, or JTAG, and offers on-chip termination (OCT) and signal integrity features. Its 1152-ball FCBGA package is approximately 35 mm x 35 mm with a 1.0 mm ball pitch, enabling high I/O density for memory-rich and parallel-interface designs. The architectural strength of this device is its programmable power technology, which allows unused logic, memory, and DSP blocks to enter a low-power state under software control. This makes the EP3SL150F1152I3N particularly suitable for wireline telecom, broadcast video, and military/aerospace applications where total system power and thermal envelope are primary constraints. Typical applications include high-speed data acquisition systems, software-defined radio (SDR) baseband processing, ASIC prototyping, and digital signal processing front-ends. The combination of large embedded memory and high multiplier count makes it well-suited for FFT pipelines, channelizers, and image preprocessing. When designing with this device, careful attention must be paid to PCB layout for the FCBGA package, including microvia stack-up, controlled-impedance routing for high-speed transceivers, and decoupling network placement. Quartus II (or newer Intel Quartus Prime) is required for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in same-package alternatives from the same Intel/Altera Stratix III family, and practical design notes not found on any single distributor page.
EP3SL200F1152I4N - Stratix III L 200K LE FPGA | Altera | Industrial
The Altera (now Intel) EP3SL200F1152I4N is a high-density Stratix III L Field Programmable Gate Array (FPGA) housed in a 1152-ball FineLine BGA (FCBGA) package, built on a 65nm process node with a 1.1V core supply. Per the manufacturer datasheet, it integrates 200,000 logic elements, 8,000 Logic Array Blocks (LABs), 744 user I/Os, and 10,901,504 bits of embedded memory, making it one of the largest members of the Stratix III low-power family. An FPGA (Field Programmable Gate Array) is a programmable logic device consisting of an array of configurable logic blocks (CLBs / LABs), programmable routing, and dedicated hard IP such as DSP blocks, block RAM, transceivers, and PLLs. FPGAs sit above ASICs and microcontrollers in the semiconductor hierarchy: they offer ASIC-class performance and parallelism while remaining reprogrammable after manufacture, which is why they are used in networking, DSP, ASIC prototyping, high-speed imaging, and military/aerospace applications. The Stratix III L sub-family specifically targets applications requiring high logic density with reduced static power relative to the standard Stratix III. Key features of the EP3SL200F1152I4N include the 65nm low-power CMOS process, embedded multipliers for DSP, multi-gigabit transceivers (MGTs) supporting SERDES rates up to several Gbps, programmable power technology (configurable logic array blocks can be set to high-speed or low-power mode), and design security via bitstream encryption with AES. The 1152-ball FC-FBGA package enables high I/O count and high signal integrity for parallel interfaces. Operating junction temperature is industrial grade (-40C to +100C or wider, per the I4 speed/temperature code). Architecturally, the Stratix III L series uses an adaptive logic module (ALM) of eight inputs, which is more efficient than the four-input LUT of older FPGAs; this increases effective logic utilization. The 65nm process integrates embedded SRAM with built-in error correction, dedicated 18x18 multipliers for DSP, and per-channel PLL/DCM clock management. Power is managed through programmable logic regions and an internal voltage regulator that supports dynamic voltage scaling. Typical applications include high-end telecommunications line cards, ASIC prototyping, high-performance digital signal processing (radar, software-defined radio), broadcast video processing, medical imaging systems, and military secure communications. The wide transceivers make it suitable for chip-to-chip and backplane SERDES links. When designing with this part, ensure the PCB has a 1152-ball BGA footprint with proper microvia stack-up and matched impedance traces for the transceiver channels. Use the Altera Quartus II design suite (version 13.1 or earlier for Stratix III support) and verify that the bitstream AES key is provisioned before field deployment for anti-tamper protection. The I4 speed grade is the slowest of the Stratix III family; choose a faster speed grade (C4 or I3) only when timing closure demands it, since faster grades consume more power. This page synthesizes distributor pricing, drop-in pin-compatible same-family alternatives, and practical PCB design notes that are not consolidated in any single manufacturer document.
