EP1S25F1020C5N - Stratix 25,660 LEs FPGA 1020-FBGA | Intel
부품 번호: EP1S25F1020C5N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $850 | $850.00 |
| 10 | $805 | $8,050.00 |
| 100 | $745 | $74,500.00 |
| 500 | $690 | $345,000.00 |
| 1,000 | $640 | $640,000.00 |
EP1S25F1020C5N 개요
A Field-Programmable Gate Array (FPGA) is a programmable logic device containing an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable interconnect. FPGAs sit in the broader semiconductor taxonomy between Application-Specific Integrated Circuits (ASICs) and general-purpose processors, offering hardware-level parallelism for high-throughput signal processing while remaining reprogrammable. The Stratix family occupies the high-performance tier within Intel's FPGA portfolio, with later generations (Stratix II/III/IV/V) building on this architecture.
Key specifications include 1.5 V core supply voltage, 500 MHz maximum operating frequency, and 25660 logic cells delivering DSP-grade performance. The device includes embedded memory (TriMatrix), DSP blocks, and high-speed transceivers for serial connectivity. The 706 user I/O pins across the 1020-ball FC-FBGA package provide ample LVDS and LVCMOS signaling capacity for high-bandwidth data acquisition and telecom infrastructure.
Technically, the EP1S25F1020C5N leverages a lookup-table (LUT)-based architecture with embedded RAM, dedicated multiplier blocks, and a hierarchical routing network. Its position in the Stratix hierarchy - below the EP1S40 and EP1S60 but above the EP1S10/EP1S20 - makes it suitable for mid-density designs requiring hundreds of thousands of system gates.
Typical applications include high-speed digital signal processing, telecommunications baseband processing, ASIC prototyping, and test and measurement instrumentation. The C5N suffix denotes the commercial temperature grade (0 to 85 C) and a -5 speed grade, with N indicating lead-free packaging. This combination suits lab, prototyping, and commercial embedded environments where industrial temperature ranges are not required.
When designing with this device, ensure PCB layout accommodates the 1.0 mm pitch BGA with appropriate via-in-pad or dog-bone fanout. Configuration via JTAG or supported boot PROM (EPCS) is required at power-up; the Quartus II design software (legacy versions supported) generates the configuration bitstream.
This page synthesizes distributor stock, drop-in Intel/Stratix-family alternatives, and engineering guidance that the raw datasheet alone does not present, giving procurement and design engineers a single reference for evaluating the EP1S25F1020C5N.
드롭인 대체품: EP1S25F1020C5N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1S25F1020C5N (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, DSP Blocks, Mounting Type, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1S25F1020C5
✅ 드롭인✓ 재고 있음
$650 / 개
데이터시트 보기 →EP1S25F1020C6N
✅ 드롭인✓ 재고 있음
$450 / 개
데이터시트 보기 →EP1S25F1020C7N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP1S25F1020I6N
✅ 드롭인✓ 재고 있음
$1028.03 / 개
데이터시트 보기 →EP1S25F1020I5N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP1S25F1020C5N 최대 정격 & 전기적 특성
| Family | Stratix |
| Logic Cells | 25660 |
| Configurable Logic Blocks (CLBs) | 2852 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Maximum Operating Frequency | 500 MHz |
| User I/O Pins | 706 |
| 패키지 | 1020-ball FC-FBGA |
| Package Dimensions | 33 x 33 mm |
| Ball Pitch | 1.0 mm |
| Temperature Grade | Commercial (0 C to 85 C) |
| Speed Grade | -5 |
| Lead-Free | Yes (N suffix) |
| Configuration Interface | JTAG / EPCS boot PROM |
| Logic Family | CMOS |
| 실장 유형 | Surface Mount (BGA) |
EP1S25F1020C5N 33 x 33 mm 핀 구성 가이드
EP1S25F1020C5N(33 x 33 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1S25F1020C5N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1S25F1020C5N 적합 용도: 6 애플리케이션s: High-Speed Digital Signal Processing (DSP), Telecommunications Baseband Processing, ASIC Prototyping and Emulation, Test and Measurement Instrumentation, Industrial Imaging and Machine Vision, Aerospace Avionics (Lab/Ground Use).
