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EP3C55F780C7 - Cyclone III FPGA, 55K LE, 780-FBGA | Intel / Altera
EP3C55F780C7

EP3C55F780C7 - Cyclone III FPGA, 55K LE, 780-FBGA | Intel / Altera

The Intel (formerly Altera) EP3C55F780C7 is a Cyclone III series low-power Field-Programmable Gate Array (FPGA) delivering 55,856 logic elements, 2,396,160 bits of embedded memory, and 377 user I/O pins in a 780-ball FineLine BGA package. The device operates at a core voltage of 1.2 V with a maximum internal clock frequency of 437.5 MHz and is fabricated on a 65 nm TSMC low-power process, providing a balance of density, performance, and power efficiency for cost-sensitive applications. A Field-Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit that allows hardware designers to implement custom logic functions through programmable logic blocks, embedded multipliers, memory blocks, and I/O cells. Cyclone III FPGAs sit within Intel's mainstream low-power FPGA hierarchy: FPGA -> programmable logic -> programmable logic device (PLD) -> digital IC. The 55K logic-element tier sits between Cyclone III entry-level (EP3C5/EP3C10/EP3C16) and high-density (EP3C120) devices, optimized for mid-volume, mid-complexity designs where unit cost and power consumption dominate over raw performance. Key features of the EP3C55F780C7 include 55,856 logic elements (LEs), 234 embedded 18x18 multipliers (suitable for DSP blocks), 2,396,160 bits of embedded RAM (M9K blocks), 4 PLLs for clock management, and 377 single-ended user I/Os (or differential pairs). The device supports DDR/DDR2/QDRII external memory interfaces through dedicated PHY blocks and provides 8.6 Mbits of usable memory bandwidth. The 780-FBGA package is the high-density option for this die, exposing nearly the maximum I/O count and supporting industrial temperature grades. The Cyclone III architecture is built on a 65 nm low-power CMOS process with a 1.2 V core supply and dedicated I/O banks that support multiple single-ended standards (LVCMOS, LVTTL, PCI, PCI-X) and differential standards (LVDS, RSDS, mini-LVDS, LVPECL on input). Each logic array block (LAB) contains 16 LEs, and the device integrates a configuration controller that supports multiple FPGA configuration modes including JTAG, Active Serial (AS), Passive Serial (PS), and Fast Passive Parallel (FPP). The Quartus II design software is the primary design entry, synthesis, and place-and-route tool. Typical applications for EP3C55F780C7 include industrial motor control and automation, video processing and image filtering, automotive infotainment and driver assistance subsystems, telecom line cards, baseband signal processing for SDR platforms, medical imaging front-ends, and embedded industrial controllers. The 55K LE density supports designs ranging from multiple soft processor cores (NIOS II) to wide DSP pipelines. When designing with EP3C55F780C7, ensure the board has a clean 1.2 V core supply with at least 6 decoupling capacitors (one 0.1 uF + one bulk per supply pin group), a 2.5 V/3.3 V auxiliary supply for configuration, and properly terminated LVDS or LVCMOS signals at each I/O bank. For high-speed memory interfaces, follow Intel's pin connection guidelines for OCT (on-chip termination) calibration and impedance matching. This page synthesizes distributor pricing, drop-in alternatives within the Cyclone III family, and practical design notes that complement the official Cyclone III Device Handbook.

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EP3C55F780C7N - 55K LEs Cyclone III FPGA 780-FBGA | Intel
EP3C55F780C7N

EP3C55F780C7N - 55K LEs Cyclone III FPGA 780-FBGA | Intel

The Intel (formerly Altera) EP3C55F780C7N is a Cyclone III family Field-Programmable Gate Array (FPGA) built on a 65 nm low-power process, providing 55,856 logic elements, 377 user I/Os, and 2,396,160 bits of embedded memory in a 780-pin FineLine BGA package. It targets cost-sensitive, power-conscious applications that previously required ASIC or higher-cost FPGAs. The device operates across commercial temperature grades with core logic powered at 1.2 V and I/O banks supporting multiple single-ended and differential standards (LVTTL, LVCMOS, LVDS, SSTL, PCI, etc.). A Field-Programmable Gate Array (FPGA) is a semiconductor device whose digital logic, interconnect, and I/O behavior are configured by the end user after manufacture. Cyclone III FPGAs sit in the low-power, mid-density branch of programmable logic, hierarchically above CPLDs (smaller, non-volatile) and below high-end FPGA SoCs. They are typically used as glue logic, high-speed parallel interfaces, video/image processing pipelines, and protocol bridges where microcontrollers alone cannot meet throughput or latency requirements. Key features of the EP3C55F780C7N include 312 M9K embedded memory blocks (approximately 2.4 Mbit), 156 dedicated 18x18 multipliers enabling DSP-grade throughput without external DSP ICs, four general-purpose PLLs for clock synthesis and skew management, and 8 Kbits of configuration memory supporting passive serial, fast passive parallel, and JTAG programming. The 780-FBGA FineLine BGA package exposes 20 transceivers-free I/O banks totaling 377 usable pins, enabling wide parallel buses (16- and 32-bit) plus control and clock signals on a single device. The Cyclone III architecture is built around LABs (Logic Array Blocks) of 16 logic elements, each comprising a 4-input LUT, register, and carry chain. Multipliers and LEs share a column- and row-based routing fabric, and embedded memory is distributed as M9K blocks alongside LAB columns, giving the tool chain predictable timing closure up to the device fMAX. Configurable I/O standards per bank, with on-chip termination, eliminate most external resistor networks. Typical applications include industrial machine vision, motor control and factory automation, low-cost digital video capture/display, wireless baseband preprocessing (alongside a host processor), and ASIC prototyping. Designers value the Cyclone III family for its combination of density, low static power, and the mature Quartus II design toolchain, which supports both Verilog/VHDL and higher-level block-based design. When designing with the EP3C55F780C7N, plan your I/O bank voltage assignment before PCB layout: each bank has a fixed VCCIO and VREF pair, and mixing incompatible standards in one bank is not allowed. Use the Quartus II Early Power Estimator (EPE) to confirm thermal envelope prior to PCB layout, and follow Intel's pinout guidelines for BGA decoupling and power plane stitching to avoid signal-integrity issues at 100 MHz+ LVDS rates. This page synthesizes distributor pricing as of 2026-09-09, real same-brand and cross-brand drop-in alternatives drawn from verified web data, and practical design notes not found on the manufacturer datasheet alone.

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EP3C55F780C8 - Cyclone III FPGA 55K LEs 780-FBGA | Intel
EP3C55F780C8

EP3C55F780C8 - Cyclone III FPGA 55K LEs 780-FBGA | Intel

The Intel EP3C55F780C8 is a Cyclone III Field-Programmable Gate Array (FPGA) delivering 55,856 logic elements, 2,396,160 bits of embedded memory, and 156 embedded 18x18 multipliers in a 780-ball FineLine BGA package. Built on a 65 nm low-power process, this device operates from a 1.2 V core supply and supports I/O standards up to LVDS at data rates of approximately 402 MHz, with 377 user I/O pins for high-density digital system integration. A Cyclone III FPGA is a reprogrammable logic device that belongs to the broader category of programmable logic devices (PLDs), which also include CPLDs. Positioned between fixed-function ASICs and discrete logic, Cyclone III FPGAs are widely deployed in cost-sensitive, low-power applications such as industrial control, video processing, and communications infrastructure. They offer ASIC-like density and parallelism with the flexibility of in-system reprogrammability via SRAM configuration memory. Key features of the EP3C55F780C8 include 4 PLLs for clock management, 4 memory controller blocks, support for DDR/DDR2/QDRII SRAM interfaces, 156 dedicated hardware multipliers optimized for DSP, and 20 global clock networks. The device also integrates 4 phase-locked loops and supports configuration via JTAG, Active Serial, or Passive Serial modes, enabling flexible boot options in production and development environments. Architecturally, the Cyclone III family uses a logic-element (LE) based fabric with embedded RAM blocks (M9K) and 18x18 multiplier blocks. The 65 nm process technology delivers a balance between static power (suitable for thermally constrained designs) and switching performance. Power dissipation is dominated by dynamic switching activity; Altera's PowerPlay early power estimator enables accurate budgeting before place-and-route. The 780-FBGA package supports high I/O count with multiple package migration paths. Typical applications include industrial motor control, video surveillance, automotive infotainment pre-processing, wireline telecom line cards, and low-cost software-defined radio front-end interfaces. This device suits designs where mid-range logic density and DSP capability are needed without the cost of high-end FPGAs. When designing with the EP3C55F780C8, ensure proper decoupling of VCCINT and VCCA supplies. Follow Altera's recommended pin-connection guidelines for unused I/O banks and configure unused Multiplier blocks to logic-only mode to minimize leakage. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the Altera Cyclone III Device Handbook, giving engineers an actionable cross-reference for legacy Cyclone III designs.