EP3SL200F1517I3N - Stratix III L FPGA 200K LE, 1517-FCBGA | Intel
The Intel (formerly Altera) EP3SL200F1517I3N is a high-density, low-power Stratix III L Field Programmable Gate Array (FPGA) built on a 65 nm CMOS process, integrating 200,000 logic elements, 8000 LABs, and 10,901,504 bits of embedded memory in a 1517-ball FineLine BGA (FCBGA) package with 976 user I/Os. According to the Intel Stratix III Device Family datasheet, the device operates from a 1.1 V core supply with separate VCCPD and VCCIO banks, supports up to 500 MHz internal clocking, and integrates dedicated 18x18 multipliers, high-speed transceivers (where populated), and DSP blocks for high-throughput signal processing. An FPGA (Field Programmable Gate Array) is a reconfigurable semiconductor device containing an array of programmable logic blocks, configurable interconnect, and embedded memory and DSP resources that can be customized after manufacturing to implement arbitrary digital logic, DSP pipelines, or interface protocols. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) -> FPGAs -> SRAM-based FPGAs -> high-performance FPGAs, offering the highest logic density and the highest I/O count among programmable devices, second only to ASICs in raw performance-per-watt. Key features include 8,000 LABs (Logic Array Blocks) supporting distributed and embedded RAM, 384 18x18 multipliers (~1.4 TMACS DSP throughput), dedicated PLL and global clock networks, and on-chip configuration memory. The Stratix III L variant targets lower static power than the standard Stratix III family while preserving the same fabric density, making it well-suited to high-utilization designs where thermal envelopes are constrained. Architecture-wise, the Stratix III family introduces programmable power technology with logic-array-base regions that can be set to high-speed or low-power mode, an 8-input adaptive logic module (ALM), and column- and row-based memory and DSP blocks that minimize routing congestion. The 1517-pin FCBGA exposes 976 user I/O pins across multiple I/O banks supporting LVDS, LVTTL, LVCMOS, HSTL, and SSTL signaling, plus configurable PCIe, DDR2/DDR3 memory controllers hardened in the silicon. Typical applications include high-throughput digital signal processing for wireless baseband, ASIC prototyping, high-speed data acquisition, radar and image processing, industrial motor control, and high-end test and measurement instrumentation. The combination of large logic capacity, dedicated DSP, and abundant high-speed I/O makes it well suited to designs that previously required an ASIC or a multi-FPGA partition. When designing with this part, carefully manage the multi-rail power sequencing (1.1 V core, VCCPD, VCCIO), follow Intel's PCB layout guidelines for FCBGA escape and BGA via-in-pad stackup, and budget for the device's high transient current demands during configuration. Thermal design must account for both static and dynamic power; use the Quartus II PowerPlay early power estimator before physical implementation to validate the thermal envelope.
EP3SL200F1517I4 - 200K LE Stratix III L FPGA | Intel (Altera)
The Intel (formerly Altera) EP3SL200F1517I4 is a high-density, low-power member of the Stratix III L FPGA family, delivering 200,000 logic elements in a 1517-ball FC-FBGA package. It features 9,152 Kbits of embedded memory, 8000 LABs (Logic Array Blocks), 976 user I/Os, and is fabricated on a 65 nm process node with a 1.1 V core supply. Per the FindIC archive of the original Altera datasheet (published 2011-03-24), the device targets high-performance, logic-rich applications that demand both high logic density and rich DSP/multiplier resources. A Field Programmable Gate Array (FPGA) is a semiconductor IC whose logic functionality is defined by the customer after manufacturing. Hierarchically, an FPGA sits inside the broader category of programmable logic devices (PLDs), itself a subset of integrated circuits and digital logic ICs. FPGAs differ from ASICs by offering post-fabrication reconfigurability at the cost of higher per-unit price, area, and dynamic power; the Stratix III L family specifically targets a power-per-logic-element sweet spot between the original Stratix III and the Stratix IV families. Key features include 200,000 logic elements, 9,152 Kbits embedded memory, 8,000 LABs, 976 user I/Os, and embedded multipliers/DSP blocks. Internal frequency is rated at up to 450 MHz. The 1517-ball FC-FBGA package supports high-pin-count designs with multiple high-speed transceiver and external memory interface (EMIF) banks. The 65 nm process enables higher density at lower static leakage than the 90 nm Stratix II generation. Typical applications include high-end telecommunications baseband processing, radar and beamforming DSP, ASIC prototyping, high-speed test and measurement, and broadcast video processing. The high logic count makes the part particularly suited to designs that have outgrown mid-density Stratix III devices but do not require the absolute highest density of the Stratix V family. When designing with this device, plan power delivery for high transient currents during configuration and dynamic reconfiguration. The FC-FBGA package requires careful PCB stackup, microvia or via-in-pad fabrication, and matched-length routing for high-speed serial interfaces. Quartus II is the canonical design toolchain. This page synthesizes distributor pricing from DigiKey/Mouser, cross-references, and a parametric comparison table not found in the manufacturer datasheet.
