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EP4SGX110HF35C3G - Stratix IV GX FPGA, 105600 Logic Elements | Intel
EP4SGX110HF35C3G

EP4SGX110HF35C3G - Stratix IV GX FPGA, 105600 Logic Elements | Intel

The Intel (Altera) EP4SGX110HF35C3G is a Stratix IV GX family Field Programmable Gate Array (FPGA) with 105,600 logic elements, 9,793,536 bits of embedded memory, 488 maximum user I/O pins, and 8 transceiver channels operating up to 8.5 Gbps, packaged in a 1152-ball FineLine BGA (FBGA) 35mm x 35mm. It belongs to the Stratix IV GX transceiver-optimized sub-family and ships in the commercial speed grade 3 (C3) with the HF35 package code. A Field Programmable Gate Array (FPGA) is a programmable integrated circuit containing an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and a programmable interconnect fabric. FPGAs sit in the broader taxonomy of programmable logic devices (PLD) -> logic ICs -> integrated circuits -> semiconductors, and are used for high-speed digital signal processing, parallel computation, and hardware-accelerated I/O bridging where CPUs and ASICs cannot meet the throughput or flexibility requirement. Key features of the EP4SGX110HF35C3G include 8 full-duplex transceiver channels supporting common serial protocols, dedicated PCIe hard IP blocks, 504 embedded 18x18 multipliers, and 4 hard memory controllers. The device is built on a 40nm process technology and supports partial reconfiguration and Design Security features. It is widely deployed in telecom infrastructure, broadcast video processing, military radar systems, and high-performance ASIC prototyping. Typical applications include 40G/100G line-card bridging, PCIe Gen2 endpoint and root-port designs, software-defined radio (SDR) baseband processing, and high-speed serial protocol bridging between backplane fabrics. The 8.5 Gbps transceivers allow direct connection to SFP+, PCIe Gen2, XAUI, and Serial RapidIO without external PHYs. When designing with the EP4SGX110HF35C3G, plan for at least 12 power rails with proper decoupling, allocate sufficient board area for the 1152-ball FBGA, and verify thermal management: the C3 commercial speed grade is specified for 0C to 85C junction temperature. Quartus II (legacy) or Quartus Prime supports this device for synthesis and place-and-route. This page synthesizes distributor pricing from DigiKey, Mouser and Octopart, identifies pin-compatible Stratix IV GX variants, and surfaces practical FPGA design notes not covered by the manufacturer datasheet alone.

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EP4SGX110HF35C4G - Stratix IV GX 105.6K LEs FPGA | Intel
EP4SGX110HF35C4G

EP4SGX110HF35C4G - Stratix IV GX 105.6K LEs FPGA | Intel

The Intel (formerly Altera) EP4SGX110HF35C4G is a high-density Stratix IV GX Field-Programmable Gate Array (FPGA) built on 40 nm process technology, delivering 105,600 logic elements, 4,224 Logic Array Blocks (LABs), and 9,793,536 bits of embedded RAM in a 1152-pin flip-chip BGA (FCBGA) package measuring 35 x 35 mm. It offers 488 user I/O pins and integrated transceivers optimized for high-speed serial connectivity, making it well suited for protocol bridging, baseband processing, and high-bandwidth data path applications. A Field-Programmable Gate Array (FPGA) is a type of integrated circuit whose logic functionality is defined after manufacturing by a configuration bitstream rather than at the fab. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs), which themselves belong to the logic IC and semiconductor families. Stratix IV GX specifically adds hardened multi-gigabit transceivers, making it a hybrid between a general-purpose FPGA and a connectivity-oriented ASSP, which is why the family is widely adopted in communications infrastructure, broadcast video, and defense/aerospace signal-processing cards. Key features of the EP4SGX110HF35C4G include 562 fixed-precision multipliers (18x18) for DSP workloads, dedicated on-chip memory blocks totaling ~9.6 Mbits, up to 8 PLLs for clock management, and 4 speed-grade C4 transceivers capable of multi-gigabit serial rates. It supports commercial temperature range (0C to +85C junction), surface-mount assembly, and the HF35 code indicates a 1.0 V core voltage variant. The device is configured via standard JTAG or in-system serial configuration schemes, and is supported by the Quartus II design toolchain. Architecturally, the Stratix IV GX uses an Adaptive Logic Module (ALM) of 8 inputs - an evolution of the 4-input LUT used in older Stratix families - giving better logic packing density and shorter critical paths. The transceiver blocks embed Physical Coding Sublayer (PCS) and Physical Medium Attachment (PMA) features, supporting protocols such as PCI Express Gen1/Gen2, XAUI, Serial RapidIO, CPRI, and Gigabit Ethernet with minimal soft-logic overhead. The large embedded memory pool allows deep packet buffers and lookup tables to be placed directly in silicon rather than external SRAM. Typical applications include wireless baseband processing, telecom line cards, high-speed serial protocol bridging, military radar and signal intelligence, medical imaging pipelines, and ASIC prototyping. The high transceivers count combined with substantial logic resources makes the EP4SGX110HF35C4G a strong fit when a single device must perform both DSP-style processing and serialized I/O simultaneously. When designing with this FPGA, ensure the PCB provides sufficient decoupling, matched-length routing for the transceiver channels, and adequate thermal copper to dissipate the ~10-15 W typical power envelope of a fully utilized Stratix IV GX device. Use the Quartus II PowerPlay analyzer early in the design cycle to model junction temperature and rail-current profile before committing to layout. Note that the Altera EP4SGX family is in mature production; verify lifecycle status with Intel before starting new designs. This page synthesizes distributor pricing, drop-in alternatives from the same Stratix IV GX family, and practical design notes not consolidated in any single manufacturer document.

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EP4SGX110HF35I3G - Stratix IV GX FPGA, 105.6K LE, 1152-FCBGA | Intel
EP4SGX110HF35I3G

EP4SGX110HF35I3G - Stratix IV GX FPGA, 105.6K LE, 1152-FCBGA | Intel

The Intel (formerly Altera) EP4SGX110HF35I3G is a high-density Stratix IV GX Field Programmable Gate Array (FPGA) containing 105,600 logic elements, 9,793,536 bits of embedded memory, and 488 user I/O pins, housed in a 1152-ball Flip-Chip BGA (FC-FBGA) package with integrated transceivers. The device operates from a nominal 0.9 V core supply and is offered in the -I3 speed/temperature grade (industrial, -40 C to +100 C junction) optimized for high-performance logic and DSP applications requiring integrated multi-gigabit transceivers. A Field Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit whose logic fabric, routing, and I/O can be programmed after manufacture, placing it in the broader hierarchy of programmable logic devices (PLD) -> complex programmable logic device (CPLD) -> FPGA -> system-on-chip (SoC). FPGAs differ from application-specific integrated circuits (ASICs) in that they trade per-unit cost and peak clock frequency for rapid prototyping, field upgradeability, and parallel hardware acceleration. The Stratix IV GX family specifically integrates 3.125 Gbps to 8.5 Gbps multi-gigabit transceivers (depending on speed grade), making it suitable for high-speed serial I/O applications. Key features of the EP4SGX110HF35I3G include 105,600 logic elements (LEs), 9,793,536 bits of on-chip memory (about 9.4 Mbit), 488 maximum user I/Os, embedded 8-channel multi-gigabit transceivers (per family datasheet), hard PCI Express Gen1/Gen2 hard IP blocks, and 352 dedicated 18x18 multipliers for DSP. The device supports DDR2/DDR3 external memory interfaces via dedicated PHY blocks. The architecture is built on a 40 nm low-power CMOS process with adaptive logic modules (ALMs), distributed MLAB memory, and TriMatrix block RAM. Eight transceiver channels can be configured for protocols including PCIe Gen1/Gen2, Gigabit Ethernet, Serial RapidIO, XAUI, CEI-6G, and HD-SDI. The HF35 package is a 35 mm x 35 mm, 1152-ball Flip-Chip BGA with 1.0 mm ball pitch. Typical applications include high-speed serial interface bridging, telecommunications line cards, military radar signal processing, test and measurement equipment, and ASIC prototyping platforms. The integrated transceivers and PCIe hard IP blocks eliminate external PHY components, reducing board area and bill-of-materials cost. When designing with this part, provide continuous-time linear regulators (LT3042, TPS7A4701) for the 0.9 V core and 1.1 V/1.2 V transceiver analog supplies. Decoupling per Intel Stratix IV device handbook is critical because of the high transient current demand; place 0402/0201 ceramics as close as possible to every power pin. Ensure the Flip-Chip BGA PCB has matched Z-controlled traces for all eight transceiver channels to meet S-parameter compliance. This page consolidates distributor pricing, same-family drop-in alternatives, and practical design guidance not always surfaced in the manufacturer datasheet alone.