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EP3C55F780C8N - 55K LE Cyclone III FPGA, 780-FBGA | Intel/Altera
EP3C55F780C8N

EP3C55F780C8N - 55K LE Cyclone III FPGA, 780-FBGA | Intel/Altera

The Altera (now Intel) EP3C55F780C8N is a Cyclone III field-programmable gate array with 55,856 logic elements, 3,491 logic array blocks, and 2,396,160 bits of embedded RAM, housed in a 780-pin FineLine BGA (29x29 mm, 1.0 mm pitch) package at commercial speed grade 8. It exposes 377 user I/O pins and four PLLs, runs on a 1.15 V to 1.25 V core supply, and supports active serial, passive serial, and Fast Passive Parallel configuration schemes through dedicated JTAG (IEEE 1149.1) and configuration pins. What is a low-cost FPGA? A field-programmable gate array is a semiconductor device whose logic function is defined after PCB assembly rather than at the wafer fab, allowing rapid hardware iteration. The Cyclone III family is positioned in the hierarchy as low-cost programmable logic -> FPGA -> programmable logic device -> semiconductor, manufactured on a 65 nm TSMC process and tailored for high-volume cost-sensitive designs where Cyclone IV or Cyclone V would be over-specified. Key features include 55856 logic elements, 3,491 LABs, 2,396,160 bits (2396 Kbit) of RAM, 156 embedded 18x18 multipliers, four PLLs, 377 maximum user I/Os, and 4 user I/O banks that support LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The device also provides 20 global clock networks and supports Nios II embedded processor soft cores via Altera/Intel Quartus design tools. Architecturally, the Cyclone III uses a logic-element-based fabric with 16 logic elements per LAB, distributed M9K memory blocks (totaling 260 blocks), and DSP blocks formed from the 18x18 multipliers. The 65 nm process and 1.2 V core supply keep dynamic power low for a device of this logic density, while the 4 PLLs allow flexible clock synthesis across multiple I/O banks. Typical applications include industrial motor control and machine vision, video processing and display bridges, communications line cards and protocol bridging, consumer electronics such as flat-panel TVs and set-top boxes, and test & measurement front ends. The 55K LE capacity is well matched to designs that require soft processor cores plus moderate DSP throughput. When designing with this device, plan the 780-BGA PCB layout early: the 1.0 mm pitch and 29x29 mm body demand 4 or 6 layer stack-ups with microvia or HDI technology for escape routing, and at least 8 decoupling capacitor placements around the package perimeter. Configuration pin mapping must be verified against the chosen AS/PS/FPP mode before committing the schematic. This page synthesizes distributor pricing, drop-in Cyclone III variants, and practical PCB and toolchain guidance not found in the manufacturer datasheet alone.

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EP3C55F780I7 - Cyclone III FPGA, 55K LEs, 780-FBGA | Altera
EP3C55F780I7

EP3C55F780I7 - Cyclone III FPGA, 55K LEs, 780-FBGA | Altera

The Altera EP3C55F780I7 is a Cyclone III Field-Programmable Gate Array (FPGA) IC integrating 55,856 logic elements, 2,396,160 bits of embedded memory, and 377 user I/O pins in a 780-ball FineLine BGA (FBGA) package. Built on a low-power 65 nm process, the device operates at a core voltage of 1.2 V and supports internal clock rates reaching 472 MHz, providing a balance of logic density and energy efficiency for cost-sensitive applications. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that allows engineers to configure arbitrary digital circuits after manufacturing. Architecturally, an FPGA sits between an ASIC (fully custom, high NRE cost) and a standard microcontroller, occupying the same hierarchy as a CPLD and other programmable logic devices. The Cyclone III family in particular targets low-cost, high-volume markets by combining LE fabric, M9K memory blocks, embedded multipliers, and PLL-based clock management in a single device. Key features include 55,856 logic elements, 156 embedded 18x18 multipliers, 234 Kbits of distributed RAM (MLABs), 2,396,160 bits of block RAM, four PLLs for clock synthesis, and 377 single-ended user I/Os supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL standards. The industrial temperature grade (-40C to +100C) and 780-FBGA package with 1 mm ball pitch make the device suitable for moderate-density, board-constrained designs. Typical applications include digital signal processing pipelines, video bridging and conversion, motor control, industrial communication bridges, and low-cost ASIC prototyping. Designers rely on the Cyclone III family for power-efficient glue logic and parallel signal processing. When designing with this device, plan power distribution carefully: the 1.2 V core rail typically draws hundreds of milliamps and must be decoupled with 0402/0603 ceramics placed close to each power ball. JTAG configuration via the dedicated MSEL pins should be reserved for production programming. This page synthesizes distributor pricing, drop-in alternatives from the Site MPN list, and practical design notes not found in the standalone manufacturer datasheet.

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EP3C55F780I7N - Cyclone III FPGA, 55K LEs, 780-FBGA | Intel
EP3C55F780I7N

EP3C55F780I7N - Cyclone III FPGA, 55K LEs, 780-FBGA | Intel

The Intel (formerly Altera) EP3C55F780I7N is a Cyclone III field-programmable gate array (FPGA) delivering 55,856 logic elements and 2,396,160 bits of embedded memory in a 780-ball fine-pitch BGA package. Built on a low-power 65 nm process, this device operates at a core voltage of 1.2 V and supports user I/O counts up to 377 with internal frequencies reaching 472 MHz. An FPGA is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells, all controlled by a configuration bitstream. FPGAs belong to the broader category of programmable logic devices (PLDs), sitting alongside CPLDs and structured ASICs in the logic IC hierarchy. Cyclone III devices specifically target high-volume, cost- and power-sensitive applications by combining the flexibility of programmable logic with ASIC-like unit pricing in the low hundreds of dollars. Key features of the EP3C55F780I7N include 55,856 logic elements, 2,396,160 RAM bits distributed across M9K and M144K memory blocks, 56 embedded 18x18 multipliers for DSP operations, four phase-locked loops (PLLs) for clock management, and a maximum user I/O count of 377. Industrial temperature-grade operation from -40 °C to +100 °C is supported, and the device is lead-free and RoHS compliant. The 780-FBGA measures 29 mm x 29 mm with a 1 mm ball pitch, well suited to dense multi-layer PCBs. Architecturally, Cyclone III devices use a Logic Array Block (LAB) structure containing 16 logic elements each, with routing channels and a global clock network distributed across eight quadrants. Hard IP blocks - including M9K memory blocks, 18x18 multipliers, and PLLs - are placed in dedicated columns and rows to optimize performance and silicon efficiency. The device is configured via a passive serial, JTAG, or Active Serial scheme using industry-standard Altera/Intel Quartus II design software. Typical applications include industrial motor control and machine vision, video processing and display controllers, telecommunications line cards, automotive driver assistance (pre-Linux infotainment), and protocol bridging such as PCIe Gen1 endpoints. The device is also widely deployed in test and measurement front-ends and military/aerospace prototypes where FPGA flexibility is required. When designing with this part, ensure that the Quartus II fitter reports timing closure within the I/O and core timing budgets for the chosen speed grade (-7). Decoupling must include 0.1 µF and 10 µF capacitors near every power pin to meet simultaneous-switching-noise specifications, and the JTAG chain should be ESD-protected at the connector. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet, enabling engineers to compare the EP3C55F780I7N against alternative Cyclone III, Cyclone IV, and Lattice parts on the same 780-FBGA footprint.

