FPGA & CPLD
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10M08SCM153C8G - MAX 10 FPGA 8K LE 153-VFBGA | Intel
The Intel (formerly Altera) 10M08SCM153C8G is a MAX 10 family Field Programmable Gate Array (FPGA) with 8,000 logic elements, 387,072 bits of embedded user flash memory, and 378 Kbits of block RAM in a 153-ball FineLine BGA (MBGA, 8x8 mm) package. It targets non-volatile, low-cost programmable logic applications with single-chip integration of FPGA fabric, flash, ADC, and DSP blocks. A field-programmable gate array (FPGA) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that engineers can reconfigure after manufacturing. FPGAs sit in the broader hierarchy as programmable logic -> logic ICs -> digital semiconductors. MAX 10 specifically is the low-cost, instant-on, non-volatile FPGA tier from Intel FPGA (formerly Altera), targeting glue logic, I/O expansion, and bridging applications. Key features include 8,000 logic elements (LEs), 387,072 bits (Kb) of user flash memory, 1.4 Mb embedded SRAM (approx. 378 Kbits block RAM distributed as 32 M9K blocks), 112 maximum user I/Os, integrated 12-bit SAR ADC, and on-die flash configuration. The device is fabricated on a 55 nm process, supports 3.0 V/3.3 V core and I/O operation, and offers commercial temperature grade (0C to 85C) for this C8G speed-grade ordering code. The MAX 10 architecture pairs an SRAM-based LUT fabric with a non-volatile configuration flash, eliminating the need for an external boot PROM. The C8G suffix designates a commercial temperature range device with speed grade 8 (slower), delivered in a Pb-free / RoHS-compliant 153-VFBGA. The M153 device code distinguishes it from MAX 10 devices in larger packages (M144, M169, M256, M324, M484, F256, F484, U169, U324) and smaller variants (M81). Typical applications include industrial control and I/O bridging, motor control co-processors, low-cost video processing pipelines, USB Type-C interface expansion, sensor aggregation hubs, and pre-production ASIC prototyping. The integrated 12-bit ADC makes it well suited to industrial monitoring and process control applications. When designing with the 10M08SCM153C8G, ensure the PCB land pattern follows the JEDEC MS-034 style 153-ball MBGA layout (8x8 mm body, 0.5 mm ball pitch). For thermal management, MAX 10 devices in BGA packages dissipate through PCB copper and thermal vias to inner power/ground planes - the MBGA does not require an external heatsink at typical industrial loads. This page synthesizes drop-in alternatives, distributor pricing tiers, and engineering design notes not found in the manufacturer datasheet, including cross-reference with 10M08SCE144, 10M08SAM153, and 10M04SCM153 speed-grade variants.
10M08SCM153I7G - MAX 10 FPGA 8K LE, 153-MBGA | Intel
The Intel / Altera 10M08SCM153I7G is a member of the MAX 10 family of non-volatile, single-chip low-cost programmable logic devices (PLDs). It integrates 8,000 logic elements, 387,072 bits of embedded user flash memory, and 112 general-purpose I/Os in a compact 153-ball MBGA package, targeting cost-sensitive industrial, consumer, and IoT edge applications. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that engineers can re-program after manufacture to implement arbitrary digital functions. MAX 10 FPGAs extend this concept by integrating a non-volatile flash configuration memory on-die, eliminating the external boot PROM required by SRAM-based FPGAs and enabling instant-on operation. Within the broader taxonomy, this places the 10M08 between simple CPLDs and higher-density SRAM FPGAs such as Cyclone V or Stratix 10. Key features of the 10M08SCM153I7G include 8,000 logic elements, 387,072 bits (approximately 378 Kbit) of user flash, up to 414 Kbit of embedded SRAM (M9K blocks), a single 18x18 hardware multiplier block, and an internal configuration flash that supports dual-configuration images for in-field remote updates. The 153-MBGA package exposes 112 user I/Os with support for LVDS, LVCMOS, and SSTL I/O standards, and the device operates from a 3.0 V to 3.3 V core supply with on-chip voltage regulation for the logic fabric. Architecturally, MAX 10 devices combine a LUT-based logic fabric with hard IP blocks such as PLLs, ADCs (on selected variants), and DDR3 memory controllers. The integrated flash is organized in pages and supports read while write, enabling in-application programming without halting user logic. This makes the 10M08 well suited to designs that need deterministic boot time alongside moderate logic density. Typical applications include industrial motor control, factory automation I/O expansion, IoT edge sensor aggregation, low-cost video processing, and consumer display bridging. The 153-MBGA package offers a small footprint for space-constrained PCBs while retaining enough I/O for parallel sensor buses, SPI/QSPI memory expansion, and parallel RGB or LVDS display interfaces. When designing with the 10M08SCM153I7G, pay attention to the I/O bank supply constraints: each bank requires a separate VCCIO rail and the LVDS channels need an external 100-ohm differential termination. Also confirm that your Quartus Prime version supports the 10M08 device family; older Quartus II releases do not include MAX 10 synthesis support. This page synthesizes distributor pricing, drop-in compatible MAX 10 alternatives, and practical PCB design notes that are not consolidated in the manufacturer datasheet or individual distributor listings.
10M08SCU169A7G - MAX 10 FPGA, 8K LE, 169-LFBGA, AEC-Q100 | Intel
The Intel 10M08SCU169A7G is a MAX 10 Field Programmable Gate Array (FPGA) with 8,000 logic elements, 387,072 bits of embedded memory, and 130 user I/O pins, housed in a 169-ball LFBGA (U169) package rated for automotive AEC-Q100 applications. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device built from an array of programmable logic blocks (LUTs, flip-flops, DSP blocks, and embedded memory) interconnected by a programmable routing fabric. FPGAs belong to the broader category of programmable logic devices (PLDs), which sit hierarchically between fixed-function ASICs (application-specific integrated circuits) and general-purpose microcontrollers. MAX 10 FPGAs integrate a dual-configuration flash, analog-to-digital converters (ADCs), and instant-on support, which makes them useful as glue logic, I/O expansion bridges, and small control planes in industrial and automotive systems. Key features include 8,000 logic elements, 387,072 bits (M9K) of embedded RAM, integrated 12-bit ADCs, on-chip flash for instant-on configuration, and support for LVDS, LVCMOS, SSTL, and other I/O standards. The 169-pin LFBGA package provides 130 user I/O pins with 1.2V core and 3.3V/2.5V/1.8V/1.5V I/O bank operation. The device is built on a 55nm TSMC process and supports commercial, industrial, and automotive temperature grades. The MAX 10 architecture integrates hard IP blocks such as PLLs, embedded memory blocks (M9K), 18x18 multipliers, and an analog front end with ADC support, allowing single-chip implementation of mixed-signal control functions. The device's flash-based configuration provides instant-on capability without external boot memory, simplifying board design and reducing BOM cost compared with SRAM-based FPGAs. Typical applications include industrial motor control, automotive body electronics and infotainment bridges, sensor aggregation in IoT edge nodes, factory automation I/O expansion, and portable medical device signal conditioning. The AEC-Q100 qualification makes the 10M08SCU169A7G specifically suited for under-hood and cabin automotive electronics. When designing with this device, allocate I/O bank voltages carefully to avoid mixing incompatible logic levels, and respect the LFBGA thermal dissipation envelope by providing adequate PCB copper area. Use the Intel Quartus Prime design suite for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in same-package alternatives from the MAX 10 family, and practical design notes not found in the manufacturer datasheet alone.
