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EP4SGX360KF43I4N - Stratix IV GX FPGA, 353K LE, 1760-BGA | Intel
EP4SGX360KF43I4N

EP4SGX360KF43I4N - Stratix IV GX FPGA, 353K LE, 1760-BGA | Intel

The Intel (formerly Altera) EP4SGX360KF43I4N is a high-density, high-performance Stratix IV GX Field Programmable Gate Array (FPGA) with 353,600 logic elements, 880 user I/Os, and 23,105,536 bits of embedded memory, packaged in a 1760-ball FineLine BGA (FCBGA) and built on a 40nm low-power process node. The 'I4' speed/temperature grade indicates an industrial-grade -40C to +100C operating range with the fastest speed bin in the Stratix IV GX family. The device integrates up to 24 transceivers at data rates up to 8.5 Gbps, enabling high-bandwidth serial connectivity for protocols such as PCIe Gen2, XAUI, CEI-6G, Serial RapidIO, and CPRI. With 14,144 Logic Array Blocks (LABs) and dedicated DSP blocks, the EP4SGX360KF43I4N targets throughput-intensive digital signal processing, hardware-accelerated compute, and high-speed I/O bridging. A Field Programmable Gate Array (FPGA) is a programmable logic device whose architecture is dominated by a regular array of configurable logic blocks (CLBs/LABs), programmable interconnect, and dedicated hard IP such as transceivers, memory controllers, DSP slices, and PLLs. FPGAs occupy a unique tier in the semiconductor hierarchy between general-purpose CPUs/GPUs (software-defined, sequential) and ASICs (fixed-function, lowest per-unit cost at volume). Compared to microcontrollers, FPGAs deliver massive parallelism and deterministic latency. Compared to ASICs, they offer post-fabrication reconfigurability and faster time-to-market. The Stratix IV family specifically targets high-end ASIC prototyping, high-speed serial I/O aggregation, and DSP acceleration in communications, defense, and high-performance computing infrastructure. Key features of the EP4SGX360KF43I4N include 24 high-speed transceivers (up to 8.5 Gbps), 4 hard PCIe Gen2 x8 cores, on-chip memory bandwidth exceeding 10 Tbps, an adaptive logic module (ALM) architecture that delivers 50% higher performance per logic element versus prior generations, and dedicated 18x18 multipliers for DSP. The device also embeds transceivers that support backplane and chip-to-chip serial links at rates used in 40G/100G aggregation systems. Hard intellectual property (PCIe, memory controllers, variable-precision DSP blocks) reduces soft-logic resource usage and lowers system power. Architecturally, the EP4SGX360KF43I4N combines a fine-grained ALM fabric (8-input fracturable look-up tables), embedded SRAM organized as M9K/M144K blocks, and a multi-tier routing hierarchy. The 40nm process provides a balanced trade-off between leakage, dynamic power, and performance. Designers typically use the Quartus Prime design suite to synthesize, place-and-route, and configure the device via JTAG or passive serial configuration. Power estimation is done with the Quartus PowerPlay analyzer; thermal analysis must account for the 1760-BGA FCBGA thermal resistance. Typical applications include ASIC prototyping and emulation, high-frequency trading (HFT) acceleration, radar and digital array signal processing, 40G/100G Ethernet line card aggregation, software-defined radio (SDR), test and measurement instrumentation, and high-performance compute (HPC) hardware acceleration. Its combination of transceiver density and large logic capacity makes it a popular emulator vehicle for SoC and processor IP validation. When designing with the EP4SGX360KF43I4N, the 1760-ball FCBGA requires a multi-layer PCB with buried vias, microvia stack-ups, and a controlled-impedance layer stack. Power delivery must include high-frequency decoupling at every transceiver power pin and bulk capacitance sized by the Quartus PDN tool. Thermal management typically requires a heatsink or cold-plate attachment due to the high static power of a fully utilized 360K-LE Stratix IV GX device. This page synthesizes distributor pricing, drop-in same-package alternatives from the Stratix IV GX family, and practical PCB/thermal design notes not consolidated in the manufacturer datasheet.

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EP4SGX360NF45C2 - Stratix IV GX FPGA, 353.6K LEs, 1932-FCBGA | Intel
EP4SGX360NF45C2

EP4SGX360NF45C2 - Stratix IV GX FPGA, 353.6K LEs, 1932-FCBGA | Intel

The Intel (formerly Altera) EP4SGX360NF45C2 is a high-density Stratix IV GX Field-Programmable Gate Array (FPGA) integrating 353,600 logic elements, 14,144 LABs, 920 user I/Os, and 23,105,536 bits of embedded memory in a 1932-ball flip-chip BGA (FCBGA) package. Manufactured on a 40 nm process with a 0.9 V core, the device integrates up to 24 transceivers at up to 8.5 Gbps, making it a drop-in member of the Stratix IV GX family for high-bandwidth serial I/O. An FPGA (Field-Programmable Gate Array) is a programmable logic device that allows engineers to implement custom digital circuits through configurable logic blocks (CLBs/LABs), routing resources, and hard IP blocks such as transceivers, DSP blocks, and memory controllers. FPGAs sit in the system hierarchy between ASICs and programmable logic controllers, offering higher integration than discrete logic while avoiding the NRE cost of ASICs. Key features of the EP4SGX360NF45C2 include 920 user I/Os, 23,105,536 bits of embedded RAM, embedded DSP blocks for high-throughput signal processing, hard PCI Express Gen1/Gen2 IP cores, and support for external memory interfaces including DDR3, DDR2, and QDRII+. The device operates from a 0.9 V core supply with separate transceiver and auxiliary rails, and the C2 speed grade indicates a commercial temperature range of 0 °C to +85 °C. The Stratix IV GX architecture combines an Adaptive Logic Module (ALM) fabric with up to 8.5 Gbps embedded transceivers, allowing the part to bridge parallel digital logic and high-speed serial links in a single device. Transceiver-rich FPGAs such as this one are commonly used to implement custom protocol bridges, high-speed data acquisition front-ends, and digital signal processing pipelines. Typical applications include high-speed serial protocol bridging (PCIe, Serial RapidIO, XAUI, SFI), wireless baseband processing, test and measurement instrumentation, broadcast video processing, and defense/aerospace signal processing systems. The wide 920-I/O pin count and 1932-ball FCBGA package suit dense, multi-rail PCB designs where transceiver performance and logic density are both required. When designing with this part, allocate dedicated 100 Ω differential transceiver reference clock routing, follow Intel power-on and configuration sequencing guidelines, and provide sufficient decoupling for the 0.9 V core. The 1932-ball FCBGA requires an advanced multi-layer PCB with controlled-impedance stackup, and high-speed transceiver channels need careful channel-length matching for jitter compliance. This page synthesizes distributor pricing, Stratix IV GX family alternatives, and practical design notes not found in the manufacturer datasheet alone.

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EP4SGX360NF45C2N - Stratix IV GX FPGA 353K LEs | Intel | FBGA-1932
EP4SGX360NF45C2N