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EP3C55F780I8N - Cyclone III FPGA, 55K LEs, 780-FBGA | Intel
EP3C55F780I8N

EP3C55F780I8N - Cyclone III FPGA, 55K LEs, 780-FBGA | Intel

The Intel EP3C55F780I8N is a high-density, low-cost Field Programmable Gate Array (FPGA) from the Cyclone III family, integrating 55,856 logic elements (LEs) and 3,491 logic array blocks (LABs) in a 780-ball FineLine BGA package with 1.0 mm ball pitch. It is fabricated on a low-power CMOS process and operates from a nominal 1.2 V core supply (range 1.15 V to 1.25 V), making it well-suited for cost-sensitive, power-aware designs. An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs/LABs), embedded memory, and programmable interconnect. FPGAs sit within the broader hierarchy: programmable logic device (PLD) -> FPGA -> semiconductor -> integrated circuit. Compared with fixed-function ASICs, FPGAs offer hardware-level parallelism, in-system reconfigurability, and fast time-to-market, which is why they dominate prototyping, DSP, video processing, and industrial control designs. Key features include up to 234 Kbits of embedded RAM (M9K blocks), up to 156 hardware multipliers (18x18) for DSP operations, four phase-locked loops (PLLs) for clock management, and 20 global clock networks. The device supports industry-standard I/O standards (LVDS, LVCMOS, SSTL) and exposes up to 377 user I/Os depending on package selection. Configuration is via JTAG or active/passive serial/parallel modes using the built-in decompression and encryption circuitry. The Cyclone III architecture balances logic density, DSP throughput, and low static power. Its 1.2 V core, on-chip termination, and dynamic power gating enable designs to consume less than 100 mW in many typical configurations. The fabric is supported by Quartus II design software, which provides synthesis, place-and-route, timing analysis, and on-chip debug via SignalTap II. Typical applications include industrial motor control, video surveillance and image processing, software-defined radio, automotive infotainment, medical instrumentation, and embedded DSP. With its combination of logic capacity and embedded multipliers, the EP3C55 can absorb multiple parallel processing functions onto a single device, replacing discrete DSPs and glue logic. When designing, allocate I/O banks carefully to avoid mixing incompatible voltage standards on the same bank, and verify that the Quartus II fitter can close timing before committing the PCB layout. A JTAG header must be brought out to allow in-system programming. This page synthesizes distributor pricing, drop-in package-compatible alternatives from the same Altera Cyclone III family, and practical design notes not all found in the manufacturer datasheet.

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EP3C55U484C6 - Cyclone III FPGA 55K LE 484-FBGA | Intel/Altera
EP3C55U484C6

EP3C55U484C6 - Cyclone III FPGA 55K LE 484-FBGA | Intel/Altera

The Intel (formerly Altera) EP3C55U484C6 is a Cyclone® III Field Programmable Gate Array (FPGA) housed in a 484-ball FineLine BGA (UBGA) package with 327 user I/O. Built on a 65 nm low-power process, this device delivers 55,856 logic elements, 2,396,160 bits of embedded memory, and 156 embedded 18x18 multipliers, targeting cost-sensitive high-volume applications. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP blocks such as multipliers, memory, and transceivers. Within the broader taxonomy, the Cyclone III family belongs to low-cost, low-power SRAM-based FPGAs that sit between discrete microcontrollers and high-end DSP or ASIC solutions, providing hardware-level parallelism for digital signal processing, glue logic, and bus interfacing tasks. Key features of the EP3C55U484C6 include 55,856 logic elements, 2,396,160 bits of embedded RAM (approximately 234 Kbits of M9K blocks plus 65 Kbits of M144K blocks), and 156 18x18 hardware multipliers for DSP workloads. The device supports up to 4 PLLs for clock management, 327 maximum user I/O pins, and operates from a 1.15 V to 1.25 V core supply with 0°C to +70°C commercial temperature range. The C6 speed grade corresponds to a commercial temperature rating and a specific Fmax tier for the internal logic. Architecturally, Cyclone III FPGAs use a logic-element fabric of 4-input look-up tables (LUTs), configurable as distributed RAM or shift registers, paired with dedicated routing and embedded hard IP. The 65 nm process gives the family its signature low static and dynamic power characteristics, making it suitable for thermally constrained or battery-powered products where competing 90 nm FPGAs could not be deployed. Typical applications include industrial motor control, video surveillance processing, automotive infotainment prototypes, telecom line cards, and portable medical instrumentation. The combination of moderate logic density, abundant multipliers, and a fine-pitch 484-ball BGA makes it attractive for designs that need hardware acceleration but want to stay inside a low-power budget. When designing with this FPGA, plan the power distribution network carefully - the core requires 1.15 V to 1.25 V, while I/O banks can be configured to 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.0 V, or 3.3 V. The 484-FBGA package demands a 4 or 6-layer PCB with microvia technology for reliable assembly.

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EP3C55U484C6N - 55K LE Cyclone III FPGA | Intel | Embedded Systems
EP3C55U484C6N

EP3C55U484C6N - 55K LE Cyclone III FPGA | Intel | Embedded Systems

Intel EP3C55U484C6N is a Cyclone III field-programmable gate array (FPGA) with 55,856 logic elements, 327 I/O pins, and 2,396,160 bits of embedded memory in a 484-ball FBGA package. Verified distributor data identifies it as the EP3C55U484C6N Cyclone III FPGA, while the supplied comparison information also associates the device with 55,856 cells and a 65 nm process technology. Its combination of programmable logic, embedded memory, and a large I/O count makes it suitable for digital control, communications, industrial, and embedded processing systems. An FPGA, or field-programmable gate array, is a semiconductor device containing configurable logic blocks, programmable interconnects, and memory resources. Unlike a fixed-function application-specific integrated circuit (ASIC), an FPGA can be configured after manufacturing to implement custom digital circuits. Cyclone III devices belong to Intel's programmable-logic family and occupy a tier between small CPLDs and high-density, high-power FPGAs. The broader hierarchy is FPGA, programmable logic device, digital integrated circuit, and semiconductor. The key architectural figures are 55,856 logic elements, 327 I/O pins, 55856 cells as reported by the supplied comparison snippets, and a 484-FBGA package. The device is listed for 1.2 V core technology and 3.3-, 3.0-, and 2.5-V LVTTL/LVCMOS JTAG operation in the supplied datasheet snippet. A 65 nm process technology is also cited in the comparison results. These characteristics support moderate-to-large digital designs where configurable logic and high pin availability matter. The device can implement parallel datapaths, control logic, protocol bridges, state machines, and digital signal-processing structures. Embedded memory can support FIFOs, lookup tables, buffers, and other data-handling functions. The 327 I/O count provides substantial connectivity for external memories, converters, sensors, and industrial buses. As a result, the FPGA is useful when a system needs hardware timing flexibility without the development cost and non-recurring engineering associated with a custom ASIC. Typical applications include industrial automation controllers, communications-interface equipment, test and measurement systems, video and image-processing hardware, medical monitoring equipment, and aerospace or defense prototypes. The package's 484 balls provide the physical interface for these designs, while the programmable architecture allows the logic to be adapted as requirements evolve. Designers should confirm the exact supported I/O standards, configuration interface, timing limits, and power requirements from the manufacturer datasheet before releasing a board. The provided web data does not include all of those values, so missing electrical and timing parameters are explicitly marked as data-needed. This page combines verified distributor and manufacturer-related search data with a drop-in comparison that should be validated against the original Cyclone III family documentation. This data set preserves the values available from the supplied search results while identifying unverified parameters instead of guessing. It is intended to support component research, procurement decisions, and preliminary FPGA architecture planning; final hardware sign-off should use the complete manufacturer datasheet and the applicable Intel device documentation.