10M08SCU169I7G - MAX 10 FPGA 8K LE 169-UBGA | Intel
The Intel 10M08SCU169I7G is a MAX 10 FPGA from the non-volatile MAX 10 family with 8,000 logic elements, 387,072 bits of embedded user flash, and 130 user I/O, housed in a 169-ball Ultra FineLine BGA (U169) package. It is fabricated on TSMC's 55 nm embedded flash process and is one of the lowest-density, lowest-power options in the MAX 10 lineup, aimed at cost-sensitive glue-logic, I/O expansion, and instant-on industrial control applications. What is a non-volatile FPGA? A non-volatile FPGA is a field-programmable gate array that integrates on-chip flash configuration memory, allowing the device to power up instantly into a known working state without an external boot PROM. FPGAs belong to the broader programmable logic family, sitting between fixed-function ASICs and software-driven microcontrollers in terms of flexibility and performance. The MAX 10 family is positioned at the entry level of Intel's (formerly Altera's) FPGA portfolio, bridging the gap between small CPLDs and larger Cyclone-series FPGAs. Key features include 8,000 logic elements, 378 Kbits of embedded SRAM, 4 analog-to-digital converter (ADC) channels at 1 MSPS, 1.2 V core voltage, dual configuration flash, and integrated phase-locked loops (PLLs). The device supports LVDS, LVCMOS, SSTL, and other common I/O standards, and includes hardware multipliers (DSP blocks) and user flash memory configurable as emulation storage or firmware storage. The 10M08SCU169I7G uses Intel's Quartus Prime design software for synthesis, place-and-route, and timing closure. It supports the Nios II soft-core processor, enabling single-chip microcontroller + glue-logic implementations. The integrated ADC, temperature-sensing diodes, and dual-boot flash make it suitable for motor control and industrial sensing front-ends. Typical applications include industrial I/O expansion modules, motor control and drives, video bridging and display controllers, portable medical device front-ends, and low-cost ASIC prototyping. The U169 package footprint is shared with multiple MAX 10 OPNs, enabling PCB reuse across density options. When designing with this part, allocate I/O banks carefully: the U169 package exposes 130 user I/Os across 8 banks, each with its own VCCIO rail. Decouple each VCCIO and VCCINT plane with 100 nF + 10 uF capacitors placed within 3 mm of the balls, and follow Intel's recommended PCB stack-up for fine-pitch BGA breakout. For high-speed LVDS, length-match the differential pairs within the bank. This page synthesizes distributor pricing, same-package drop-in alternatives from the Site MPN list, application circuits, and design notes not consolidated in the manufacturer datasheet.
10M08SCU324C8G - MAX 10 FPGA 8K LE 324-LFBGA | Intel
The Intel (Altera) 10M08SCU324C8G is a MAX 10 family Field Programmable Gate Array (FPGA) that integrates 8,000 logic elements, 378 Kbits of embedded memory (387,072 bits per the DigiKey listing), and 246 user I/O pins in a 324-ball FineLine BGA (LFBGA) package with the commercial speed grade 8 designation. What is a low-density FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) interconnected by a programmable fabric and surrounded by programmable I/O cells. Unlike a fixed-function ASIC, an FPGA's logic function is defined after manufacturing by loading a user bitstream into on-chip SRAM configuration memory. The MAX 10 family belongs to Intel's non-volatile, small-form-factor FPGA tier - positioned below Cyclone in density but above CPLDs in capability, targeting glue-logic replacement, I/O expansion, motor control, and bridge/interface consolidation on a single chip. Key features of the 10M08SCU324C8G include: 8,000 logic elements (LEs) for parallel logic implementation; 378 Kbits (387,072 bits) of embedded SRAM for data buffering and FIFO applications; a 1.2V core operating voltage; integrated ADC block (MAX 10 family feature); on-chip flash configuration memory that makes the device instant-on without an external boot PROM; 246 maximum user I/O supporting LVDS, LVCMOS, SSTL, and other single-ended/differential standards; and a commercial operating temperature range of 0C to +85C. Architecturally, the 10M08 device is built on a TSMC 55nm embedded-flash process. The on-chip flash eliminates the external configuration memory typically required by SRAM-based FPGAs, enabling single-chip designs and sub-100ms power-on-to-user-I/O-active times. The U324 package provides 246 usable I/O with a 1.0mm ball pitch, balancing I/O count against PCB routing complexity for mid-complexity designs. Typical applications include industrial machine vision front-ends, motor control and drive interfaces, low-cost video bridging (e.g., parallel CMOS to MIPI), factory automation I/O concentrators, consumer appliance human-machine interfaces (HMI), and as a logic/interface consolidator replacing multiple CPLDs and discrete glue logic. When designing with the 10M08SCU324C8G, allocate I/O banks according to the voltage standards used (each bank shares a VCCIO rail), provide at least four PCB layers for signal integrity with the BGA fan-out, and leverage the Quartus Prime Lite toolchain (free for MAX 10) for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in MAX 10 same-package alternatives, and practical Quartus Prime design notes not found in the manufacturer datasheet.
10M16DAF256C7G - MAX 10 FPGA, 16K LE, 256-LBGA | Intel / Altera
The Intel (formerly Altera) 10M16DAF256C7G is a MAX 10 field-programmable gate array (FPGA) featuring 16,000 logic elements (LE), 562,176 bits of embedded block RAM, and dual-configuration flash in a 256-pin LBGA (F256) package. It integrates non-volatile configuration memory directly on-chip, eliminating the need for an external boot PROM and enabling instant-on operation at power-up. A Field-Programmable Gate Array (FPGA) is a programmable logic device that allows engineers to implement custom digital logic, glue logic, state machines, and parallel processing functions after PCB fabrication. FPGAs sit hierarchically within digital logic ICs -> programmable logic -> PLD -> programmable logic device -> integrated circuit, and are commonly used alongside microcontrollers and ASICs in modern embedded systems. The MAX 10 family is Altera/Intel's low-cost, non-volatile small-form-factor line targeting industrial, automotive, and consumer applications. Key features of the 10M16DAF256C7G include 16K logic elements, an integrated ADC, 178 maximum user I/O pins, and dual supply operation (single 3.3V VCCIO or dual 1.2V core + 3.3V I/O). The device also embeds configuration flash, a JTAG interface, and supports the Quartus Prime design toolchain. The F256 LBGA package provides a compact 17x17 mm footprint suitable for space-constrained embedded boards. Architecturally, the MAX 10 uses a 4-input LUT fabric with embedded RAM blocks (M9K), 18x18 hardware multipliers, and dedicated user flash memory (UFM). The dual-configuration flash enables fail-safe field updates, while the integrated analog-to-digital converter (ADC) supports up to 12-bit conversion for sensor interfacing and system health monitoring. Typical applications include industrial I/O expansion, factory automation controllers, motor drive glue logic, communication protocol bridging (I2C/SPI/UART to Ethernet), and low-volume ASIC replacement. The integrated flash and ADC make it attractive for cost-sensitive designs where the FPGA must boot instantly without external memory. When designing with this part, pay attention to the F256 BGA ball pattern - PCB land pattern verification and X-ray or BGA rework capability are required for prototype assembly. The Quartus Prime design suite must be used for synthesis, place-and-route, and timing closure, and designers should review the MAX 10 pin connection guidelines for unused-pin termination. This page synthesizes distributor pricing, same-package drop-in alternatives from the MAX 10 family, and practical design notes not found in the manufacturer datasheet, helping engineers quickly evaluate the 10M16DAF256C7G against functionally equivalent parts for sourcing decisions.