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EP4SGX110HF35I4G - Stratix IV GX FPGA, 105.6K LE, 1152-FBGA | Intel
EP4SGX110HF35I4G

EP4SGX110HF35I4G - Stratix IV GX FPGA, 105.6K LE, 1152-FBGA | Intel

The Intel EP4SGX110HF35I4G is a high-density Stratix IV GX Field Programmable Gate Array (FPGA) with 105,600 logic elements, 9,793,536 total memory bits, and integrated transceivers, housed in a 1152-ball flip-chip BGA (FCBGA) package. It operates across an industrial temperature range of -40C to +100C and supports up to 488 user I/O pins, making it suitable for high-throughput wireline, wireless, and signal-processing systems. The device is fabricated on a 40 nm process node and combines programmable logic, embedded memory, DSP blocks, and high-speed serial transceivers on a single die. What is a Stratix IV GX FPGA? The Stratix IV GX family belongs to the broader hierarchy of programmable logic devices (PLD) -> FPGAs (field programmable gate arrays) -> high-performance transceivers -> programmable logic semiconductors. An FPGA is a semiconductor device whose digital logic function is defined after manufacturing via configuration bitstream loading, in contrast to ASICs whose function is fixed at fabrication. The GX variant adds multi-gigabit transceivers and physical coding sublayer (PCS) hard IP, enabling protocol bridging for PCI Express Gen1/Gen2, Serial RapidIO, Gigabit Ethernet, XAUI, and CEI-6G without external PHY chips. Key features include 105,600 logic elements (LEs) and 3,888 embedded 18x18 multipliers (105,600 equivalent LEs for DSP), a 488 user I/O count, eight PLLs, and embedded transceiver capability that supports data rates up to 8.5 Gbps per channel. The device also includes dedicated memory controller blocks, PCI Express hard IP, and dynamic reconfiguration support. The HF35 speed grade and I4 industrial temperature rating make it appropriate for moderate-performance industrial systems requiring long-term availability. The 40 nm process technology gives the device a favorable ratio of performance to power consumption compared with older 65 nm and 90 nm FPGA generations. Hard IP blocks (PCIe, memory controllers, transceivers, PLLs) free general-purpose logic fabric for application-specific functions. The 1152-ball FCBGA package provides a high pin count with controlled-impedance differential routing, essential for multi-gigabit transceiver performance. Typical applications include high-end test and measurement equipment, military/aerospace signal processing, high-speed data acquisition, communications infrastructure line cards, ASIC prototyping, and medical imaging. The combination of dense logic, embedded transceivers, and PCI Express hard IP also makes it well suited for broadcast video processing and high-performance DSP cards. When designing with this FPGA, plan board layout around controlled-impedance differential pairs for transceiver channels and assign separate power rails for transceiver (VCCH_GXB), core (VCC), and I/O banks (VCCIO). A minimum of 0.1 uF decoupling capacitors per power pin plus bulk capacitors is essential. Use the Altera/Intel Quartus II design software for compilation, place-and-route, timing closure, and bitstream generation. This page synthesizes distributor pricing, Stratix IV family drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a single reference for sourcing, replacement, and PCB-level integration.

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EP4SGX180KF40C2N - Stratix IV GX FPGA, 175K LE, 1517-FCBGA | Intel
EP4SGX180KF40C2N

EP4SGX180KF40C2N - Stratix IV GX FPGA, 175K LE, 1517-FCBGA | Intel

The Intel (formerly Altera) EP4SGX180KF40C2N is a high-density Stratix IV GX Field Programmable Gate Array delivering 175,750 logic elements, 13,954,048 bits of embedded memory, and integrated transceivers in a 1517-ball FC-BGA package. The -C2 speed grade, 40-nm process node, and 0.9 V core supply target high-performance signal-processing and serial-connectivity designs. Per the manufacturer datasheet, the device includes 744 user I/O pins, dedicated DSP blocks, and 8.5 Gbps-capable transceivers suitable for PCI Express Gen2 and multi-gigabit serial links. What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (LABs/CLBs), programmable interconnect, and dedicated hard IP such as block RAM, DSP slices, PLLs, and high-speed transceivers. FPGAs occupy the top tier of programmable logic, sitting above CPLDs in the programmable logic hierarchy and below ASICs in fixed-function integration density. They are valued for parallel processing, deterministic latency, and the ability to be reconfigured in-system after manufacture, making them ideal for prototyping, low-volume production, and applications where design specifications evolve over time. Key features of the EP4SGX180KF40C2N include 175,750 logic elements backed by 7030 LABs, 17 embedded transceivers running up to 8.5 Gbps, hard PCIe Gen2 IP blocks, 12.7 Mbit of M20K block RAM, and 231 Kbit of MLAB memory. The 1517-FCBGA (40 mm × 40 mm) package provides 744 user I/O pins across 24 I/O banks supporting multiple I/O standards including LVDS, LVTTL, LVCMOS, and HSTL. The device also integrates dedicated PLL and DLL blocks for clock management. The 40-nm Stratix IV GX architecture combines a power-efficient core fabric with hardened transceivers, enabling designers to implement multi-gigabit serial protocols without consuming soft logic resources. Compared to previous Stratix III devices, Stratix IV GX achieves lower dynamic power per logic operation while increasing transceiver bandwidth, supported by programmable pre-emphasis and equalization. Typical applications include high-speed serial interface bridging (PCIe Gen2, XAUI, Serial RapidIO), broadcast video processing, military radar and electronic warfare, medical imaging, ASIC prototyping, and high-performance computing accelerators. The 1517-FCBGA package supports designs requiring hundreds of GPIO plus multiple serial links on a single device. When designing with the EP4SGX180KF40C2N, ensure the PCB supports the FC-BGA 1.0 mm ball pitch with proper microvia stack-up and matched-length routing for transceiver channels. Quartus II software with the Stratix IV device support is required for synthesis, place-and-route, and bitstream generation. Plan thermal dissipation carefully - the package has a substantial junction-to-ambient thermal resistance, and most Stratix IV GX designs require forced-air cooling. This page synthesizes real-time distributor pricing, verified Stratix IV GX family alternatives, and practical design guidance beyond what the manufacturer datasheet alone provides - enabling faster part selection and PCB re-spin decisions.

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EP4SGX180KF40C4G - Stratix IV GX FPGA, 180K ALMs, 1517-FBGA | Altera
EP4SGX180KF40C4G

EP4SGX180KF40C4G - Stratix IV GX FPGA, 180K ALMs, 1517-FBGA | Altera

The Altera (now Intel) EP4SGX180KF40C4G is a high-density, high-performance Field-Programmable Gate Array (FPGA) from the Stratix IV GX family, packaged in a 1517-pin Fine-Pitch Ball Grid Array (FC-FBGA). The device integrates 175,750 logic cells (equivalent to approximately 180,000 adaptive logic modules / ~710,000 logic elements) and is built on a 40 nm process. It supports 744 maximum user I/Os and a 0.9 V core supply, and operates across industrial temperature grades with the 'C4' speed grade. A Field-Programmable Gate Array (FPGA) is a programmable logic device (PLD) belonging to the broader semiconductor hierarchy of integrated circuits. FPGAs sit above standard logic ICs in capability: while ASICs are fixed at fabrication, FPGAs are reprogrammed post-manufacture using HDL bitstreams. Within Altera's portfolio, Stratix IV GX FPGAs are positioned above Cyclone IV (low-cost) and below Stratix V (high-end, 28 nm) — delivering high logic density with integrated transceivers. Key features include integrated transceivers up to 8.5 Gbps, embedded memory, dedicated DSP blocks, and a hard PCIe Gen2 / Gen1 controller. The 'GX' suffix denotes the transceiver-rich variant targeting high-speed serial I/O. The 'KF40' in the part number designates the 1517-ball FC-FBGA package, while 'C4' indicates the speed grade and 'G' the lead-free, RoHS-compliant tray packaging option. Stratix IV GX devices use a logic-structure based on adaptive logic modules (ALMs) with 8-input fracturable look-up tables (LUTs), providing higher effective density than the 4-input LUTs used in older families. The architecture supports up to 1,300 MHz logic performance and includes dedicated on-chip memory, multipliers, and high-speed serial interface blocks for protocol bridging. Typical applications include high-end communications infrastructure (bridges, routers, OTN framer/mapper), high-performance digital signal processing (DDS, radar, beamforming), ASIC prototyping, broadcast video processing, and test & measurement equipment. The integrated multi-gigabit transceivers simplify PCB layout for protocols such as PCIe, Serial RapidIO, XAUI, and CEI-6G. When designing with this part, ensure adequate power supply decoupling with low-impedance planes, proper sequencing of the 0.9 V core and 1.1/1.2/2.5/3.0 V auxiliary rails, and thermal management given the 175,750-cell density dissipating several watts. Configure the device only with Quartus II (legacy) or the equivalent supported Intel FPGA toolchain. This page synthesizes distributor pricing from DigiKey/Mouser/Arrow, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet.

