EP1S25F1020C7 - Stratix 25,660-Cell FPGA, 706 I/O, 1020-BGA | Altera
부품 번호: EP1S25F1020C7 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $947.77 | $947.77 |
| 10 | $920 | $9,200.00 |
| 100 | $890 | $89,000.00 |
| 500 | $855 | $427,500.00 |
| 1,000 | $820 | $820,000.00 |
EP1S25F1020C7 개요
An FPGA (Field Programmable Gate Array) is a reconfigurable semiconductor device that combines programmable logic blocks, interconnect, and I/O on a single die, allowing engineers to implement custom digital logic after manufacturing. FPGAs sit above microcontrollers in design flexibility but below ASICs in per-unit cost; they are widely used for ASIC prototyping, DSP, glue logic, high-speed I/O bridging, and parallel processing. The Stratix family in particular is Altera's high-performance, logic-rich line optimized for communications, video, and DSP workloads.
Key features of the EP1S25F1020C7 include 2566 logic array blocks, four phase-locked loops (PLLs) for clock synthesis, and configurable high-speed I/O standards including LVDS and SSTL. The device also supports multiple configuration modes (Passive Serial, Active Serial, JTAG) and includes dedicated hardware multipliers that accelerate DSP operations up to 420 MHz internal operation. The 33 x 33 mm package with 1 mm ball pitch is JEDEC compliant for fine-pitch BGA assembly.
Architecturally, the Stratix EP1S25 employs an ALM-based logic fabric with embedded TriMatrix memory blocks distributed in columns, providing high-bandwidth on-chip storage for FIFO and packet-buffer use cases. The DSP blocks implement hardened 9x9, 18x18, and 36x36 multiply-accumulate functions, freeing fabric for additional logic. Differential I/O with up to 80 LVDS channels supports high-speed chip-to-chip links.
Typical applications include ASIC prototyping, telecom line-card DSP, video processing, network switching fabrics, military/aerospace signal processing, and high-speed data-acquisition front-ends. It is also commonly used in FPGA-based prototyping of next-generation SoCs and as glue logic in test-and-measurement equipment.
Design considerations: ensure signal integrity on the 1 mm-pitch BGA through controlled-impedance routing and matched-length LVDS pairs. The commercial-grade temperature range (0 °C to 85 °C) limits use in industrial or automotive environments; for extended temperature, choose the EP1S25F1020I7 variant. Note this part is now obsolete/EOL — verify long-term supply through franchised distributors or licensed independent stock.
This page synthesizes distributor pricing, drop-in same-package alternatives from the same Altera Stratix family, and practical design notes not consolidated in the original datasheet.
드롭인 대체품: EP1S25F1020C7 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1S25F1020C7 (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Speed Grade, Mounting Type, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1S25F1020C7N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP1S25F1020C6N
✅ 드롭인✓ 재고 있음
$450 / 개
데이터시트 보기 →EP1S25F1020C5N
✅ 드롭인✓ 재고 있음
$640 / 개
데이터시트 보기 →EP1S25F1020C6
✅ 드롭인✓ 재고 있음
$425 / 개
데이터시트 보기 →EP1S25F1020C5
✅ 드롭인✓ 재고 있음
$650 / 개
데이터시트 보기 →EP1S25F1020C7 최대 정격 & 전기적 특성
| Series | Stratix® |
| Manufacturer | Altera (now Intel) |
| Logic Elements / Cells | 25,660 |
| Number of LABs/CLBs | 2566 |
| Total RAM Bits | 1,944,576 |
| Number of I/O | 706 |
| Voltage - Supply | 1.5 V core |
| Process Technology | 130 nm CMOS |
| 동작 온도 | 0 °C to +85 °C (Commercial) |
| Maximum Internal Frequency | 420 MHz |
| 실장 유형 | Surface Mount (BGA) |
| 패키지 / 케이스 | 1020-BBGA, FC-FBGA, 33 x 33 mm, 1 mm pitch |
| Configuration Method | Passive Serial / Active Serial / JTAG |
| PLL Count | 4 |
EP1S25F1020C7 1020-bbga, fc-fbga, 33 x 33 mm, 1 mm pitch 핀 구성 가이드
EP1S25F1020C7(1020-bbga, fc-fbga, 33 x 33 mm, 1 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1S25F1020C7.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1S25F1020C7 적합 용도: 6 애플리케이션s: ASIC Prototyping and Emulation, Telecom Line-Card DSP and Packet Processing, Video and Image Processing Pipelines, High-Speed Data Acquisition Front-Ends, Military and Aerospace Signal Processing, Test-and-Measurement Instrumentation.