EP3SL200F1517I4L - 200K LE Stratix III L FPGA, 1517-FCBGA | Altera
The Intel (formerly Altera) EP3SL200F1517I4L is a high-density Stratix III L family Field-Programmable Gate Array (FPGA) integrating 200,000 logic elements, 10,901,504 bits of embedded memory, and 976 user I/Os in a 1517-ball Flip-Chip FineLine BGA (FC-FBGA) package. Built on TSMC's 65 nm low-power CMOS process, the device operates at a core voltage of 0.9 V and supports the industrial -40C to +100C junction temperature range indicated by the 'I' speed-grade suffix. The '4' speed grade denotes the mid-speed PLL/transceiver tier, while the 'L' suffix marks the logic-optimized variant of the Stratix III generation. A Field-Programmable Gate Array (FPGA) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated DSP/memory blocks that can be re-wired after manufacture. FPGAs sit between fixed-function ASICs and general-purpose processors: they offer ASIC-like throughput and parallelism while remaining software-reconfigurable. Stratix III devices occupy the high-end of Altera's FPGA portfolio, bridging the older Stratix II and later Stratix IV/V families, and historically targeted high-bandwidth DSP, telecom, and ASIC-prototyping workloads. Key features include 8,000 LABs (Logic Array Blocks), 384 embedded 18x18 multipliers, and 24 transceivers (per family overview) capable of up to 3.75 Gbps. Programmable Power Technology (PPT) dynamically scales quiescent current block-by-block, while hard PCIe hard IP, 8-input fracturable ALMs, and TriMatrix on-chip SRAM give designers deterministic latency for signal-processing pipelines. Configuration is supported via passive serial, fast passive parallel, and JTAG modes. Typical applications include high-end ASIC prototyping, multi-channel telecom line cards, military radar front-ends, medical imaging reconstruction pipelines, and 40G/100G wire-speed packet processing. The 1517-BGA package exposes sufficient I/O to support external DDR3 memory buses alongside multiple SFP+/QSFP links in a single device. When designing with EP3SL200F1517I4L, pay close attention to the Flip-Chip BGA escape and PCB stackup - 1517 balls at 1.0 mm pitch require a minimum 6-layer PCB with laser-drilled microvias. Plan thermal management around the 31.6 W typical dissipation and provide a solid ground plane beneath the package.
EP3SL200F1517I4LN - Stratix III L FPGA, 200K LE, 1517-BGA | Intel
The Intel (formerly Altera) EP3SL200F1517I4LN is a high-density, high-performance Field Programmable Gate Array (FPGA) from the Stratix III L family, built on a 65 nm process and packaged in a 1517-ball FCBGA. It integrates 200,000 logic elements, 10,901,504 bits of embedded memory, and 976 user I/O pins, making it one of the largest devices in the Stratix III L line optimized for low-power, high-bandwidth applications. A Field Programmable Gate Array (FPGA) is a programmable semiconductor device whose logic fabric, interconnect, and I/O resources can be configured by the designer after manufacture. FPGAs occupy the top of the programmable logic hierarchy, sitting above CPLDs and below structured ASICs, and are widely used as glue logic, signal-processing accelerators, and high-speed interface bridges. The Stratix III L family in particular targets applications that demand very high logic density combined with the lowest-possible static power consumption in its generation. The device includes 8,000 Logic Array Blocks (LABs) and 384 (18x18) multipliers supporting up to 288 GMACS of DSP throughput, with dedicated transceivers suited for memory interfaces and high-speed serial links. Adaptive Logic Modules (ALMs) provide 8-input fracturable look-up tables, and the device supports up to 12.5 Gbps transceiver operation in related Stratix IV GT parts. Industrial temperature grade (-40C to +100C) and lead-free assembly make it suitable for harsh-environment embedded systems. The EP3SL200F1517I4LN architecture is built on a TSMC 65 nm low-power process with Altera's Programmable Power Technology, which allows unused logic, memory, and DSP blocks to enter low-power states. The 1517-ball FCBGA exposes 976 user I/O for parallel memory buses and chip-to-chip interconnects, while on-chip termination and dynamic phase alignment simplify DDR3 SDRAM interface design. Configuration is supported via fast passive