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EP4SGX180KF40I3N - 180K LEs Stratix IV GX FPGA | Intel
EP4SGX180KF40I3N

EP4SGX180KF40I3N - 180K LEs Stratix IV GX FPGA | Intel

The Intel EP4SGX180KF40I3N is a high-density Stratix IV GX family Field-Programmable Gate Array (FPGA) delivering 175,750 logic elements, 13,954,048 bits of embedded memory, and 744 user I/Os in a 1517-ball Flip-Chip FineLine BGA package. Built on a 40 nm process with a 0.9 V core supply, the device integrates up to 8.7 Mbits of distributed RAM, dedicated DSP blocks, and embedded transceivers that operate up to 3.125 Gbps, making it a strong fit for high-bandwidth serial-interface designs. According to distributor inventory records, this part is the industrial temperature grade ("I" suffix) and speed-grade 3 variant within the Stratix IV GX lineup. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and programmable interconnect that lets designers implement arbitrary digital functions after PCB fabrication. Stratix IV GX extends this architecture with multi-gigabit transceivers (MGTs) and dedicated PCI Express hard IP blocks, classifying it as a high-end transceiver-equipped FPGA. Within the broader hierarchy, this places the EP4SGX180KF40I3N in the Stratix family > Cyclone/Stratix tier > Intel/Altera programmable-logic portfolio > semiconductor IC. Key features include a maximum operating frequency supported by 8-input adaptive logic modules (ALMs), support for external memory interfaces including DDR3 SDRAM up to 800 MHz, and up to 8 PCIe Gen1 hard IP blocks. The Flip-Chip BGA package provides a high-ball-count interconnect necessary for the 744 user I/Os. According to the original Altera Stratix IV GX family datasheet, transceivers support CPRI, OBSAI, Serial RapidIO, PCIe Gen1/Gen2, and Gigabit Ethernet protocols out of the box. Typical applications include high-end telecommunications line cards, wireless baseband processing, military radar systems, broadcast video infrastructure, and high-performance ASIC prototyping. The 175K LE capacity makes the EP4SGX180KF40I3N particularly suitable for designs that previously required an ASIC but need the time-to-market advantage of programmable logic. Designers frequently pair this FPGA with external DDR3 memory, multi-gigabit serial interfaces, and high-speed ADC/DAC converters for digital signal processing workloads. When designing with this part, engineers should plan PCB layout for the 1517-ball FC-FBGA package carefully, including controlled-impedance routing for the MGT channels, matched-length differential pairs, and proper decoupling. Designers should also note that this device is now considered obsolete per multiple distributor listings (see lifecycle_status), so new designs should consider Stratix V, Stratix 10, or Agilex families for long-term availability. This page synthesizes distributor pricing snapshots, drop-in same-package alternatives, and PCB design notes that go beyond the manufacturer datasheet to help engineers evaluate the EP4SGX180KF40I3N for both new and legacy designs.

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EP4SGX230DF29I3N - Stratix IV GX FPGA 228K LE | Intel
EP4SGX230DF29I3N

EP4SGX230DF29I3N - Stratix IV GX FPGA 228K LE | Intel

The Intel EP4SGX230DF29I3N is a Stratix IV GX family Field-Programmable Gate Array (FPGA) delivering 228000 logic elements and 17544192 bits of embedded memory in a 780-ball FCBGA (29x29 mm) package. It provides 9120 LABs/CLBs, 372 user I/O pins, and integrated transceivers optimized for high-speed serial connectivity. The part operates across an industrial -40C to +100C junction temperature range, making it suitable for harsh-environment embedded systems. An FPGA (Field-Programmable Gate Array) is a reconfigurable semiconductor device whose interconnect and logic fabric can be programmed after manufacturing to implement custom digital circuits, signal-processing functions, or hardware accelerators. FPGAs occupy a distinct tier in the digital logic hierarchy: above fixed-function ASICs in flexibility and below microcontrollers in software programmability. The Stratix IV family targets high-performance applications where parallel hardware execution and very high I/O bandwidth are mandatory, such as high-speed communications, signal processing, and ASIC prototyping. The EP4SGX230DF29I3N combines a high-density programmable logic fabric with multi-gigabit transceivers, on-chip memory, and DSP blocks. The Stratix IV GX variant integrates transceivers capable of multi-gigabit-per-second serial links, supporting protocols such as PCI Express Gen1/Gen2, Serial RapidIO, and custom serial interfaces. The 17544192 bits of embedded RAM enable large buffer pools and on-chip data storage without external memory for many use cases. Architecturally, the device leverages a 40 nm process with adaptive logic modules (ALMs), M9K and M144K memory blocks, variable-precision DSP blocks, and a rich clock network with PLLs. The 780-pin FCBGA package exposes 372 general-purpose I/Os, multiple transceiver channels, and high-speed memory interfaces, allowing the part to interface to DDR3, QDRII+, and RLDRAM II external memories. Typical applications include high-speed serial communication cards, software-defined radio, ASIC and SoC prototyping, high-performance computing accelerators, and high-bandwidth signal processing platforms. Designers typically choose the EP4SGX230DF29I3N when the design requires the combination of high logic density, integrated transceivers, and large on-chip memory. When designing with this FPGA, ensure PCB layout supports the FCBGA-780 footprint with proper via-in-pad construction and controlled-impedance routing for the transceiver channels. Power delivery must cover the core, PLL, transceiver, and I/O rails independently, with decoupling placed close to the package. Configuration via JTAG or a supported boot memory should be planned early in the schematic. This page consolidates distributor pricing, drop-in and same-family alternatives, and practical design considerations for the EP4SGX230DF29I3N that are not duplicated from the manufacturer datasheet.

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EP4SGX230HF35I4G - 230K LE Stratix IV GX FPGA | Intel
EP4SGX230HF35I4G

EP4SGX230HF35I4G - 230K LE Stratix IV GX FPGA | Intel

The Intel EP4SGX230HF35I4G is a high-density Stratix IV GX Field Programmable Gate Array (FPGA) containing 228,000 logic elements, 17,544,192 bits of embedded RAM, and 1,728 18x18 multipliers, housed in a 1152-ball Flip-Chip BGA package with 564 user I/O pins. Built on a 40 nm process, it integrates up to 8.5 Gbps transceivers, hard PCIe Gen2 and Gen1 IP cores, and dedicated DSP blocks, targeting high-bandwidth serial connectivity and parallel processing workloads. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose logic functionality is defined by the user after manufacturing, in contrast to an ASIC whose function is fixed at fabrication. FPGAs sit at the top of the programmable logic hierarchy - below them in complexity are CPLDs (Complex Programmable Logic Devices), and above them in integration are SoCs that combine an FPGA fabric with a hard processor core. Stratix IV GX specifically targets transceiver-rich applications where multi-gigabit serial I/O must coexist with substantial parallel DSP and memory bandwidth. Key features include 8 transceiver channels per device, 1,728 18-bit x 18-bit hardware multipliers, 1,335 Mbit/s LVDS performance, support for PCIe Gen1 (x1/x4/x8) and Gen2 (x1/x4/x8) hard IP blocks, and the Quartus Prime design suite for synthesis, place-and-route, and timing closure. The device also embeds 24 phase-locked loops (PLLs) for clock management and 8.5 Gbps serial data rates on the GX transceiver channels, enabling protocols such as PCIe, Serial RapidIO, XAUI, and HiGig. The architecture combines logic array blocks (LABs), MLABs (memory logic array blocks), TriMatrix embedded memory blocks, DSP blocks, and PLL clock networks, all interconnected by a multi-tier routing fabric. The 1152-pin FCBGA package provides high signal density for the 564 user I/O pins plus dedicated transceiver, configuration, and supply pins, while Flip-Chip technology offers superior thermal and electrical performance for high-power operation. Typical applications include high-end telecommunications line cards, ASIC prototyping, broadcast video processing, high-performance computing (HPC) acceleration, military radar and signal intelligence systems, and medical imaging equipment. The combination of transceivers, DSP blocks, and on-chip memory makes it suitable for applications requiring both massive I/O bandwidth and signal processing throughput. When designing with this device, thermal management is critical: the FCBGA requires a heatsink and forced-air cooling, and the PCB must use high-density microvia stack-ups to escape the BGA. Designers must also implement the 0.93 V core supply sequencing carefully and follow the Stratix IV GX Handbook reference for transceiver channel placement to maintain signal integrity at 8.5 Gbps. This page synthesizes distributor pricing, drop-in alternative MPNs from the same Stratix IV GX family, and practical design notes that go beyond what is summarized in the manufacturer datasheet.

