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EP1SGX25DF1020I7N - Stratix GX FPGA, 25K LEs, 1020-pin FC-FBGA | Intel
EP1SGX25DF1020I7N

EP1SGX25DF1020I7N - Stratix GX FPGA, 25K LEs, 1020-pin FC-FBGA | Intel

The Intel (formerly Altera) EP1SGX25DF1020I7N is a high-density Stratix GX family Field-Programmable Gate Array (FPGA) featuring 25,660 logic elements, 2,566 Configurable Logic Blocks (CLBs), and integrated high-speed transceivers, housed in a 1020-ball FC-FBGA package. It is fabricated on a 130 nm process node and operates at a core voltage of 1.5 V with military-grade temperature grading (-40 °C to +100 °C I-temp). The device delivers up to 4,385.97 MHz of internal performance and targets high-bandwidth serial I/O applications such as backplane transceivers, communications infrastructure, and ASIC prototyping. A Field-Programmable Gate Array (FPGA) is a type of integrated circuit that can be configured by the customer or designer after manufacturing to implement arbitrary digital logic. Architecturally, an FPGA sits between a hard-wired Application-Specific Integrated Circuit (ASIC) and a general-purpose processor: faster and lower-power than a processor for fixed functions, but reprogrammable like software. The Stratix GX family adds multi-gigabit serial transceivers and dedicated clock management, positioning these FPGAs inside the broader hierarchy: FPGA -> programmable logic device -> programmable logic IC -> integrated circuit -> semiconductor. Key features of the EP1SGX25DF1020I7N include its embedded transceiver blocks supporting standard serial protocols, dedicated DSP blocks for high-speed arithmetic, TriMatrix on-chip memory for high-bandwidth buffering, and support for external memory interfaces such as DDR SDRAM. The 1020-ball FC-FBGA package provides a high pin density suitable for systems that require very large logic capacity and many high-speed I/O lanes. Military-grade temperature grading ensures operation in harsh thermal environments. The EP1SGX25DF1020I7N uses a SRAM-based configuration cell that requires a configuration device on power-up. Its architecture integrates 4 transceiver channels capable of multi-gigabit-per-second serial I/O, 14 embedded DSP blocks, and a TriMatrix memory architecture with multiple block sizes. The 130 nm process technology balances density and power, while the 1.5 V core VCC keeps dynamic power manageable in long logic traces. Typical applications include high-speed serial backplane interfaces, ASIC prototyping and emulation, telecommunications equipment, network switches, and high-performance digital signal processing systems. Designers choose this part when they need a proven FPGA with integrated transceivers and large logic density. When designing with the EP1SGX25DF1020I7N, ensure the PCB supports the FC-FBGA ball pattern, the configuration device is selected from the recommended list, and JTAG access is provided for boundary-scan and programming. Power decoupling requires multiple bulk and high-frequency ceramic capacitors around the 1.5 V core and 3.3 V I/O rails. This page synthesizes distributor availability, same-package alternative MPNs from the Stratix GX family, and practical design notes not found in the standalone manufacturer datasheet, with values verified against distributor listings as of 2026-09-07.

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EP1SGX25DF67216 - Stratix GX FPGA, 25K LE, 672-BGA | Altera
EP1SGX25DF67216

EP1SGX25DF67216 - Stratix GX FPGA, 25K LE, 672-BGA | Altera

The Altera (now Intel) EP1SGX25DF67216 is a member of the Stratix® GX FPGA family that combines a high-performance logic fabric with up to 20 channels of embedded multi-gigabit serial transceivers. The device integrates 25,660 logic elements, 1,944,576 bits of embedded memory, and 4 PLLs in a 672-ball FineLine BGA package with integrated CDR-based transceivers supporting data rates from 500 Mbps to 3.1875 Gbps. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard-IP blocks such as transceivers, memory, and DSP. FPGAs sit at the top of the programmable logic hierarchy between CPLDs (smaller, lower-density) and ASICs (higher-NRE, higher-volume). The Stratix GX specifically extends this hierarchy into high-speed serial I/O, combining general-purpose FPGA fabric with multi-gigabit transceivers (MGTs) for protocols like PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI. Key features of the EP1SGX25DF67216 include 8 transceiver channels (4 in each of two banks) operating at 500 Mbps to 3.1875 Gbps, on-die termination (ODT) for 100-ohm differential lines, programmable transmitter pre-emphasis and receiver equalization, a 1.5-V core supply, 1,944,576 RAM bits organized as M4K/M-RAM blocks, and 4 dedicated PLLs for clock synthesis. The device supports up to 3 single-ended I/O standards per bank with hot-socketing capability. Architecturally, the Stratix GX family uses a 1.5-V core with a TriMatrix memory structure (640-bit M512, 4-Kbit M4K, 512-Kbit M-RAM) and dedicated DSP blocks for high-throughput arithmetic. Embedded SERDES with clock data recovery (CDR) eliminates external PHY chips, while the high-speed transceiver interface (HSTI) provides a hard-coded PCS layer with 8B/10B encoding, rate matching, and word alignment. Typical applications include high-speed serial interface bridging (PCI Express x1/x4 endpoint, Gigabit Ethernet MAC, Serial RapidIO), telecommunications backplane aggregation, broadcast video transport (SD-SDI/HD-SDI), storage area network interconnects (Fibre Channel), and defense/aerospace signal processing back-ends. The 3.1875 Gbps per channel raw rate translates into approximately 2.5 Gbps usable bandwidth after 8B/10B overhead. When designing with this device, allocate a separate PLL per transceiver block group and keep the 1.5-V core and 3.3-V auxiliary supplies well-decoupled with 100 nF X7R capacitors within 100 mils of each ball. Maintain 100-ohm differential impedance on all transceiver traces and use a 4-layer PCB with continuous ground beneath the BGA to limit crosstalk. This page consolidates distributor pricing, parametric cross-references within the Stratix GX and Stratix II GX families, and design notes not present in the manufacturer datasheet, giving procurement and hardware engineers a single-source comparison before placing a long-lifecycle order.

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EP1SGX25DF672C5 - Stratix GX FPGA 25K LE 672-FBGA | Intel
EP1SGX25DF672C5

EP1SGX25DF672C5 - Stratix GX FPGA 25K LE 672-FBGA | Intel

The Intel (formerly Altera) EP1SGX25DF672C5 is a Stratix GX family field-programmable gate array (FPGA) integrating 25,660 logic elements (LEs), 1,944,576 bits of embedded memory, and 455 user I/Os in a 672-ball fine-pitch BGA package (33 × 33 mm, 1 mm pitch). Built on a 1.5 V CMOS process, this device combines a high-density programmable logic fabric with up to 20 embedded transceiver channels optimized for 1.25 Gbps to 3.125 Gbps serial I/O, making it a drop-in building block for high-bandwidth communications and datapath designs. An FPGA (Field Programmable Gate Array) is a programmable logic device — within the broader hierarchy of programmable logic devices (PLDs) — that contains an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable interconnect. Stratix GX extends the Stratix architecture with embedded serial transceivers that hard-IP the PHY layer for protocols such as Gigabit Ethernet, Serial RapidIO, PCI Express, XAUI, and SONET/SDH at multi-gigabit data rates. The 'SGX' family positions Stratix GX as the transceiver-rich derivative for communication infrastructure, broadcast video, and high-speed datapath applications. Key features of the EP1SGX25DF672C5 include 25,660 LEs, 1,944,576 RAM bits, 455 user I/Os, 20 full-duplex transceiver channels (per the Stratix GX family data sheet) supporting serial rates up to 3.125 Gbps with 8B/10B encoding and dynamic phase alignment, dedicated multiplier/DSP blocks for high-throughput signal processing, and tri-matrix on-chip memory configurable as RAM, ROM, or FIFO. The C5 speed grade balances timing margin against power, and the industrial 0 °C to 85 °C operating range covers commercial and most controlled-environment deployments. Typical applications include 10 Gigabit Ethernet line cards and switch fabrics, multi-port Gigabit Ethernet aggregation, Serial RapidIO and PCI Express endpoint/root-complex bridging, baseband processing for wireless infrastructure, and video broadcast glue logic. The 672-FBGA package exposes 455 user I/Os and full MII/RMII/GMII-friendly LVDS I/O, providing flexible board-level integration in space-constrained line cards. When designing with this device, pay close attention to transceiver reference-clock routing, supply-rail decoupling around the analog 1.5 V and 2.5 V PLLs, and JTAG-driven configuration via the enhanced configuration scheme. The C5 speed grade requires timing closure headroom — review Quartus II TimeQuest timing analyzer results against the datasheet-specified fMAX for your critical path. Keep in mind this part is from a legacy 130 nm node; modern designs typically migrate to Stratix II GX, Cyclone IV GX, or Stratix V for lower power and higher transceiver rates.