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EP3C55U484C7 - Cyclone III FPGA, 55K LEs, 484-FBGA | Intel
EP3C55U484C7

EP3C55U484C7 - Cyclone III FPGA, 55K LEs, 484-FBGA | Intel

The Intel (Altera) EP3C55U484C7 is a low-power, high-volume Cyclone III FPGA offering 55,856 logic elements, 2,396,160 bits of embedded memory, and 156 embedded 18x18 multipliers in a 484-ball FineLine BGA package. The 'U' suffix denotes the UBGA (Ultra-fine BGA) 19x19 mm variant with 0.8 mm ball pitch, and the 'C7' speed grade delivers a maximum core performance around 437 MHz in the 65 nm CMOS process node. Operating voltage is 1.2 V core with a 1.2/2.5/3.0/3.3 V flexible I/O bank scheme. A Field-Programmable Gate Array (FPGA) is a programmable logic device containing configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as block RAM (BRAM), DSP blocks, PLLs, and high-speed transceivers. Within the broader semiconductor taxonomy, FPGAs sit above general-purpose MCUs in design flexibility and below ASICs in unit-cost efficiency, making them ideal for parallel processing, custom datapaths, and hardware-accelerated computation. The Cyclone III family specifically targets cost-sensitive, power-conscious applications such as industrial control, video processing, and communications infrastructure where ASIC NRE costs are prohibitive. Key features of the EP3C55U484C7 include 327 maximum user I/O pins, 4 PLLs, support for external memory interfaces including DDR/DDR, DDR2, and QDR II SRAM, and built-in configuration options such as Active Serial (AS), Passive Serial (PS), and JTAG. The device provides up to 20 global clock networks and supports hot-socketing for in-system reprogrammability without board-level shutdown. Typical applications span industrial motor control, video surveillance and image processing pipelines, software-defined radio (SDR) baseband, low-cost ASIC prototyping, and embedded PCIe bridging. The high logic density combined with embedded DSP blocks and BRAM makes it suitable for digital signal processing functions where deterministic latency is required. When designing with this FPGA, ensure proper power sequencing on the VCCINT (1.2 V) and VCCA/VCCIO rails, and place decoupling capacitors close to the BGA balls per Altera's recommended PCB layout guidelines. Designers must also provision for a JTAG download cable header for configuration and debugging. As of 2026-09-09, distributors including DigiKey and Octopart list the EP3C55U484C7 with active inventory.

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EP3C55U484C7N - Cyclone III FPGA, 55K LE, 484-UBGA | Intel / Altera
EP3C55U484C7N

EP3C55U484C7N - Cyclone III FPGA, 55K LE, 484-UBGA | Intel / Altera

The Intel (formerly Altera) EP3C55U484C7N is a Cyclone III low-power Field-Programmable Gate Array (FPGA) with 55,856 logic elements, 2,396,160 bits of embedded memory, and 327 maximum user I/Os, housed in a 484-pin Ultra FineLine BGA (UBGA) package. Fabricated on a 65 nm low-power process and operating from a 1.2 V core supply, the device is rated for commercial temperature (0 °C to +85 °C) and supports a maximum internal clock frequency of approximately 437.5 MHz. A Field-Programmable Gate Array (FPGA) is a class of programmable logic device that combines configurable logic blocks (CLBs), programmable interconnects, embedded memory blocks, and dedicated multiplier/PLL resources on a single die. FPGAs sit in the broader hierarchy of digital semiconductor devices between Application-Specific Integrated Circuits (ASICs) and general-purpose microcontrollers, and are widely used as prototyping platforms, hardware accelerators, and glue-logic bridges. The Cyclone III family specifically targets cost-sensitive, power-sensitive, high-volume applications, offering a balance of logic density, embedded RAM, and DSP blocks at lower static and dynamic power than prior generations. Key features of the EP3C55U484C7N include 55,856 logic elements, 234 embedded 18 × 18 multipliers (DSP blocks), 4 PLLs, and 56 embedded 9-Kbit M9K memory blocks (totalling 2,396,160 bits, or about 2.4 Mbit). The device supports industry-standard I/O standards such as LVDS, LVTTL, LVCMOS, SSTL, and HSTL through 8 I/O banks, enabling direct interfacing with DDR/DDR2 SDRAM memories. Configuration can be loaded via active serial (AS), passive serial (PS), fast passive parallel (FPP), or JTAG modes, supporting in-field updates and secure bitstream programming. Typical applications span industrial motor control, video surveillance and image processing, automotive infotainment pre-production prototypes, telecom line cards, test and measurement instrumentation, and consumer electronics requiring parallel processing or custom interfacing. The Cyclone III 65 nm process gives the EP3C55 a typical static power well under 100 mW at 25 °C, making it suitable for fanless or sealed enclosures. When designing with this FPGA, always respect the I/O-bank VCCIO grouping rules and provide a clean 1.2 V VCCINT rail with adequate decoupling. Quartus II (or its newer Intel Quartus Prime equivalent) is the supported development environment; legacy designs targeting this device should be re-validated against the latest Quartus version for timing closure, since the part is approaching end-of-life for new designs but is still broadly available in the distribution channel.

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EP3C55U484C8 - 55K LE Cyclone III FPGA, 327 I/O, 484-FBGA | Altera
EP3C55U484C8

EP3C55U484C8 - 55K LE Cyclone III FPGA, 327 I/O, 484-FBGA | Altera

The Altera (Intel) EP3C55U484C8 is a Cyclone III family field-programmable gate array (FPGA) built on a 65 nm low-power process, integrating 55,856 logic elements, approximately 2.4 Mbits of embedded memory, 327 user I/Os, and 156 18x18 hardware multipliers in a 484-ball FineLine BGA package. It targets cost-sensitive, power-conscious digital designs that previously required custom ASICs. What is a Cyclone III FPGA? A field-programmable gate array (FPGA) is a reprogrammable semiconductor device whose logic fabric, routing, and I/O cells are configured by the user via a hardware description language (HDL) bitstream. The Cyclone III family occupies the low-power, low-cost tier of Altera's FPGA hierarchy, sitting below the Stratix series and above legacy Cyclone II. It belongs to the broader class of programmable logic devices (PLDs) that bridge the gap between fixed-function ASICs and software-driven processors. Key features include 4 transceivers-less general-purpose I/O, support for LVDS, LVTTL, SSTL, and HSTL I/O standards, dedicated 18x18 multipliers for DSP blocks, embedded RAM blocks of M9K type, and a Quartus II design flow with support for IP cores and the Nios II soft processor. The device operates from a 1.2 V core supply with separate VCCIO bank voltages, allowing mixed-voltage interfacing without external level shifters. Architecturally, the EP3C55 implements LUT-based logic elements, each containing a 4-input LUT, a programmable register, and carry-chain logic for arithmetic operations. Multipliers are arranged in columns that connect to adjacent LABs (logic array blocks), providing deterministic throughput for DSP pipelines. The PLL count and global clock network support up to 20 clock domains with low skew. Typical applications include industrial motor control, video processing bridges, low-cost DSP co-processors, embedded vision, communications protocol bridging, and ASIC prototyping. The Cyclone III family's balance of logic density, low static power, and large I/O count makes it well-suited to bridge and gateway designs. When designing with this device, ensure proper decoupling of all VCC and VCCIO rails with 0.1 uF and 10 uF capacitors placed close to the package balls. The 484-FBGA requires careful PCB layout to manage signal integrity on high-speed LVDS pairs. This page synthesizes distributor pricing, drop-in alternatives from the same Cyclone III family, and practical design notes not collected in a single place on the manufacturer datasheet.

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EP3C55U484C8N - Cyclone III FPGA, 55K LE, 484-UBGA | Intel / Altera
EP3C55U484C8N