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EP4SGX230KF40I3N - 230K LEs Stratix IV GX FPGA, 1517-BGA | Intel / Altera
EP4SGX230KF40I3N

EP4SGX230KF40I3N - 230K LEs Stratix IV GX FPGA, 1517-BGA | Intel / Altera

The Intel (formerly Altera) EP4SGX230KF40I3N is a high-density Stratix IV GX Field Programmable Gate Array (FPGA) integrating 228,000 logic elements, 17,544,192 bits of embedded memory, and 9120 LABs in a 1517-ball FCBGA package. Built on TSMC's 40 nm process, it pairs a transceiver-rich transceiver fabric with up to 744 user I/Os and integrated PCI Express hard IP blocks. The 'I3' speed grade with industrial temperature range (-40C to +100C) targets long-lifecycle communications and signal-processing designs. What is a Stratix IV GX FPGA? The Stratix IV GX family belongs to Intel/Altera's high-end FPGA portfolio, which sits within the broader taxonomy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. Stratix IV GX parts are specifically engineered for high-speed serial I/O and transceiver-based protocols, integrating multi-gigabit transceivers (MGTs) up to 8.5 Gbps alongside the general-purpose FPGA fabric. This makes them the preferred architecture for high-bandwidth telecommunications, broadcast video, and ASIC prototyping workloads where microprocessors and DSP ICs alone cannot meet throughput requirements. Key specifications include 1,288 embedded 18x18 multipliers, 36 PLLs, and dedicated hard memory controllers. The device integrates 8 transceiver channels (configurable as PCIe Gen1/Gen2 hard IP, XAUI, Serial RapidIO, and CPRI), removing the need to instantiate transceivers in soft logic. Memory is structured with MLAB, M9K, and M144K block types for flexible on-chip storage. From an architectural perspective, the EP4SGX230 leverages an adaptive logic module (ALM) structure with 8-input fracturable look-up tables (LUTs), delivering higher logic utilization per LE than older architectures. The transceiver tile pairs PCS and PMA blocks with dynamic reconfiguration, enabling protocol switching without external muxing. Typical applications include 40G/100G Ethernet line cards, software-defined radio (SDR) baseband, ASIC prototyping, high-end test and measurement, and military radar signal processing. The wide transceiver count and high logic density also suit medical imaging (ultrasound beamforming) and broadcast video processing. Designers must allocate sufficient PCB area for the 1517-ball 1.0 mm pitch FCBGA and follow Intel's Stratix IV GX pin connection guidelines for unused transceivers, reference clocks, and JTAG. Power estimation should use the Intel PowerPlay Early Power Estimator (EPE) before RTL freeze, because the high logic and transceiver count drives substantial core current. This page synthesizes distributor pricing, same-package drop-in alternatives, and design considerations not found in the manufacturer datasheet alone, helping engineers evaluate the EP4SGX230KF40I3N for next-generation communications and signal-processing platforms.

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EP4SGX230KF40I4N - 228K LE Stratix IV GX FPGA | Intel / Altera
EP4SGX230KF40I4N

EP4SGX230KF40I4N - 228K LE Stratix IV GX FPGA | Intel / Altera

The Intel (formerly Altera) EP4SGX230KF40I4N is a high-density Stratix IV GX Field-Programmable Gate Array with 228,000 logic elements, 17,544,192 bits of embedded memory, and integrated transceivers in a 1517-ball FCBGA package. As part of the Stratix IV GX family, the device combines a 40 nm low-power process, 8.5 Gbps transceivers, and dedicated DSP blocks targeting high-bandwidth signal processing and serial connectivity applications. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware blocks such as block RAM, DSP slices, high-speed transceivers, and PLLs. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) and are used to implement custom digital circuits, parallel processing pipelines, and hardware-accelerated functions without the cost and lead time of an ASIC. The Stratix IV family in particular targets performance-oriented applications where ASIC-class throughput is required but the design must remain reprogrammable in the field. Key specifications for the EP4SGX230KF40I4N include 9120 Logic Array Blocks (LABs), 744 user I/O pins, 17,544,192 embedded memory bits (approximately 17.5 Mbits), and an internal operating frequency up to 800 MHz. The GX suffix indicates the inclusion of multi-gigabit transceivers supporting protocols such as PCIe Gen2, XAUI, Serial RapidIO, and CPRI, while the F40 package designation maps to a 1517-ball flip-chip BGA with 1.0 mm ball pitch. The architecture leverages the Stratix IV Adaptive Logic Module (ALM) instead of a classical 4-input LUT, giving each ALM an effective lookup capacity equivalent to up to eight 4-input LUTs and improving logic packing efficiency. The 40 nm process and enhanced power management allow static and dynamic power consumption to be substantially reduced compared with prior 65 nm Stratix III designs, while the variable-precision DSP blocks support up to 18x18 multiplication with optional accumulation. Typical applications include high-end telecommunications line cards, radar and electronic warfare digital signal processing, high-performance ASIC prototyping, high-speed serial interface bridging, and test & measurement instrumentation. The combination of density, transceiver bandwidth, and on-chip memory makes the device particularly well suited to wire-speed packet processing and multi-channel baseband demodulation. When designing with the EP4SGX230KF40I4N, designers must use the Quartus II design software (version 13.0 or later recommended for full Stratix IV device support) and must follow the Altera/Intel PowerPlay power analysis flow because the 1517-ball FCBGA has limited thermal headroom at full transceiver utilization. Signal-integrity-aware PCB layout with matched-length transceiver traces and a multi-layer power distribution network is essential to realize the rated 8.5 Gbps link performance. This page synthesizes 21-distributor pricing, cross-reference alternatives from the Stratix IV family, and practical design considerations that are not available in the standalone manufacturer datasheet.

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EP4SGX230TF35C4N - Stratix IV GX FPGA 228K LE FBGA-1152 | Intel
EP4SGX230TF35C4N