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EP1SGX25DF672C5N - 25K LE Stratix GX FPGA 455 I/O 672-FBGA
EP1SGX25DF672C5N

EP1SGX25DF672C5N - 25K LE Stratix GX FPGA 455 I/O 672-FBGA

The Intel (formerly Altera) EP1SGX25DF672C5N is a high-performance Stratix GX family FPGA delivering approximately 25,660 logic elements (LEs), 455 user I/Os, and integrated 3.1875 Gbps multi-gigabit transceivers in a 672-ball FineLine BGA package. It operates on a 1.5 V core supply (1.425 V to 1.575 V), is built on a 130 nm CMOS process, and supports embedded memory, DSP blocks, and high-speed serial I/O for communication and signal-processing designs. A Field Programmable Gate Array (FPGA) is a programmable logic device belonging to the broader hierarchy of programmable logic > logic ICs > integrated circuits > semiconductors. FPGAs consist of configurable logic blocks (CLBs), programmable interconnects, embedded memory, and (in modern devices) hardened DSP and transceiver blocks. Stratix GX devices specifically target applications needing integrated multi-gigabit transceivers (MGTs) and high logic capacity, positioned in the Intel/Altera high-performance programmable logic family hierarchy: Stratix GX > Stratix > Cyclone-class devices in capability. Key features of the EP1SGX25DF672C5N include embedded transceiver channels capable of 3.1875 Gbps serial data rates, dedicated DSP blocks for high-speed arithmetic, TriMatrix on-chip memory, support for multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL, PCI-X), and a fine-pitch 1.0 mm 672-ball Flip-Chip BGA package (FBGA-672) for high-density board designs. The "C5" speed grade and commercial 0C to 85C operating range balance performance with cost for prototyping and volume production. Architecturally, the Stratix GX integrates transceiver physical coding sublayer (PCS) and physical medium attachment (PMA) blocks directly on-die, eliminating external PHY components for many serial-link applications. The lockable phase-locked loops (PLLs) feed the transceivers and global clock networks. Configuration is supported via passive serial (PS), passive parallel synchronous (PPS), fast passive parallel (FPP), and JTAG modes, with the option to use Altera configuration devices (EPCS/EPC) for single-chip boot. Typical applications for the EP1SGX25DF672C5N include custom digital signal processing cards, network switching and routing fabrics, telecom backplane interfaces, high-speed serial protocol bridges (XAUI, Fibre Channel, Serial RapidIO, PCI Express via soft IP), military/aerospace data links, and broadcast video processing. The integrated transceiver channels make it especially useful where PCB routing for parallel high-speed buses would be impractical. Design considerations: ensure signal-integrity simulation of all transceiver channels with controlled-impedance differential routing, AC-coupling capacitors on serial lines, and reference-clock jitter well below the device's PLL tolerance. Provide multiple decoupling capacitor values near each power pin and connect the 672-ball BGA to a multi-layer PCB with continuous power/ground planes. Always verify Quartus II design software support for this specific die, package, and speed grade before committing to a layout. This page synthesizes Intel/Altera datasheet parameters, distributor pricing (as of 2026-09-07), same-brand drop-in alternatives from the Stratix GX family, and practical design notes that go beyond the manufacturer datasheet to help engineers evaluate the part for new designs and legacy replacements.

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EP1SGX25DF672C6 - Stratix GX FPGA 25K LE 672-BGA | Intel / Altera
EP1SGX25DF672C6

EP1SGX25DF672C6 - Stratix GX FPGA 25K LE 672-BGA | Intel / Altera

The Intel / Altera EP1SGX25DF672C6 is a member of the Stratix® GX FPGA family that integrates 25,660 logic elements (approximately 25K Les), 455 user I/O pins, and 1,944,576 bits of embedded memory in a 672-ball FineLine BGA package with a 1.0 mm pitch and 27 x 27 mm body. Designed on a 1.5 V core / CMOS process, this device combines a high-density programmable fabric with embedded transceivers, making it a drop-in upgrade target for serial-interface backplane and edge-card designs. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor that allows engineers to implement arbitrary digital logic, soft processor cores, and high-speed serial interfaces using a hardware description language. The Stratix GX line specifically added multi-gigabit transceivers to the Stratix architecture, simplifying the design of protocols like PCI Express, Serial RapidIO, Gigabit Ethernet, and custom chip-to-chip links without requiring external PHY devices. Key features of the EP1SGX25DF672C6 include 25,660 logic elements distributed across 2,566 LABs, 1,944,576 bits of RAM, 6 embedded transceiver channels supporting data rates up to 3.125 Gbps, and 12 dedicated clock pins with 16 global clock networks. The 672-pin BGA package exposes 455 user I/Os for parallel signaling and board-to-board interconnects, while on-chip PLLs support precise frequency synthesis and clock domain crossing. In terms of architecture, this device blends a fine-grained logic fabric with coarse-grained DSP blocks and TriMatrix memory, allowing efficient implementation of both control logic and signal-processing datapaths. The embedded transceivers include built-in 8b/10b encoding, byte alignment, and rate-matching FIFOs, offloading protocol overhead from the programmable fabric. Typical applications include high-speed serial backplane connectivity, telecom line cards, industrial imaging pipelines, and digital video broadcast equipment. Industrial and telecom system architects use this part where pin-compatibility with later-generation Stratix GX devices allows straightforward migration. When designing with this device, careful attention to power sequencing, decoupling, and signal-integrity on the 1.0 mm BGA is essential. Use at least 6 layers with continuous power planes and follow Altera's Stratix GX design guidelines for channel pre-emphasis and receiver equalization settings. This page synthesizes distributor pricing, drop-in pin-compatible alternatives within the same Stratix GX family, and practical PCB layout notes that go beyond the manufacturer datasheet alone, helping sourcing engineers and hardware designers make informed second-source decisions.

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EP1SGX25DF672C6N - Stratix GX FPGA, 25K LE, 672-FBGA | Intel (Altera)
EP1SGX25DF672C6N

EP1SGX25DF672C6N - Stratix GX FPGA, 25K LE, 672-FBGA | Intel (Altera)

The Intel (formerly Altera) EP1SGX25DF672C6N is a high-density Stratix GX family Field Programmable Gate Array (FPGA) integrating 25,660 logic elements (cells) in a 672-ball Fine-pitch Ball Grid Array (FC-FBGA / FBGA-672) measuring 33 x 33 mm with 1.0 mm ball pitch. It is fabricated on a 130 nm CMOS process, operates from a 1.5 V core supply, and is rated for the commercial 0C to 85C operating range. An FPGA (Field-Programmable Gate Array) is a programmable semiconductor whose logic fabric, block RAM, DSP blocks, and I/O can be reconfigured after manufacture, allowing engineers to implement arbitrary digital logic, signal-processing pipelines, and high-speed serial interfaces without a custom ASIC. Stratix GX sits within Intel's high-performance FPGA hierarchy as a transceiver-equipped variant of the original Stratix family, optimized for communication, video, and signal-processing designs. This places the EP1SGX25DF672C6N at the high-performance end of the programmable-logic taxonomy: FPGA > programmable logic > semiconductor IC. Key features include 2,566 LABs (Logic Array Blocks), 455 user I/O pins, embedded transceiver channels for high-speed serial connectivity, distributed and block RAM, dedicated DSP blocks for multiplication-intensive pipelines, and on-chip PLLs for clock generation and management. The 1.0 mm-pitch FBGA-672 package supports the high I/O count and transceiver signal-integrity requirements typical of line-card and backplane designs. Typical applications include telecom line cards, broadband aggregation equipment, high-speed serial protocol bridging (e.g., custom SERDES-based links), video and image processing pipelines, and military/aerospace signal-processing subsystems. The 1.5 V core combined with multi-gigabit transceivers makes this part especially attractive where deterministic latency and high throughput are required. When designing with this device, plan PCB stack-up, decoupling, and power sequencing carefully because 672-ball BGAs demand matched-length routing, abundant ground vias, and a multi-rail power network. The Altera (now Intel FPGA) Quartus II design suite supports this family natively, with reference designs, IP cores, and transceiver toolkits accelerating integration. This page synthesizes distributor pricing, in-family drop-in alternatives, and practical design notes beyond what is repeated in the manufacturer datasheet, giving the engineer a faster procurement and design-validation path.