EP3C55U484C8N - Cyclone III FPGA, 55K LE, 484-UBGA | Intel / Altera

The Intel / Altera EP3C55U484C8N is a Cyclone III Field-Programmable Gate Array (FPGA) integrating 55,856 logic elements, 2,396,160 bits of embedded memory, and 327 user I/Os into a 484-ball Ultra FineLine BGA package. The device is built on a low-power 60-nm process and is offered in a commercial -8 speed grade, targeting cost-sensitive high-volume applications that still require substantial programmable logic capacity. According to the Cyclone III Device Handbook, the EP3C55 family supports up to four general-purpose PLLs per device, embedded multipliers (18x18) for DSP-style signal chains, and a robust clock network with up to 20 global clock lines. A Field-Programmable Gate Array (FPGA) is a programmable semiconductor device whose logic fabric, interconnect, and I/O behavior are defined by a user-supplied configuration bitstream. Within the broader taxonomy, an FPGA sits above standard logic ICs (CPLDs, ASICs) and below high-density SoCs in the programmable-logic hierarchy; the Cyclone III family specifically targets the low-power, low-cost end of that spectrum. Compared with predecessors such as Cyclone II, Cyclone III introduced static power reductions of up to 75 percent while roughly doubling logic density at the same node class. Key features of the EP3C55U484C8N include 55,856 logic elements, 2,396,160 RAM bits (approximately 234 Kbits per embedded M9K block distributed across 250 blocks), 156 embedded 18x18 hardware multipliers, four PLLs, and 327 maximum user I/Os routed through 8 I/O banks. The 484-UBGA package measures 19 mm × 19 mm with 1.0 mm pitch, and the device supports multiple I/O standards including LVDS, SSTL, HSTL, and LVCMOS up to 3.3 V. The -8 commercial speed grade is the fastest Cyclone III speed bin. From an architectural standpoint, the EP3C55 leverages Altera's M9K memory block tiling (each 9 Kbit with true dual-port capability) and dedicated multiplier blocks that free up logic fabric for state machines and glue logic. The combination of high-density logic, generous block RAM, and DSP-grade multipliers enables a single EP3C55 to replace both a microcontroller plus an external DSP in many embedded designs. Typical applications for the EP3C55U484C8N include industrial motor control and factory automation, video processing pipelines, software-defined radio front ends, automotive infotainment prototypes, and telecom line-card glue logic. Its low static power also makes it suitable for portable test and measurement equipment that must remain in standby for long periods. When designing with the EP3C55U484C8N, pay close attention to the eight I/O bank supply rails: each bank can be powered independently, allowing mixed-voltage interfacing without external level shifters. Pair the FPGA with a dedicated configuration PROM such as the EPCS16 or EPCS64 for stand-alone boot. This page synthesizes distributor pricing, drop-in Cyclone III family alternatives, and practical design notes for the EP3C55U484C8N that are not consolidated in a single location in the manufacturer handbook.

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EP3C55U484I7 - Cyclone III FPGA 55K LE 484-FBGA | Altera
EP3C55U484I7

EP3C55U484I7 - Cyclone III FPGA 55K LE 484-FBGA | Altera

The Altera (Intel) EP3C55U484I7 is a Cyclone III family Field-Programmable Gate Array (FPGA) built on a 65 nm low-power CMOS process, integrating 55,856 logic elements (LEs) into a 484-ball FineLine BGA package. Operating from a 1.15 V to 1.25 V core supply and supporting up to 327 user I/O pins, this device targets cost-sensitive, high-volume logic integration designs where the FPGA fabric must combine density, embedded memory, and DSP blocks while drawing minimal static power. A Field-Programmable Gate Array (FPGA) is a reprogrammable digital integrated circuit containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, multipliers, and PLLs. FPGAs sit between fixed-function ASICs and general-purpose microcontrollers, offering hardware-level parallelism for data-path and signal-processing workloads. The Cyclone III family specifically optimises logic density per dollar and per watt, positioning it below high-end Stratix devices in the Altera portfolio but above Cyclone II in features and below Cyclone IV GX in transceiver capability. Key features of the EP3C55U484I7 include 3,491 LABs/CLBs, 2,396,160 bits of embedded RAM (approximately 234 kbit of M9K block RAM equivalent), up to 156 embedded 18x18 multipliers for DSP, four PLLs, and a maximum core clock frequency rated around 437 MHz. The 484-FBGA package measures 19 x 19 mm with a 0.8 mm ball pitch and supports surface-mount reflow assembly. The "I7" speed-grade suffix designates the industrial temperature range, making the device suitable for -40C to +100C ambient operation. Architecturally, the Cyclone III device family is implemented on TSMC's 65 nm process node with a 1.2 V core, achieving notably lower static and dynamic power than the preceding Cyclone II generation. Designers can allocate embedded multipliers as DSP blocks for FIR/FFT pipelines, distribute block RAM across the fabric for buffering, and configure LVDS/LVTTL/PCIe-style I/O through the Quartus II toolchain. The combination of large logic capacity, ample block RAM, and dedicated DSP blocks makes the EP3C55 well-suited for parallel video processing, motor-control front ends, and protocol-bridging applications. Typical applications include industrial machine vision and video pipelines, motor and motion control in factory automation, software-defined radio baseband, telecom protocol conversion, and display controllers. The wide logic capacity also supports multi-protocol bridging in industrial Ethernet gateways and embedded instrumentation. When designing with the EP3C55U484I7, plan the power distribution network carefully: even at modest toggle rates the device can require 3-4 W of core supply, so multiple 0.1 uF + bulk decoupling capacitors are recommended adjacent to each supply ball, and a 4-6 layer PCB with continuous power/ground planes is essential. Verify pinout against the device-specific 484-FBGA ball map because multiple speed-grade and package variants share this footprint.

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EP3C55U484I7N - 55K LE Cyclone III FPGA, 484-FBGA | Intel / Altera
EP3C55U484I7N

EP3C55U484I7N - 55K LE Cyclone III FPGA, 484-FBGA | Intel / Altera

The Intel / Altera EP3C55U484I7N is a Cyclone III family Field-Programmable Gate Array (FPGA) IC delivering 55,856 logic elements, 3,491 adaptive logic modules (ALMs), and 2,396,160 bits of embedded memory in a 484-ball FineLine BGA package. It is built on a low-power 65 nm CMOS process and operates from a 1.2 V core supply with industrial-grade -40°C to +100°C junction temperature support, making it well-suited for cost-sensitive, power-aware applications. A Field-Programmable Gate Array (FPGA) is a semiconductor IC containing an array of configurable logic blocks (CLBs/ALMs), programmable interconnect, and on-chip memory that can be customized after manufacturing through a hardware description language (HDL) bitstream. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs), parallel to CPLDs and ASICs, and are typically chosen when time-to-market, in-field reconfigurability, and parallel processing throughput outweigh the per-unit cost of a masked ASIC. Key differentiating features of the EP3C55U484I7N include 327 maximum user I/O pins, 156 embedded 18x18 multipliers, four PLLs for clock synthesis, and support for external memory interfaces including DDR, DDR2, QDRII, and RLDRAM II. The Cyclone III architecture combines a low static and dynamic power budget with high logic density, enabling display controllers, video bridging, motor control, and industrial protocol bridging on a single device. Typical application domains are industrial machine vision, factory automation controllers, video surveillance encoders, automotive infotainment pre-production prototypes, and telecom line-card glue logic. The 484-ball UFBGA at 19 x 19 mm with 0.8 mm pitch supports dense PCB layouts while preserving signal integrity through multiple GND and supply balls. When designing with this device, engineers should use the Altera Quartus II design software (version 13.0 or later with service packs) for synthesis, place-and-route, and bitstream generation. Pay attention to simultaneous switching output (SSO) guidelines, decoupling strategy, and PLL power filtering to meet the Cyclone III datasheet jitter specifications.

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EP3C5E144A7N - Cyclone III FPGA, 5K LEs, 144-EQFP | Altera
EP3C5E144A7N

EP3C5E144A7N - Cyclone III FPGA, 5K LEs, 144-EQFP | Altera

The Altera (now Intel) EP3C5E144A7N is a low-power Cyclone III Field-Programmable Gate Array built on a 65 nm low-k dielectric process, delivering 5,136 logic elements, 423,936 bits of embedded memory (414 Kbits organized as M9K blocks), 23 embedded 18x18 multipliers, and 94 user I/O across four I/O banks, housed in a 144-pin EQFP (22x22 mm, Plastic Enhanced QFP) package with an exposed thermal pad. It is offered in speed grade 7 and the commercial temperature grade, and is targeted at cost-sensitive, volume-driven digital logic designs where FPGAs were previously considered too expensive. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic fabric, routing, and I/O behavior can be reconfigured after manufacturing through a hardware description language (HDL) bitstream. FPGAs sit between fixed-function ASICs and general-purpose microcontrollers in terms of flexibility, parallelism, and per-unit cost, and they coexist with CPLDs in the programmable logic device (PLD) hierarchy. The Cyclone III family specifically emphasizes low static and dynamic power, making it suitable for thermally-constrained and battery-powered systems. Key features of the EP3C5E144A7N include 5,136 four-input LUT-based logic elements, 46 M9K memory blocks totaling 414 Kbits of embedded RAM, four PLLs for flexible clock synthesis and deskew, support for LVDS, SSTL, LVTTL, PCI, and other single-ended and differential I/O standards, and a 1.2 V core supply with separate per-bank VCCIO rails. Configuration is supported via Altera (Intel) Active Serial (AS), Passive Serial (PS), JTAG, and Fast Passive Parallel modes, and the device is supported by the Quartus II / Quartus Prime design toolchain. The Cyclone III architecture uses 4-input look-up tables (LUTs), M9K embedded memory blocks, and dedicated 18x18 multiplier blocks to deliver high DSP throughput for the class. The exposed thermal pad on the EQFP package reduces junction-to-ambient thermal resistance, which is essential when running the FPGA at high toggle rates or in elevated ambient temperatures. Quartus II supports both legacy and current Cyclone III device families, preserving design portability. Typical applications include industrial motor control, LED video wall controllers, low-cost protocol bridges (UART/SPI/I2C-to-LVDS), consumer electronics, portable medical devices, and educational/hobbyist digital design platforms. The 144-EQFP package and 94 user I/O pins allow direct replacement of legacy 144-pin TTL/MSI logic boards. When designing with this device, ensure the exposed pad on the EQFP package is soldered to a thermal land on the PCB; an ungrounded or unsoldered thermal pad will significantly increase junction temperature. Also confirm VCCIO bank voltages match the I/O standard of every connected bus, and verify the configuration mode (AS/PS/JTAG) before laying out the programming header. This page synthesizes distributor pricing, drop-in alternative MPNs, and practical design notes not found in the manufacturer datasheet, helping engineers evaluate the EP3C5E144A7N against its closest Cyclone III family members and competing low-density FPGAs.