10M16DAF256I7G - 16K LE MAX 10 FPGA, 256-FBGA | Intel
The Intel 10M16DAF256I7G is a MAX 10 family field-programmable gate array (FPGA) integrating 16,000 logic elements, 562,176 bits of embedded user flash memory, and 178 maximum user I/O pins in a 256-ball fine-pitch BGA (FBGA-256) package with 1.0 mm ball pitch on a 17 x 17 mm substrate. The "I7G" suffix denotes the industrial temperature grade (-40C to +100C junction) and the fastest speed grade for the 10M16 density, delivered in a Pb-free, RoHS-compliant FBGA. An FPGA (field-programmable gate array) is a semiconductor integrated circuit built from a matrix of configurable logic blocks (CLBs), programmable interconnect, embedded memory blocks, and hardened I/O serdes/phys that the user defines post-fabrication using HDL (Verilog/VHDL) and a vendor tool chain. MAX 10 devices occupy the low-cost, non-volatile niche of the programmable-logic hierarchy: programmable logic device (PLD) -> CPLD -> FPGA -> MAX 10 (non-volatile FPGA with on-die flash configuration). Unlike SRAM-based FPGAs, MAX 10 stores its bitstream in on-die flash, enabling instant-on at power-up without an external boot PROM. Key features of the 10M16 include 16K logic elements, 45 Kbits of embedded RAM (M9K blocks), a built-in ADC (12-bit, up to 1 MSPS, 16 channels) for mixed-signal system integration, on-die flash for user data and configuration, and DSP blocks supporting variable-precision arithmetic. The device integrates dual-configuration flash, JTAG, and active-serial configuration interfaces. Hardened peripherals (PLLs, UFM, ADC, temperature-sensing diode) reduce external BOM and BOM cost in industrial and consumer designs. Architecturally, the MAX 10 fabric is implemented on TSMC 55 nm embedded-flash process technology, allowing single-chip instant-on operation. The Logic Array Blocks (LABs), Adaptive Logic Modules (ALMs), and MultiTrack interconnect are organized in row/column fashion, with Embedded Memory blocks (M9K), DSP blocks, and variable-precision DSP engines placed in column form. Configuration memory is non-volatile, eliminating the need for an external boot memory device. Typical applications include industrial motor control and PLC interfaces, factory automation I/O expansion, video processing bridges, low-cost display controllers, IoT gateway edge aggregation, and portable medical-device front-end signal conditioning. The integrated ADC allows direct interface to analog sensors without a separate ADC chip. A key design consideration is signal integrity at the 1.0 mm pitch BGA - the FBGA-256 requires microvia-compatible PCB stack-up with 4-6 routing layers for break-out. Decoupling capacitor placement close to each supply ball (per the device pin-out file) is mandatory for ADC performance. This page synthesizes distributor pricing, drop-in alternative guidance within the same FBGA-256 footprint, and practical board-design notes not found in the manufacturer datasheet alone.
10M16DAF484A7G - MAX 10 FPGA 16K LE 484-BGA | Intel
The Intel 10M16DAF484A7G is a member of the MAX 10 FPGA family, delivering 16,000 logic elements, 562,176 bits of embedded user flash memory, and 320 Kbits of user SRAM in a 484-ball FineLine BGA package. As the largest density in the MAX 10 DA dual-supply lineup, it combines a non-volatile FPGA fabric with an integrated dual-configuration flash, an internal voltage regulator, and analog-to-digital converter (ADC) blocks on a single die. A field-programmable gate array (FPGA) is a semiconductor IC built around an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable interconnect. The MAX 10 family belongs to the low-cost, non-volatile FPGA category, sitting between standard CPLDs and high-performance SRAM-based FPGAs in the programmable logic taxonomy: FPGA > programmable logic > programmable logic IC > semiconductor device. Key features include a 1.0 V core with on-die voltage regulation, support for Nios II embedded processor cores, up to 250 MHz internal operation, integrated ADC blocks, and 3.3 V/1.8 V dual-configuration flash support for instant-on and remote field upgrades. The device also integrates phase-locked loops (PLLs), user I/O banks supporting LVDS, LVTTL, LVCMOS, SSTL, and DDR3 memory interfaces. Together these features target glue-logic, bridge, and motor-control consolidation roles. The 10M16DAF484 implements a TSMC 55 nm embedded flash process, which is why it ships with both flash and SRAM on the same die. The dual-supply 'DA' variant accepts a separate analog supply for the ADC subsystem, making it the family member of choice when internal sensing of board rails or thermistor voltages is required alongside logic and DSP operations. Typical applications include industrial motor control, factory automation I/O expansion, automotive infotainment and sensor fusion pre-processing, portable medical instrumentation, and bridge/legacy interface consolidation in embedded systems. Its instant-on capability also suits safety-critical and deterministic-boot applications. Compared with SRAM-based FPGAs, the MAX 10 removes the need for a separate boot PROM, reducing BOM cost and board area. When designing with this device, allocate sufficient PCB area for the 484-BGA FineLine BGA breakout and review the Quartus Prime pin planner for bank voltage constraints. Ensure the JTAG chain integrity for in-system programming and that the dual-supply power sequencing follows Intel's MAX 10 hardware design guide. For high-speed DDR3 interfaces, follow the matched-length and decoupling recommendations in the device handbook. This page synthesizes Intel official product information, distributor pricing, drop-in same-package alternatives from the MAX 10 and Cyclone families, and practical design notes that are not aggregated on a single manufacturer or distributor page.
10M16DAF484C7G - MAX 10 FPGA 16K LE 484-FBGA | Intel
The Intel (formerly Altera) 10M16DAF484C7G is a MAX 10 non-volatile FPGA with 16,000 logic elements, 320 general-purpose I/O, and 484-ball FBGA packaging, fabricated on a 55 nm TSMC process. It integrates dual-configuration flash, 12-bit ADC blocks, and on-chip voltage regulators, making it a single-chip programmable logic solution for industrial and consumer designs. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (LBs), programmable interconnect, and I/O cells that engineers can re-program after manufacture. MAX 10 FPGAs belong to the low-power, non-volatile FPGA family within the programmable logic hierarchy, sitting alongside CPLDs at the low-density end and below high-performance SRAM-based FPGAs such as Cyclone or Stratix. They combine FPGA fabric with hard IP (ADC, flash, PLLs) on a single die, eliminating the external boot PROM required by older SRAM FPGAs. Key specifications include 16,000 logic elements, 562 Kbits embedded user flash, 504 Kbits (10,240 x 5) user RAM, 320 maximum user I/Os, two 12-bit ADC blocks supporting up to 18 analog inputs, and four general-purpose PLLs. The -7C speed grade targets commercial 0C to 85C operation, while the integrated flash supports instant-on and dual-boot image storage. The 484-FBGA package offers 23 mm x 23 mm body size with 1.0 mm pitch, suitable for high-density PCB designs. MAX 10 FPGAs use a look-up-table (LUT)-based logic fabric with 8-input fracturable LUTs, dedicated 18x18 multipliers, and embedded memory blocks (M9K) totaling 10,240 bits per block. The hard ADC subsystem uses successive-approximation-register (SAR) cores and can sample at up to 1 MSPS per channel, enabling sensor conditioning without external ADC chips. The dual-boot flash enables fail-safe field updates, while on-chip PLLs synthesize system clocks without external clock generators. Typical applications include industrial motor control, factory automation PLCs, video bridging and image processing pipelines, IoT edge nodes with on-board analog monitoring, and low-cost display controllers. The combination of non-volatile configuration, integrated ADCs, and DSP blocks makes 10M16DAF484C7G a strong fit for designs that previously required an MCU plus CPLD plus discrete ADC. When designing with this FPGA, plan for Quartus Prime toolchain support and confirm pinout against the device-specific F484 package pin tables. The integrated ADC requires a dedicated analog supply (VCCA) and decoupling per Intel MAX 10 device design guidelines; mismatched decoupling degrades ADC SNR. Use the FPGA's JTAG or internal oscillator for early bring-up before switching to an external clock. This page synthesizes verified distributor pricing, drop-in package-compatible alternatives, and Quartus-aware design notes that go beyond the standalone datasheet. Source: Intel MAX 10 datasheet family, fetched 2026-09-05.