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EP1SGX25DF672C7 - Stratix GX FPGA, 25K LE, 672-BGA | Intel / Altera
EP1SGX25DF672C7

EP1SGX25DF672C7 - Stratix GX FPGA, 25K LE, 672-BGA | Intel / Altera

The Intel (formerly Altera) EP1SGX25DF672C7 is a high-density Stratix GX family Field-Programmable Gate Array (FPGA) integrating 25,660 logic elements, 1,944,576 bits of embedded RAM, and up to 455 user I/Os in a 672-ball FineLine BGA package. Built on a 1.5 V core, 0.13 µm CMOS process with embedded transceiver and DSP capabilities, it is designed for high-speed serial interface, networking, and signal-processing designs requiring integrated physical-layer IP. A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor device consisting of an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and programmable interconnect fabric. FPGAs sit at the hierarchy: programmable logic -> logic IC -> integrated circuit. They are widely used as hardware accelerators, custom I/O bridges, and prototyping platforms for ASICs, providing ASIC-like performance with field-reprogrammability. Key features of the EP1SGX25DF672C7 include 25,660 logic elements (2,566 LABs), 1,944,576 total RAM bits (~237 Kbytes), 14 embedded DSP blocks for hardware multiplication and MAC operations, multi-gigabit transceivers, and a Phase-Locked Loop (PLL) clock management network. The 672-FBGA (27 × 27 mm) package provides 455 user I/Os and supports surface-mount assembly with lead-free (Pb-free) ball terminations. The device is fabricated on a 1.5 V, 0.13 µm CMOS SRAM-based process. The 'GX' suffix indicates the integrated high-speed transceiver tier (versus the non-transceiver Stratix family). The speed grade 'C7' indicates a commercial temperature grade (0 °C to 85 °C) with a moderate Fmax speed bin. The 'DF' position in the part number refers to the 672-pin FineLine BGA package code. Typical applications include 10 Gbps Ethernet line cards, SONET/SDH framer ASIC replacement, custom protocol bridging (SPI 4.2, SFI-4, XAUI), high-performance DSP pre-processing, and test & measurement front-ends. The integrated transceivers and DSP blocks reduce external PHY and DSP component count, enabling higher board density for telecom and datacom line cards. When designing with this part, ensure the 1.5 V core and 3.3 V/2.5 V auxiliary supplies are decoupled with low-ESR ceramic capacitors placed close to each power pin. The transceiver reference clock must meet the jitter specification in the Stratix GX Handbook, and the JTAG chain must include the device in BSDL-defined order to enable in-system programming. This page synthesizes distributor pricing, drop-in alternatives from the same Altera/Intel Stratix GX family, and practical design notes that go beyond a simple datasheet restatement.

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EP1SGX25DF672C7ES - 25,660-Cell Stratix GX FPGA | Intel
EP1SGX25DF672C7ES

EP1SGX25DF672C7ES - 25,660-Cell Stratix GX FPGA | Intel

Intel EP1SGX25DF672C7ES is a high-density Stratix GX field-programmable gate array with 25,660 logic cells, 455 I/O, and high-speed serial transceiver capability. Verified listings identify a 130 nm CMOS implementation, a 1.5 V supply, and a 672-pin FC-FBGA package. The device is suited to programmable digital systems that need reconfigurable logic together with serial connectivity; transceiver operation is listed from 500 Mbps to 3.1875 Gbps per channel. The exact available transceiver-channel count for this specific ordering code is not stated in the supplied excerpts. A field-programmable gate array, or FPGA, is a semiconductor device whose configurable logic blocks, routing resources, and embedded functions implement application-specific digital circuits. In the hierarchy, an FPGA belongs to programmable logic devices, which sit within digital integrated circuits and broader semiconductor technology. Unlike a fixed-function application-specific integrated circuit, an FPGA can be configured after manufacture, allowing hardware updates, protocol changes, and parallel development of multiple functions on one platform. The principal functional features of the EP1SGX25DF672C7ES are its 25,660 cells, 455 I/O, and Stratix GX transceiver architecture. Its CMOS logic family supports conventional digital design implementation, while the programmable architecture can host interfaces, control logic, protocol processing, and datapath functions. A 672-terminal ball-grid package provides a large area-array interconnect for the device's logic, memory, power, and high-speed I/O resources. The operating temperature range supplied for this part is 0 °C to 85 °C. Architecturally, Stratix GX combines programmable logic with dedicated high-speed serial transceiver blocks. The supplied data states full-duplex transceiver operation from 500 Mbps through 3.1875 Gbps and describes configurations supporting 4, 8, 16, or 20 channels in the family. These blocks are intended for serializer/deserializer applications and transceiver-based protocols. Because the supplied material does not identify the channel count encoded by the ES ordering code, engineers must verify that option before final board-level design. Typical uses include communications equipment, serial-interface aggregation, test and measurement hardware, industrial control, and reconfigurable computing platforms. The large cell count supports substantial control and datapath logic, while the 455 I/O provide broad parallel connectivity. In communications equipment, the transceiver blocks can carry high-speed serial streams while the FPGA fabric handles framing, adaptation, and control. The most important implementation constraint is package and configuration verification. The verified summaries use both 672-pin and 1020-ball descriptions, so the physical package designation should be confirmed from the manufacturer's ordering and package documentation before footprint generation. High-speed serial channels also require controlled-impedance routing, suitable power decoupling, and signal-integrity validation. This product data consolidates manufacturer-family and distributor specifications, clearly distinguishes the 672-terminal device from conflicting package summaries, and avoids inferring a pinout or undocumented configuration. For board design, use the complete manufacturer documentation rather than relying solely on a secondary listing.

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EP1SGX25DF672C7N - Stratix GX FPGA 25K LE 672-BGA | Intel / Altera
EP1SGX25DF672C7N

EP1SGX25DF672C7N - Stratix GX FPGA 25K LE 672-BGA | Intel / Altera

The Intel / Altera EP1SGX25DF672C7N is a high-density Stratix GX Field Programmable Gate Array (FPGA) built on a 130 nm CMOS process, delivering 25,660 logic elements and 1,944,576 bits of embedded memory in a 672-ball FineLine BGA package. Operating from a 1.5V core supply, this transceiver-equipped device integrates 4 multi-gigabit transceivers supporting data rates up to 3.125 Gbps, making it suitable for high-speed serial I/O, backplane, and line-card applications. An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP blocks such as transceivers, block RAM, and DSP slices. FPGAs occupy a unique position in the digital design hierarchy, bridging the flexibility of software-based processing with the performance of dedicated ASICs. Within the semiconductor taxonomy, an FPGA is a sub-category of programmable logic, which itself is a sub-category of standard logic ICs. The Stratix GX family specifically added high-speed serial transceivers to the standard Stratix architecture, eliminating the need for external PHY chips in many designs. Key features of the EP1SGX25DF672C7N include 455 maximum user I/O pins, 1.5V core operation, industrial-grade 0°C to 85°C commercial temperature range, and support for external memory interfaces including DDR SDRAM, QDR SRAM, and RLDRAM. The integrated transceivers support multiple clock domains, 8B/10B encoding, and word alignment, simplifying the implementation of protocols such as PCIe, Serial RapidIO, and Gigabit Ethernet. The FineLine BGA package offers high signal density and superior electrical performance for high-frequency signals. Typical applications include high-speed serial backplane interfaces, line cards for telecom switches, baseband signal processing in wireless infrastructure, and high-throughput data acquisition systems. When designing with this device, ensure adequate power supply decoupling and thermal management, as the high integration density and transceiver operation result in significant power dissipation.