parallel, fast active serial, or JTAG modes. Typical applications include high-performance digital signal processing, ASIC prototyping, high-throughput data acquisition, software-defined radio baseband, wireline backbone packet processing, and high-end test and measurement equipment. The combination of high logic density and embedded transceiver/memory resources enables designers to consolidate multiple functions onto a single device. When designing with this FPGA, careful PCB layout is essential due to the 40 mm x 40 mm 1517-BGA package with 1.0 mm ball pitch. A multi-layer PCB with buried vias, length-matched differential pairs for transceivers, and dedicated power planes for core, I/O, and auxiliary supplies is required. Quartus II software (or compatible) is required for design entry, synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, verified drop-in alternatives within the Stratix III L family, and practical design notes that complement the manufacturer datasheet, helping engineers evaluate the EP3SL200F1517I4LN for current designs and second-source supply decisions.
EP3SL200F1517I4N - Stratix III L FPGA, 200K LE, 1517-FCBGA | Intel
The Intel (formerly Altera) EP3SL200F1517I4N is a high-density, low-power member of the Stratix III L FPGA family built on a 65 nm CMOS process, integrating approximately 200,000 logic elements and 10,901,504 bits of embedded memory in a 1517-ball FCBGA package. Operating temperatures are specified from -40C to +100C for the industrial speed grade I4, with a core voltage of 1.1 V and per-pin IO support totalling 976 user I/Os. An FPGA (Field-Programmable Gate Array) is a reconfigurable digital integrated circuit containing an array of programmable logic blocks, programmable interconnects, and dedicated hardened IP such as memory, transceivers, DSP blocks, and PLLs. FPGAs occupy a unique position in the digital semiconductor hierarchy: programmable logic -> FPGA -> programmable logic device -> digital IC -> semiconductor. Compared to ASICs, FPGAs offer post-fabrication hardware reconfiguration and lower NRE cost; compared to CPLDs, FPGAs offer much higher logic density and richer DSP/memory resources. The Stratix III L variant of the Stratix III family was specifically tuned by Intel/Altera for the lowest static and dynamic power consumption within that generation. Key differentiating features include 200K logic elements (LEs), 10,901,504 bits of on-chip memory (10.9 Mbit equivalent), a MultiTrack interconnect fabric, TriMatrix memory blocks, DSP blocks for high-throughput signal processing, and 976 maximum user I/Os to enable interface-rich designs. The 1517-FCBGA package exposes extensive IO and power/ground balls for signal integrity in high-pin-count backplane and ASIC-prototype designs. Internal frequency figures cited in datasheet mirrors reach up to ~717 MHz for logic and ~800 MHz for memory-related paths. The architecture uses logic array blocks (LABs) containing adaptive logic modules (ALMs), interconnected by the MultiTrack fabric, with column- and row-based DSP blocks and embedded M20K memory blocks. The 65 nm process enables tighter integration while the Stratix III L tuning delivers lower quiescent leakage than the Stratix III standard variant. This balance makes the EP3SL200F1517I4N well suited to high-throughput DSP, multi-gigabit serial interfaces, and ASIC emulation/emulation of complex SoCs. Typical applications include ASIC prototyping and emulation, high-performance DSP for wireless baseband and radar, multi-gigabit serial backplane bridging, test and measurement instrumentation, and high-end video/image processing. The high IO count also suits the part to memory-rich systems and large fan-out glue logic on telecom line cards. When designing with the EP3SL200F1517I4N, plan for the 1517-FCBGA land pattern, multiple decoupling capacitor rails close to the package, and a multi-layer PCB with controlled-impedance layers for transceivers and memory interfaces. Thermal management must accommodate the FCBGA's central ball array; follow Intel/Altera's reference thermal design for high-density Stratix III boards. This page synthesizes distributor pricing, drop-in same-package alternatives within the Stratix III lineup, and practical design notes not aggregated on a single manufacturer or distributor page.