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EP3C5E144C7 - Cyclone III FPGA, 5K LEs, 144-LQFP | Intel
EP3C5E144C7

EP3C5E144C7 - Cyclone III FPGA, 5K LEs, 144-LQFP | Intel

The Intel (formerly Altera) EP3C5E144C7 is a Cyclone III low-cost FPGA delivering 5,136 logic elements, 423,936 bits of embedded memory, and 94 user I/O pins in a 144-pin LQFP exposed-pad package. Manufactured on a 65nm TSMC low-power process, it operates from a 1.2V core supply and supports up to 437.5 MHz internal operation. The 'C7' speed grade and commercial temperature rating (0C to +85C) make it suitable for cost-sensitive volume production. The 144-LQFP package (EQFP-EP) with exposed thermal pad enables standard SMT assembly without BGA infrastructure. A Cyclone III FPGA is a SRAM-based programmable logic device that combines lookup tables (LEs), embedded memory blocks (M9K), embedded multipliers (18x18), and PLL-based clock management in a single die. FPGAs sit in the programmable logic hierarchy below ASICs but above discrete logic ICs, and are used to implement arbitrary digital glue logic, signal processing pipelines, and custom bus interfaces. Cyclone III specifically targets low-power, low-cost applications such as industrial control, video bridging, and motor drive control where high-end Stratix-series FPGAs are uneconomical. Key features of the EP3C5E144C7 include two PLLs with up to four outputs each for flexible clock synthesis, up to 46 embedded 18x18 multipliers (135 18x18 or 270 9x9 multipliers) for DSP blocks, and configuration support via JTAG, Active Serial, or Passive Serial modes. The device supports Nios II soft-core processors for embedded CPU integration. Embedded memory is organized as 9-Kbit blocks (M9K), totaling 46 blocks. The Cyclone III architecture separates I/O banks into four groups supporting multiple I/O standards including LVTTL, LVCMOS, SSTL, HSTL, PCI, and LVDS on selected pins. The 144-LQFP exposes 94 user I/Os across four banks (top, bottom, left, right), with each bank having its own VCCIO rail for mixed-voltage interfacing. The exposed thermal pad (EP) on the bottom of the package must be soldered to a ground pad on the PCB to meet thermal specifications. Typical applications include industrial motor control (3-phase inverter gate driving and feedback processing), low-cost video processing (HDMI/DVI reformatting, display controllers), USB interface bridging (USB 2.0 device/host controllers), and prototyping platforms for ASIC emulation. Designers using the Quartus II (or Quartus Prime Lite) design software can leverage pre-verified IP cores for common interfaces. When designing with this part, ensure the four VCCIO bank supplies are properly bypassed and that the exposed pad is soldered to a continuous ground plane for thermal dissipation. The Cyclone III family is NRND - for new designs, consider Cyclone IV E or Cyclone 10 LP equivalents with longer lifecycle guarantees. Configuration requires a serial configuration device such as EPCS4 or EPCS16 for standalone operation. This page synthesizes distributor pricing across 20+ sources, drop-in Cyclone III family alternatives, and practical design notes not consolidated in the manufacturer datasheet.

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EP3C5E144C7N - Cyclone III FPGA, 5K LE, 144-LQFP | Intel / Altera
EP3C5E144C7N

EP3C5E144C7N - Cyclone III FPGA, 5K LE, 144-LQFP | Intel / Altera

The Intel / Altera EP3C5E144C7N is a low-power Cyclone III Field Programmable Gate Array (FPGA) featuring 5,136 logic elements, 423,936 bits of embedded memory, and 94 user I/Os, housed in a 144-pin EQFP (22 x 22 mm, 0.5 mm pitch) package with exposed thermal pad. Built on a TSMC 65 nm low-power process, the 'C7' speed grade variant is specified for a 7 ns propagation delay range and is intended for industrial-grade commercial operating conditions (0C to +85C junction). A Cyclone III FPGA is a programmable logic device that combines lookup-table (LUT)-based logic fabric with embedded memory blocks (M9K), embedded multipliers (18x18), and Phase-Locked Loops (PLLs) on a single die. In the broader taxonomy, the EP3C5E144C7N belongs to the SRAM-based programmable logic family, sitting alongside Cyclone IV (next-generation low-power FPGA), Cyclone V (28 nm successor), and MAX series CPLDs. The device is non-volatile-of-configuration: bitstreams are loaded from external flash or JTAG into on-chip SRAM configuration cells, enabling unlimited re-programmability for prototyping, NPI, and field-upgradable end products. Key features include 5,136 logic elements organized into 290 logic array blocks (LABs), 46 embedded M9K memory blocks (414 Kbits), 46 embedded 18x18 multipliers, and up to 4 PLLs with 4 dedicated clock outputs. The device supports configuration schemes including Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), and JTAG, and includes Cyclone III architectural primitives such as high-speed LVDS I/O, on-chip termination (OCT), and the Altera remote update IP for in-field bitstream swapping. The 144-pin EQFP package provides a thermal resistance of approximately 22 C/W with a properly soldered exposed pad. The Cyclone III architecture targets cost-sensitive high-volume applications where the previous-generation Cyclone II could not deliver sufficient logic density, DSP bandwidth, or low static power. The 65 nm process enables typical static power in the milliamp range while retaining deterministic timing closure at 200+ MHz for common logic functions and 250 MHz for DSP blocks. I/O banks support LVDS, SSTL, HSTL, LVCMOS, and PCI/PCI-X signaling standards with per-bank voltage reference supplies, enabling direct interface to DDR/DDR2 SDRAM without external level shifters. Typical applications include industrial motor control and PLC logic, video surveillance and image-processing front ends, portable medical instrumentation, low-cost software-defined radio (SDR) baseband, and consumer audio/video processing. The combination of low static power, moderate logic capacity, and a small footprint package makes the EP3C5E144C7N a strong fit for space-constrained, cost-driven designs that still need hardware-accelerated DSP or parallel sensor aggregation. When designing with this device, allocate at least an 8-layer PCB stack-up with continuous GND planes for signal integrity on LVDS pairs, and use the Quartus II / Quartus Prime design suite (13.0 or later recommended for final bitstream) with the Cyclone III device library installed. Decoupling must include 0.1 uF and 10 uF capacitors placed within 5 mm of every VCCIO/VCCINT ball pair, and the exposed thermal pad must be soldered to a 1 sq. inch copper pour to keep junction temperature within the C7 commercial rating. This page synthesizes Cyclone III device specs, Intel / Altera distributor pricing tiers, drop-in same-package and same-family alternatives, and practical Quartus II design notes not found in the standalone manufacturer datasheet PDF.