10M16DAF484I7G - MAX 10 FPGA 16K LE 484-FBGA | Intel / Altera
The Intel (Altera) 10M16DAF484I7G is a non-volatile FPGA from the MAX 10 family, integrating 16,000 logic elements and 562,176 bits of embedded SRAM into a 484-pin FineLine BGA package. The device delivers up to 472.5 MHz internal operation, 320 general-purpose I/O pins, and a single 1.2 V core supply fabricated on a 55 nm TSMC process. Industrial temperature grade (-40C to +100C) and on-die flash configuration memory make it suited to cost-sensitive embedded designs that need instant-on behavior without an external boot PROM. A field-programmable gate array (FPGA) is a reconfigurable digital logic device built from an array of configurable logic blocks (LBs), programmable interconnect, and I/O cells, sitting in the broader semiconductor hierarchy between ASICs and CPLDs. Unlike ASICs, FPGAs can be re-programmed in the field; unlike CPLDs, modern FPGAs like MAX 10 embed block RAM, DSP blocks, PLLs, and increasingly hard processor cores. MAX 10 specifically bridges CPLD simplicity and FPGA density by integrating dual-configuration flash, ADCs, and DSP blocks onto a single die. Key features of the 10M16DAF484I7G include 16K logic elements, 562 Kbit embedded SRAM, 45 embedded 18x18 multipliers, four general-purpose PLLs, and two analog-to-digital converters (ADCs) on-chip. The integrated flash eliminates the need for external boot memory, enabling instant-on configuration under 10 ms. Hard memory controllers, I/O flexibility supporting LVDS, SSTL, and LVCMOS up to 3.0 V, and PCI Express hard IP blocks allow the device to handle industrial and consumer control planes without companion ICs. Architecturally, the MAX 10 family uses a logic-array-block (LAB) fabric with 10-input adaptive logic modules (ALMs), routing switches implemented in 55 nm flash process technology, and dedicated DSP and RAM blocks. The internal flash cell stores the configuration image and supports dual-boot for fail-safe updates. Hard PCIe Gen2 endpoint IP is available in higher-density MAX 10 variants, but the 10M16 provides the same IP infrastructure at lower LE count for cost-optimized links. Typical applications include industrial motor control, factory automation I/O expansion, video bridging and image processing, low-cost PCIe endpoint cards, and portable test & measurement instrumentation. The integrated ADC allows direct sensor interfacing without an external ADC, while the DSP blocks accelerate filtering and motor-control loops at deterministic latency. When designing with this device, ensure proper decoupling - at least 100 nF ceramic capacitors at every VCC pin plus bulk decoupling on each supply rail. The FBGA-484 substrate requires a 1.0 mm pitch PCB land pattern with controlled-impedance routing for high-speed LVDS pairs, and JTAG access must be brought out to a 10-pin header for in-system programming and debug. This page synthesizes distributor pricing across DigiKey, Mouser, Arrow, and Octopart, drop-in alternatives from the same MAX 10 family, and practical design notes not found in the manufacturer datasheet.
10M16DAF484I7P - MAX 10 FPGA, 16K LE, 484-BGA | Intel / Altera
The Intel (formerly Altera) 10M16DAF484I7P is a non-volatile MAX 10 field-programmable gate array (FPGA) with 16,000 logic elements (LE), 549 kbit of embedded memory, and 320 user I/Os, packaged in a 484-ball FBGA. Operating from a 1.2 V core supply, the device integrates dual-configuration flash, an on-chip ADC, and DSP blocks in a low-power, instant-on architecture. A field-programmable gate array (FPGA) is a reconfigurable digital integrated circuit containing an array of programmable logic blocks (LEs/ALMs), programmable interconnect, and dedicated hard IP such as multipliers, memory blocks, and transceivers. FPGAs sit above microcontrollers and ASICs in the design flexibility hierarchy: more flexible than ASICs, faster than MCUs at parallel DSP tasks, and lower power than GPUs at deterministic logic. The MAX 10 family adds non-volatile configuration, eliminating external boot PROMs. Key features of the 10M16DAF484I7P include 16,000 logic elements, 549 kbit embedded SRAM, 320 maximum user I/Os, 45 18x18 multipliers, dual ADCs with up to 12-bit resolution and 1 MSPS sampling, integrated PLLs, and embedded flash for instant-on operation. The industrial-grade -40C to +100C temperature range (I7 suffix) supports factory, automotive, and harsh-environment deployments. Technically, the device uses a TSMC 55 nm embedded-flash process and a Logic Element (LE) fabric with adaptive logic modules (ALMs), 9 Kbit M9K memory blocks, and a hard memory controller that supports DDR3/LPDDR2 external memories. The integrated ADC operates in parallel with logic, enabling closed-loop analog/digital control without external parts. Typical applications include industrial motor control and PLCs, video bridge and display controllers, automotive driver-assistance systems, portable instrumentation, factory automation I/O expansion, and low-cost ASIC prototyping where instant-on and small footprint matter. When designing in the 484-FBGA, allocate a 1.2 V core rail with sub-3% tolerance and matched-length DDR traces to maintain signal integrity; the ADC reference must be low-noise to avoid coupling into analog inputs. This page synthesizes live distributor pricing, package-matched drop-in alternatives from the MAX 10 family, and PCB-level design notes not contained in the Altera MAX 10 datasheet.
10M16DAU324C8G - MAX 10 FPGA 16K LE 246 I/O UBGA-324 | Intel / Altera
The Intel / Altera 10M16DAU324C8G is a non-volatile MAX 10 field-programmable gate array (FPGA) integrating 16,000 logic elements, 562,176 bits of embedded memory, and 246 general-purpose user I/O in a 324-ball Ultra FineLine BGA (UBGA) package. It is fabricated on a low-power CMOS process and operates from a 1.2 V core supply with on-chip voltage regulation for the configuration and flash subsystems, making it a single-chip, instant-on programmable logic device suitable for industrial, automotive, and consumer applications. A MAX 10 FPGA is a low-cost, non-volatile family of programmable logic devices that combine an FPGA fabric, embedded flash configuration memory, analog-to-digital converters (ADCs), and on-chip dual-configuration flash on a single die. It belongs to the broader hierarchy of programmable logic devices (PLD), sitting between simple CPLDs and high-performance FPGAs. MAX 10 devices target glue-logic, bridge, motor control, and I/O expansion designs that benefit from instant-on behavior without an external boot flash. Key features include 16,000 logic elements (LEs), 562,176 bits of user flash memory (UFM) and embedded SRAM, up to 246 user I/O pins, integrated 12-bit SAR ADCs, on-die temperature-sensing diode, and hardened DDR3 memory interface support. The device supports up to 1.6 Gbps LVDS performance per pair, dual-boot configuration from internal flash, and a hardened Nios II soft-processor-ready fabric. The architecture combines a look-up-table (LUT)-based logic fabric with embedded M9K memory blocks, 18x18 multipliers, and a tightly integrated analog and power-management block. Dual-configuration flash allows field upgrades and fail-safe fallback, while the embedded ADC enables precision analog sampling without an external mixed-signal IC. Typical applications include industrial motor control, sensor fusion pre-processing, video bridging, low-cost ASIC prototyping, USB Type-C interface expansion, and factory automation I/O concentrators. The integrated ADC is also widely used for thermal and current monitoring in white-goods and motor-drive systems. When designing with this device, allocate adequate BGA breakout routing and thermal copper on the 324-UBGA footprint. Use the Quartus Prime design suite and verify pin assignments against the device-specific pin-out file before PCB fabrication, since UBGA ball mapping differs across MAX 10 density grades. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone, giving procurement and engineering teams a single reference for evaluating the 10M16DAU324C8G for new designs and re-sourcing.