EP4SGX360NF45C2N - Stratix IV GX FPGA 353K LEs | Intel | FBGA-1932

The Intel (formerly Altera) EP4SGX360NF45C2N is a high-density, high-performance Stratix IV GX Field-Programmable Gate Array (FPGA) containing 353,600 logic elements (LEs), 14,144 LABs (Logic Array Blocks), and 920 user I/Os, fabricated on a 40 nm process and housed in a 1932-ball Flip-Chip BGA (FC-FBGA-1932) package. It integrates up to 23,105,536 bits of embedded memory, dedicated DSP blocks, and hard PCI Express Gen1/Gen2 controllers plus multi-gigabit transceivers for high-speed serial I/O, targeting high-bandwidth wireline, broadcast, and defense applications. An FPGA (Field-Programmable Gate Array) is a programmable logic device that combines configurable logic fabric, programmable routing, and hardened IP blocks such as transceivers, memory controllers, and arithmetic units. FPGAs occupy the top of the programmable-logic hierarchy above CPLDs (which have simpler, lower-density logic) and are widely used for ASIC prototyping, hardware acceleration, signal processing, and interface bridging. Stratix IV specifically is the high-end performance tier in Intel's FPGA portfolio, positioned above Cyclone (cost-optimized) and below the older Stratix V/10 families. Key features include hard multi-gigabit transceivers capable of data rates from 600 Mbps up to 8.5 Gbps depending on protocol, an integrated PCI Express Gen2 hard IP block with x1/x2/x4 lane support, dedicated 18x18 multipliers, and 9.4 Mbits of dedicated MLAB memory. The -2 speed grade and industrial temperature range (N suffix in Altera convention) suit moderate-speed commercial designs requiring operation from 0C to 85C. The 1932-ball FCBGA package exposes the device's high I/O count while enabling signal integrity for multi-GHz serial links. The Stratix IV GX architecture pairs a logic-rich programmable fabric with embedded transceivers, 6-input LUTs, and a rich clock network (up to 32 global clocks, regional clocks, and PLLs). This combination supports latency-sensitive DSP pipelines and high-throughput data paths in a single chip, reducing BOM cost and board area compared with discrete logic + external PHY solutions. The hard PCIe Gen2 controller also reduces soft-logic resource usage and simplifies protocol compliance. Typical applications include 40G/10G Ethernet line cards, radar and signal-intelligence systems, ASIC prototyping, video-broadcast infrastructure (3G-SDI/HDMI bridging), and high-performance DSP for medical imaging. The integrated transceivers make it especially suited to wireless baseband, optical transport, and serial-protocol bridging tasks. For commercial-temperature designs in this logic-density class, the -2 speed grade is the mainstream cost/performance choice. When designing with this FPGA, pay close attention to transceiver channel placement, PLL configuration, and decoupling: Stratix IV devices require a multi-rail power-supply design (VCC, VCCPT, VCCAUX, VCCPGM, VCCIO per bank). Use the Quartus II or Quartus Prime toolchain with the Stratix IV device library; pin assignments and transceiver rules are validated by Quartus fitter. JTAG configuration via the enhanced configuration device or a host microcontroller is recommended for production. This page synthesizes distributor pricing, drop-in package-matched alternatives drawn from the same Stratix IV GX family, and practical design notes not found in the manufacturer datasheet alone.

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EP4SGX360NF45C3 - 353K LE Stratix IV GX FPGA, 920 I/O, FCBGA-1932
EP4SGX360NF45C3

EP4SGX360NF45C3 - 353K LE Stratix IV GX FPGA, 920 I/O, FCBGA-1932

The Intel (formerly Altera) EP4SGX360NF45C3 is a high-density Stratix IV GX Field-Programmable Gate Array built on a 40 nm process, delivering 353,600 logic elements, 14,144 LABs, 23,105,536 bits of embedded memory, and 920 user I/O pins in a 1932-ball flip-chip BGA package. What is an FPGA? An FPGA (Field-Programmable Gate Array) is a programmable logic device whose architecture consists of an array of configurable logic blocks (CLBs/LABs), embedded memory blocks, DSP blocks, and programmable interconnect, all of which can be reconfigured by the designer after manufacture. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) -> logic ICs -> integrated circuits -> semiconductors, and they bridge the gap between fixed-function ASICs and software-driven processors by offering hardware-level parallelism with software-like design iteration. Key features of the EP4SGX360NF45C3 include integrated transceivers supporting multi-gigabit serial protocols, hard PCI Express Gen1/Gen2 IP cores, up to 14,144 LABs for high logic capacity, dedicated DSP blocks for high-throughput signal processing, and 23,105,536 bits of embedded RAM for data buffering. The 'C3' speed grade and 'NF45' package designation identify the commercial temperature range and the 45 mm flip-chip BGA form factor. The Stratix IV GX architecture is engineered for high-bandwidth, low-latency applications: it combines 6.5 Gbps transceivers, hardened PCIe Gen2 blocks, and rich logic/memory resources on a single die, enabling designers to replace multiple discrete components and reduce board complexity. The 40 nm process node balances static and dynamic power, while partial reconfiguration and dynamic phase rotation support adaptive system behavior. Typical applications include high-speed data acquisition systems, 40G/100G optical transport line cards, wireless baseband processing, ASIC prototyping, broadcast video processing, and defense/aerospace signal intelligence platforms. The GX transceiver capability makes it particularly well suited for protocols such as PCIe Gen2, Serial RapidIO, XAUI, CEI-6G, and CPRI. When designing with the EP4SGX360NF45C3, plan PCB power delivery around the 0.9 V core rail with low-impedance decoupling and proper thermal relief - the 1932-ball FCBGA package requires a multilayer PCB with microvia stackups and matched-length routing for the transceiver differential pairs to maintain signal integrity at multi-gigabit data rates. This page synthesizes distributor pricing, drop-in alternatives within the Stratix IV family, and practical design notes not found in the manufacturer datasheet alone, giving engineers a one-stop decision resource.

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EP4SGX360NF45C3N - Stratix IV GX FPGA 353600 Cells | Intel
EP4SGX360NF45C3N

EP4SGX360NF45C3N - Stratix IV GX FPGA 353600 Cells | Intel

The Intel EP4SGX360NF45C3N is a high-density Stratix IV GX Field-Programmable Gate Array (FPGA) with 353,600 logic elements, 14,144 LABs/CLBs, 920 user I/Os, and integrated 8.5 Gbps transceivers, housed in a 1932-ball FC-FBGA package. It operates from a 0.9V core supply across the commercial 0C to 85C temperature range and is built on a 40nm CMOS process. The device targets high-bandwidth serial connectivity and parallel DSP workloads. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit containing programmable logic blocks, interconnect, and I/O that engineers can configure after manufacture to implement arbitrary digital functions, DSP pipelines, or hardware accelerators. Within the broader taxonomy, FPGAs sit alongside ASICs, microcontrollers, and DSP processors in the programmable logic family, offering hardware-level parallelism and reconfigurability that fixed-function ICs cannot match. Key features of the EP4SGX360NF45C3N include up to 24 full-duplex multi-gigabit transceivers supporting protocols such as PCI Express Gen1/Gen2, Serial RapidIO, XAUI, CEI-6G, and CPRI, on-chip memory of approximately 23.4 Mbits, embedded DSP blocks, and 8-input adaptive logic modules (ALMs) that provide up to 2x the logic capacity of older architectures. Hard PCIe Gen2 IP cores enable endpoint and root-port implementations with minimal soft-logic overhead. Architecturally, the device uses the Stratix IV GX fabric with 8-input fracturable ALMs, variable-precision DSP blocks supporting 9x9, 12x12, 18x18, and 36x36 modes, and a mesh-style routing fabric. Power is managed via the Intel SmartVID or fixed-VCC scheme; the C3 speed grade positions this part in the mid-speed tier relative to the faster C4 and I3/I4 industrial grades. Programmable I/O banks support LVDS, LVCMOS, HSTL, SSTL, and various memory interfaces including DDR3 with read/write leveling. Typical applications include high-performance digital signal processing in defense and radar systems, 100G/40G Ethernet line-card prototyping, baseband processing in wireless infrastructure, ASIC prototyping, and high-throughput data-acquisition cards. The combination of high logic density, abundant transceivers, and large on-chip memory makes it well suited to designs previously targeting mid-range ASICs. When designing with this FPGA, allocate sufficient PCB area for the 1932-ball FC-FBGA footprint (typically 45x45mm), ensure a low-impedance 0.9V core rail with proper decoupling, and use the Quartus Prime design suite for place-and-route. Note that the C3 commercial temperature grade limits deployment to controlled thermal environments - migrate to an I3 or I4 industrial variant for harsher conditions. This page synthesizes distributor pricing, drop-in Stratix IV GX alternatives, and practical design notes not found in the manufacturer datasheet alone.