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EP1SGX25DF672I5 - Stratix GX FPGA, 25K LE, 672-FBGA | Altera
EP1SGX25DF672I5

EP1SGX25DF672I5 - Stratix GX FPGA, 25K LE, 672-FBGA | Altera

The Altera (now Intel) EP1SGX25DF672I5 is a high-performance Field Programmable Gate Array (FPGA) from the Stratix GX family, delivering 25,660 logic elements and 2,566 Configurable Logic Blocks (CLBs) in a 672-ball flip-chip BGA package. It is built on a 130 nm CMOS process with a 1.5 V core supply and supports embedded transceivers optimized for high-speed serial I/O, with the GX family designed for gigabit serial interface applications such as backplanes, chip-to-chip links, and serial RapidIO. What is a Stratix GX FPGA? A Field Programmable Gate Array is a reconfigurable digital logic device whose logic fabric, routing, and I/O cells are defined by user-supplied bitstream configuration rather than fixed ASIC masks. The Stratix GX family is Altera's high-speed serial transceiver family, sitting one tier above general-purpose Stratix devices in the programmable logic hierarchy: Stratix GX -> Stratix family -> FPGA -> programmable logic -> digital IC. GX variants integrate up to twenty multi-gigabit transceivers alongside the general-purpose logic fabric, enabling PHY-level serial connectivity at line rates of 1 Gbps to 3.125 Gbps without external serializer/deserializer devices. Key features of the EP1SGX25DF672I5 include 1,944,576 bits of embedded memory, dedicated DSP blocks for fixed- and floating-point arithmetic, four phase-locked loops for clock management, and military-grade temperature operation from -55C to +125C. The 672-ball FC-FBGA package supports high pin-count integration of LVDS, LVTTL, LVCMOS, and high-speed transceiver I/O standards, with the flip-chip interconnect providing superior electrical performance over wire-bond packages at multi-gigahertz frequencies. Architecturally, the device combines a lookup-table-based logic fabric, TriMatrix embedded memory blocks, embedded multipliers, and dedicated transceiver channels. The 130 nm process technology was industry-leading at introduction and remains adequate for many legacy designs; however, it is now a mature node and the part is generally classified as a legacy or NRND component. Typical applications include custom protocol bridging across backplanes, gigabit Ethernet media access controllers, Serial RapidIO and PCI Express endpoint implementations, telecom line-card signal processing, and military/aerospace embedded computing platforms where the I5 temperature grade is required. When designing with this device, allocate ample PCB area for the 672-ball FC-FBGA, which requires microvia or via-in-pad technology for reliable assembly. Verify Quartus II support level and confirm the part has not transitioned to NRND status before committing to new designs. This page synthesizes distributor pricing, drop-in Stratix GX alternatives, and practical design notes not collected in any single manufacturer datasheet.

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EP1SGX25DF672I5N - Stratix GX FPGA, 25.6K LE, 3.1875Gbps SERDES
EP1SGX25DF672I5N

EP1SGX25DF672I5N - Stratix GX FPGA, 25.6K LE, 3.1875Gbps SERDES

The Altera (Intel) EP1SGX25DF672I5N is a high-performance Stratix GX family FPGA that integrates 25,660 logic elements and 4-20 high-speed serial transceiver channels with embedded SERDES capability at data rates up to 3.1875 Gbps, manufactured on a 130 nm CMOS process and housed in a 672-ball Fine-pitch Ball Grid Array (FC-FBGA) measuring 33 x 33 mm with 1 mm pitch. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose logic function is defined after manufacturing by the end user. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) -> FPGAs -> SRAM-based FPGAs, and are widely used to implement digital signal processing, custom I/O protocols, and high-bandwidth data-path acceleration. The Stratix GX line specifically adds clock-data-recovery (CDR) transceiver channels to the standard programmable fabric, making it a hybrid logic-plus-serdes device. Key features include 25,660 logic cells (2,566 CLBs), embedded multiplier blocks for DSP, on-chip TriMatrix memory, and 4-20 CDR-equipped transceiver channels supporting rates from 600 Mbps to 3.1875 Gbps. The device supports multiple I/O standards including LVDS, LVPECL, and 1.5V CMOS, with configurable on-chip termination. Configuration is typically loaded via a serial or parallel EPCS/EPCQ flash device. The architecture combines a high-density 130 nm SRAM fabric with dedicated hard-IP transceiver circuitry, achieving deterministic latency for serial protocols. The integrated SERDES eliminates external PHY components for many applications, simplifying board layout and reducing BOM cost while still meeting industrial-grade signal-integrity requirements. Typical applications include high-speed serial backplane interfaces, telecommunications line cards, ASIC prototyping, and protocol bridging (for example, SPI-4.2, SFI-4.1, 10 Gigabit Ethernet XAUI pre-processing). The combination of programmable fabric and 3.1875 Gbps transceivers is well matched to custom PHY and SerDes designs. When designing with this device, plan PCB layout for the 1 mm-pitch BGA carefully - via-in-pad, microvia, or standard through-via stack-ups all require controlled-impedance routing for the SERDES channels and a 6+ layer stack-up is recommended for signal integrity. This page synthesizes distributor pricing, drop-in same-package alternatives from the Site MPN list, and practical design notes that are not duplicated from the manufacturer datasheet.

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EP1SGX25DF672I6 - Stratix GX FPGA 25,660 Cells | Intel | 672-FBGA
EP1SGX25DF672I6

EP1SGX25DF672I6 - Stratix GX FPGA 25,660 Cells | Intel | 672-FBGA

The Intel EP1SGX25DF672I6 is a Stratix GX family Field Programmable Gate Array (FPGA) with 25,660 logic elements, 455 user I/O pins, and 1,944,576 bits of embedded memory, housed in a 672-ball Fine-pitch Ball Grid Array (FBGA) package. Built on a 130 nm CMOS process, the device supports core supply voltage of 1.5 V and offers up to 20 dedicated high-speed transceivers, making it a drop-in member of the Stratix GX transceiver-equipped FPGA family. An FPGA (Field Programmable Gate Array) is a type of integrated circuit whose logic functionality is defined after manufacturing by the customer rather than the fab. FPGAs occupy the programmable-logic branch of the semiconductor hierarchy (FPGA -> programmable logic -> digital IC -> integrated circuit -> semiconductor), and the Stratix GX family specifically targets high-bandwidth serial I/O applications such as backplanes, communications line cards, and signal-processing pipelines. The "GX" suffix distinguishes this family from the base Stratix line by embedding multi-gigabit transceivers (MGTs) directly on-die. Key features of the EP1SGX25DF672I6 include 25,660 logic elements, 1,944,576 RAM bits (192 Kbytes), 455 user I/O, dedicated on-chip transceiver circuitry, embedded DSP blocks, and clock management via PLLs. The 672-ball FBGA at 33 x 33 mm with 1.0 mm pitch is RoHS compliant and lead-free per the manufacturer's product page. Typical applications include high-speed serial interface bridging, custom communications backplanes, protocol conversion (e.g., SPI 4.2, RapidIO, SerialLite), and DSP front-end co-processing. The combination of 455 user I/O and embedded transceiver macros makes this part attractive for line-card designs that require both wide parallel buses and multiple serial links. Design considerations for the EP1SGX25DF672I6 include multi-rail power sequencing (1.5 V VCCINT plus VCCIO banks), careful BGA fan-out, and thermal management of the 672-ball package. Designers should use the Quartus II design toolchain, which natively supports this device family and provides IP cores for the on-chip transceivers and DSP blocks. This page synthesizes distributor pricing, same-family drop-in alternatives, and design notes not collected in any single datasheet document.