High-Speed Digital Signal Processing (DSP)
The EP1S25F1020C5N's 25,660 logic cells and dedicated DSP blocks (Stratix architecture) deliver hundreds of GMACs of multiply-accumulate throughput, ideal for radar, software-defined radio, and baseband DSP. The 500 MHz Fmax across CLBs supports high-sample-rate FIR filters and FFT engines in a single device. Its 706 user I/Os accommodate wide LVDS data buses from high-speed ADCs without external muxing. The 1.5 V core supply and 130 nm CMOS process are mature for long-life programs; the commercial 0-85 C temperature grade suits lab and protected enclosures. Use Quartus II DSP Builder to accelerate design capture.
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Telecommunications Baseband Processing
Telecom baseband designs demand parallel processing for channel coding, modulation/demodulation, and protocol stack acceleration - the EP1S25F1020C5N's embedded TriMatrix memory blocks provide distributed and block RAM ideal for symbol buffers, while DSP blocks accelerate Viterbi/Turbo decoders. The 706 I/Os support multiple CPRI or OBSAI links alongside fabric interconnect. The 1020-ball FC-FBGA package integrates well on telecom line cards with controlled impedance stackups. The C5N commercial temp grade suits indoor base-station and central-office environments; for outdoor radio units, consider the I-grade variant instead.
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ASIC Prototyping and Emulation
With 25,660 LEs and 706 I/Os, the EP1S25F1020C5N functions as a mid-density ASIC prototype vehicle for designs targeting gate counts in the 100k-300k region. The Stratix LUT-based architecture and abundant routing fabric support deep logic cones and complex state machines. Multiple FPGAs can be partitioned via LVDS across the 706 I/Os for larger ASIC prototypes. JTAG configuration supports fast design iteration. The C5N commercial temp grade is appropriate for lab bring-up; Quartus II provides ASIC-equivalent timing analysis to de-risk tape-out. The 1020-ball BGA requires careful PCB layout but enables high signal count per device.
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Test and Measurement Instrumentation
The EP1S25F1020C5N's parallel processing capability makes it suitable for arbitrary waveform generators, logic analyzers, and protocol testers where multiple stimulus/response channels must operate concurrently. Its 706 I/Os drive many comparator/buffer paths without external muxing, and the 500 MHz Fmax supports high-symbol-rate pattern generation. The commercial 0-85 C range covers standard lab environments; the -5 speed grade balances timing margin with availability. JTAG configuration simplifies field firmware updates for shipped instruments. Designers should consider the C6N variant if headroom is needed for timing closure at high toggle rates.
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Industrial Imaging and Machine Vision
Image-processing pipelines (preprocessing, segmentation, feature extraction) benefit from the EP1S25F1020C5N's parallel DSP blocks and TriMatrix memory, which can sustain real-time pixel rates from multiple Camera Link or LVDS camera streams. The 706 I/Os accommodate parallel image data paths plus trigger/control signals. The 1020-ball FC-FBGA supports controlled-impedance routing needed for high-fidelity LVDS image links. For industrial environments requiring -40 to +100 C operation, substitute the I5N or I6N variant on the same footprint. Quartus II IP libraries include Camera Link receivers and Sobel/FFT cores.
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Aerospace Avionics (Lab/Ground Use)
Although the EP1S25F1020C5N is commercial grade, it remains useful for lab-based avionics development, ground-test rigs, and hardware-in-the-loop simulation where the -40 to +85 C industrial range is not required. Its 25,660 LEs accommodate MIL-STD-1553, ARINC 429, and other avionics protocol stacks alongside processing logic. The 706 I/Os allow interfacing to legacy avionic buses through transceivers. Note: actual flight hardware should use radiation-hardened or ruggedized parts; this FPGA is appropriate for non-flight ground systems only. The 1020-ball FC-FBGA package integrates well on conduction-cooled test boards.