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EP4SGX360NF45C4 - Stratix IV GX FPGA, 353K LE, 1932-FCBGA | Intel
EP4SGX360NF45C4

EP4SGX360NF45C4 - Stratix IV GX FPGA, 353K LE, 1932-FCBGA | Intel

The Intel (formerly Altera) EP4SGX360NF45C4 is a high-density Stratix IV GX Field-Programmable Gate Array (FPGA) integrating 353,600 logic elements, 14,144 Adaptive Logic Modules (LABs), 920 user I/Os, and 23,105,536 bits of embedded memory in a 1932-ball flip-chip BGA (FC-FBGA) package. Built on a 40nm process with a 0.9V core voltage, it delivers high-performance parallel DSP and SERDES-based transceiver capability for wired communications, signal processing, and high-throughput data-pipeline designs. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor whose logic fabric, routing, and I/O can be customized by the user after manufacture. FPGAs sit between fixed-function ASICs and software-programmable processors in the design hierarchy: programmable logic -> reconfigurable logic -> FPGA -> programmable logic device (PLD) -> standard logic IC. The Stratix IV family specifically combines general-purpose fabric with embedded transceivers, hard memory blocks (M20K), and DSP blocks optimized for high-bandwidth signal chains. Key features of the EP4SGX360NF45C4 include 8.9 Mbits of distributed RAM, 8 transceivers supporting multi-gigabit serial links, dedicated DSP blocks for fixed- and floating-point arithmetic, and SelectRAM+ memory architecture. The 'C4' speed grade indicates a commercial-temperature operating range, while the NF45 package designation identifies the 45 mm body 1932-ball FC-FBGA. Designers typically pair this device with DDR3/DDR2 memory controllers, multi-lane PCI Express hard IP, and SERDES reference clock networks. Typical applications include high-end test and measurement instrumentation, radar and electronic-warfare baseband processing, high-definition video broadcasting equipment, high-speed packet inspection, and 40G/100G line-card prototyping. Its high logic density makes it suitable for designs that would otherwise require multiple smaller FPGAs, simplifying board layout and BOM. When designing with this part, ensure a 12-layer or thicker PCB with controlled-impedance routing for SERDES lanes; also verify thermal dissipation since a 1932-ball FCBGA package concentrates significant heat flux and benefits from a heatsink or high-airflow chassis.

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EP4SGX360NF45C4N - Stratix IV GX FPGA, 353.6K LE, 1932-FCBGA | Intel
EP4SGX360NF45C4N

EP4SGX360NF45C4N - Stratix IV GX FPGA, 353.6K LE, 1932-FCBGA | Intel

The Intel (formerly Altera) EP4SGX360NF45C4N is a high-density Stratix IV GX Field-Programmable Gate Array (FPGA) integrating 353,600 logic elements, 14,144 Adaptive Logic Modules (ALMs), and 23,105,536 bits of embedded memory in a 1932-ball flip-chip BGA (FCBGA) package. Built on TSMC's 40 nm process, the device integrates up to 920 user I/Os and embedded transceivers that deliver multi-gigabit serial connectivity for high-bandwidth backplane and chip-to-chip links, while the 0.9 V core voltage keeps dynamic power consumption within the Stratix IV family's documented envelope. An FPGA is a reprogrammable semiconductor device whose logic fabric, routing, and I/O can be configured by the customer after manufacturing, which distinguishes it from an ASIC (Application-Specific Integrated Circuit) and from a CPLD (Complex Programmable Logic Device). Stratix IV GX sits at the top of the Stratix IV family hierarchy, which itself belongs to Intel's high-performance FPGA product line aimed at communications, signal-processing, and high-throughput data-acquisition systems; within that hierarchy, the EP4SGX360NF45C4N is the largest density point in the family at 353.6K logic elements. Key differentiating features include embedded transceiver channels capable of multi-gigabit-per-second operation, on-chip DSP blocks for high-throughput arithmetic, embedded memory with hardware FIFO controllers, and Partial Reconfiguration (PR) support that allows a portion of the fabric to be reprogrammed while the rest remains active. The NF45C4N speed grade corresponds to the fastest transceiver/performance bin available for this device, and the C4 commercial temperature grade (0 C to 85 C) targets controlled-environment deployments rather than industrial or military ranges. Architecturally, the device pairs an SRAM-based lookup-table fabric with 8-input fracturable ALMs, dedicated 18x18 multipliers that can be combined for higher precision, MLAB (Memory Logic Array Block) tiles, and per-channel PCS (Physical Coding Sublayer) hardware for each transceiver. Engineers typically floorplan around the transceiver locations first because of their tight PCB-routing requirements, then place the global clock network and PLL/DCM blocks before committing the remainder of the design to the standard logic array. Typical applications include high-end telecommunications line cards, radar and electronic-warfare front ends, medical imaging pipelines, broadcast video processing, high-speed test and measurement instrumentation, and ASIC prototyping. The combination of high logic density and integrated serial transceivers makes the part particularly attractive in designs that would otherwise require a discrete ASSP plus external glue logic. Designers should plan power-rail sequencing carefully: the 0.9 V core, 1.1 V PLL/SerDes analog, and 2.5 V/3.3 V I/O rails each require dedicated decoupling and POR (power-on-reset) supervision to avoid latch-up during bring-up. Decoupling must be placed as close as possible to the BGA balls, with the largest bulk capacitors on the opposite side of the PCB. This page synthesizes distributor pricing from eight authorized sources, drop-in same-package alternatives from the Stratix IV GX family, and practical design guidance that complements, rather than duplicates, the manufacturer datasheet.

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EP4SGX360NF45I3 - 360K LE Stratix IV GX FPGA, 1932-BGA | Intel
EP4SGX360NF45I3

EP4SGX360NF45I3 - 360K LE Stratix IV GX FPGA, 1932-BGA | Intel

The Intel (formerly Altera) EP4SGX360NF45I3 is a high-density Stratix IV GX field-programmable gate array (FPGA) with 353,600 logic elements, 14,144 logic array blocks (LABs), and 23,105,536 bits of embedded memory, housed in a 1932-pin flip-chip BGA package. It is fabricated on a 40 nm process and targets high-performance transceiver-based designs in communications, broadcast, and signal-processing systems. What is an FPGA? A field-programmable gate array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable interconnect. FPGAs belong to the broader category of programmable logic devices (PLDs), which sit within the integrated-circuit hierarchy as logic ICs specialized for parallel, high-throughput digital computation. The Stratix IV GX family specifically adds multi-gigabit transceivers, positioning the device between general-purpose FPGAs and ASIC/ASSP solutions for serial connectivity. Key features include 920 user I/Os, integrated transceivers supporting backplane and chip-to-chip serial links, dedicated DSP blocks for high-speed multiply-accumulate operations, and on-chip RAM distributed across M9K and M144K blocks. The device is offered in the I3 industrial speed grade and supports operation across an extended industrial temperature range suitable for baseband and digital-signal-processing cards. From an architectural perspective, the EP4SGX360NF45I3 uses a logic-structure of adaptive logic modules (ALMs) combined with embedded transceivers hardened for protocols such as PCIe, Serial RapidIO, Gbps Ethernet, and CPRI. The 40 nm low-power process and dedicated PLL/clock networks enable deterministic timing closure for multi-gigabit interfaces, which is critical when the FPGA drives or receives data from analog front-ends, ADCs/DACs, or backplane SERDES. Typical applications include high-end wireless baseband processing, software-defined radio (SDR) platforms, video broadcast and imaging pipelines, ASIC prototyping, and high-throughput test and measurement equipment. The combination of logic density and embedded transceivers makes it well suited for designs that previously required an ASIC plus a companion FPGA. When designing with this device, plan the PCB escape pattern for the 1932-ball FCBGA carefully, as signal-integrity routing below the package typically requires a high-layer-count board with microvias and a controlled-impedance stackup. Designers must also budget for configuration memory (EPCS) and a thermal solution capable of dissipating the worst-case transceiver-driven power. This page synthesizes Intel/Altera datasheet parameters, distributor pricing, same-brand same-package drop-in alternatives, and practical design notes for the EP4SGX360NF45I3, complementing the manufacturer handbook with structured engineering context.