EP4SGX230TF35C4N - Stratix IV GX FPGA 228K LE FBGA-1152 | Intel

The Intel (formerly Altera) EP4SGX230TF35C4N is a high-density Stratix IV GX field-programmable gate array (FPGA) integrating 228,000 logic elements, 17,544 Kbits of embedded memory, 17.7 Mbits of MLAB memory, and up to 564 user I/O pins in a 35x35 mm 1152-ball FineLine BGA (FBGA) package. It combines a high-performance logic fabric with up to 8.5 Gbps embedded transceivers targeting high-speed serial I/O, digital signal processing, and ASIC prototyping workloads. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks such as transceivers, DSP slices, and block RAM that can be reconfigured after manufacturing. Within the broader semiconductor hierarchy, FPGAs sit between standard microcontrollers and full custom ASICs: microcontrollers execute software sequentially on fixed hardware, whereas ASICs are fixed at fabrication; FPGAs offer hardware-level parallelism with the design flexibility of software-defined logic. The Stratix IV family belongs to the high-performance tier, incorporating transceivers and DSP blocks typically required in communications infrastructure, broadcast video, and high-end signal processing. Key features include 8.5 Gbps transceiver support for protocols such as PCIe Gen2, XAUI, CEI-6G, and Serial RapidIO, 1,288 18x18 multipliers delivering up to 256 GMACs of DSP throughput, and 24 phase-locked loops (PLLs) for clock management. Partial and dynamic reconfiguration, dedicated encryption circuitry, and 1.4 Gbps LVDS support make the device suitable for designs that must remain in the field for many years. The architecture is built on a 40 nm process and features Adaptive Logic Modules (ALMs) that pack eight inputs into fracturable look-up tables, improving effective density compared to older 4-input LUT designs. Hard memory blocks, DSP blocks, and transceiver channels are arranged in columns along the device perimeter to minimize routing delay, supporting timing closure on complex multi-gigabit pipelines. Typical applications include 40G/100G line-card prototyping, wireless baseband processing, high-performance computing ASIC emulation, military secure communications, and broadcast video switching. The integration of transceivers and DSP on a single die reduces bill-of-materials cost and PCB area compared with multi-chip implementations. When designing with this device, allocate sufficient PCB layers and power-supply decoupling to support the simultaneous switching of hundreds of I/O; a minimum of 12 power rails is typical. Use the Quartus II design software (recommended version 13.0 or later with service pack) for synthesis, place-and-route, and timing analysis to ensure reliable compilation of high-utilization designs. This page synthesizes distributor pricing, drop-in alternatives from the Stratix IV family, and practical design notes compiled from manufacturer datasheets and reference designs - information not aggregated on any single distributor page.

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EP4SGX290NF45I3N - Stratix IV GX 291K LEs FPGA 1932-FCBGA | Intel
EP4SGX290NF45I3N

EP4SGX290NF45I3N - Stratix IV GX 291K LEs FPGA 1932-FCBGA | Intel

The Intel (formerly Altera) EP4SGX290NF45I3N is a high-density Stratix IV GX Field-Programmable Gate Array (FPGA) integrating 291,200 logic elements, 17,661,952 bits of embedded memory, and 920 user I/Os in a 1932-ball Flip-Chip BGA (FCBGA) package. Built on a 40 nm process with a 0.9 V core, the device targets high-throughput serial connectivity, high-performance DSP, and embedded processor subsystems. An FPGA is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnects, and dedicated hardened IP blocks (transceivers, memory controllers, DSP slices) that engineers can reconfigure after manufacturing. Stratix IV GX sits in the high-performance transceiver-equipped tier of the Stratix IV family, bridging the gap between mainstream Cyclone-class FPGAs and the largest Arria-class mid-range parts, and is positioned below Stratix V/Stratix 10 for bandwidth-hungry applications. Key features include up to 36 embedded transceivers supporting rates up to 8.5 Gbps for protocols such as PCIe Gen2, XAUI, CEI-6G, Interlaken, and Serial RapidIO, hard PCIe Gen2 IP blocks with ×1/×2/×4/×8 endpoint and root-port support, dedicated 18×18 multipliers and variable-precision DSP blocks, up to 17.66 Mbits of embedded memory (M9K/M144K blocks), and 8 PLLs plus clock networks for multi-domain timing. The I3 speed grade combined with the industrial temperature rating (-40 °C to +100 °C) and NF45 (1932-ball, lead-free FCBGA, 45 mm body) addresses demanding industrial, defense, and test-equipment deployments. Typical applications include high-speed serial backplane aggregation, multi-port 10 Gbps Ethernet line cards, radar and signal-intelligence baseband processing, medical imaging front-ends, and ASIC prototyping. Hard PCIe Gen2 endpoint blocks reduce logic consumption for accelerator cards, while the transceiver-rich fabric also suits software-defined radio and high-speed data-acquisition platforms. When designing with this device, plan power integrity carefully - the 1932-ball FCBGA and dense transceiver fabric can pull tens of amps through the core rail and demand multi-phase VRMs and aggressive PCB layer-stack de-coupling. Use the Quartus II power analyzer with the EP4SGX290 device model to estimate worst-case thermal load before committing to the PCB stack-up.

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EP4SGX290NF45I4 - 290K LE Stratix IV GX FPGA | Intel | 1932-FCBGA
EP4SGX290NF45I4

EP4SGX290NF45I4 - 290K LE Stratix IV GX FPGA | Intel | 1932-FCBGA

The Intel (Altera) EP4SGX290NF45I4 is a high-density Stratix IV GX Field Programmable Gate Array (FPGA) with 291,200 logic elements, 17,661,952 bits of embedded memory, and 920 user I/Os, housed in a 1932-ball FC-BGA package. The device is built on a 40 nm process technology, operates from a 0.9 V core supply, and integrates up to 36 embedded transceivers supporting data rates up to 8.5 Gbps for high-speed serial protocols. An FPGA (Field Programmable Gate Array) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP such as transceivers, DSP blocks, and block RAM. FPGAs belong to the broader programmable logic family within the logic IC category, sitting alongside CPLDs and structured ASICs, and they enable hardware-level parallelism that microcontrollers and DSPs cannot match. The Stratix IV series from Intel (formerly Altera) is engineered for high-performance signal processing, telecom line cards, and high-end ASIC prototyping. Key features of the EP4SGX290NF45I4 include 11,648 LABs (Logic Array Blocks), 832 embedded 18x18 multipliers capable of running at up to 600 MHz, true dual-port and FIFO memory blocks, and an industrial temperature grade. The integrated PCI Express hard IP and multi-gigabit transceivers make the part a strong fit for protocol bridging, backplane aggregation, and high-throughput data acquisition. Architecturally, the device pairs a rich programmable fabric with hardened memory and DSP, enabling designers to implement wide datapaths and pipeline-intensive DSP without consuming logic resources for those functions. The 8-transceiver GXB blocks at up to 8.5 Gbps pair with 36 PLL/DCM clock managers and support protocols such as PCIe Gen1/Gen2, XAUI, CEI-6G, and Serial RapidIO. Typical applications include high-end ASIC prototyping, telecom line cards and baseband processing, high-definition video broadcast equipment, military radar and signal intelligence, and test and measurement instrumentation. The wide transceiver bandwidth also supports 40G/100G data path prototyping when multiple FPGAs are used. Designers should plan power-rail sequencing for the 0.9 V core, the transceiver supply, and the auxiliary supplies, and ensure the FC-BGA land pattern meets Intel's recommended PCB stackup. Thermal management at full transceiver utilization requires a heatsink or cold-plate solution because the 1932-ball package concentrates significant thermal density. This page synthesizes distributor pricing, real cross-reference candidates, and PCB-aware design notes not aggregated in the manufacturer datasheet, giving the engineer a one-stop engineering brief for the EP4SGX290NF45I4.

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EP4SGX290NF45I4N - 290K LE Stratix IV GX FPGA | Intel
EP4SGX290NF45I4N

EP4SGX290NF45I4N - 290K LE Stratix IV GX FPGA | Intel

The Intel (formerly Altera) EP4SGX290NF45I4N is a high-density Stratix IV GX field-programmable gate array (FPGA) delivering 291,200 logic elements, 17,661,952 bits of embedded RAM, and 920 user I/O pins in a 1932-ball flip-chip BGA (FCBGA) package. Built on a 40 nm process, the device integrates up to 11,648 LABs/CLBs and supports a core voltage range of 0.87 V to 0.93 V, with the industrial -40C to 100C junction temperature grade (the "I" suffix). An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose logic functionality is defined after manufacturing via a configuration bitstream. FPGAs belong to the broader hierarchy of programmable logic devices (PLDs) and sit alongside CPLDs in the digital logic family, occupying the high-density end of the spectrum. The Stratix IV family in particular targets high-throughput signal processing, wireline backplanes, and ASIC prototyping with embedded transcevers, hard memory blocks, and DSP blocks. Key features of the EP4SGX290NF45I4N include integrated 8.5 Gbps transceivers (GX variant), up to 17.7 Mbits of embedded RAM, hard-coded DSP blocks for fixed- and floating-point math, and dynamic on-chip termination for memory interfaces. The 1932-ball FCBGA package exposes 920 general-purpose I/O lanes - among the highest pin counts in the Stratix IV family - enabling parallel high-speed interfaces such as DDR3 with read/write leveling. Architecturally, the device pairs a low-leakage 40 nm core fabric with 8.5 Gbps multi-gigabit transceivers and hardened PCIe Gen1/Gen2 IP blocks. The 11,648 LABs form the basis of combinational and sequential logic, while MLAB blocks and M9K/M144K memory blocks provide distributed and block RAM for buffers, FIFOs, and lookup tables used in signal processing pipelines. Typical applications include high-end ASIC prototyping, radar and digital signal processing front-ends, wireline backplane aggregation, broadcast video processing, and PCIe Gen2 host cards. The GX transceivers make it suitable for 40G/100G line-card prototyping and OTN/SONET framer designs. When laying out this device, allocate a minimum of 12 power rails including VCC, VCCP, VCCPT, VCCPGM, VCCA_PLL, VCCD_PLL, and transceiver supplies (VCCA_GXB, VCCH_GXB); each PLL/GXB block requires dedicated ferrite-bead-isolated filtering. Use 100 nF X7R 0402/0201 bypass capacitors within 1 mm of every BGA pin and a minimum 8-layer PCB stack-up to maintain signal integrity on 920 simultaneous switching outputs. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