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추천 제품 요약
엔지니어링 참조 데이터: EP1S25F1020C5N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1S25F1020C5 | EP1S25F1020C6N | EP1S25F1020C7N | EP1S25F1020I6N | EP1S25F1020I5N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1020-ball FC-FBGA 33x33 mm, 1.0 mm pitch | 1020-ball FC-FBGA 33x33 mm, 1.0 mm pitch - same | 1020-ball FC-FBGA 33x33 mm, 1.0 mm pitch - same | 1020-ball FC-FBGA 33x33 mm, 1.0 mm pitch - same | 1020-ball FC-FBGA 33x33 mm, 1.0 mm pitch - same | 1020-ball FC-FBGA 33x33 mm, 1.0 mm pitch - same |
| Logic Cells | 25660 | 25660 | 25660 | 25660 | 25660 | 25660 |
| Speed Grade | -5 | -5 | -6 (faster) | -7 (fastest) | -6 (faster) | -5 (matches baseline) |
| Temperature Grade | Commercial 0 C to 85 C | Commercial 0 C to 85 C | Commercial 0 C to 85 C | Commercial 0 C to 85 C | Industrial -40 C to 100 C | Industrial -40 C to 100 C |
| User I/O Count | 706 | 706 | 706 | 706 | 706 | 706 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Process Technology | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Mid-density sweet spot in the original Stratix family (vs EP1S10F780C6N)
- Lead-free (N suffix) terminal finish (vs EP1S25F1020C5)
- Identical die, faster speed grade option available (vs EP1S25F1020C6N)
설계 노트
The 1020-ball FC-FBGA at 1.0 mm pitch requires 4-6 layer PCB stackup with microvia or via-in-pad construction. Use dog-bone fanout only if your fab cannot do microvias. Maintain 50 ohm controlled impedance on LVDS pairs and matched-length routing within 50 mil for high-speed interfaces. Provide at least 4 ground-referenced power planes under the BGA for VCCINT, VCCIO, and GND to manage the 1.5 V core current transients.
Estimate (not datasheet-specified): at 500 MHz with typical Stratix toggle rates, the 1.5 V VCCINT rail can draw 1.5-3 A depending on logic utilization. Decouple with 100 uF bulk + 10 uF ceramic per regulator + 0.1 uF + 0.01 uF per power pin. The VCCIO rails (3.3 V or 2.5 V depending on I/O standard) similarly need bulk + ceramic decoupling. Use a sequencer to enforce VCCINT before VCCIO per Intel/Altera power-up guidelines.
Do not omit the configuration boot PROM (EPCS family) - the EP1S25F1020C5N cannot self-configure from flash. Ensure JTAG chain pull-ups are present on TCK/TMS/TDO/TDI. Configuration mode pins (MSEL) must be set correctly for the chosen boot mode (AS, AP, PS, JTAG). The Quartus II software version must be a legacy release supporting the original Stratix architecture (Quartus II v9.1 or earlier is typical).
Estimated: at full 25,660 LE utilization and 500 MHz toggle rate, junction power can reach 3-5 W. The FC-FBGA package has no exposed thermal pad - rely on internal balls and PCB copper for heat spreading. For enclosed industrial environments, derate toggle activity or upgrade to the I-grade variant for wider thermal headroom. Forced-air cooling is recommended above 70 C ambient.
규정 준수 정보
N suffix indicates lead-free terminal finish per Intel/Altera legacy part numbering convention. RoHS/REACH/AEC-Q100 compliance not explicitly confirmed in verified web data - flagged as unknown. Device is commercial grade (0-85 C), so AEC-Q100 automotive qualification is not applicable.