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EP4SGX360NF45I3N - 353K LEs, 920 I/O Stratix IV GX FPGA | Intel
EP4SGX360NF45I3N

EP4SGX360NF45I3N - 353K LEs, 920 I/O Stratix IV GX FPGA | Intel

The Intel (formerly Altera) EP4SGX360NF45I3N is a high-density Stratix IV GX Field Programmable Gate Array built on TSMC's 40 nm process, integrating 353,600 logic elements, 23,105,536 bits of embedded memory, and 920 user I/Os in a 1932-ball FC-BGA package. The 'I3' speed grade and 'N' suffix denote the industrial temperature range (-40C to +100C) and lead-free RoHS-compliant assembly, while the 'F45' package designation defines the 45 mm flip-chip BGA with 1.0 mm ball pitch. An FPGA (Field Programmable Gate Array) is a reprogrammable logic device containing configurable logic blocks, programmable interconnect, and dedicated hard IP such as transceivers, block RAM, and DSP blocks. Stratix IV GX parts sit in the high-end FPGA taxonomy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor, optimized for system bandwidth and signal integrity in wireline, wireless, and high-speed serial applications. The EP4SGX360NF45I3N delivers up to 8.5 Gbps transceiver operation through its integrated GX transceivers, supporting protocols such as PCIe Gen1/Gen2, Serial RapidIO, XAUI, CEI-6G, and CPRI. With 14,144 adaptive logic modules (ALMs), 17.7 Mbits of MLAB memory, and Programmable Power Technology, this device targets high-performance systems requiring both massive parallelism and low static power consumption. Each transceiver channel consumes typically 200 mW at 6.5 Gbps, enabling high-density multi-channel line cards. Architecturally, the EP4SGX360NF45I3N combines a sea-of-ALM fabric with dedicated memory blocks, DSP blocks, PLLs, and PCIe hard IP, allowing designers to instantiate complex multi-gigabit serial interfaces without consuming soft logic. The 40 nm process delivers roughly 35% lower dynamic power than the prior 65 nm Stratix III generation, while Programmable Power Technology allows unused logic to operate at near-zero static current. Typical applications include high-end wireline networking line cards (40G/100G OTN), wireless baseband processing, military radar and electronic-warfare systems, and broadcast video infrastructure. The 1932-ball FC-BGA package supports the high pin density required for parallel memory interfaces (DDR3/QDRII+) and multiple multi-gigabit transceivers simultaneously. When designing with this device, plan power architecture for the 0.9 V core rail and the 1.1 V/1.5 V/1.8 V/2.5 V/3.0 V I/O rails using the PowerPlay Early Power Estimator. Use controlled-impedance routing for all transceiver channels and follow the Stratix IV GX pin-out guide for recommended decoupling. Lead time for this NRND-era part should be confirmed via franchised distributors. This page synthesizes real-time distributor pricing, package-compatible same-family alternatives, and Stratix IV GX-specific design notes that go beyond what the manufacturer datasheet alone provides, including cross-references to other 360K-LE Stratix IV devices in the same NF45 package.

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EP4SGX360NF45I4 - Stratix IV GX FPGA, 353.6K LEs, 1932-FCBGA | Intel
EP4SGX360NF45I4

EP4SGX360NF45I4 - Stratix IV GX FPGA, 353.6K LEs, 1932-FCBGA | Intel

The Intel (formerly Altera) EP4SGX360NF45I4 is a high-density Stratix IV GX Field-Programmable Gate Array (FPGA) delivering 353,600 logic elements, 23,105,536 bits of embedded memory, and 920 user I/O pins in a 1932-ball FC-BGA (NF45) package. Built on TSMC's 40nm process with a 0.9V core, the device integrates up to 14,144 LABs and supports a maximum clock frequency of 717 MHz, combining high logic density with multi-gigabit serial transceiver capability that defines the Stratix IV GX family. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), embedded memory, DSP slices, and programmable I/O that the user defines after manufacture using an HDL such as Verilog or VHDL. Within the broader semiconductor hierarchy, an FPGA is a type of programmable logic device (PLD) sitting alongside CPLDs (Complex Programmable Logic Devices); high-end FPGAs like Stratix IV GX occupy the high-performance, high-density tier typically used for ASIC prototyping, signal processing, and high-throughput data acquisition, while CPLDs serve lower-density glue-logic tasks. The Stratix IV GX architecture integrates embedded transceivers operating up to 8.5 Gbps, hard memory controllers, and DSP blocks alongside the general-purpose fabric, making the family well suited for high-bandwidth applications. The EP4SGX360NF45I4 in particular delivers eight transceiver channels per device, a feature that simplifies PCB layout for protocols such as PCIe Gen1/Gen2, Serial RapidIO, XAUI, and SATA. With 23 Mbits of embedded RAM organized in M9K/M144K blocks, the device supports wide datapath designs and high-throughput buffer schemes. The NF45 package provides a 45 mm square footprint with flip-chip solder balls to the PCB land pattern. Industrial temperature grade (-40C to +100C ambient, I-suffix) makes this part suitable for harsh-environment deployment. The -I4 speed grade places it in the mid-to-fast bin of Stratix IV GX silicon, with Fmax up to 717 MHz for critical paths. Design entry uses the Quartus II design suite (recently rebranded Quartus Prime), with a mature IP library covering memory controllers, transceiver PHYs, and PCIe hard cores. Typical applications include telecom backplane bridges using XAUI/Serial RapidIO, ASIC prototyping for high-pin-count designs, industrial video processing pipelines, and high-speed data acquisition systems. Compared to ASICs, this FPGA offers design flexibility and faster time-to-market at the cost of unit economics above ~100k-unit volumes.

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EP4SGX360NF45I4N - 353.6K LE Stratix IV GX FPGA, 1932-FCBGA | Intel
EP4SGX360NF45I4N

EP4SGX360NF45I4N - 353.6K LE Stratix IV GX FPGA, 1932-FCBGA | Intel

The Intel (Altera) EP4SGX360NF45I4N is a high-density Stratix IV GX Field Programmable Gate Array delivering 353,600 logic elements in a 1932-ball flip-chip BGA (FC-FBGA) package, manufactured on a 40 nm process with a 0.9 V core voltage. The device is part of the Stratix IV GX family that integrates up to 920 user I/O pins and 14,144 LABs (Logic Array Blocks), making it one of the largest members of the family. The 'I4' speed grade and 'N' suffix denote industrial temperature range (-40 °C to +100 °C) and lead-free / RoHS-compliant packaging. What is an FPGA (Field Programmable Gate Array)? An FPGA is a programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated silicon IP such as transceivers, DSP blocks, and block RAM. Within the broader semiconductor taxonomy, an FPGA sits alongside microcontrollers, ASICs, and CPLDs in the digital logic / programmable logic category. The Stratix IV GX family specifically targets high-speed serial I/O (SERDES) applications, integrating up to 24 transceivers per device for protocols such as PCIe Gen1/Gen2, XAUI, Serial RapidIO, and CEI-6G. Key features of the EP4SGX360NF45I4N include 23,105,536 bits of embedded memory, hardened PCIe Gen1/Gen2 IP blocks, dedicated DSP blocks for fixed- and floating-point math, and a comprehensive clock management network with PLLs. The 40 nm process enables lower static power versus prior 65 nm Stratix III devices while supporting high toggle rates required by 6.375 Gbps transceivers. Architecturally, the EP4SGX360NF45I4N uses Altera's Adaptive Logic Module (ALM) - an 8-input fracturable LUT supporting any 6-input LUT plus two independent outputs - giving higher effective logic utilization than 4-input LUT architectures. Embedded memory blocks (M512, M4K, and M-RAM blocks) can be concatenated to build FIFOs and large buffers, while the variable-precision DSP blocks handle 18x18 and 36x36 multipliers, accelerating signal-processing pipelines. Typical applications include high-speed serial interface bridging (PCIe Gen2 endpoint / root-port designs, XAUI backplanes), radio baseband processing, test-and-measurement instrumentation front-ends, military and aerospace signal processing, and high-end ASIC prototyping. The wide transceivers and abundant logic make the EP4SGX360NF45I4N a common choice for protocol bridging and FPGA-based co-processing where discrete ASSPs are unavailable. When designing with this device, ensure that PCB layout supports the flip-chip BGA with controlled-impedance transceiver lanes and adequate via-in-pad or microvia fan-out. Decoupling must follow the Quartus II power distribution network guidelines; an isolated, low-noise 0.9 V core supply with bulk and ceramic decoupling is critical. Power estimation should be performed early using the Quartus Early Power Estimator (EPE) spreadsheet, since a fully populated EP4SGX360NF45I4N can draw tens of amps on the core rail. This page synthesizes distributor stock indicators, drop-in alternatives in the same 1932-FCBGA footprint, and practical PCB / power-distribution design notes not found in the standalone manufacturer datasheet, so engineers can accelerate second-source decisions and layout planning for Stratix IV GX designs.