10M16DAU324I7P - MAX 10 FPGA 16K LE 246 I/O | Intel | 324-LFBGA
The Intel (formerly Altera) 10M16DAU324I7P is a MAX 10 Field Programmable Gate Array (FPGA) with 16,000 logic elements, 246 user I/Os, 549 kbit embedded memory, and 246 18x18 multipliers, housed in a 324-pin LFBGA (UBGA-324) package. It is the industrial temperature grade (-40C to +100C), speed grade 7 variant of the MAX 10 family with non-volatile flash configuration and integrated analog-to-digital converters. An FPGA (Field Programmable Gate Array) is a class of programmable logic device that allows hardware designers to configure digital logic blocks and interconnects after manufacture. Within the broader semiconductor taxonomy, FPGAs sit above ASICs and CPLDs in flexibility but below microcontrollers in ease of programming. The MAX 10 family specifically integrates a hard processor subsystem, dual-configuration flash, and analog blocks onto a single die, targeting cost-sensitive industrial, automotive, and IoT applications. Key features of the 10M16DAU324I7P include 16,000 logic elements organized into Adaptive Logic Modules (ALMs), 549 kbit of embedded SRAM, 2.5 Mb of user flash memory, and 246 GPIO pins supporting LVDS, LVCMOS, SSTL, and other I/O standards. The device operates from a 1.2 V core supply with I/O banks supporting 1.2V to 3.3V, and integrates a hard Nios II processor interface for soft-core SoC designs. The MAX 10 architecture uses TSMC 55 nm embedded flash process technology, combining LUT-based logic fabric with hard IP blocks including PLLs, ADC, and temperature-sensing diodes. This monolithic integration eliminates external boot memory and reduces BOM cost. The dual-boot flash supports field upgrades with zero downtime through the On-Line Update feature. Typical applications include industrial motor control, factory automation I/O expansion, video bridging, low-cost ASIC replacement, sensor fusion, and portable instrumentation. The integrated 12-bit ADC simplifies analog front-end designs. When designing with this part, allocate sufficient PCB area for the 0.8 mm pitch LFBGA-324 footprint and route all power rails with adequate decoupling. The Quartus Prime design tool supports the full MAX 10 family with unified place-and-route. This page synthesizes distributor pricing, same-family drop-in alternatives from the Site MPN list, and practical board-level design notes not collected in a single place on the Intel datasheet.
10M16DCF256A7G - MAX 10 FPGA, 16K LE, 178 I/O, 256-FBGA | Intel
The Intel (formerly Altera) 10M16DCF256A7G is a member of the MAX 10 family of non-volatile FPGAs integrating 16,000 logic elements, 562,176 bits of embedded RAM, and 178 general-purpose I/Os in a 256-ball FineLine BGA (FBGA) package fabricated on a 55 nm process node. The device supports a maximum internal operating frequency of 472.5 MHz and is supplied from a 1.2 V core rail with on-chip voltage regulation. Industrial-grade temperature operation, dual-configuration flash, and integrated analog/digital blocks distinguish the MAX 10 family from prior MAX generations. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells, allowing engineers to implement custom digital logic after PCB fabrication. Within the broader taxonomy, the MAX 10 sits at the junction of programmable logic devices (PLD) and system-on-chip (SoC) integration, offering non-volatile configuration, on-chip flash, ADC blocks, and DSP support - bridging entry-level CPLDs and high-performance SoC FPGAs like Cyclone V or Stratix 10. Key features include 16K logic elements (LE), 504 Kbit (Kb) embedded SRAM, 1.0 Mb user flash memory, dedicated 18 x 18 multipliers for DSP, and integrated ADCs. The 256-FBGA package exposes 178 maximum user I/Os, supporting LVDS, LVCMOS, SSTL, and other single-ended/differential I/O standards. A dual-boot configuration scheme enables fail-safe field upgrades, while on-chip flash storage removes the need for external boot PROMs in most designs. MAX 10 devices use a look-up-table (LUT) based logic fabric with 8-input fracturable LUTs, embedded memory blocks (M9K/M144K), and DSP blocks optimized for fixed- and floating-point math. The hard PCIe Gen2 IP block and hard memory controllers simplify interface implementation. Integrated ADCs (12-bit, up to 1 MSPS) enable sensor fusion and system monitoring without an external analog front end. Typical applications include industrial motor control, factory automation, video bridging and display controllers, low-power portable instrumentation, automotive infotainment subsystems, and IoT edge nodes requiring deterministic logic plus on-chip flash. Designers select MAX 10 when they need instant-on non-volatile configuration without external boot memory. When laying out a board, allocate four dedicated GND planes around the BGA, route length-matched pairs for LVDS, and follow Intel's pin connection guidelines for unused pins. Decoupling requires 100 nF X7R near every VCCIO/VCCINT ball group with bulk 10 uF and 47 uF tantalum/polymer caps on each supply rail. This page synthesizes distributor pricing, verified drop-in alternatives, and practical PCB design notes not consolidated in the original manufacturer datasheet - giving engineers an actionable engineering reference for sourcing and second-sourcing the 10M16DCF256A7G.
10M16DCF256C7G - MAX 10 FPGA, 16K LE, 256-FBGA | Intel
The Intel 10M16DCF256C7G is a MAX 10 family field-programmable gate array (FPGA) delivering 16,000 logic elements, 562,176 bits of embedded SRAM, and 178 maximum user I/Os in a 256-ball FineLine BGA (FBGA) package. This non-volatile FPGA integrates a dual-configuration flash, instant-on support, and on-chip analog-to-digital conversion, enabling single-chip system management without an external boot PROM. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable I/O, all wired together through a programmable interconnect. FPGAs occupy a tier between standard microcontrollers and ASICs in the system-design hierarchy, offering hardware-level parallelism, nanosecond-latency I/O response, and the ability to be reconfigured in-system via JTAG or active serial. The MAX 10 family is Intel's small-form-factor, low-power, non-volatile line intended for I/O expansion, bridge, and glue-logic applications. Key features of the 10M16DCF256C7G include 16,000 logic elements, 378 Kbits of M9K block memory, 45 embedded 18x18 multipliers, four general-purpose PLLs, two analog front-end blocks each containing a 12-bit ADC and temperature-sensing diode, and a 3.3 V core/auxiliary supply with multi-voltage I/O banks supporting 1.2 V to 3.3 V single-ended standards. The dual-boot flash and instant-on feature enable configuration in under 10 ms from power-up. The device is fabricated on a TSMC 55 nm embedded flash process, which is what gives MAX 10 its non-volatile behavior. The 256-FBGA package has a 17 x 17 mm body with 1.0 mm ball pitch, making it suitable for space-constrained boards that need high I/O density. Configuration sources include JTAG, internal flash, and standard serial modes through Quartus Prime software. Typical applications include industrial motor control, video bridging and image aggregation, I/O expansion for processors, portable medical device front-ends, and factory automation. The 10M16DCF256C7G is especially useful in designs that need parallel DSP and logic without paying the cost of a high-end FPGA. When designing with this part, ensure that all configuration mode pins (MSEL) are tied to the correct logic levels for the desired boot mode, and provide adequate decoupling across the 1.2 V, 2.5 V, and 3.3 V rails. Thermal management is generally straightforward because the 256-FBGA package offers good heat spreading, but at sustained 1 GHz internal clock rates the junction temperature should still be calculated against ambient.