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EP3C5E144C8 - Cyclone III FPGA, 5K LE, 144-EQFP | Intel
EP3C5E144C8

EP3C5E144C8 - Cyclone III FPGA, 5K LE, 144-EQFP | Intel

The Intel EP3C5E144C8 is a Cyclone III family Field Programmable Gate Array (FPGA) with 5,136 logic elements, 94 user I/Os, and 423,936 bits of embedded memory, fabricated on a 65 nm process and housed in a 144-pin EQFP exposed-pad package. The 'C8' speed grade delivers commercial-temperature operation with a maximum core frequency of approximately 402 MHz, while the device core operates at 1.2 V. An FPGA (Field Programmable Gate Array) is a programmable logic device that combines configurable logic blocks (CLBs), programmable interconnect, and dedicated I/O cells on a single silicon die. FPGAs sit hierarchically within the digital semiconductor stack: FPGA -> programmable logic -> programmable logic device (PLD) -> digital IC -> semiconductor. They are distinguished from CPLDs (less logic, non-volatile) and ASICs (fixed function) by their SRAM-based configuration, parallel architecture, and ability to be re-programmed in-system. The Cyclone III family specifically targets cost-sensitive, low-power applications where high logic density and DSP capability are needed without the expense of high-end FPGAs. Key features include 5,136 logic elements in 321 LABs (Logic Array Blocks), 23 embedded 18x18 multipliers for DSP, 423,936 bits of embedded RAM (RAM bits), 4 PLLs for clock management, and 94 general-purpose I/O pins supporting LVDS, LVCMOS, SSTL, and HSTL I/O standards. The 65 nm process technology reduces static and dynamic power compared to earlier Cyclone generations, and Cyclone III devices do not require a separate configuration device when using active serial (AS) configuration mode. Technical depth: the Cyclone III architecture uses a four-input LUT (Look-Up Table) per logic element, with each LAB containing 16 LEs, dedicated carry chains, and shared arithmetic resources. The embedded multipliers can be configured as 9x9, 18x18, or 36x36 structures, supporting DSP functions up to 287 GMACs (Giga Multiply-Accumulates per second) in the EP3C5. Configuration is supported via JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes, with Quartus II as the primary design tool. Typical applications include industrial motor control, low-cost video processing, consumer electronics display controllers, telecommunications line cards, and education/hobbyist digital design platforms. The EP3C5E144C8 is well-suited to low-volume prototype systems where an ASIC is uneconomical but where logic density above simple CPLD capacity is required. Design consideration: when migrating designs between Cyclone III speed grades, the 'C8' grade is the slowest commercial part; for timing-critical paths the 'C6' or 'C7' grades provide faster Fmax but typically at higher cost and longer lead time. Verify all I/O bank assignments for LVDS compatibility - the EP3C5 supports LVDS on selected I/O standards only. This page synthesizes Intel datasheet specifications, distributor stock and pricing as of 2026-09-09, drop-in alternative MPNs from the same Cyclone III family, and practical FPGA design notes not assembled in any single manufacturer document.

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EP3C5E144C8N - Cyclone III FPGA, 5K LEs, 144-LQFP | Intel
EP3C5E144C8N

EP3C5E144C8N - Cyclone III FPGA, 5K LEs, 144-LQFP | Intel

The Intel (formerly Altera) EP3C5E144C8N is a low-power, low-cost Cyclone III Field-Programmable Gate Array (FPGA) built on a 65 nm process, offering 5,136 logic elements, 423,936 bits of embedded memory, and 23 embedded 18x18 multipliers in a 144-pin LQFP exposed-pad package. It operates from a 1.15 V to 1.25 V core supply, supports up to 94 user I/Os, and is rated for a commercial junction temperature range with the C8 speed grade targeting up to 402 MHz internal operation. What is a Cyclone III FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor device containing programmable logic blocks, interconnect, and I/O cells that engineers can configure after manufacture to implement custom digital circuits. The Cyclone III family sits in the low-power, low-cost tier of the FPGA taxonomy, bridging the gap between small CPLDs and high-end FPGAs. Within Intel's programmable-logic hierarchy, Cyclone III belongs to the cost-optimized Cyclone series, positioned below Cyclone IV/IV GX and Cyclone V for mid-range logic-density applications. Key features of the EP3C5E144C8N include 5,136 vertically arranged logic elements (LEs), 414 Kbits of embedded RAM (M9K blocks), 23 dedicated 18x18 hardware multipliers for DSP, two general-purpose PLLs per device, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and PCI. The exposed-pad LQFP-144 package provides 94 user I/Os while enabling a low-thermal-resistance PCB land pattern. Architecture-wise, Cyclone III uses a 65 nm low-leakage process to achieve static power below 100 mW, with each logic element containing a 4-input LUT, a programmable register, a carry chain, and a register chain. The device embeds MultiTrack interconnect that delivers predictable timing closure even at 402 MHz fMAX for arithmetic pipelines, while the dedicated 18x18 multipliers accelerate DSP blocks without consuming LE resources. Typical applications include industrial motor control, video processing bridges, low-cost digital signal processing front-ends, glue-logic consolidation, and PCI/PCI-X interface bridges. Engineers also use the EP3C5E144C8N in legacy industrial designs that require a 144-pin LQFP for hand-rework or socketed prototyping where fine-pitch BGA packages are not practical. When designing with this device, plan power sequencing so the 1.2 V VCCINT rail ramps before or simultaneously with the 2.5 V/3.3 V VCCIO rails. Decoupling requires 100 nF X7R capacitors placed within 5 mm of every VCCINT/VCCIO pin pair, and the exposed thermal pad must be soldered to a 1 oz copper pour with thermal vias for heat extraction. Bitstream configuration should use a JTAG or AS (active serial) configuration device such as the EPCS4 or EPCS16. This page synthesizes Cyclone III family datasheet specifications, real-time distributor pricing, and 144-LQFP drop-in alternatives that engineers can evaluate without leaving the product page.

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EP3C5E144I7 - Cyclone III FPGA 5K LE, 144-EQFP | Altera / Intel
EP3C5E144I7

EP3C5E144I7 - Cyclone III FPGA 5K LE, 144-EQFP | Altera / Intel

The Altera (now Intel) EP3C5E144I7 is a low-power, low-cost Cyclone III FPGA from the EP3C5 family, packaged in a 144-pin EQFP (Plastic Enhanced Quad Flat Pack) with exposed thermal pad. The device integrates 5,136 logic elements (LEs), 423,936 bits of embedded memory, and 94 user I/O pins fabricated on TSMC's 65nm low-power process. It is rated for industrial temperature range (-40C to +100C junction) and operates from a 1.2V core supply with separate PLL and I/O bank voltages. An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device whose logic fabric is organized as an array of configurable logic blocks (CLBs) connected through programmable interconnect and surrounded by I/O and hard IP blocks (memory, multipliers, PLLs, transceivers). FPGAs occupy the 'programmable logic' tier of the broader semiconductor hierarchy: ASIC < CPLD < FPGA < SoC FPGA < CPU/GPU. Unlike fixed-function ASICs, FPGA logic can be reconfigured in-circuit any number of times, which makes them the standard implementation platform for prototyping, low-volume production, and applications requiring late-stage hardware revision. Cyclone III specifically targets cost- and power-sensitive applications such as industrial control and video/display bridging, where higher-end Stratix devices would be overkill. Key features of the EP3C5E144I7 include two general-purpose PLLs per device, support for multiple I/O standards (LVDS, SSTL, LVCMOS, PCI) with 8 I/O banks, embedded 18x18 multipliers for DSP, and Cyclone III's signature low-power architecture (less than 0.5W static). The 144-pin EQFP exposed-pad package provides enhanced thermal dissipation compared to non-EP variants, important for sustained industrial-grade operation. The device is supported by Altera Quartus II design software (now Intel Quartus Prime) and includes configuration options such as active serial (AS), passive serial (PS), and JTAG. Typical applications span industrial motor control, video processing bridges, automotive infotainment prototypes, custom peripheral glue logic, and portable/mobile embedded platforms. Cyclone III devices balance logic density and power efficiency for designs in the 5K-120K LE range. When designing with the EP3C5E144I7, plan for at least 4 dedicated power rails (VCCINT 1.2V, VCCAUX 2.5V, VCCIO bank-dependent, VCCD_PLL) and follow Altera's decoupling and PCB layout guidelines. Use the Quartus II PowerPlay analyzer early to verify thermal feasibility before committing to PCB layout. This page synthesizes distributor pricing, drop-in pin-compatible variants, and practical Quartus II design notes not consolidated on the manufacturer product page.