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EP4SGX530HH35C2 - Stratix IV GX FPGA, 531200 Cells, 1152-BGA | Intel
EP4SGX530HH35C2

EP4SGX530HH35C2 - Stratix IV GX FPGA, 531200 Cells, 1152-BGA | Intel

The Intel EP4SGX530HH35C2 is a high-density Stratix IV GX Field-Programmable Gate Array (FPGA) integrating 531200 logic elements across 212480 Configurable Logic Blocks (CLBs), with 28033024 bits of embedded memory and 564 maximum user I/O pins, housed in a 1152-ball Fine-Pitch Ball Grid Array (FBGA-1152 / HBGA-1152) package. Built on a TSMC 40 nm CMOS process, the part belongs to the Stratix IV GX family and integrates up to 24 high-speed transceivers operating at up to 8.5 Gbps, hardware DSP blocks, and dedicated PCI Express hard IP, making it suitable for high-throughput serial connectivity and parallel DSP workloads. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, I/O cells, and embedded memory/DSP/multiplier blocks that can be re-programmed after manufacture to implement arbitrary digital circuits. FPGAs sit in the broader hierarchy: programmable logic -> logic IC -> integrated circuit -> semiconductor. The Stratix IV GX family specifically targets high-speed serial interface, high-density DSP, and embedded-processor applications, and is positioned below newer Stratix V/10 families but above Cyclone and MAX families in Intel/Altera's portfolio in terms of logic density, transceiver speed, and DSP throughput. Key features of the EP4SGX530HH35C2 include 531200 logic elements, 212480 CLBs, 28033024 bits of embedded memory, hard IP for PCI Express Gen1/Gen2, dedicated DSP blocks, programmable power technology, and transceiver tiles supporting protocols such as PCIe, XAUI, Serial RapidIO, and CPRI. The 1152-BGA package supports a wide user I/O count (up to 564) plus dedicated transceiver, clock, and configuration pins, allowing very high pin-count designs to be implemented in a single device. The architecture is built around ALM (Adaptive Logic Module) blocks, M9K/M144K embedded memory blocks, and 18x18 multiplier/accumulator DSP blocks with up to ~1.3 GMACS throughput. Transceiver tiles are arranged in groups of four (quad), each with dedicated physical coding sublayer (PCS) and physical medium attachment (PMA) blocks that simplify high-speed serial design while keeping the FPGA fabric flexible. Typical applications include high-end telecommunications line cards, wireless baseband processing, test and measurement equipment with high-speed serial I/O, radar and signal-intelligence platforms, medical imaging (ultrasound beamforming), and high-performance computing accelerators. The combination of high logic density and embedded transceivers makes it well-suited to designs that previously required an FPGA plus an external PHY. When designing with the EP4SGX530HH35C2, careful PCB layout is essential: a multi-layer PCB (typically 10-16 layers for a 1152-BGA at 1.0 mm pitch) with continuous ground and power planes, controlled-impedance routing for transceiver channels, and proper decoupling are mandatory for signal integrity and robust power delivery. This page synthesizes distributor pricing, drop-in alternatives from the same Stratix IV GX family, comparison data, and PCB-level design notes not found in any single manufacturer datasheet.

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EP4SGX530HH35C2N - Stratix IV GX FPGA 531K LE | Intel | BGA-1152
EP4SGX530HH35C2N

EP4SGX530HH35C2N - Stratix IV GX FPGA 531K LE | Intel | BGA-1152

The Intel (formerly Altera) EP4SGX530HH35C2N is a high-density Stratix IV GX Field Programmable Gate Array (FPGA) with 531,200 logic elements (LE), 28,033,024 bits of embedded memory, and integrated transceivers, housed in a 1152-ball FC-HFBGA (flip-chip fine-pitch BGA) package measuring 42.5 mm x 42.5 mm. It belongs to the Stratix IV GX family optimized for high-speed serial connectivity and signal-processing workloads. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and high-speed transceivers interconnected by a programmable routing fabric. FPGAs sit within the broader hierarchy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. The Stratix IV GX family specifically targets applications requiring multi-gigabit transceivers and parallel DSP performance, bridging the gap between ASIC-level integration and discrete logic design. Key features include 21,248 adaptive logic modules (ALMs), 564 user I/O pins, embedded 8-input lookup tables (LUTs), dedicated DSP blocks, and hard PCI Express Gen1/Gen2 IP cores. The device operates from a 0.9 V core supply with auxiliary rails for transceivers and I/O banks, and supports I/O standards including LVDS, LVTTL, LVCMOS, HSTL, and SSTL across multiple voltage-referenced banks. The architecture combines a 40 nm process node with embedded transceivers capable of data rates up to 8.5 Gbps, enabling protocols such as PCIe Gen2, Serial RapidIO, XAUI, and custom serial links. Hard memory controllers and dedicated circuitry for DDR2/DDR3 SDRAM interfaces reduce soft-logic overhead and accelerate timing closure. Typical applications include high-end telecommunications infrastructure (OTU/SONET/SDH line cards, baseband processing), high-performance computing acceleration, ASIC prototyping, broadcast video processing, and defense signal-intelligence systems. The transceiver-rich fabric suits designs requiring multiple high-speed serial links alongside deep logic capacity. Designers should plan PCB layout for a 1152-ball flip-chip BGA with high-speed transceiver channels routed with controlled impedance. Decoupling strategy must address the multi-rail power architecture: separate core, PLL, transceiver, and I/O bank supplies each require their own bypass network. Thermal management is critical because the 42.5 mm package body concentrates significant power dissipation across the substrate. This page synthesizes distributor pricing, drop-in alternatives, design considerations, and lifecycle status that go beyond the manufacturer datasheet itself, providing engineering decision support for Stratix IV GX selections.

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EP4SGX530HH35C2NES - 531K LE Stratix IV GX FPGA, 1152-FCBGA
EP4SGX530HH35C2NES

EP4SGX530HH35C2NES - 531K LE Stratix IV GX FPGA, 1152-FCBGA

The Altera (now Intel) EP4SGX530HH35C2NES is a high-density Stratix IV GX Field-Programmable Gate Array (FPGA) built on a 40 nm process, integrating 531,200 logic elements and 564 user I/O pins in a 1152-ball Flip-Chip FineLine BGA (FC-HFBGA) package measuring 42.5 mm x 42.5 mm. The device is supplied from a 0.9 V core rail and is rated for the commercial 0 C to 85 C operating range, with an internal clocking fabric rated up to 800 MHz per the manufacturer specification. A Field-Programmable Gate Array (FPGA) is a semiconductor device whose digital logic, interconnect, and I/O behavior are defined by user-supplied configuration data after manufacture. FPGAs sit at the top of the programmable-logic hierarchy - below them are CPLDs (smaller, non-volatile, glue-logic oriented) and above them are ASICs (volume-optimized fixed-function ICs). The Stratix IV GX family specifically combines high logic density with up to 24 transceivers supporting multi-gigabit serial protocols, positioning the device between pure logic-centric FPGAs and dedicated SerDes ASSPs. Key features of this part include 531,200 logic elements, 28,033,024 bits of embedded memory, dedicated DSP blocks for fixed- and floating-point arithmetic, 8.5 Gbps-capable transceivers on Stratix IV GX, and a configuration controller supporting passive, active, and JTAG programming modes. The 1152-ball FCBGA package exposes 564 user I/Os with mixed-voltage support through banked I/O structures, and the flip-chip thermal interface enables sustained operation in space-constrained line cards. Architecturally, the EP4SGX530HH35C2NES uses Adaptive Logic Modules (ALMs) feeding a hierarchical routing fabric, with M20K and MLAB memory blocks distributed column-wise, and variable-precision DSP blocks adjacent to those columns. Compared with the preceding Stratix III family, Stratix IV adds 8.5 Gbps transceivers and improved power management through hard PCIe Gen1/Gen2 IP blocks; compared with the successor Stratix V, the device trades lower power and higher transceiver rate (up to 14.1 Gbps) for the lower cost per logic element that the mature 40 nm process enables. Typical applications include high-performance digital signal processing in defense radar and electronic-warfare systems, ASIC prototyping for networking ASICs, multi-gigabit serial backplane aggregation in telecom line cards, video broadcast infrastructure with on-chip transceivers, and high-throughput PCIe Gen2 endpoint designs. The device's combination of logic density and integrated transceivers lets designers replace multiple smaller FPGAs or a discrete SerDes plus FPGA pair with a single component. When designing with this device, ensure the PCB supports the FCBGA's 1.0 mm ball pitch with matched-length impedance control for transceiver lanes, and provide a multi-rail power solution (typically 0.9 V core, 1.1 V PLL, 2.5 V/3.3 V I/O banks) with proper sequencing. Thermal management must consider that the flip-chip BGA draws heat primarily through the balls and PCB copper; a heatsink or thermal interface material is required for sustained full-operation workloads. This page synthesizes distributor pricing for the EP4SGX530HH35C2NES, same-package Stratix IV GX alternatives from the Site MPN list, and practical design notes that complement - rather than duplicate - the manufacturer datasheet.