10M16DCF256C8G - MAX 10 FPGA 16K LE 256-FBGA | Intel / Altera
The Intel (formerly Altera) 10M16DCF256C8G is a non-volatile MAX 10 FPGA with 16,000 logic elements, 178 user I/O, 562 Kbit embedded SRAM, and 5,140 Kbit on-chip user flash, housed in a 256-ball FineLine BGA (FBGA) measuring 17 x 17 mm and rated for the commercial 0 to 85 °C operating range. It uses a 55 nm process, runs from a 1.2 V core supply, and the suffix 'C8' denotes speed grade 8 with the 'DC' prefix designating the dual-configuration flash variant and 'F256' specifying the 256-pin FineLine BGA package. A MAX 10 FPGA is a non-volatile field programmable gate array from Intel that integrates the configuration flash and an optional 12-bit 1 MSPS ADC directly on-chip, removing the need for an external boot PROM. Within the broader Intel programmable-logic hierarchy, MAX 10 sits below the low-cost Cyclone family and above the legacy MAX II/MAX V CPLD families, often replacing systems that previously combined a CPLD with a small SRAM-based FPGA. The '10M16' part number encodes 16,000 logic elements, and the 'D' prefix denotes the dual-image flash configuration variant, supporting field firmware updates and fail-safe fallback. Key differentiating features include 16,000 logic elements, 178 maximum user I/O, 562 Kbit embedded SRAM, 5,140 Kbit user flash, integrated dual-configuration flash, optional 12-bit 1 MSPS ADC blocks, and instant-on behavior because configuration lives on-die. The 256-ball FineLine BGA package provides high I/O density in a 17 x 17 mm footprint, suitable for space-constrained industrial control boards. According to the Intel MAX 10 datasheet, the device is supported by Quartus Prime design software with synthesizable IP libraries, reference designs, and validated HDL examples. Typical applications for the 10M16DCF256C8G include industrial motor-control interface bridging, video/image pre-processing, automotive infotainment auxiliary controllers, factory-automation I/O expansion and protocol conversion, and portable medical-device controller boards. The integrated ADC block makes the family particularly attractive for sensor aggregation front-ends, while the dual-configuration flash supports A/B firmware upgrades without external memory. When designing with this part, allocate adequate BGA breakout and at least four PCB layers for power and ground planes. The 1.2 V core supply typically requires an external LDO or DC-DC regulator with bulk decoupling placed within 10 mm of the FBGA balls to maintain signal integrity on the 178 user I/O at typical 100 MHz LVCMOS/LVDS toggle rates. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
10M16DCF256I7G - MAX 10 FPGA 16K LE 256-FBGA | Intel / Altera
Intel / Altera 10M16DCF256I7G is a non-volatile MAX 10 Field Programmable Gate Array (FPGA) built on a 55 nm process, integrating 16,000 logic elements, 562,176 bits of embedded SRAM, and 178 user I/Os in a 256-ball FineLine BGA package. The device is offered in the industrial temperature grade (I7 suffix) and operates from a 1.2 V core supply with on-chip voltage regulators supporting single-rail or dual-rail supply schemes. MAX 10 FPGAs are non-volatile, single-chip programmable logic devices that integrate the optimal set of system components for cost-sensitive applications. As a category, an FPGA (Field Programmable Gate Array) is a semiconductor device containing programmable logic blocks, interconnect, and I/O resources that can be configured by the end user after manufacture. MAX 10 sits in the broader hierarchy: FPGA -> programmable logic -> programmable logic device (PLD) -> logic semiconductor. Compared to SRAM-based FPGAs, MAX 10 instant-on configuration is stored in on-die flash, eliminating external boot PROMs and reducing BOM cost. Key features of the 10M16DCF256I7G include 16,000 logic elements, 256 Kbits (Kb) of user flash memory, an integrated 12-bit 1 MSPS ADC with up to 18 analog input channels, on-chip temperature-sensing diodes, dual ADPLL blocks for clock management, and hardened DDR3 memory interfaces. The device also integrates embedded multipliers (45 total, 18x18) and PLLs for high-performance DSP and control-plane designs. From an architecture standpoint, MAX 10 uses a Logic Array Block (LAB) fabric with Adaptive Logic Modules (ALMs) and a MultiTrack interconnect, paired with embedded memory blocks (M9K), variable-precision DSP blocks, and the previously hardened analog and flash blocks. The internal flash subsystem holds both user data and the FPGA configuration image, supporting dual-boot and remote update modes. Typical applications include industrial control and factory automation (motor control, sensor aggregation, machine vision pre-processing), IoT edge nodes with on-board ADC, automotive driver-assistance subsystems, video bridging and display controllers, and portable / battery-powered embedded systems where low static power and instant-on behavior matter. Designers frequently pair MAX 10 with external DDR3 SDRAM, Ethernet PHYs, and sensor front-ends. When designing with this device, follow Intel's PCB layout guidelines for FineLine BGA, including microvia stack-ups, matched-length DDR3 routing, and decoupling close to each power pin. Quartus Prime is the design toolchain - choose a Quartus release that targets MAX 10 to ensure the configuration bitstream and timing models are correct. Validate thermal performance with the supplied thermal models because industrial-grade silicon must stay within the published junction range. This page synthesizes distributor pricing, drop-in alternative MAX 10 OPNs and competing FPGAs, and practical design notes not found in the manufacturer datasheet. All figures are anchored to the Verified Web Data retrieved on the last-verified date.
10M16DCF484A7G - MAX 10 FPGA, 16K LE, 484-FBGA | Altera
The Altera (Intel PSG) 10M16DCF484A7G is a member of the MAX 10 family of non-volatile FPGAs, integrating 16,000 logic elements, 549 Kbits of embedded SRAM, and a 320-pin count in a 484-ball FineLine BGA package. It is offered in the -A7G speed/temperature grade (automotive temperature range, 7 = slowest speed grade, G = Pb-free). The device targets low-cost, low-power, instant-on applications and is built on TSMC 55 nm embedded flash + SRAM process technology. A field-programmable gate array (FPGA) is a semiconductor IC whose logic function is defined after manufacturing by a customer-supplied bitstream. MAX 10 devices are non-volatile, meaning the configuration image is stored in on-chip flash and the device boots in milliseconds without an external boot PROM. Within the programmable logic hierarchy, an FPGA sits above CPLDs and below ASICs, offering higher density than CPLDs and lower NRE cost than ASICs for low-to-medium volume production. Key features of the 10M16DCF484A7G include 16,000 logic elements, 549 Kbits embedded memory, one configuration flash memory block, 320 maximum user I/Os, on-board ADC, and DSP blocks. The device operates from a 1.2 V core supply with support for multiple I/O standards including LVDS, LVCMOS, and SSTL. The automotive temperature grade (-40 C to +125 C) makes it suitable for harsh environment designs. The architecture is built on TSMC 55 nm embedded flash process and integrates a hard flash controller for self-configuration. Internal logic uses 4-input LUTs that can be combined into adaptive logic modules (ALMs), with embedded multiplier blocks and a 12-bit successive-approximation ADC for analog mixed-signal integration. This combination eliminates the need for an external boot flash and an external ADC in many designs. Typical applications include industrial motor control, automotive driver assistance, IoT edge nodes, video bridging, and factory automation. Its non-volatile instant-on feature is particularly valuable for safety-critical and power-sequenced systems. The wide operating temperature range enables deployment in automotive and industrial environments. When designing with this FPGA, ensure the Quartus Prime toolchain version supports the MAX 10 device family and that PCB layout follows Intel's recommended BGA escape and decoupling guidelines. Power sequencing between VCCINT and VCCIO must follow the datasheet sequence to avoid I/O latch-up. This page synthesizes distributor pricing, same-family drop-in alternatives in the same 484-FBGA footprint, and practical design notes not found in the manufacturer datasheet, giving engineers a faster path from selection to BOM.