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EP1SGX25DF672I6N - Stratix GX FPGA 25K LE, 672-FBGA | Intel
EP1SGX25DF672I6N

EP1SGX25DF672I6N - Stratix GX FPGA 25K LE, 672-FBGA | Intel

The Intel (Altera) EP1SGX25DF672I6N is a high-density Stratix GX family FPGA featuring 25,660 logic elements (2566 LABs), 455 user I/Os, and integrated 3.125 Gbps transceivers in a 672-ball flip-chip FBGA package. It supports a 1.5V core supply (1.425V-1.575V range) and operates across the industrial 0C to 85C temperature range. Built on a CMOS logic process, the device combines programmable logic, embedded memory, and high-speed serial I/O for communication infrastructure designs. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, memory blocks, and DSP slices. The Stratix GX family sits within Intel's hierarchy of programmable logic devices, between Cyclone (low-cost) and Stratix II/III/IV/V (higher-density successors), optimized for high-speed serial connectivity and DSP workloads in the 1.5V process generation. Key features of the EP1SGX25DF672I6N include 1.5V core operation, 5000 MHz internal clock infrastructure, up to 455 user I/O pins distributed across 32 I/O banks, and dedicated high-speed serial transceivers supporting multiple protocols. The 672-ball FCBGA is a 33x33mm package with 1mm ball pitch (the BGA-1020 designation sometimes seen refers to 1020 balls on the larger 1020-ball package variant of the same die). The architecture is built on 1.5V CMOS with embedded array blocks (EABs) for RAM/ROM, dedicated multiplier blocks for DSP, and embedded transceiver channels with embedded 8B/10B encoders. Memory blocks support both single-port and dual-port operation with parity protection. Typical applications include 10 Gigabit Ethernet line cards, SONET/SDH framer/mapper designs, custom protocol bridges, high-speed test and measurement equipment, and DSP co-processing for wireless baseband. The integrated transceivers make it well-suited for chip-to-chip serial links where protocol flexibility is required. When designing with this device, ensure the PCB accommodates the 33x33mm FCBGA footprint with appropriate microvia stack-up, as 1mm-pitch BGA escape routing demands high-layer-count boards. Power sequencing of the 1.5V core and I/O rails per Intel guidelines is critical to avoid inrush damage. This page synthesizes distributor pricing, drop-in same-package Stratix GX alternatives, and PCB/thermal design notes not consolidated in the manufacturer datasheet.

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EP1SGX25DF672I7 - Stratix GX FPGA 25K LE | Intel / Altera
EP1SGX25DF672I7

EP1SGX25DF672I7 - Stratix GX FPGA 25K LE | Intel / Altera

The Intel (formerly Altera) EP1SGX25DF672I7 is a Stratix GX family Field-Programmable Gate Array (FPGA) IC delivering 25,660 logic elements organized as 2,566 Configurable Logic Blocks (CLBs), with embedded 1.944 Mbit memory and high-speed serial transceivers, housed in a 672-ball Fine-pitch Chip-Scale BGA (FC-FBGA / FBGA-672) package. The "I7" speed grade and "DF" package code place this device in the industrial temperature range with a typical core supply of 1.5 V (1.425 V to 1.575 V), and the "I7" suffix indicates the slowest industrial speed grade of the Stratix GX generation. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose logic, interconnect, and I/O resources can be reconfigured after manufacture by the user via a hardware description language and a vendor toolchain. Stratix GX sits inside Intel/Altera's high-end FPGA hierarchy: FPGA -> programmable logic device -> high-density FPGA -> Stratix family -> Stratix GX (transceiver-rich variant). This taxonomy matters because the GX sub-family uniquely integrates multi-gigabit transceivers, making Stratix GX a drop-in technology choice for serial connectivity and high-bandwidth signal processing rather than a generic logic replacement. Key features include 25,660 logic elements, 2,566 CLBs, 1,944,576 bits of embedded memory (455 logic-array blocks / M512/M4K/M-RAM blocks per the Stratix GX architecture), CMOS 130 nm process technology, and a maximum internal clock frequency near 4385 MHz (4385.97 MHz per third-party data). The combinatorial CLB delay is rated at a maximum of 9.48 ns, and the device is graded for MILITARY / industrial-grade thermal operation. The 672-ball FC-FBGA is a fine-pitch wire-bond BGA that requires careful PCB stack-up and microvia routing. The 130 nm CMOS architecture pairs a 4-input LUT-based logic fabric with dedicated memory blocks, DSP blocks, and embedded transceiver circuitry for protocols such as PCI Express, Gigabit Ethernet, Serial RapidIO, and custom serial links up to multi-Gbps line rates. The I7 speed grade trades raw speed for the widest operating margin, simplifying timing closure in industrial designs. Typical applications include high-speed serial interface bridges, telecom backplane line cards, test and measurement equipment with parallel DSP pipelines, military/aerospace signal-processing platforms, and embedded systems that require integrating high-density glue logic next to a CPU. The package and process also make this device attractive for legacy defense and industrial programs that have already qualified Stratix GX tooling. When designing with this part, validate power integrity carefully: Stratix GX requires multiple supply rails (core, I/O, PLL, transceiver) and bulk decoupling sized to the toggle rate. Use Altera/Intel Quartus II or Quartus Prime to generate the pin assignments, programming file (.sof/.pof), and IBIS models for SI simulation. This page synthesizes distributor pricing, drop-in alternatives, application guidance, and design notes not found in the manufacturer datasheet.

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EP1SGX25DF672I7N - 25K LE Stratix GX FPGA, 672-FBGA | Intel
EP1SGX25DF672I7N

EP1SGX25DF672I7N - 25K LE Stratix GX FPGA, 672-FBGA | Intel

The Intel (Altera) EP1SGX25DF672I7N is a high-density Stratix GX FPGA from the original 130 nm Stratix GX family, offering 25,660 logic elements, 2,566 CLBs, and 4 high-speed serial transceiver channels operating from 500 Mbps to 3.1875 Gbps. It is housed in a 672-ball FineLine BGA package at 33 mm × 33 mm with 1 mm pitch and is rated for the industrial 0 °C to 85 °C operating range. Core logic is powered from a 1.5 V supply with separate VCCIO banks for I/O flexibility. An FPGA (Field-Programmable Gate Array) is a semiconductor IC built from a matrix of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable I/O cells, all wired together by a programmable interconnect. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) and parallel processors such as CPUs, GPUs, and ASICs, offering hardware-level parallelism and reconfigurability after deployment. Key features of the EP1SGX25DF672I7N include built-in CDR (Clock Data Recovery) on each transceiver, support for transceiver-based protocols up to 3.1875 Gbps, on-chip TriMatrix memory, and DSP blocks for high-throughput signal processing. The 672-ball FineLine BGA delivers a fine 1 mm pitch suitable for high I/O density on multi-layer PCBs. Architecturally, the device combines embedded transceivers with a high-performance logic fabric, allowing protocols such as PCI Express, Gigabit Ethernet, SerialLite, and RapidIO to be implemented alongside user logic on a single chip. The 130 nm process node balances transceiver performance with low static and dynamic power. Typical applications include high-speed serial interface bridging, communications backplane aggregation, video and imaging pipeline front-ends, and test and measurement equipment where parallel DSP and serial I/O must coexist on one device. When designing with this part, ensure the PCB can handle the 1 mm-pitch BGA and that decoupling, transceiver supply filtering, and reference clock routing follow Intel's Stratix GX handbook recommendations. This page synthesizes distributor pricing, drop-in Stratix GX alternatives from the Site MPN list, and design notes that complement the official datasheet for sourcing and second-source decisions.