ASIC Prototyping and Emulation
The EP1S25F1020C7's 25,660 logic elements and 1,944,576 bits of embedded memory make it well-suited to ASIC prototyping and emulation, where engineers map large gate-level designs to a single FPGA before taping out silicon. The 706 user I/Os support multi-chip partitioning and high-pin-count SoC prototypes, while the 420 MHz internal operation preserves timing headroom for synthesized ASIC clock trees. The Stratix DSP blocks implement hardened 9x9, 18x18, and 36x36 multipliers, which accelerate prototype verification of DSP-heavy ASICs without using fabric multipliers. Designers typically pair the EP1S25F1020C7 with the Quartus II design suite and Active Serial configuration via an EPCS device.
추천
Telecom Line-Card DSP and Packet Processing
In telecom line-card and packet-processing applications, the EP1S25F1020C7's combination of TriMatrix memory (1.9 Mbits) and dedicated DSP blocks delivers the buffering and multiply-accumulate throughput needed for Viterbi, Turbo, and FFT pipelines. The 706 I/Os support multiple SFI / SPI / UTOPIA interfaces and connect to external network processors. Per the Stratix Family Data Sheet, the part also provides 4 PLLs for clock synthesis across multiple line-card clock domains. Power consumption typically sits around 1.5-2 W at full utilization, so the 33 x 33 mm BGA requires attention to airflow and copper thermal via density.
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Video and Image Processing Pipelines
For broadcast video processing and image pipelines, the EP1S25F1020C7 offers enough logic and on-chip RAM to host multi-channel SDI processing, color-space conversion, and motion-adaptive deinterlacing. The 706 I/Os accept multiple 10-bit parallel video buses plus LVDS links for camera input. Hard multipliers accelerate DCT/IDCT and chroma resampling. The C7 speed grade preserves timing margin at typical 148.5 MHz HD video clocks; the commercial 0-85 °C operating range covers most studio and rack-mount chassis environments.
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High-Speed Data Acquisition Front-Ends
Data-acquisition front-ends benefit from the EP1S25F1020C7's 706 I/Os and up to 80 LVDS channels at 624 Mbps, which allow direct connection to multi-channel ADCs and DACs. The 1.9 Mbit embedded memory buffers transient bursts before DMA handoff to a host processor. Hard DSP blocks implement real-time FIR filtering, decimation, and windowing without consuming fabric. The BGA's 1 mm ball pitch requires ENIG finish and high-quality PCB stackup to maintain signal integrity on parallel LVDS buses above 400 MHz.
추천
Military and Aerospace Signal Processing
Although the EP1S25F1020C7 is commercial-grade (0-85 °C), many defense and aerospace programs qualified it for benign airborne and shipboard signal-processing applications before the part was discontinued. The 25,660 logic elements accommodate moderate-sized FFT, beamforming, and radar return processing, while the 706 I/Os connect to RF ADC back-ends. For new designs, the part is obsolete; for sustaining legacy programs, expect to source from qualified independent distributors with MIL-STD-1686 ESD handling and full traceability.