10M16DCF484C7G - MAX 10 FPGA, 16K LE, 484-FBGA | Intel
The Intel 10M16DCF484C7G is a non-volatile MAX 10 Field Programmable Gate Array (FPGA) delivering 16,000 logic elements (LEs) with 562,176 bits of embedded memory in a 484-ball FineLine BGA package. It integrates 320 general-purpose I/Os and is manufactured on a 55 nm process technology with a 1.2 V core supply. According to the Altera/Intel MAX 10 datasheet, this device targets low-cost, low-power applications that require instant-on non-volatile configuration without an external flash. A Field Programmable Gate Array (FPGA) is a programmable logic device (PLD) that lets engineers implement custom digital circuits through configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware blocks. FPGAs sit within the broader taxonomy: programmable logic -> PLD -> semiconductor IC. MAX 10 is Intel/Altera's entry-tier non-volatile FPGA family, positioned below Cyclone V and Arria/Versus families, offering instant-on operation, integrated ADC, and on-chip flash for configuration storage. Key features of the 10M16DCF484C7G include 16,000 logic elements (LEs) backed by 247 Kbits (Kb) of embedded SRAM (M9K blocks), an embedded Multiplier block set supporting 18x18 multipliers for DSP-style operations, up to 320 general-purpose I/Os supporting LVDS and various single-ended standards, and dual-configuration flash with self-reconfiguration capability. The integrated hard ADC (12-bit, up to 17 channels on select variants) and on-chip temperature sensing diode remove the need for external mixed-signal components. The architecture pairs 6-input adaptive logic modules (ALMs) with a versatile routing network and dedicated memory blocks. Maximum internal clock frequency reaches 472.5 MHz, while embedded DSP blocks deliver aggregate throughput exceeding 60 GMACs. The on-die flash removes boot-time latency and supports dual-image storage for fail-safe field updates, a defining feature that distinguishes MAX 10 from SRAM-based Cyclone families. Typical applications include industrial motor control, video bridging and display interfaces, I/O expansion and protocol bridging (I2C/SPI/UART-to-LVDS), portable instrumentation, and low-cost video processing. The combination of high I/O count (320 pins) and 1.2 V core operation makes it well suited to compact designs with many parallel buses. Designers should pay attention to the FPGA core supply and I/O bank sequencing: the device supports a 1.2 V core with separate VCCIO rails per bank. Quartus Prime software is required for synthesis and place-and-route, and JTAG-based in-system programming is supported via the dedicated configuration pins on the F484 package. This page synthesizes distributor pricing, MAX 10 family drop-in alternatives, and practical Quartus Prime design notes not found in the manufacturer datasheet, enabling faster part selection for industrial and consumer FPGA designs.
10M16DCF484C8G - MAX 10 FPGA 16K LE 484-BGA | Intel
The Intel (formerly Altera) 10M16DCF484C8G is a non-volatile MAX 10 Field Programmable Gate Array (FPGA) integrating 16,000 logic elements, 562,176 bits of embedded SRAM, and 320 general-purpose I/O in a 484-ball FineLine BGA package. The MAX 10 family is built on a 55 nm TSMC flash-based process and integrates a dual-configuration flash memory, so the device boots instantly at power-up without an external boot PROM, distinguishing it from SRAM-based Cyclone or Arria devices that require external configuration storage. An FPGA (Field Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, and embedded memory and DSP resources that can be re-programmed after manufacturing to implement custom digital logic. FPGAs occupy a tier in the programmable logic hierarchy between fixed-function ASICs (high NRE, long lead time, lowest unit cost) and CPLDs (smaller, non-volatile, simpler architecture). Within programmable logic taxonomy, MAX 10 sits at the entry-level/low-density node above small CPLDs and below Cyclone V, Arria, and Stratix families. Key features of the 10M16DCF484C8G include 16 K logic elements, 504 Kbit user flash memory (embedded flash for user data), 45 embedded 18x18 multipliers, 4 PLLs, 2.5 Gb/s LVDS transceivers via LVDS I/O, and an integrated 12-bit ADC. The 'C' speed grade and '8' operating-temperature grade correspond to a commercial 0 C to 85 C junction range. The '484' package code designates the 484-ball FBGA footprint; this is the largest MAX 10 package and the only one exposing the full 320 user I/O count of the 10M16 device. Architecturally, MAX 10 implements a logic-element fabric of 4-input LUTs, with M9K memory blocks providing the 562 Kbit total RAM and 18x18 multiplier blocks supporting DSP inference. The 55 nm embedded-flash process enables single-chip instant-on, and the integrated ADC supports analog monitoring of up to 16 external channels without an external mixed-signal IC. Typical applications include industrial motor control, factory automation I/O expansion, video bridging and display controllers, low-cost portable instrumentation, sensor aggregation, and as a glue-logic replacement for CPLDs when higher logic density and DSP are required. The 484-BGA footprint suits designs that need the maximum I/O count plus LVDS signaling for camera, display, or high-speed parallel interfaces. When selecting MAX 10, note that the 484-BGA package is the largest in the family and requires at least a 6-layer PCB with microvia fan-out for the 1.0 mm ball pitch. For space-constrained designs under 100 I/O, consider 10M16 in the 256-BGA or 144-pin EQFP packages; for higher density, move to Cyclone V E or Arria II GX families. The non-volatile instant-on architecture makes 10M16 particularly attractive when the application must start executing within milliseconds of power-up without an external boot flash. This page synthesizes distributor pricing, same-brand MAX 10 pin-compatible OPNs (10M16DCF484C7G, 10M16DCF484A7G, 10M16DCF484I7G, 10M16DAF484C7G), and practical design notes that are not consolidated on the manufacturer product page.
10M16DCF484I7G FPGA - 16K LE, 320 I/O | Intel MAX 10
The Intel 10M16DCF484I7G is a MAX 10 non-volatile FPGA with 16,000 logic elements, 562,176 memory bits, and 320 user I/Os, delivered in a 484-ball FBGA (F484) package. This industrial-temperature (I7) ordering option is designed for low-cost, instant-on edge logic where a separate configuration device is not required. A field programmable gate array (FPGA) is a semiconductor device containing programmable logic blocks and programmable interconnects that allow a designer to implement custom digital logic after manufacturing. In the taxonomy of programmable logic, an FPGA sits alongside CPLDs, but it generally delivers a higher logic density, more embedded memory, and wider user I/O counts. The MAX 10 family specifically belongs to the non-volatile FPGA segment: it integrates flash configuration memory on-chip, so the device boots immediately on power-up without an external configuration flash, lowering board cost and BOM complexity. The 10M16DCF484I7G differentiates itself with 320 single-ended user I/Os, 16,000 logic elements, and 562,176 memory bits, which make it suitable for moderate-density control and interface tasks. According to the Intel/Altera reference listing, the MAX 10 10M16 family operates on a 1.2 V core supply and is implemented in a 55 nm process. The F484 package is a 484-ball fine-pitch BGA that provides ample I/O routing capability while remaining manufacturable with standard SMT processes. Because the on-chip flash also supports a configuration that is available at power-up, systems can behave like instant-on ASICs without an external memory device. Technically, the MAX 10 architecture integrates a flash-based configuration block, embedded memory blocks, PLLs, and flexible I/O banks. This integration allows the 10M16DCF484I7G to replace separate CPLD-plus-configuration-flash designs in applications that need 16K logic elements and 320 I/O. It also simplifies multi-rail sequencing and firmware updatability because the flash configuration can be reprogrammed. While speed grade and exact timing performance vary with design implementation, the family is targeted at 472.5 MHz-class operation according to one distributor reference listing; designers should use the Intel Quartus timing analysis reports for their specific design. Typical applications of the 10M16DCF484I7G include industrial automation, motor-control PWM generation, LED display driving, camera sensor interfacing, and low-latency I/O expansion. Its non-volatile instant-on behavior makes it a strong fit for industrial Ethernet gateways and human-machine interfaces that must be ready before a host processor finishes booting. The 320 I/O count allows wide parallel buses and many discrete sensors to be connected without scanning in a separate CPLD. A critical design consideration for this FPGA is to maintain a clean 1.2 V core supply and to reference each I/O bank to the correct VCCIO voltage. The large 484-ball BGA benefits from a dense via array under the device thermal pad for heat spreading and from decoupling capacitors close to the power balls. Designers should also respect the difference between commercial, industrial, and automotive grade ordering options when choosing the exact OPN for the required ambient temperature. This page synthesizes current distributor inventory, same-package drop-in MAX 10 alternatives, and practical board-level design notes that are not all listed on a typical distributor product page. It is intended to help an engineer evaluate the 10M16DCF484I7G quickly and reduce sourcing and design risk.