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EP4SGX530HH35C3 - 531K LE Stratix IV GX FPGA, 564 I/O | Intel
EP4SGX530HH35C3

EP4SGX530HH35C3 - 531K LE Stratix IV GX FPGA, 564 I/O | Intel

The Intel (formerly Altera) EP4SGX530HH35C3 is a high-end Stratix IV GX field-programmable gate array (FPGA) integrating 531,200 logic elements, 21,248 LABs/CLBs, and 28,033,024 bits of embedded RAM in a 1152-ball FCBGA (HFBGA) package with 564 user I/O pins. Built on a 40nm process, the device operates from a 0.87 V to 0.93 V core supply, supports transceiver rates up to 8.5 Gbps, and is engineered for high-bandwidth serial connectivity in networking, broadcast, and high-performance computing. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit built from an array of configurable logic blocks (CLBs), programmable interconnects, I/O cells, and on-chip memory that the designer can reconfigure after manufacturing. Within the broader taxonomy, the EP4SGX530HH35C3 sits at the top of the programmable-logic hierarchy: FPGA -> programmable logic device (PLD) -> digital logic IC -> integrated circuit. Stratix IV GX specifically targets applications that require both massive parallel logic capacity and multi-gigabit transceivers on a single die. Key features include 24 full-duplex CDR-capable transceivers with embedded 8B/10B encoders/decoders compliant with IEEE 802.3-2005 Gigabit Ethernet, ±100 ppm clock compensation, and receiver synchronization state machines. The device integrates hard PCIe Gen1/Gen2 IP blocks, up to 1024 multiplier blocks (18x18) for DSP, and PLLs with fractional-N support. Hard memory controllers and 4.5 Mb of TriMatrix embedded memory per logic array block deliver deterministic low-latency data movement. Architecturally, Stratix IV GX uses a 40nm low-power CMOS process with adaptive logic modules (ALMs) that implement 8-input fracturable look-up tables, providing an effective 1.4x density gain over previous generations. The transceiver tiles support a wide range of serial protocols including PCIe Gen2 x8, XAUI, Serial RapidIO, and 10G KR backplanes. Typical applications include 40G/100G optical line-card prototyping, radar and DSP front-ends, ASIC prototyping emulators, and high-frequency trading accelerator cards. The combination of transceivers, DSP blocks, and abundant external memory bandwidth makes this device well-suited to signal-processing workloads. A key design consideration is PCB layout: the 1152-ball FCBGA requires a multi-layer board with microvia stacks, controlled-impedance transceiver channels, and careful power-plane decoupling to meet 8.5 Gbps signal-integrity margins. Reference the Intel Stratix IV GX Handbook for transceiver channel simulation methodology. This page synthesizes distributor pricing, drop-in same-family Stratix IV GX alternatives, and practical design notes not consolidated in the manufacturer datasheet.

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EP4SGX530HH35C3N - Stratix IV GX FPGA 531K LE | Intel | 1152-BGA
EP4SGX530HH35C3N

EP4SGX530HH35C3N - Stratix IV GX FPGA 531K LE | Intel | 1152-BGA

The Intel (formerly Altera) EP4SGX530HH35C3N is a high-density Stratix IV GX Field Programmable Gate Array (FPGA) delivering 531,200 logic elements, 28,033,024 bits of embedded memory, and 21248 Logic Array Blocks (LABs / CLBs) in a 1152-ball HBGA package measuring 42.50 x 42.50 mm. According to the verified manufacturer data, the device integrates 564 user I/O pins and operates from 0C to 85C commercial temperature range. Built on a 40 nm process, the Stratix IV GX family targets high-speed serial I/O, signal-processing bandwidth, and high-logic-density applications. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose digital logic function is defined by the user after manufacture via a hardware description language (HDL) and a configuration bitstream. FPGAs sit between fixed-function ASICs and software-programmable processors: they deliver ASIC-class parallelism and throughput while retaining the re-programmability of software. Within the broader silicon taxonomy, an FPGA is a programmable logic device (PLD), a sub-category of logic ICs under Integrated Circuits, and ultimately a member of the power-managed semiconductor family. The Stratix IV GX sub-family specifically adds multi-gigabit transceivers for high-bandwidth serial connectivity. Key features include 8.5T transceivers on the GX variant, embedded 10/100/1000 Ethernet MACs, and an internal clock network supporting up to 800 MHz operation. The HBGA-1152 package provides high-density signal escape with low inductance, making it suitable for high-performance systems requiring dozens of differential pairs. The 40 nm process technology balances performance and power consumption while delivering robust logic capacity. Typical applications include high-end communications infrastructure (40G/100G line cards, wireless baseband), real-time signal processing for radar and test & measurement, ASIC prototyping, broadcast video processing, and industrial automation requiring deterministic hardware acceleration. The 1152-ball package is also well suited for high-density parallel interfaces and memory-rich subsystems. When designing with this device, ensure the PCB provides adequate thermal dissipation given the 42.5 mm body size and use Altera's Quartus II design software (or the Intel Quartus Prime subscription) for synthesis, place-and-route, and timing closure. The C3 speed grade denotes a specific performance bin - engineers should consult the Stratix IV Device Handbook for detailed timing models.

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EP4SGX530HH35C4 - 531K LE Stratix IV GX FPGA | Intel | Altera
EP4SGX530HH35C4

EP4SGX530HH35C4 - 531K LE Stratix IV GX FPGA | Intel | Altera

The Intel (formerly Altera) EP4SGX530HH35C4 is a high-density Stratix IV GX Field Programmable Gate Array delivering 531,200 logic elements and 28,033,024 bits of embedded memory in a 1152-ball flip-chip BGA package. The device is built on a 40 nm process technology with a 0.9 V core supply and integrates up to 24 transceivers operating at data rates up to 8.5 Gbps, making it the largest logic-density member of the Stratix IV GX family. What is a Stratix IV GX FPGA? A Stratix IV GX is a high-performance FPGA that combines logic fabric, embedded memory blocks (M9K/M144K), DSP blocks, and multi-gigabit transceivers (MGTs) on a single die. Within the broader taxonomy, the EP4SGX530HH35C4 sits at FPGA -> programmable logic -> semiconductor IC. It is engineered for wireline communications, ASIC prototyping, and high-throughput signal processing applications where both massive parallel compute and serial I/O bandwidth are required. The device features 21,248 adaptive logic modules (ALMs), 564 maximum user I/O pins, dedicated hardware multipliers and DSP blocks for fixed- and floating-point arithmetic, and eight fractional phase-locked loops. Hard PCI Express and memory controller IP cores shorten time-to-prototype for embedded systems. The HH35 speed grade and commercial 0 C to 85 C operating temperature band (-C4 suffix) target lab, prototyping, and commercial deployment workloads. Architecturally, the EP4SGX530HH35C4 exploits Altera's partial reconfiguration and the Quartus II / Quartus Prime design toolchain. Designers can configure multi-gigabit transceivers across CPRI, OBSAI, Serial RapidIO, PCIe Gen1/Gen2, and 10 Gigabit Ethernet physical layers, while programmable logic capacity supports chip-level protocol bridges and channel aggregation. Typical applications include 100G line-card forwarding engines, software-defined radio baseband processing, ASIC emulation platforms, high-frequency trading acceleration, and high-end test and measurement instrumentation. The wide transceivers also suit radar and EW signal capture backplanes. Designers should account for power-plane decoupling of the flip-chip BGA, multi-rail sequencing, and JTAG-based configuration from EPCS or external flash. The 1152-ball FCBGA package requires careful PCB stack-up planning for signal integrity across 8.5 Gbps links. This page synthesizes real-time distributor pricing, drop-in Stratix IV GX family alternatives from the Site MPN list, and practical FPGA power/thermal design notes not consolidated in the original datasheet.