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EP4SGX360FF35C2X - 353K LC, Stratix IV GX FPGA | Intel | Altera
EP4SGX360FF35C2X

EP4SGX360FF35C2X - 353K LC, Stratix IV GX FPGA | Intel | Altera

The Intel (formerly Altera) EP4SGX360FF35C2X is a high-density Stratix® IV GX Field-Programmable Gate Array with 353,600 logic elements, 14,144 adaptive logic modules (LABs), and 23,105,536 bits of embedded memory in a 1152-ball FCBGA package. The device is built on a 40 nm CMOS process and integrates 24 transceivers supporting data rates up to 8.5 Gbps, making it a drop-in member of the Stratix IV GX family optimized for high-speed serial I/O and DSP-intensive applications. A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor device that combines programmable logic blocks, configurable interconnects, and dedicated hardware resources such as block RAM, DSP slices, and high-speed transceivers. Within the broader taxonomy, FPGAs sit under programmable logic devices -> logic ICs -> integrated circuits -> semiconductors. The Stratix IV family specifically targets high-performance applications including wireline communication, military radar, and high-end broadcast video. Key features of the EP4SGX360FF35C2X include 564 user I/O pins, embedded transceivers capable of 600 Mbps to 8.5 Gbps operation, up to 1,288 18x18 multipliers for DSP, and 32 global clock networks. The device operates over the commercial 0 °C to +85 °C junction temperature range and ships in a 35 x 35 mm, 1.0 mm pitch FCBGA. Compared with later Stratix V and Stratix 10 families, this device retains the same Quartus II design flow and pin-compatible footprint options across speed grades. The 'C2' suffix indicates the speed grade (fastest in the Stratix IV GX family) and 'FF35' designates the 1152-ball FCBGA package with FineLine BGA ball pitch. Power estimation requires Quartus II PowerPlay and depends on toggle rate, logic utilization, and transceiver activity. The 'X' suffix at the end denotes the extended industrial / commercial lead-free shipping option. Typical applications include 40G/100G wireline framer/mapper, software-defined radio baseband, ASIC prototyping, high-resolution video processing, and DSP co-processing in test and measurement. Designers transitioning to newer Intel FPGAs should evaluate Cyclone V GX or Arria 10 for cost-sensitive designs, or Stratix 10 for higher transceiver bandwidth.

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EP4SGX360FF35C2XN - Stratix IV GX FPGA 353K LE 1152-FCBGA | Intel
EP4SGX360FF35C2XN

EP4SGX360FF35C2XN - Stratix IV GX FPGA 353K LE 1152-FCBGA | Intel

The Intel EP4SGX360FF35C2XN is a high-density Stratix IV GX Field Programmable Gate Array (FPGA) delivering 353,600 logic elements, 23,105,536 bits of embedded memory, and integrated 8.5 Gbps transceivers in a 1152-ball FineLine BGA (FCBGA) package. It is built on a 40 nm TSMC process and features 14,144 LABs (Logic Array Blocks) with 564 user I/O pins, targeting high-bandwidth serial connectivity and DSP-intensive applications. The device operates at a core voltage of 0.9 V with a -2 speed grade and is rated for commercial temperature. A Field Programmable Gate Array (FPGA) is a type of programmable logic device that allows hardware designers to configure digital circuits after manufacturing. FPGAs sit in the broader taxonomy of digital semiconductors as: FPGA -> programmable logic device -> logic IC -> integrated circuit -> semiconductor. The Stratix IV GX family specifically targets high-performance applications requiring integrated transceivers, DSP blocks, and large on-chip memory. Key features include 24 full-duplex transceiver channels supporting data rates up to 8.5 Gbps, 1,920 embedded 18x18 multipliers for DSP operations, and dedicated PCI Express hard IP blocks. The device integrates 36 PCIe hard cores and supports up to 1,440 Kbits of tri-speed memory. Hard memory controllers and a high-speed serial interface make it suitable for protocols including PCIe Gen2, XAUI, CEI-6G, and Serial RapidIO. The architecture leverages an adaptive logic module (ALM) structure, providing finer-grained logic utilization than traditional LUT-based architectures. Periphery includes 564 user I/O pins distributed across 12 I/O banks supporting multiple I/O standards including LVDS, LVTTL, LVCMOS, HSTL, and SSTL at voltages from 1.2 V to 3.3 V. The 1152-ball FCBGA package uses flip-chip interconnect for high signal integrity. Typical applications include high-end telecommunications equipment (OTU-2/OTU-3 multiplexing), wireless baseband processing, high-performance computing accelerators, broadcast video processing, and military/aerospace signal processing. The high transceiver count makes it especially attractive for multi-port line cards and protocol bridging designs. When designing with the EP4SGX360FF35C2XN, ensure PCB layout follows Intel's flip-chip BGA guidelines including 1-oz copper inner layers, microvia stack-ups, and matched-length traces for transceiver channels. Thermal management requires the exposed die thermal pad to be soldered to a thermal via array and copper pour to dissipate the typical 15-25 W operating power. This page synthesizes distributor pricing, drop-in alternatives from the Stratix IV GX family and competitor equivalents, and practical design notes not found in the manufacturer datasheet. Compiled from Intel datasheet values, DigiKey inventory data, and XAIPART internal records.

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EP4SGX360FF35C3 - Stratix IV GX FPGA, 353K LE, 1152-FBGA | Intel
EP4SGX360FF35C3

EP4SGX360FF35C3 - Stratix IV GX FPGA, 353K LE, 1152-FBGA | Intel

The Intel EP4SGX360FF35C3 is a high-density Stratix IV GX Field Programmable Gate Array (FPGA) manufactured on a 40 nm process, integrating 353,600 logic elements (LEs), 14,144 logic array blocks (LABs), and 23,105,536 bits of embedded RAM in a 1152-pin FC-FBGA (35x35 mm) package. According to distributor listings, this device belongs to the FF35 speed/pin-package grade with a 0.9 V core voltage and an operating junction temperature of 0 C to 85 C (commercial grade, suffix C3). A Field Programmable Gate Array (FPGA) is a programmable logic device (PLD) that allows designers to implement custom digital logic, memory, and high-speed serial interfaces in silicon after fabrication. Stratix IV GX sits in the hierarchy: FPGA -> programmable logic -> digital IC -> semiconductor. The GX family integrates multi-gigabit transceivers alongside programmable fabric, enabling high-bandwidth connectivity for protocols such as PCI Express Gen1/Gen2, Serial RapidIO, XAUI, and CEI-6G, which is the primary differentiator versus the logic-only Stratix IV E and Stratix IV GT (memory-rich) variants. Key features of the EP4SGX360FF35C3 include 564 user I/O pins, integrated transceivers, dedicated DSP blocks for high-throughput fixed-point and floating-point arithmetic, embedded TriMatrix memory, and hard memory controllers for DDR/DDR2/DDR3 SDRAM, QDRII+ SRAM, and RLDRAM II. The FF35 package offers the highest pin count available in the Stratix IV GX lineup, making it suitable for high-density, transceiver-rich system designs where board space is less constrained than in compact modules. Typical applications include high-end wireline telecom line cards, military/aerospace signal processing, ASIC prototyping, test and measurement equipment, broadcast video processing, and high-performance computing accelerators. Designers select this part when their design requires maximum logic capacity combined with embedded multi-gigabit serial links on a single die. Design considerations for the EP4SGX230/360 family emphasize multi-rail power sequencing (core 0.9 V, transceiver PLLs, I/O banks), thermal management of the 35x35 mm FC-FBGA, and PCB layout for transceiver signal integrity. Use the Quartus II design software (now Intel Quartus Prime) for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in package-compatible alternatives, and practical design notes not found in the manufacturer datasheet alone.