추천
Test-and-Measurement Instrumentation
Test-and-measurement instruments — protocol analyzers, BERTs, and logic analyzers — leverage the EP1S25F1020C7's high I/O count to expose many test points and the DSP blocks for real-time waveform processing. The 4 PLLs synthesize multiple baud-rate clocks from a single reference, simplifying multi-rate test patterns. The 420 MHz internal frequency drives state machines faster than the stimulus rate, giving margin for protocol timing. Many legacy test platforms are still in production use; the part remains sought-after on the secondary market for repair and calibration purposes.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1S25F1020C7 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1S25F1020C7N | EP1S25F1020C6N | EP1S25F1020C5N | EP1S25F1020C6 | EP1S25F1020C5 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1020-BBGA, FC-FBGA, 33 x 33 mm, 1 mm pitch | 1020-BBGA, FC-FBGA, 33 x 33 mm, 1 mm pitch (same) | 1020-BBGA, FC-FBGA, 33 x 33 mm, 1 mm pitch (same) | 1020-BBGA, FC-FBGA, 33 x 33 mm, 1 mm pitch (same) | 1020-BBGA, FC-FBGA, 33 x 33 mm, 1 mm pitch (same) | 1020-BBGA, FC-FBGA, 33 x 33 mm, 1 mm pitch (same) |
| Speed Grade | C7 (fastest C-grade) | C7 (same) | C6 (slower) | C5 (slowest) | C6 (slower) | C5 (slowest) |
| Logic Elements | 25,660 | 25,660 (same die) | 25,660 (same die) | 25,660 (same die) | 25,660 (same die) | 25,660 (same die) |
| Number of LABs/CLBs | 2566 | 2566 | 2566 | 2566 | 2566 | 2566 |
| Total RAM Bits | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| Number of I/O | 706 | 706 | 706 | 706 | 706 | 706 |
| Operating Temperature | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) |
| Unit Price (qty 1) | ~$947.77 | Similar (~$950) | Slightly lower (~$880) | Lowest (~$820) | Slightly lower (~$880) | Lowest (~$820) |
주요 차별점
- Fastest C-grade speed in the EP1S25F1020 family (vs EP1S25F1020C6 / C5)
- Lead-free RoHS variant available as drop-in (vs EP1S25F1020C6 (non-N))
- Same 1,020-BGA footprint as five drop-in alternatives (vs EP1S25B672C7N)
설계 노트
The 1020-BGA at 33 x 33 mm with 1 mm ball pitch requires a high-quality PCB stackup. Per the Stratix Handbook package guidelines, use microvia (laser-drilled) stackup with 0.5-0.65 mm pitch escape routing. Match LVDS pairs to within 5 mil length tolerance and keep reference planes continuous under the entire BGA. ENIG or ENEPIG surface finish is recommended; OSP is acceptable for prototypes.
Estimated: at typical 1.5 V core supply and ~70% utilization (Stratix family typical), the EP1S25F1020C7 dissipates ~3-5 W. With 33 x 33 mm BGA package theta_JA around 12-18 C/W (vendor-stated), expect junction-to-ambient rise of ~50-80 C without airflow. Provide thermal vias under the central balls and at least 200 LFM airflow for commercial-grade operation at 85 C ambient.
The EP1S25F1020C7 supports up to 80 LVDS channels at 624 Mbps, requiring strict impedance control (100 ohm differential ±10%). Use buried stripline layers with reference planes on both sides; avoid reference plane splits near BGA breakout. Per Altera's Stratix Device Handbook, source-synchronous LVDS clock-to-data skew must be held within 75 ps at 624 Mbps.
Critical: the EP1S25F1020C7 is obsolete. Do not design it into new production programs without a sustaining-of-life plan. For new designs, use the Quartus II (legacy) or Quartus Prime toolchain with a supported Stratix II/III/IV/V device. Mixing C7 and C5 speed grades on the same JTAG chain can cause timing mismatch; verify all variants carry the same speed-grade suffix when designing a multi-FPGA system.
규정 준수 정보
RoHS/lead-free status of the EP1S25F1020C7 itself is not confirmed in the verified web data; the 'N' suffix variants (EP1S25F1020C7N etc.) are documented as lead-free per Altera's ordering nomenclature. AEC-Q100 does not apply to this FPGA commercial-grade part.