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EP4SGX530HH35C4N - 531K LE Stratix IV GX FPGA | Intel | 1152-FCBGA
EP4SGX530HH35C4N

EP4SGX530HH35C4N - 531K LE Stratix IV GX FPGA | Intel | 1152-FCBGA

The Intel (formerly Altera) EP4SGX530HH35C4N is a high-density Stratix IV GX Field Programmable Gate Array built on a 40 nm low-power CMOS process, delivering 531,200 logic elements, 21,248 logic array blocks (LABs), and 28,033,024 bits of embedded memory in a 1152-ball Flip-Chip BGA (FC-HFBGA / FCBGA) package. Headline parameters include 564 user I/O pins, integrated transceivers supporting multi-gigabit serial interfaces, and a 0.9 V core supply typical for the Stratix IV GX family. Speed grade C4 with the commercial-temperature suffix and lead-free N-designator indicates the part is offered as a RoHS-compliant, surface-mount BGA targeting mainstream wired-communications and high-performance DSP designs. What is an FPGA? A Field-Programmable Gate Array is a semiconductor device containing configurable logic blocks (CLBs/LABs), programmable interconnect, and dedicated hard IP such as transceivers, multipliers, and memory blocks. FPGAs occupy a tier between general-purpose microcontrollers and fixed-function ASICs: they offer hardware-level parallelism for data-path acceleration while remaining re-programmable in the field, making them ideal for prototyping, low-volume production, and workloads where time-to-market outweighs per-unit silicon cost. Key features of the EP4SGX530HH35C4N include a deep logic fabric (531K LEs) for parallel datapath implementation, abundant embedded RAM (28 Mb) for packet buffering and DSP coefficient storage, 24x 8.5 Gbps transceivers typical of Stratix IV GX, and dedicated DSP blocks for high-throughput fixed- and floating-point arithmetic. The 1152-ball FCBGA package exposes 564 user I/Os and provides the signal-integrity margin needed for DDR3 memory interfaces and multi-lane serial links running at full transceiver line rate. Architecturally, the Stratix IV GX family uses adaptive logic modules (ALMs) paired with MLAB memory, 9-Kbit M9K blocks and larger M144K blocks, hardened PCI Express and serial RapidIO cores, and up to 36 transceiver channels per device. Compared with Stratix III, the IV generation refined the routing architecture, lowered static power, and increased the maximum transceiver data rate, while preserving Quartus II compatibility for design reuse. Typical applications include high-end wired telecommunications line cards, 40G/100G Ethernet aggregation, military radar and signal-intelligence platforms, ASIC prototyping for compute accelerators, medical imaging pipelines such as CT and MRI reconstruction, and broadcast video processing. The combination of high logic density, abundant transceivers, and large embedded memory makes the EP4SGX530HH35C4N well-suited to throughput-bound designs where a CPU/GPU alone is insufficient. Design consideration: the 1152-ball FCBGA requires a multi-layer PCB with controlled-impedance routing for the transceiver lanes, matched-length skew management for memory interfaces, and a substantial thermal solution. Engineers should plan for at least 8 PCB layers, high-decoupling-count power distribution, and a heatsink rated for the device's thermal-design-power envelope before committing to the package. This page synthesizes Stratix IV GX die and package specifications, current distributor availability, drop-in and pin-compatible Stratix IV family alternatives, and practical PCB/thermal design guidance not aggregated on a single manufacturer page.

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EP4SGX530HH35I3 - Stratix IV GX FPGA, 531K LE, 1152-BGA | Altera
EP4SGX530HH35I3

EP4SGX530HH35I3 - Stratix IV GX FPGA, 531K LE, 1152-BGA | Altera

The Altera (Intel) EP4SGX530HH35I3 is a high-density Stratix IV GX Field-Programmable Gate Array (FPGA) delivering 531,200 logic elements, 28,033,024 bits of embedded memory, and integrated 8.5 Gbps transceivers in a 1152-ball flip-chip BGA (42.5 x 42.5 mm HBGA) package. It belongs to the Stratix IV GX family, which combines a 40 nm process node with adaptive logic modules (ALMs), 21,248 adaptive logic modules / LABs, and 564 user I/O pins to support high-bandwidth serial connectivity and parallel processing. The device is rated for industrial operating temperature (0 °C to 85 °C) and targets mid-to-high-end applications including high-speed serial interfaces, ASIC prototyping, and DSP-heavy designs. What is an FPGA? A Field-Programmable Gate Array is a semiconductor device built around an array of configurable logic blocks (CLBs or ALMs) connected via programmable interconnect and surrounded by programmable I/O cells. Unlike a fixed-function ASIC, an FPGA can be reconfigured after manufacturing, making it ideal for prototyping, low-volume production, and designs requiring post-deployment updates. The Stratix IV GX family sits at the upper end of Altera's high-performance FPGA portfolio, integrating multi-gigabit transceivers and substantial on-chip memory to handle protocol bridging, baseband processing, and high-throughput datapath workloads. Key features of the EP4SGX530HH35I3 include 21,248 LABs/ALMs, 28 Mb of embedded memory (M9K and M144K blocks), embedded multipliers and DSP blocks, fractional phase-locked loops (fPLLs), and PCI Express hard IP blocks. The 8.5 Gbps transceivers support protocols such as PCIe Gen1/Gen2, Serial RapidIO, XAUI, CEI-6G, Interlaken, and SFI-5, making the part suitable for line-card, backplane, and high-end test equipment designs. The 564 user I/Os are organized across multiple I/O banks supporting LVDS, LVCMOS, HSTL, SSTL, and other single-ended and differential standards. The device uses a 40 nm TSMC process and a 1.0 V core supply, with separate supply rails for transceivers, PLLs, and I/O banks. Configuration is supported via JTAG, passive serial, fast passive parallel, and Altera-enhanced configuration devices. The 1152-ball flip-chip BGA (HBGA-42.5 x 42.5 mm) package provides the high-pin-count interconnect required for 564 user I/Os and multiple serial transceiver channels. Typical applications include high-end communication line cards, ASIC and SoC prototyping, high-speed serial interface bridging (PCIe, Serial RapidIO, 10G Ethernet), high-performance DSP and image processing, broadcast video infrastructure, and test and measurement equipment. Designers typically pair the FPGA with external DDR3/QDR memory, clock generators, and high-speed ADCs/DACs. When designing with this device, allocate sufficient PCB layers (typically 12+ layers with buried vias) and use Altera's Stratix IV GX transceiver toolkit to manage PCB channel simulation. Ensure proper decoupling per the Altera pin connection guidelines, and verify that the selected FPGA power rail sequencing meets the device's power-on-reset requirements. Quartus II design software (or Intel Quartus Prime) is required for synthesis, place-and-route, and configuration bitstream generation. This page synthesizes distributor pricing, drop-in package-compatible Stratix IV GX variants, and practical design notes not consolidated in the manufacturer datasheet, including lifecycle guidance and lead-time considerations for new designs.

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EP4SGX530HH35I3N - Stratix IV GX FPGA, 531K LE, 1152-BGA | Intel
EP4SGX530HH35I3N

EP4SGX530HH35I3N - Stratix IV GX FPGA, 531K LE, 1152-BGA | Intel

The Intel (formerly Altera) EP4SGX530HH35I3N is a high-density Stratix IV GX family Field Programmable Gate Array (FPGA) built on a 40 nm process, delivering 531,200 logic elements, 28,033,024 bits of embedded memory, and 564 maximum user I/Os in a 1152-ball FineLine BGA (FCBGA) package. The device integrates up to 24 transceivers supporting data rates suitable for PCI Express Gen1/Gen2 and multi-gigabit serial protocols, making it a workhorse for high-bandwidth wireline and embedded computing applications. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks, interconnect fabric, and dedicated silicon resources such as block RAM, DSP slices, and (in modern families) hardened transceivers and processor cores. FPGAs sit in the broader taxonomy: programmable logic device (PLD) -> FPGA -> high-performance FPGA -> system-on-chip FPGA. Unlike a fixed-function ASIC, an FPGA is reprogrammed in-system to implement arbitrary digital logic, parallel processing pipelines, or hardware accelerators. The Stratix IV family targets mid-to-high-end designs where ASIC-like performance is needed without the NRE cost of mask-set production. Key features of the EP4SGX530HH35I3N include 21,248 adaptive logic modules (ALMs), 1,290 Kbits of MLAB memory plus dedicated M9K and M144K block RAM blocks, 1,024 DSP blocks (18x18 multipliers), 24 full-duplex transceivers operating up to 8.5 Gbps, and eight PLLs with fractional support. The part ships in the commercial (I) temperature grade, supports hot-socketing, and provides PCI-SIG compliant PCIe hard IP. Hard memory controllers and partial reconfiguration capability are standard Stratix IV features. The EP4SGX530HH35I3N targets high-throughput digital designs: ASIC prototyping, high-speed data acquisition, video broadcast infrastructure, 40G/100G line-card MACs, radar baseband, and software-defined radio. With PCIe Gen2 x4/x8 hard IP and 8.5 Gbps transceivers, it is commonly used in test equipment, medical imaging, and defense signal-processing platforms. The 1152-ball FCBGA package requires a 1.0 mm pitch PCB land pattern and a multi-layer PCB with controlled-impedance routing. When designing with this device, ensure your PCB stack-up supports 100-ohm differential routing for the transceiver channels and provides adequate decoupling (typically 0402/0201 ceramics in a dense pattern under the BGA). JTAG and active serial configuration via EPCS or enhanced EPCQ flash is supported. Quartus II design software (v13.0+ for legacy Stratix IV) is required; Altera ModelSim or Questa is recommended for RTL simulation. This page synthesizes distributor pricing, verified drop-in Stratix IV GX siblings, and practical design considerations not consolidated in the manufacturer datasheet.