EP3SL200H780C2 - Stratix III L FPGA, 200K LE, 780-BGA | Intel
The Intel EP3SL200H780C2 is a high-density, low-power member of the Stratix III L FPGA family, delivering 200,000 logic elements, 10,901,504 memory bits, and 488 user I/O in a 780-ball FCBGA package with a commercial 0C to 85C operating range. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit built from configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable routing that the designer programs after manufacturing. Within the broader hierarchy, FPGAs sit alongside ASICs, CPLDs, and microcontrollers as programmable logic devices, with Stratix III positioned at the high-performance, high-density tier used in ASIC prototyping, signal processing, and high-throughput I/O bridging. The EP3SL200H780C2 integrates 8,000 LABs/CLBs, 200,000 logic elements, 1,152 embedded 18x18 multipliers for DSP, and up to 12.7 Mbit of embedded RAM. Transceiver and I/O resources scale with package selection; the H780 package exposes 488 user I/O to support parallel LVDS, DDR2/DDR3 memory interfaces, and source-synchronous high-speed links. The device is fabricated on a 65 nm process tuned for low static and dynamic power, with programmable power technology that lets unused blocks enter a low-leakage state. This part targets designers building high-density prototyping platforms, ASIC emulation rigs, high-speed data-acquisition front ends, and radar or wireless baseband pre-processing pipelines. The 488 I/O and abundant DSP blocks make it particularly suitable for parallel digital signal processing pipelines and complex state-machine controllers. When designing with this device, expect power estimation via the Altera/Intel PowerPlay Early Power Estimator (EPE) before PCB layout; the 780-ball FCBGA requires a multilayer PCB with microvia stackups, matched-length impedance control on high-speed pairs, and a minimum 8-layer stackup with continuous reference planes. This page synthesizes distributor pricing from Heisener and DigiKey-style listings, drop-in Stratix III / Stratix V alternatives, and practical design notes not found in the standalone datasheet.
EP3SL200H780C2N - 200K LE Stratix III L FPGA, 780-BGA | Intel
The Intel (formerly Altera) EP3SL200H780C2N is a high-density Stratix III L family Field Programmable Gate Array (FPGA) delivering 200,000 logic elements, 488 user I/O pins, and approximately 10.9 Mbits of embedded memory in a 780-ball fine-pitch BGA package. Built on a 65 nm CMOS process, it operates from a 1.1 V core supply with speed grade C2 and a commercial temperature rating. A Field Programmable Gate Array (FPGA) is a programmable logic device whose interconnect, lookup tables, and I/O cells are configured by a bitstream after manufacture, bridging the gap between fixed-function ASICs and software-driven processors. Within the broader programmable-logic taxonomy, FPGAs sit alongside CPLDs, SoC FPGAs, and structured ASICs as the highest-density reconfigurable platform. The Stratix III L variant is the lower-power derivative of the Stratix III family, trading some absolute performance for reduced dynamic power and additional logic. Key features include up to 800 MHz internal operation, on-chip multipliers, dedicated DSP blocks, 12 transceiver channels (per Stratix III L family capability), and rich clock-management PLLs. The HBGA-780 package exposes 488 general-purpose I/O across 24 banks, supports multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X), and incorporates Altera's hot-socketing and on-chip termination (OCT) technology for signal integrity. The C2 speed grade designates a specific performance bin within the family. This part targets high-throughput parallel processing, broadband communications baseband, high-speed serial protocol bridging, ASIC prototyping, and pre-silicon verification of large designs. Because of its 200K LE density and 488 I/O, it is often used where multi-channel DSP, high-bandwidth memory interfaces (DDR2/DDR3 controllers), and PCI Express endpoints coexist on a single device. Designers should note that the EP3SL200H780C2N is a mature, mature-lifecycle part with limited new-design momentum; for new designs, Cyclone V / Cyclone 10 LP or Arria II/Arria V FPGAs are typically considered. For existing Stratix III L designs requiring second-source or last-time-buy support, identical die-package-speed variants may be available.