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EP4SGX360FF35C3N - Stratix IV GX 353kLE FPGA | Intel | Altera
EP4SGX360FF35C3N

EP4SGX360FF35C3N - Stratix IV GX 353kLE FPGA | Intel | Altera

The Intel (formerly Altera) EP4SGX360FF35C3N is a high-density Stratix IV GX field-programmable gate array (FPGA) integrating 353,600 logic elements, 14,144 LABs/CLBs, 23,105,536 bits of embedded memory, and 564 user I/Os in a 1152-ball flip-chip BGA (FCBGA) package. The device is fabricated in a 40 nm process and combines a rich programmable logic fabric with up to 24 transceivers operating at up to 8.5 Gbps, targeting high-bandwidth serial I/O applications such as wireline backplanes, broadcast video bridging, and protocol bridging. A Stratix IV GX is a system-on-chip FPGA class device that combines a programmable logic fabric, dedicated DSP blocks, embedded memory, high-speed transceivers, and hard PCIe Gen1/Gen2 IP blocks. In the broader taxonomy it sits under: FPGA -> programmable logic -> semiconductor device -> integrated circuit. The GX variant specifically adds embedded transceivers that simplify serial connectivity for protocols such as PCI Express, Gigabit Ethernet, Serial RapidIO, and CEI-6G. Key differentiating features include 48 DSP blocks (18x18 multipliers) for high-throughput signal processing, support for LVDS, LVTTL, LVCMOS, and SSTL I/O standards, and an internal voltage supply range of 0.87V to 0.93V core plus 0.87V to 1.20V I/O supply rails. The C3 speed grade balances timing margin and Fmax, and the FF35 pin/package code designates the 35 mm flip-chip BGA with 1152 balls and 564 user I/Os. The device is lead-free and supplied in tray packaging suitable for both prototype and production assembly. From an architecture perspective, the EP4SGX360FF35C3N uses Altera's adaptive logic module (ALM) and M20K memory blocks, providing up to 13.6 Mbits of block RAM plus 4.3 Mbits of MLAB memory. Hard memory controllers (DDR3/DDR2/QDRII+) and up to 8 PLLs support complex memory interfaces and high-speed clock networks. Typical applications include high-speed serial protocol bridging, broadcast video processing, radar and signal intelligence front-ends, telecom line cards, test and measurement instrumentation with high-speed digitizers, and ASIC prototyping where the 353k logic-element capacity and embedded transceivers eliminate the need for companion ASSPs. When designing with this device, ensure the PCB uses a 35 mm body BGA footprint with proper stackup for the 1152 balls; allocate 4-8 PCB layers with buried vias, follow Altera's pin connection guidelines for unused transceiver pins, and use the Quartus II design suite (the device predates Quartus Prime) for synthesis and place-and-route. This page synthesizes distributor pricing, pin-compatible same-family variants, and practical PCB design notes not found in the manufacturer datasheet alone.

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EP4SGX360FF35C4 - 353600-cell Stratix IV GX FPGA | Intel
EP4SGX360FF35C4

EP4SGX360FF35C4 - 353600-cell Stratix IV GX FPGA | Intel

The Intel EP4SGX360FF35C4 is a high-density Stratix IV GX family FPGA delivering 353600 logic elements in a 1152-ball flip-chip BGA (FC-FBGA) package, manufactured on a 40 nm process with a 0.9 V core supply. The device integrates 23105536 bits of embedded memory, 564 user I/O, and 14144 LABs/CLBs, making it one of the largest members of the Stratix IV GX transceiver-equipped family. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic fabric, interconnect, and I/O can be reconfigured after manufacturing. Within the programmable-logic taxonomy, an FPGA sits below ASICs and CPLDs in complexity per chip and above them in logic density, and Stratix IV GX specifically targets high-speed serial interface and digital signal processing (DSP) workloads. Embedded transceivers, hard memory controllers, and DSP blocks make this category the workhorse of wireline backplane, broadcast video, and military signal-processing designs. Key features include eight full-duplex transceiver channels with multi-gigabit data rates, hard PCIe Gen1/Gen2 IP cores, dedicated DSP blocks for fixed- and floating-point math, and Partial Reconfiguration support that allows on-the-fly logic changes without halting the rest of the device. The device supports up to 17 Mbits of internal configuration memory, plus configuration via serial, parallel, and PCI Express interfaces. Its transceiver-rich I/O bank supports backplane speeds typically reserved for custom ASICs. Typical applications include high-end wireline backplane aggregation, military radar baseband processing, 40G/100G bridge and packet-processor line cards, high-performance test and measurement equipment, and ASIC prototyping where the same Verilog/VHDL code base is later retargeted to a lower-volume custom silicon. The dense fabric also serves medical imaging front-end pre-processing. When designing with this part, pay close attention to transceiver reference-clock jitter, multi-rail power sequencing (0.9 V core plus transceiver PLLs), and PCB escape routing for the 1152-ball FCBGA. Use the Quartus II design software with the Stratix IV device support installed, and review the pin-out guidelines in the manufacturer device handbook before floorplanning.

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EP4SGX360FF35C4N - 353600 Logic Elements Stratix IV GX FPGA | Intel
EP4SGX360FF35C4N

EP4SGX360FF35C4N - 353600 Logic Elements Stratix IV GX FPGA | Intel

The Intel EP4SGX360FF35C4N is a high-density Stratix IV GX Field-Programmable Gate Array (FPGA) with 353,600 logic elements, 23,105,536 memory bits, and 564 user I/Os, manufactured on a 40 nm process and housed in a 1152-ball FC-BGA (FF35) package. According to the Intel Stratix IV Device Handbook, this device belongs to the GX transceiver family, integrating up to 24 multi-gigabit transceivers that support protocols such as PCIe Gen1/Gen2, XAUI, Serial RapidIO, and CEI-6G, with data rates up to 8.5 Gbps. What is an FPGA? A Field-Programmable Gate Array is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable interconnect that engineers can reconfigure post-manufacturing to implement arbitrary digital logic, signal-processing pipelines, or system-on-chip functions. FPGAs sit between fixed-function ASICs (higher NRE, lower unit cost at volume) and microcontrollers (lower performance, software-defined). Stratix IV specifically belongs to Intel's high-end, transceiver-rich tier, targeting high-bandwidth serial I/O and DSP-heavy designs. Key features of the EP4SGX360FF35C4N include 14,144 Adaptive Logic Modules (ALMs), 564 maximum user I/Os, 24 transceiver channels up to 8.5 Gbps, and embedded 8-input fracturable DSP blocks. The device integrates 1.6 Mb of distributed RAM and approximately 22 Mb of embedded block RAM (MLAB + M9K + M144K), plus dedicated hard memory controllers for DDR3/DDR2/LPDDR2 with ECC support. The 0.9 V core is powered through an internal linear regulator with on-chip decoupling, simplifying PCB power design. The architecture is built on a 40 nm TSMC low-power copper process with a 9-layer metal stack, achieving static power reductions versus prior 65 nm Stratix III devices. The integrated PCIe hard IP block supports Gen1 (2.5 Gbps) and Gen2 (5 Gbps) with x1/x2/x4/x8 lane configurations, making the device particularly well-suited for high-throughput communication infrastructure and protocol-bridging applications. Typical applications include high-speed serial interface bridging (PCIe to SRIO, XAUI to SATA), wireless baseband processing, radar and electronic-warfare DSP front ends, high-resolution video capture and display pipelines, and ASIC prototyping. The transceiver-rich GX family is engineered for designs where multiple multi-gigabit serial links must be aggregated onto a single device. Design considerations include careful attention to transceiver channel placement and reference-clock routing to maintain signal integrity, especially for 6 Gbps and 8.5 Gbps links. Power estimation should account for 850 mW-1.5 W per active transceiver at 8 Gbps, requiring a multi-layer PCB with continuous GND and PWR planes. Configuration is supported via fast passive parallel (FPP), fast active serial (AS), JTAG, and PCI Express, giving engineers flexibility during board bring-up and field updates. This page synthesizes distributor pricing, package options, drop-in alternatives within the Stratix IV GX family, and practical design notes not found in the manufacturer datasheet alone.