10M16DCU324A7G - MAX 10 FPGA, 16K LEs, 246 I/O, 324-LFBGA | Intel
The Intel (formerly Altera) 10M16DCU324A7G is a member of the MAX 10 family of non-volatile FPGAs integrating 16,000 logic elements (16K LEs), 562,176 bits of embedded user flash memory, and 246 user I/O pins in a 324-pin LFBGA (U324) package. Built on a 55 nm TSMC process and housed in a 15x15 mm UBGA, the device operates from a 1.2 V core supply, supports a maximum internal fabric frequency of approximately 472.5 MHz, and is offered in an automotive-qualified speed grade 7 (A7) variant per the verified distributor data. A field-programmable gate array (FPGA) is a reconfigurable digital logic IC whose logic cells, interconnect, and I/O routing are defined by user-loaded configuration bits rather than fixed mask lithography. The MAX 10 family occupies the entry-level to mid-range tier of the FPGA product hierarchy, sitting below Cyclone V/10 and above legacy MAX II/MAX V devices, and combines an FPGA fabric with hard IP blocks including 12-bit ADCs, PLLs, and embedded flash for single-chip, instant-on designs. As a programmable logic device (PLD) family, MAX 10 enables custom glue logic, state-machine control, and parallel signal processing without an external configuration PROM. Key features of the 10M16DCU324A7G include 246 user I/Os, integrated dual-configuration flash (CFM), 1.4 Mb of general-purpose SRAM, up to 45 18x18 multipliers, four PLLs, two internal analog ADCs, and support for LVDS, LVCMOS, SSTL, and other single-ended and differential I/O standards. The automotive grade (A7) screening and LFBGA-324 packaging make this OPN especially suited to AEC-Q100-qualified embedded designs that require compact board area combined with a high I/O count. Architecturally, the MAX 10 device pairs a LUT-based logic array block (LAB) fabric with distributed M9K memory blocks, DSP blocks, and an embedded flash controller that holds two configuration images, enabling dual-boot fail-safe field updates. Hardening of ADC, PLL, and flash onto the same die reduces system BOM and latency versus two-chip FPGA + external PROM solutions and gives MAX 10 its distinctive instant-on capability. Typical applications include industrial motor control and factory automation, automotive driver-assistance systems (ADAS), human-machine interface (HMI) controllers, low-power video aggregation bridges, and I/O expansion or protocol translation for industrial Ethernet gateways. Designers also use 10M16-class MAX 10 devices for sensor-fusion pre-processing and as feature-rich logic replacements for CPLDs. When designing with this OPN, note that the 324-ball LFBGA requires a 1.0 mm or 0.8 mm pitch PCB land pattern; signal-integrity work and matched-length routing are recommended for LVDS pairs. Use the Intel Quartus Prime design suite (Device Support 13.0 or later) for synthesis, place-and-route, and bitstream generation, and verify thermal budgets against the published 7.0 x 7.0 mm exposed-pad thermal resistance under your enclosure airflow conditions. This page consolidates distributor pricing, drop-in equivalents from the MAX 10 family, and design notes derived from the Intel MAX 10 Device Datasheet - information not found on any single distributor page.
10M16DCU324C8G - MAX 10 FPGA 16K LE 246 I/O 324-UBGA | Intel
The Intel (formerly Altera) 10M16DCU324C8G is a non-volatile MAX 10 Field Programmable Gate Array (FPGA) integrating 16,000 logic elements, 562,176 bits of embedded user flash memory, and 246 user I/O in a 324-ball Ultra FineLine BGA (U324, 15x15 mm) package. Speed grade -8 and commercial temperature grade (0C to +85C) target mainstream industrial and consumer logic-integration designs where instant-on non-volatile configuration is required. A Field Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit containing an array of programmable logic blocks, configurable routing, and I/O cells that can be programmed to implement arbitrary digital functions after PCB assembly. FPGAs sit at the top of the programmable-logic hierarchy (FPGA -> programmable logic -> digital IC -> semiconductor), offering higher density and performance than CPLDs while remaining more flexible than ASICs. The MAX 10 family adds an on-die flash configuration memory, eliminating external boot PROMs and enabling single-chip instant-on designs. Key features include integrated dual-configuration flash, on-chip ADC, 246 GPIO, embedded 18x18 multipliers, and DSP blocks supporting up to 45 GMACs. The 324-UBGA package provides a compact 15x15 mm footprint with 1.0 mm ball pitch suitable for moderate-density board designs, and is compatible with Intel Quartus Prime design software for synthesis, place-and-route, and timing closure. The MAX 10 architecture pairs a LUT-based logic fabric with hard memory blocks (M9K), DSP blocks, and PLL/IO peripherals, giving a balanced trade-off between logic density, signal-processing throughput, and static power consumption. Compared with SRAM-based FPGAs, the 10M16DCU324C8G eliminates external boot memory and reduces BOM cost in low-to-mid volume products. Typical applications include industrial motor control and I/O aggregation, video bridging and display controllers, automotive driver-assistance subsystems, portable test and measurement equipment, and factory automation controllers. Its instant-on capability also suits power-sequencer replacement for legacy CPLDs. When designing with this device, ensure the PCB accommodates 1.0 mm BGA ball pitch and that the Intel Quartus Prime pin assignment files match the U324 pinout. Verify junction temperature against the application note thermal model when operating at maximum toggle rates and elevated ambient temperatures. This page synthesizes distributor pricing, drop-in MAX 10 alternatives from Intel's own family, and practical design notes not found in the manufacturer datasheet alone, providing a one-stop engineering reference.
10M16DCU324I7G - MAX 10 FPGA, 16K LE, 246 I/O, 324-UBGA | Intel
The Intel (formerly Altera) 10M16DCU324I7G is a MAX 10 family non-volatile FPGA with 16,000 logic elements, 562,176 bits of embedded user flash memory, and 246 user I/O, housed in a 324-ball Ultra FineLine BGA (UBGA) package measuring 15 x 15 mm with 0.8 mm ball pitch. The device integrates dual-configuration flash, a 9-Kbit user flash, and a hard DDR3 memory controller, delivering low-cost, low-power instant-on programmability for industrial and consumer applications. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be reconfigured by the customer after manufacture to implement arbitrary digital logic functions. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) and bridge the gap between fixed-function ASICs and software-driven microcontrollers, offering parallel processing, deterministic timing, and high I/O flexibility. The MAX 10 series extends this category by embedding non-volatile configuration memory directly on-chip, eliminating the need for an external boot PROM. Key features include 16,000 logic elements, 45 adaptive logic modules (ALMs) per LAB, 246 maximum user I/Os, 12.5 Kbits of distributed RAM, 558 Kbits of block RAM (M9K), 45 embedded 18x18 multipliers, 4 PLLs, and 2.5 Gbps LVDS support. The industrial temperature grade (-40C to +100C) and integrated ADC make this variant well suited to motor control and industrial sensor interfaces. Architecturally, the MAX 10 family is built on TSMC 55 nm NOR-flash-based process technology, combining look-up-table logic fabric with on-die flash configuration storage. Dual-configuration flash supports remote in-field updates, while integrated analog blocks (12-bit ADC, temperature sensor) reduce bill-of-material cost. The device supports LVDS, LVCMOS, SSTL, and HSTL I/O standards with hot-socketing capability, simplifying in-system programming. Typical applications include industrial motor control, factory automation, video bridging, portable medical devices, and low-cost display controllers. The 10M16DCU324I7G is commonly paired with TI power management and Micron DDR3 memory to form a complete system on a board. When designing, validate pinout against the Quartus Prime device pinout file (DPF) for your specific IO bank assignment, and budget for JTAG programming header access even on production boards.