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EP3C5E144I7N - Cyclone III FPGA, 5K LE, 144-EQFP | Intel
EP3C5E144I7N

EP3C5E144I7N - Cyclone III FPGA, 5K LE, 144-EQFP | Intel

The Intel (formerly Altera) EP3C5E144I7N is a low-power, low-cost Cyclone® III Field-Programmable Gate Array (FPGA) offering 5,136 logic elements, 423,936 bits of embedded memory, and 94 user I/O pins in a 144-pin EQFP (plastic enhanced QFP) package with exposed pad. It is built on a 60 nm, low-k dielectric process and operates from a 1.2 V core supply with industry-leading static power of approximately 30 mW and total power under 0.75 W at full logic utilization. A Field-Programmable Gate Array (FPGA) is a semiconductor device whose digital logic is defined after manufacture by the user, belonging to the broader family of programmable logic devices (PLDs) and sitting alongside CPLDs, ASICs, and microcontrollers as the highest-density option for custom digital hardware. Cyclone III FPGAs specifically occupy the low-power, low-cost tier of Intel's FPGA portfolio, sitting below Cyclone IV/IV GX and above legacy Cyclone II in feature density. Key features of the EP3C5E144I7N include up to 23 embedded 18×18 multipliers (suitable for DSP blocks), 4 PLLs for clock management, support for external memory interfaces including DDR/DDR2/QDRII SRAM, and a maximum internal clock frequency rating of approximately 437.5 MHz. The device supports JTAG (IEEE 1149.1) configuration via Altera/Intel Quartus II design software, with industrial-grade temperature range of -40 °C to +100 °C. Architecturally, the Cyclone III device integrates dedicated RAM blocks (M9K), multiplier blocks, and Logic Array Blocks (LABs), each containing 16 Logic Elements (LEs). The exposed thermal pad on the EQFP-144 package enables PCB thermal dissipation for fanless industrial designs operating continuously at high ambient temperatures. Typical applications include industrial motor control, video processing bridges, low-cost protocol bridging (I2C/SPI/UART to parallel), LED display controllers, handheld test instruments, and consumer electronics requiring custom glue logic. The 1.2 V core simplifies integration with modern low-voltage SoCs and DDR memory interfaces. When designing with this device, ensure the Quartus II version supports the EP3C5 family - Quartus 13.0sp1 or later is recommended, with the older Quartus II Web Edition 9.1 still functional for low-utilization designs. The exposed pad (EP) must be soldered to a thermal land pattern on the PCB for rated thermal performance; failure to do so will derate the device above 1 W total power. This page synthesizes distributor pricing from DigiKey, Mouser and Arrow, drop-in same-family alternatives with identical EQFP-144 footprints, and practical design notes not consolidated in any single distributor listing.

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EP3C5F256A7N - Cyclone III FPGA, 5136 LE, 256-FBGA | Intel / Altera
EP3C5F256A7N

EP3C5F256A7N - Cyclone III FPGA, 5136 LE, 256-FBGA | Intel / Altera

The Intel (formerly Altera) EP3C5F256A7N is a low-power, low-cost Cyclone III Field Programmable Gate Array (FPGA) featuring 5,136 logic elements, 423,936 bits of embedded memory, and 182 user I/O pins, housed in a 256-ball FineLine BGA (FBGA-256) package. Built on a 65 nm CMOS process, this device operates at a 1.2 V core supply and supports automotive-grade qualification per AEC-Q100 across the extended -40 °C to +125 °C temperature range. The Cyclone III family targets high-volume, cost-sensitive applications where FPGA flexibility must coexist with tight power and BOM budgets. A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that lets engineers implement arbitrary digital logic — from simple glue logic to complete processor cores — through a configuration bitstream loaded into on-chip SRAM. FPGAs sit in the broader hierarchy of programmable logic devices -> programmable logic ICs -> digital ICs -> semiconductors. Unlike ASICs, FPGAs are post-fabrication reprogrammable, enabling rapid prototyping, in-field upgrades, and design error recovery. Cyclone III FPGAs specifically target the low-power, low-density end of the FPGA market. Key features of the EP3C5F256A7N include 321 logic array blocks (LABs), up to 23 embedded 18 × 18 multipliers suitable for DSP operations, embedded M9K memory blocks totaling 423,936 RAM bits, and dedicated global clock networks. The device also includes a hard memory controller, support for external DDR/DDR2 memories, and multiple I/O standards (LVCMOS, LVTTL, LVDS, SSTL) on most user pins. Configuration can be performed via JTAG, Active Serial (AS), or Passive Serial (PS) modes using commodity flash memory. Architecturally, Cyclone III devices use a four-input look-up table (LUT) based logic fabric combined with dedicated routing, variable-sized embedded memory, and hard multipliers. The 65 nm low-power process allows static and dynamic power consumption to be considerably lower than prior Cyclone generations, making the family suitable for thermally constrained enclosures. The device supports hot-socketing and I/O pre-emphasis features that simplify board bring-up. Typical applications include automotive driver-assistance interfaces, industrial machine control, low-cost video processing pipelines, motor drive peripherals, and protocol bridging (I2C/SPI/UART/Ethernet) on factory automation buses. The 256-ball FBGA package exposes enough I/O and memory bandwidth to host a soft Nios II processor plus several custom peripherals in a single device. When designing with this FPGA, allocate at least one configuration mode (typically AS with a serial flash) and provide proper decoupling per the device family datasheet. Thermal dissipation remains modest thanks to the 65 nm low-power process, but designers should still observe the recommended PCB footprint, ball-to-trace via pattern, and keep critical clock traces matched. Verify JTAG chain ordering if multiple devices share the bus. This page synthesizes distributor stock, parametric alternatives, and practical design considerations not found in the manufacturer datasheet alone.

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EP3C5F256C6 - Cyclone III FPGA 5K LE, 256-FBGA | Intel / Altera
EP3C5F256C6

EP3C5F256C6 - Cyclone III FPGA 5K LE, 256-FBGA | Intel / Altera

The Intel (formerly Altera) EP3C5F256C6 is a low-power Cyclone III Field-Programmable Gate Array (FPGA) built on a 65 nm CMOS process, delivering 5,136 logic elements, 182 user I/Os, and 423,936 bits of embedded memory in a 256-ball FineLine BGA (FBGA) package. It operates across a 1.15 V to 1.25 V core voltage range with industrial-grade temperature support, targeting cost-sensitive applications that need a balance of logic density, memory, and DSP capability without the power budget of higher-end FPGA families. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows hardware designers to configure digital logic blocks, routing, and I/O after fabrication. Within the broader hierarchy, FPGAs sit below ASICs in performance-per-watt but above CPLDs in logic capacity, making them the workhorse of rapid prototyping, low-volume production, and accelerator designs. The Cyclone III family specifically targets low static and dynamic power consumption versus the older Cyclone II generation. Key features include 5,136 logic elements, 423,936 RAM bits distributed across M9K blocks, 23 embedded 18x18 multipliers for DSP-style arithmetic, and up to 182 general-purpose user I/Os supporting LVDS, LVCMOS, SSTL, and other single-ended standards. The device integrates four phase-locked loops (PLLs) for clock generation and skew management, plus configuration support via active serial (AS), passive serial (PS), and JTAG interfaces. Architecturally, the Cyclone III LE combines a 4-input look-up table (LUT) with a programmable register, embedded memory blocks, and dedicated multiplier hardware on a low-k, 65 nm process. This combination allows designers to implement soft-core processors (such as Nios II), custom peripherals, and DSP datapaths on a single device while keeping power in the hundreds of milliwatts range. Typical applications include industrial motor control and machine vision, low-cost video processing pipelines, communications protocol bridging (SPI, I2C, UART, Ethernet MAC glue logic), consumer electronics display controllers, and educational/development platforms where the Quartus II design toolchain is supported. The 256-FBGA package offers a compact 17 mm x 17 mm footprint with 1.0 mm ball pitch suitable for multilayer PCBs. When designing with this FPGA, plan power sequencing for the core and I/O banks, provide adequate decoupling on every bank supply, and use the Quartus II PowerPlay estimator early to verify thermal margins under your worst-case toggle rate. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the bare manufacturer datasheet.

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