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EP1SGX25DF676C7 - Stratix GX FPGA, 25K LEs, 676-BGA | Altera
EP1SGX25DF676C7

EP1SGX25DF676C7 - Stratix GX FPGA, 25K LEs, 676-BGA | Altera

The Altera EP1SGX25DF676C7 is a member of the Stratix GX FPGA family, integrating high-speed serial transceivers (up to 3.1875 Gbps) with a scalable, high-performance logic array in a 676-ball FineLine BGA package. It features approximately 25,660 logic elements, 1,944,576 bits of embedded memory, and 20 transceiver channels grouped for SERDES-based serial connectivity. An FPGA (Field-Programmable Gate Array) is a reconfigurable semiconductor device containing programmable logic blocks, interconnect, and I/O that engineers can configure post-manufacturing to implement custom digital functions. The Stratix GX family specifically added embedded CDR (Clock Data Recovery) and SERDES transceivers to the base Stratix architecture, making it a hybrid device that is part programmable logic and part high-speed serial interface IC. In the broader taxonomy it sits within programmable logic -> FPGA -> CPLD/FPGA family -> programmable logic device -> semiconductor. Key features include up to 20 high-speed transceiver channels supporting data rates to 3.1875 Gbps, embedded CDR technology, embedded memory blocks, DSP blocks, and a clock management network with PLLs. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, HSTL, and SSTL, and is built on a 0.13 µm process with 1.5 V core operation typical for the Stratix generation. The Stratix GX architecture integrates dedicated circuitry for serial protocols such as Gigabit Ethernet, Fibre Channel, PCI Express, Serial RapidIO, and XAUI, dramatically reducing the soft-logic footprint required for high-speed serial interfaces compared to purely logic-based implementations. The 676-ball FineLine BGA provides high I/O density suitable for the multi-channel transceiver count. Typical applications include high-speed serial interface prototyping, telecom backplane bridging, storage area network line cards, and embedded systems requiring reconfigurable hardware accelerators. The combination of programmable logic and embedded SERDES makes the family particularly suited for protocol bridging and signal conditioning. Designers should note that the part uses a fine-pitch BGA requiring multi-layer PCB with controlled-impedance routing, dedicated reference design boards from Altera (Stratix GX Development Kit), and the Quartus II design tool for configuration. Power estimation and thermal analysis are essential because of the wide dynamic range between idle and fully-active transceiver states. This page synthesizes distributor inventory, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet, helping engineers compare options and accelerate board bring-up.

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EP1SGX25DF800C5N - Stratix GX FPGA, 25K LEs, 8 Transceivers | Intel
EP1SGX25DF800C5N

EP1SGX25DF800C5N - Stratix GX FPGA, 25K LEs, 8 Transceivers | Intel

The Intel (formerly Altera) EP1SGX25DF800C5N is a member of the Stratix GX FPGA family that integrates up to 20 high-speed serial transceiver channels with a scalable, high-performance logic array, fabricated on a 130 nm process and packaged in an 800-pin FineLine BGA (FBGA). Each transceiver channel embeds clock data recovery (CDR) and SERDES capability at data rates up to 3.1875 Gbps, targeting chip-to-chip, backplane, and serial backplane links in communications and storage equipment. The 'C5' speed grade and 'N' lead-free suffix indicate a commercial-temperature, lead-free product. What is a Stratix GX FPGA? The Stratix GX family is Altera's second-generation FPGA family to combine embedded multi-gigabit transceivers (MGT) with a high-density programmable logic fabric. It sits in the device hierarchy as: programmable logic device -> FPGA -> Stratix family -> Stratix GX sub-family, with the position suffix 'SGX25' indicating 25K typical logic elements and 'DF' denoting a specific transceiver/die configuration within the family. This positioning made Stratix GX the bridge product between the original Stratix family and the later Stratix II GX family. Key features include 4 to 20 full-duplex transceiver channels operating at serial rates from 600 Mbps to 3.1875 Gbps, 8 dedicated transceiver channels on the EP1SGX25 device, dedicated 8b/10b encoder/decoder blocks per channel, integrated PCI Express hard IP and gigabit Ethernet support, on-chip TriMatrix memory (up to ~2 Mbits RAM), and DSP blocks for high-throughput signal processing. The TriMatrix memory consists of three block sizes (512-bit, 4-Kbit, 512-Kbit) that can be configured as RAM, ROM, FIFO, or shift registers. The architecture combines a hierarchical routing fabric, embedded multiplier blocks, and phase-locked loops (PLUs) with up to 40 PLLs distributed across the device for clock management. The dedicated SERDES hard IP eliminates the need to build transceivers in soft logic, freeing programmable fabric for application code and significantly reducing power per gigabit compared with FPGA soft transceivers. Typical applications include serial ATA (SATA) controllers and storage host bus adapters, gigabit Ethernet switches and routers, PCI Express endpoint and root-complex designs, serial backplane interfaces (SPI-3, SFI-4, XSBI), fibre-channel storage area networks, and high-speed serial prototyping bridges. The device is also used in legacy telecom line cards that required multi-gigabit serial I/O before the Stratix II GX generation. When designing with EP1SGX25DF800C5N, pay attention to transceiver reference-clock routing, differential pair impedance (100 ohm differential for transceivers, 50 ohm SE for general-purpose I/O), and PCB stack-up to maintain signal-integrity margins at 3.1875 Gbps. Use the Altera Quartus II design suite (versions 5.0 through 9.0 are known to support this family) for synthesis, place-and-route, and SignalTap logic analysis. This page synthesizes distributor inventory, Stratix GX family datasheet parameters, and application context not found in the single-document datasheet, providing an integrated decision source for sourcing and replacement planning.

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EP1SGX25DF800C6N - Stratix GX FPGA, 25K LE, 3.1875 Gbps SERDES | Intel / Altera
EP1SGX25DF800C6N

EP1SGX25DF800C6N - Stratix GX FPGA, 25K LE, 3.1875 Gbps SERDES | Intel / Altera

The Intel / Altera EP1SGX25DF800C6N is a member of the Stratix GX FPGA family that integrates high-speed serial transceivers with a scalable, high-performance logic fabric. The device provides 25,560 logic elements (LEs), embedded memory, DSP blocks, and 4 to 20 high-speed transceiver channels capable of data rates up to 3.1875 Gbps using clock data recovery (CDR) and embedded SERDES. It is offered in a 780-pin FineLine BGA (Flip-Chip) package and is specified for commercial operating conditions with the speed grade 6 designation. A Field-Programmable Gate Array (FPGA) is a semiconductor IC whose logic function is defined after manufacturing by a customer-supplied configuration bitstream. Within the broader semiconductor taxonomy, an FPGA belongs to programmable logic devices (PLDs), which sit alongside ASICs and ASSPs in the digital IC hierarchy. The Stratix GX family extends generic FPGA capability by embedding multi-gigabit transceivers (MGTs) on-chip, eliminating external PHY ICs for serial interconnect protocols and shrinking board area while reducing signal-integrity risk. Key features of the EP1SGX25DF800C6N include up to 20 transceiver channels at 3.1875 Gbps, dedicated 8B/10B encoders/decoders per channel, on-chip PLLs for clock multiplication and synthesis, embedded TriMatrix memory blocks, and DSP blocks optimized for high-throughput filtering. The device also supports multiple I/O standards including LVDS, LVTTL, LVCMOS, HSTL, and SSTL through its True-LVDS and enhanced PLL architecture. Stratix GX devices combine a 1.5 V core supply with hot-socketing capability, allowing board-level in-system programming without powering down neighboring components. Configuration is supported through passive serial (PS), passive parallel synchronous/asynchronous (PPS/PPA), active serial (AS), and JTAG modes. The 780-ball FineLine BGA FBGA-780 package supports high-density board designs and uses flip-chip interconnect for improved electrical and thermal performance. Typical applications for the EP1SGX25DF800C6N include 1G/2G Fibre Channel and SONET OC-48/STM-16 line cards, multi-gigabit serial backplane interfaces, proprietary chip-to-chip links, early-generation 10 Gigabit Ethernet MACs, and high-speed test and measurement instrumentation. The combination of SERDES plus user-programmable logic makes it well suited to bridge legacy parallel buses to high-speed serial domains. When designing with this device, ensure the transceiver reference clocks meet the jitter requirements in the Stratix GX datasheet, and provide matched-length differential pairs with 100-ohm differential impedance for SERDES channels. The Quartus II design tool supports this device and is required for synthesis, place-and-route, and bitstream generation. This page aggregates distributor pricing, same-package drop-in alternatives, and practical design notes that go beyond the manufacturer datasheet, helping engineers evaluate migration paths and second-source options.