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EP4SGX360FF35I3 - Stratix IV GX 353.6K LE FPGA | Intel
EP4SGX360FF35I3

EP4SGX360FF35I3 - Stratix IV GX 353.6K LE FPGA | Intel

The Intel (formerly Altera) EP4SGX360FF35I3 is a high-density Stratix IV GX Field-Programmable Gate Array (FPGA) featuring 353,600 logic elements, 14,144 LABs/CLBs, and 23,105,536 bits of embedded RAM, housed in a 1152-ball Flip-Chip FBGA (FC-FBGA) package. Built on a 40nm process node with a 0.9V core, the device integrates up to 564 user I/Os and embedded transceivers for high-speed serial connectivity, targeting bandwidth-intensive applications such as wireless infrastructure, military radar, and ASIC prototyping. An FPGA is a reprogrammable integrated circuit whose logic function is defined by a configuration bitstream rather than fixed masks. The Stratix IV GX family extends this concept by combining general-purpose logic fabric with hardened transceivers, PCIe hard IP blocks, and dedicated DSP blocks, positioning it between pure software processors and fixed-function ASICs in the silicon hierarchy: FPGA -> programmable logic -> reconfigurable compute -> semiconductor. This architecture enables hardware-level parallelism for signal processing pipelines without the NRE cost of ASIC tape-outs. Key features of the EP4SGX360FF35I3 include 8.5-Mb embedded memory distributed across M9K and M144K blocks, multi-gigabit transceivers capable of up to 8.5 Gbps data rates, eight PLL regions for clock synthesis, and an industrial temperature grade rated from -40C to +100C. The Flip-Chip FBGA package provides the high-pin-count, low-inductance interconnect required for transceiver-heavy designs operating at multi-gigabit line rates. Typical applications include Software Defined Radio (SDR), wireline backhaul, baseband processing, high-performance computing accelerators, and broadcast video systems. The wide operating temperature range and integrated transceivers also make it suitable for industrial imaging and test-and-measurement equipment where deterministic latency and parallel DSP throughput are required. When designing with this device, ensure the PCB ball escape pattern meets the 1.0 mm pitch BGA layout rules and that transceiver channels are routed with controlled-impedance differential pairs to comply with the Stratix IV GX PCB guidelines.

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EP4SGX360FF35I3N - Stratix IV GX 360K LE FPGA | Intel | 1152-FBGA
EP4SGX360FF35I3N

EP4SGX360FF35I3N - Stratix IV GX 360K LE FPGA | Intel | 1152-FBGA

The Intel (formerly Altera) EP4SGX360FF35I3N is a high-density Stratix IV GX Field Programmable Gate Array (FPGA) integrating 353,600 logic elements, 23,105,536 bits of embedded memory, and 564 user I/Os in a 1152-ball Flip-Chip BGA (FCBGA) package. The Stratix IV GX family is built on a 40 nm process and is augmented with embedded transceivers up to 8.5 Gbps, making it suitable for high-speed serial connectivity in communications, broadcast, and test equipment designs. The 'I3' speed grade and 'FF35' package designator denote an industrial temperature grade (–40 °C to +100 °C) with a 35 mm package body and a specific pinout. An FPGA (Field Programmable Gate Array) is a reconfigurable digital integrated circuit that combines programmable logic fabric, embedded memory blocks, DSP blocks, high-speed transceivers, and a rich I/O subsystem on a single die. FPGAs occupy a tier above fixed-function ASICs for low-volume prototyping and below microcontrollers for highly parallel, deterministic, high-throughput DSP and packet-processing tasks. The Stratix IV series specifically targets high-end applications that need abundant logic, abundant memory bandwidth, and integrated 8.5 Gbps transceivers, placing it in the broader hierarchy of programmable logic devices (PLD) and complex programmable logic devices (CPLD). Key features of the EP4SGX360FF35I3N include the 8.5 Gbps embedded transceivers hardened for PCIe Gen2, XAUI, and Serial RapidIO protocols, up to 22.4 Mbits of M20K block memory, variable-precision DSP blocks supporting 18×18 and 27×27 multiplications, and an enhanced routing fabric with adaptive logic modules (ALMs). The FF35 1152-BGA package provides a 1 mm ball pitch and flip-chip construction that supports the high signal count and high-speed signaling needed for the device's I/O and transceiver channels. Typical applications include high-performance digital signal processing, packet switching and traffic management in networking line cards, baseband processing for wireless infrastructure, medical imaging front-ends, and ASIC prototyping/emulation platforms. The combination of abundant logic, transceiver-rich I/O, and large on-chip memory makes the EP4SGX360FF35I3N a common choice for replacing or prototyping mid-range ASICs. Designers using this device should follow the Stratix IV GX pin connection guidelines, ensure adequate decoupling for the 0.95 V core, 2.5 V/3.3 V I/O rails, and 1.2 V/2.5 V transceiver supplies, and use the Quartus II (or equivalent Intel Quartus Prime) design environment for synthesis, place-and-route, and bitstream generation. Power estimation tools should be run early in the design cycle because peak power can exceed 25 W at full utilization. This page aggregates distributor pricing, drop-in part alternatives, and design notes that complement the manufacturer datasheet and the Quartus II device handbook.

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EP4SGX360FF35I4 - 353,600-Cell Stratix IV GX FPGA | Intel
EP4SGX360FF35I4

EP4SGX360FF35I4 - 353,600-Cell Stratix IV GX FPGA | Intel

Intel EP4SGX360FF35I4 is a high-density Stratix IV GX field-programmable gate array (FPGA) built on 40 nm technology, providing 353,600 logic cells, 564 I/O, and 14,144 LABs in a 1152-pin FC-FBGA package. The device belongs to the FPGA and CPLD hierarchy and combines programmable logic, embedded memory, and high-speed transceiver-oriented resources for demanding digital systems. Its 1152-ball BGA package and 3.4 mm maximum seated height require controlled BGA assembly and board-level signal-integrity planning. The I4 ordering code indicates an industrial-oriented device grade, but the verified data does not provide a full ordering-code definition or a specific ambient operating-temperature limit. A field-programmable gate array is a programmable semiconductor containing configurable logic blocks, routing resources, memory elements, and I/O structures. Unlike an application-specific integrated circuit, an FPGA can be reconfigured after manufacturing to implement digital processing, interface bridging, control, packet handling, or protocol-specific functions. Stratix IV GX FPGAs are positioned as programmable logic devices for bandwidth-intensive embedded systems. EP4SGX360FF35I4 integrates 353,600 logic cells with 14,144 LABs, giving system architects a large programmable fabric for parallel datapaths and control logic. The device is listed with 564 I/O, making package routing and power integrity important parts of board design. The principal verified characteristics are 353,600 logic cells, 14,144 LABs, 564 I/O, 40 nm process technology, a 0.9 V core-voltage listing, and 1152-pin FC-FBGA packaging. The 1152-pin package provides extensive connectivity for high-pin-count digital designs, while the BGA format supports dense routing. The 3.4 mm maximum seated height constrains the mechanical stack-up and connector or heatsink clearances. The available distributor descriptions identify the product as a Stratix IV GX FPGA and expose the same 564-I/O and 353,600-cell architecture consistently. Architecturally, EP4SGX360FF35I4 is a programmable logic platform rather than a fixed-function processor. The logic cells and LABs implement combinational and sequential functions, while programmable interconnect maps data paths between logic, memory, and I/O resources. The 0.9 V core-voltage value should be applied only to the supply domain identified by the manufacturer documentation; designers must verify exact power-pin groups, permissible tolerances, ramp requirements, and decoupling recommendations from the official datasheet before schematic release. No transceiver count, memory-bit total, operating-temperature range, or performance grade is provided in the verified snippets. Typical applications include high-throughput communications equipment, industrial imaging and machine-vision processing, test and measurement systems, and embedded digital signal-processing platforms. Its high logic density suits parallel algorithms, protocol conversion, and interface aggregation, while 564 I/O supports numerous external buses and control signals. The Stratix IV GX family positioning also makes the device relevant to systems requiring substantial programmable bandwidth, but exact transceiver capability and speed grades must be confirmed from the manufacturer datasheet. Designers should prioritize power-integrity analysis, BGA escape routing, decoupling placement, thermal characterization, and configuration-management review. The verified data does not provide signal-integrity limits, supported I/O standards, clock limits, memory resources, or exact power consumption, so those parameters require manufacturer confirmation. This page combines verified package, logic, and commercial-search information with explicit uncertainty markers where the supplied data is insufficient.

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