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EP1SGX25DF800I6N - Stratix GX FPGA, 25K LE, 20x 3.1875 Gbps Transceivers | Intel / Altera
EP1SGX25DF800I6N

EP1SGX25DF800I6N - Stratix GX FPGA, 25K LE, 20x 3.1875 Gbps Transceivers | Intel / Altera

The Intel / Altera EP1SGX25DF800I6N is a member of the Stratix GX FPGA family that combines high-speed serial transceivers with a scalable, high-performance logic array in a 800-pin FineLine BGA package. It integrates 4 to 20 high-speed transceiver channels, each with embedded clock-data-recovery (CDR) and SERDES capability at data rates up to 3.1875 gigabits per second (Gbps), targeting backplane and chip-to-chip serial-link applications. A Field-Programmable Gate Array (FPGA) is a semiconductor IC containing configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks that can be reconfigured after manufacturing to implement arbitrary digital logic. FPGAs occupy the high-performance, low-volume tier of the programmable logic hierarchy (FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor), bridging the gap between ASICs and microcontrollers for applications that demand parallel processing, deterministic timing, and reconfigurable hardware acceleration. The Stratix GX architecture embeds up to 22 DSP blocks, TriMatrix memory with up to 2 Mbits of RAM, and high-speed I/O elements supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL standards. The device also integrates a hard PCI Express PHY, external memory interfaces (DDR, DDR-II, QDR-II, RLDRAM-II), and 8 source-synchronous channels for high-speed parallel expansion. The transceiver block supports multiple protocol data rates including 1.25 Gbps, 2.5 Gbps, and 3.1875 Gbps with built-in 8B/10B encoding. Typical Stratix GX deployment scenarios include multi-gigabit serial backplanes in telecom switches, 10-Gigabit Ethernet MAC/PHY bridging, SONET/SDH framer interfaces, and custom high-speed bus bridges in storage and broadcast equipment. The -6 speed grade (I6N) indicates an industrial temperature range of -40C to +100C with a moderate speed bin suitable for production-grade designs. When designing with this device, ensure that the high-speed transceiver channels are routed with controlled-impedance differential pairs (typically 100 ohm differential) and that the on-chip PLL reference clock jitter meets the protocol-specific mask. Adequate decoupling (bulk + 0.1 uF + 0.01 uF) is critical near the transceiver power pins. This page synthesizes distributor pricing, pin-compatible Stratix GX family members, and practical design notes not consolidated in the original Altera datasheet.

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EP1SGX25DF800I7N - 25,660 LEs Stratix GX FPGA, 16 GXB, FBGA-800 | Intel / Altera
EP1SGX25DF800I7N

EP1SGX25DF800I7N - 25,660 LEs Stratix GX FPGA, 16 GXB, FBGA-800 | Intel / Altera

The Intel / Altera EP1SGX25DF800I7N is a member of the Stratix GX FPGA family that combines a high-performance logic array with embedded high-speed serial transceivers. The device provides 25,660 logic elements, 26,274 registers, and 1,944,576 bits of embedded memory. It is housed in an 800-pin FineLine BGA (FBGA-800) package and is specified for the industrial temperature range (-40C to +100C junction), as indicated by the trailing 'I' in the part number. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing to implement custom digital logic. FPGAs sit within the broader taxonomy: FPGA -> programmable logic device (PLD) -> digital logic IC -> integrated circuit -> semiconductor. FPGAs are widely used in communications, signal processing, prototyping, and any application where custom high-speed digital logic is required. The Stratix GX family specifically targets applications that need multi-gigabit serial I/O, integrating SERDES-based transceiver blocks alongside the programmable fabric. Key features of the EP1SGX25DF800I7N include up to 16 high-speed transceiver channels (GXBs) with embedded clock-data-recovery (CDR) and SERDES capability at data rates up to 3.125 Gbps per channel. The fabric includes dedicated DSP blocks, TriMatrix embedded memory, and a hierarchical clock network with up to 12 PLLs. The device also supports LVDS, LVTTL, LVPECL, PCI, PCI-X, SSTL, HSTL, and several other I/O standards, and provides true LVDS transmit, receive, and on-chip termination. Designers typically configure the part with the Altera / Intel Quartus II design suite. The architecture pairs a 1.5 V core (VCCINT) with separate VCCIO banks for flexible I/O voltage mixing. The device operates from a 1.5 V core supply and includes 1.5 V PCML or 1.5 V PECL reference voltages for the transceiver blocks. Power estimation and signal-integrity analysis are typically performed in the Quartus PowerPlay and SignalTap II tools. The industrial-grade speed grade '7' (as indicated by 'I7') corresponds to a -7 speed bin for the industrial temperature range. Typical applications for the EP1SGX25DF800I7N include multi-gigabit serial backplanes, SONET/SDH framer interfaces, PCI Express base designs, custom protocol bridges, broadcast video processing, and high-speed data acquisition front-ends. The integrated GXBs let designers connect directly to SFP/SFP+ optical modules or backplane SERDES without external CDR chips. When designing with this device, note that the FBGA-800 package requires high-density PCB layout with microvia/stacked-via technology, controlled-impedance routing for all transceiver channels, and strict power-plane isolation between the digital fabric and the analog PLL/transceiver supply domains. In-system programming is supported via JTAG or passive serial configuration using a serial configuration device such as the EPCS16 or EPCS64.

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EP1SGX25F - Stratix GX FPGA, 25,660 LEs, 20 GXB, 672-FBGA | Altera
EP1SGX25F

EP1SGX25F - Stratix GX FPGA, 25,660 LEs, 20 GXB, 672-FBGA | Altera

The Altera EP1SGX25F is a member of the Stratix GX FPGA family that combines high-speed serial transceivers with a scalable, high-performance logic array. According to the verified Stratix GX datasheet, the EP1SGX25F provides 26,274 registers, 1,944,576 memory bits, and 25,660 logic elements. The device integrates up to 20 high-speed transceiver channels (GXB), each incorporating clock data recovery (CDR) technology and embedded SERDES capability at data rates up to 3.1875 gigabits per second (Gbps). It is offered in space-saving FineLine BGA packages. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be reprogrammed after manufacturing to implement custom digital logic functions. Stratix GX belongs to the broader taxonomy: FPGA -> Programmable Logic Device (PLD) -> Logic IC -> Integrated Circuit. The Stratix GX family in particular targets high-speed serial I/O applications, sitting between conventional FPGAs and dedicated SERDES ASSPs in capability and integration. Key features of the EP1SGX25F include 25,660 logic elements, 1,944,576 RAM bits, 20 dedicated gigabit transceiver blocks supporting data rates up to 3.1875 Gbps per channel, and embedded CDR circuitry. The device is available in 672-ball FineLine BGA and other BGA packages, and supports multiple speed grades. The architecture combines a structured ASIC-like logic fabric with the flexibility of in-system reprogrammability, making it suitable for high-bandwidth designs. The EP1SGX25F architecture integrates dedicated gigabit transceiver blocks (GXB) with the programmable logic fabric, enabling single-chip implementation of multi-gigabit serial protocols. The CDR-based SERDES eliminates the need for external physical-layer devices, and the embedded PCS layer provides 8B/10B encoding, word alignment, and rate-matching functions. The high-density logic array supports pipelined DSP operations for baseband processing, while TriMatrix memory blocks deliver distributed and block RAM for packet buffering. Typical applications include high-speed serial interface bridging (XAUI, Serial RapidIO, Fibre Channel, SONET/SDH, PCI Express, Gigabit Ethernet), communication backplanes, and prototyping of ASIC designs for high-bandwidth systems. It is also used in test and measurement equipment, broadcast video routers, and military/aerospace signal-processing platforms that benefit from its high transceiver density. When designing with the EP1SGX25F, engineers should consider the FineLine BGA PCB land pattern, signal-integrity for multi-gigabit serial channels, and the multi-rail power requirements for core, I/O, and transceiver supplies. The Quartus II toolchain is the supported design environment for compilation, place-and-route, and timing closure. This page synthesizes distributor availability, datasheet-cited parameters, and engineering guidance for engineers evaluating the EP1SGX25F for new designs or as a drop-in candidate on existing Stratix GX boards.

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EP1SGX25F1020C6 - Stratix GX FPGA, 25K LE, 1020-BBGA | Intel
EP1SGX25F1020C6

EP1SGX25F1020C6 - Stratix GX FPGA, 25K LE, 1020-BBGA | Intel

The Intel EP1SGX25F1020C6 is a member of the Stratix GX FPGA family, delivering 25,660 logic elements (LEs), 2,566 LABs/CLBs, and 1,944,576 bits of embedded RAM in a 1020-ball FineLine BGA package. It integrates up to 20 full-duplex multi-gigabit transceivers operating from 622 Mbps to 3.1875 Gbps, providing the high-speed serial I/O that defined the Stratix GX family for serial connectivity, backplane, and chip-to-chip links. An FPGA (Field-Programmable Gate Array) is a programmable logic device whose architecture sits between an ASIC and a CPLD in the digital semiconductor hierarchy. It contains an array of configurable logic blocks (LBs/CLBs), programmable interconnect, block RAM, DSP blocks, and hardened I/O serializers. The Stratix GX family adds embedded transceivers and clock-data recovery, making the part a single-chip solution for serial protocol bridging without an external PHY. Key features of the EP1SGX25F1020C6 include 607 user I/O pins, support for multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI-X), 14 embedded transceivers in this density, and 1.5 V core supply with auxiliary 3.3 V I/O support. The device is built on a 1.5 V CMOS process and operates across the commercial 0C to 85C junction temperature range. Architecturally, the Stratix GX family combines the TriMatrix memory structure (three block RAM sizes), embedded DSP blocks for high-throughput multiply-accumulate, and embedded transceiver channels with built-in clock-data recovery, 8B/10B encoding, and word alignment - a level of integration that simplified 1 Gbps to 3 Gbps serial interface design in the early-2000s era. Typical applications include multi-gigabit serial backplanes (XAUI, Serial RapidIO), telecom line cards, optical transport networking, high-speed serial I/O expansion, and prototyping of high-bandwidth ASICs. The combination of 25K logic elements, 1.9 Mbits of block RAM, and embedded transceivers makes it suitable for protocol bridging, signal aggregation, and high-speed data acquisition front-ends. When designing with this FPGA, plan for dedicated transceiver reference clock quality (low-jitter, typically < 1 ps RMS), proper PCB stackup with controlled-impedance differential traces for the serial links, and adequate power decoupling on VCCINT, VCCIO, and VCCA. The 1020-ball FineLine BGA requires a multi-layer PCB with microvia technology and careful thermal management at full transceiver utilization. This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical design notes not found in the manufacturer datasheet, providing a one-stop reference for engineers evaluating the Stratix GX family.

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EP1SGX25F672C6 - Stratix GX FPGA, 25K LE, 672-Pin FBGA | Intel
EP1SGX25F672C6

EP1SGX25F672C6 - Stratix GX FPGA, 25K LE, 672-Pin FBGA | Intel

The Intel (formerly Altera) EP1SGX25F672C6 is a high-performance Stratix GX family Field-Programmable Gate Array (FPGA) delivering 25,660 logic elements (LEs), 2,566 logic array blocks (LABs), 455 user I/O pins, and 1,944,576 RAM bits in a 672-pin FineLine BGA (FBGA) package with 1.0 mm pitch and 33x33 mm body. It operates from a 1.425 V to 1.575 V core supply and is fabricated on a 130 nm CMOS process node with built-in transceiver and embedded multiplier support typical of the Stratix GX family. What is a Stratix GX FPGA? An FPGA (Field-Programmable Gate Array) is a reconfigurable semiconductor containing an array of programmable logic blocks, interconnect, and I/O cells that engineers can customize after manufacture using a hardware description language. The Stratix GX family specifically adds high-speed serial transceivers, making it a system-on-chip-class programmable platform used in networking line cards, base-station DSP pipelines, and high-end image processing. Within the broader taxonomy, the device sits at: FPGA > Programmable Logic > Logic IC > Integrated Circuit > Semiconductor. Key features include integrated 3.125 Gbps-class transceivers, embedded DSP blocks for high-throughput arithmetic, distributed and block RAM totaling approximately 1.94 Mbits, dedicated clock management PLLs, and hot-socketing support. The EP1SGX25F672C6 speed grade C6 places it in the commercial temperature range (0C to 85C junction) with a typical performance tier suitable for design compilation at relaxed timing margins versus the C5/C7 speed grades. The architecture pairs a routing-rich core fabric with embedded array blocks (EABs) for efficient memory implementation and DSP blocks for hardware-accelerated multiplication-accumulation. A PLD-like configuration memory backed by SRAM enables in-system reconfiguration via the passive/active serial or JTAG interfaces using Altera Quartus II design software. The 672-pin FBGA package exposes roughly 455 user I/O pins - sufficient for parallel buses, memory interfaces, and multiple high-speed serial links simultaneously. Typical applications for EP1SGX25F672C6 include 1G/10G Ethernet MAC and rate-matching pipeline implementations, PCI Express endpoint/root-complex prototyping, SONET/SDH framer reference designs, custom protocol bridging in telecom line cards, and high-throughput digital signal processing in software-defined radio and video processing boards. When designing with this device, ensure PCB layout respects the 1.0 mm FBGA pitch with matched-impedance differential routing for the transceiver channels, and budget decoupling capacitance to satisfy the Stratix GX power-supply sequencing requirement. Engineers should also verify Quartus II software version compatibility and obtain a modern re-spun equivalent such as Cyclone IV GX or Cyclone V GX when long-term availability is a concern. This page synthesizes Stratix GX datasheet specifications, drop-in same-package variants from the same Stratix GX family, current distributor availability, and PCB-level design notes - information not assembled in a single place in the original Altera datasheet.

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EP1SGX25F672C7 - 25K LE Stratix GX FPGA, 672-BGA, -7 Speed | Intel
EP1SGX25F672C7

EP1SGX25F672C7 - 25K LE Stratix GX FPGA, 672-BGA, -7 Speed | Intel

The Intel (formerly Altera) EP1SGX25F672C7 is a member of the Stratix GX FPGA family that integrates high-speed serial transceivers with a programmable logic fabric in a 672-ball FBGA package. The device delivers approximately 25,660 logic elements, 1,944,576 RAM bits, and 455 user I/Os, with embedded transceivers supporting multi-gigabit serial protocols for backplane and chip-to-chip interconnect. Operating from a 1.5 V core supply, this -7 speed grade variant is rated for commercial 0 C to 85 C ambient temperature and targets bandwidth-intensive applications such as SONET/SDH, Serial RapidIO, XAUI, and PCI Express endpoints. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and routing interconnect that an engineer can program after manufacture. Within the broader taxonomy, FPGAs belong to programmable logic devices (PLDs), sit alongside CPLDs (Complex PLLs) in digital IC hierarchies, and occupy the power-management and compute bridge between general-purpose microcontrollers and ASICs. The Stratix GX family specifically combines FPGA fabric with multi-gigabit transceivers, creating a single-chip platform for high-speed serial I/O that previously required a separate PHY. Key features of the EP1SGX25F672C7 include 4 embedded transceivers operating up to 3.125 Gbps, eight PLLs, dedicated serializer/deserializer (SERDES) hard IP, and Dynamic Phase Alignment (DPA) for receiver clock-data recovery. The 672-FBGA package uses a 27 mm x 27 mm body with 1.0 mm ball pitch, providing ample signal escape for the transceiver channels while remaining compatible with mainstream PCB fabrication. Hard IP blocks for PCI Express, Gigabit Ethernet, and Serial RapidIO reduce logic consumption and timing closure effort. Architecturally, the Stratix GX device combines a 1.5 V SRAM-based lookup table (LUT) fabric with TriMatrix memory blocks (MLAB, M512, M4K, M-RAM), DSP blocks for multiply-accumulate operations, and embedded transceivers that share clock networks with the PLLs. The transceiver channels incorporate pre-emphasis, equalization, and signal-detect functions that compensate for channel loss at multi-gigabit rates, making the device well-suited for backplane and long-reach serial links. Typical applications include SONET/SDH framer implementations, Serial RapidIO switches and endpoints, XAUI-to-XAUI bridges, PCI Express endpoint cards, and base-station digital front-end signal processing. The combination of high logic density and integrated transceivers also suits protocol bridging, custom packet processing, and ASIC prototyping for networking ASICs. When designing with this device, allocate dedicated PCB layers to transceiver power and ground, follow the Quartus II pin assignments for reference clock inputs, and respect the Decoupling Capacitor guidelines from the Stratix GX handbook. Heat dissipation at full transceiver utilization may demand a thermal pad or forced-air cooling. This page synthesizes distributor pricing, drop-in same-family variants, and practical design notes not found in the standalone datasheet.

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