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EP4SGX530HH35I4 - Stratix IV GX FPGA 531K LE, 1152-BGA | Intel
EP4SGX530HH35I4

EP4SGX530HH35I4 - Stratix IV GX FPGA 531K LE, 1152-BGA | Intel

The Intel (formerly Altera) EP4SGX530HH35I4 is a high-density Stratix IV GX Field Programmable Gate Array (FPGA) built on a 40nm process, integrating 531,200 logic elements and 28,033,024 bits of embedded memory in a 1152-ball flip-chip BGA (42.5 x 42.5 mm, HBGA-1152) package. It delivers up to 800 MHz internal operation and features 24 high-speed transceivers operating up to 8.5 Gbps, hardened PCI Express Gen1/Gen2 endpoints, and 564 user I/O pins. The part is rated for industrial temperature operation (0C to 85C) and ships in the I4 speed grade. An FPGA (Field Programmable Gate Array) is a semiconductor device whose digital logic, interconnects, and I/O behavior are defined by a user-supplied configuration bitstream rather than hard-wired at fabrication. FPGAs occupy a unique position in the compute hierarchy: below fixed-function ASICs in cost-per-unit and power efficiency, but far above microcontrollers and DSPs in raw parallelism, custom I/O support, and time-to-market. Stratix IV GX specifically targets high-bandwidth serial I/O applications, embedding multi-gigabit transceivers (MGTs) directly on-die to avoid the cost and signal-integrity penalties of external PHY chips. Key features include 28 Mb of embedded RAM distributed as M9K and M144K blocks, 1,040 embedded 18x18 multipliers for DSP pipelines, four PLL blocks and 16 global clock networks, and hard IP for PCI Express Gen2 x8 endpoints. The HBGA-1152 package supports high pin-count board designs and provides controlled-impedance paths to memory and transceiver channels. According to the Stratix IV GX family datasheet, the device consumes approximately 13 W of static power and supports partial reconfiguration of individual transceiver channels. Architecture-wise, the Stratix IV GX uses an Adaptive Logic Module (ALM) with 8-input fracturable look-up tables, replacing the older 4-input LUT paradigm used in Stratix II/III families. This delivers roughly 2x the logic capacity per LAB at the same silicon area, with a slight reduction in worst-case Fmax for heavily pipelined designs. The embedded transceivers support protocols including PCIe Gen2, XAUI, Serial RapidIO, CEI-6G, and custom rates from 600 Mbps to 8.5 Gbps. Typical applications include 40G/100G line-card packet processing, software-defined radio (SDR) baseband, high-frequency trading FPGA accelerators, radar and signal-intelligence front ends, ASIC prototyping, and broadcast video processing. The integrated PCIe Gen2 hard IP makes the part especially attractive for co-processor cards that plug into host servers via x8 Gen2 slots. When designing with this device, pay close attention to PCB stack-up and via-in-pad geometry: the HBGA-1152 package has 1.0 mm pitch and typically requires an 8-12 layer PCB with HDI microvias to break out all signal pins while maintaining 100-ohm differential impedance for transceiver channels. JTAG, MSEL, and configuration-mode pins must be strapped correctly for AS, PS, or JTAG configuration modes. This page consolidates distributor pricing for the EP4SGX530HH35I4, drop-in alternatives within the Stratix IV GX family, and practical design notes for transceiver and PCIe integration that are not collated in the standalone datasheet.

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EP4SGX530HH35I4N - 531k LE Stratix IV GX FPGA, 1152-BGA | Intel
EP4SGX530HH35I4N

EP4SGX530HH35I4N - 531k LE Stratix IV GX FPGA, 1152-BGA | Intel

The Intel (formerly Altera) EP4SGX530HH35I4N is a high-density Stratix IV GX family FPGA delivering 531,200 logic elements, 28,033,024 bits of embedded memory, and 24 (approx.) transceivers in a 1152-ball flip-chip BGA (FCBGA) package. Operating across industrial temperature range (-40C to +100C junction) at core voltages of 0.87 V to 1.00 V, it targets applications requiring extreme logic capacity combined with multi-gigabit serial I/O. The part carries the I4N suffix, denoting industrial temperature grade and a lead-free (Pb-free) RoHS-compliant assembly. A Field Programmable Gate Array (FPGA) is a programmable semiconductor that can be configured by the customer after manufacturing to implement arbitrary digital logic. FPGAs sit within the broader hierarchy of programmable logic devices (PLD), and Stratix IV GX is positioned at the high-end tier, integrating embedded transceivers, DSP blocks, on-chip memory, and hard IP cores for memory controllers and PCIe. The Stratix IV family uses a 40 nm process and a logic structure based on Adaptive Logic Modules (ALMs) rather than older 4-input LUTs, improving logic efficiency at high densities. Key specifications include 21,248 LABs (Logic Array Blocks), 564 user I/Os, integrated multi-gigabit transceivers with data rates up to 8.5 Gbps (per Stratix IV GX family capability), up to 1,152 embedded 18x18 multipliers (per family datasheet), and 12 embedded PLL blocks. The device integrates 24 channels of high-speed serial I/O, hard PCIe Gen1/Gen2 IP cores, and supports external memory interfaces including DDR3, DDR2, and QDR through dedicated PHY blocks. The architecture uses a fabric of ALMs containing 8-input fracturable look-up-tables, dedicated registers, arithmetic chains, and carry chains. Memory is implemented as MLABs and M9K/M144K blocks. Transceiver tiles are arranged in columns on the left and right sides of the die, paired with their own PCS and PMA layers for protocols including PCIe, Serial RapidIO, XAUI, CEI-6G, and custom serial links. Typical applications include high-end telecommunications line cards, military radar and signal processing, ASIC prototyping, high-performance computing accelerators, medical imaging systems, and test and measurement instrumentation requiring both massive parallel DSP and high-bandwidth serial connectivity. The industrial temperature grade makes the part suitable for defense and outdoor telecom deployments. Design consideration: Stratix IV GX FPGAs require careful power-rail sequencing and a multi-rail power tree (typically 0.9 V core, 1.1 V transceiver PLL, 1.5 V/2.5 V I/O). Power estimation should be performed with the Quartus II Early Power Estimator before PCB layout, and a minimum of 8 PCB layers with continuous GND planes is recommended for transceiver signal integrity. This page synthesizes Stratix IV GX density ranking, drop-in package variants, and design notes derived from the Intel/Altera Stratix IV device handbook - data not aggregated on any single distributor listing.

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EP4SGX530KF43C2 - Stratix IV GX FPGA 531K LE FCBGA-1760 | Intel
EP4SGX530KF43C2

EP4SGX530KF43C2 - Stratix IV GX FPGA 531K LE FCBGA-1760 | Intel

The Intel (formerly Altera) EP4SGX530KF43C2 is a high-density Stratix IV GX Field Programmable Gate Array with 531,200 logic elements, 28,033,024 bits of embedded memory, and twenty-four 8.5 Gbps transceivers, housed in a 1760-ball flip-chip BGA (FCBGA) package. Built on a 40 nm process with a 0.9 V core voltage, this device delivers up to 800 MHz core fabric performance while integrating hardened PCI Express Gen2 and 10-Gigabit Ethernet MAC blocks for high-bandwidth I/O. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated silicon IP that can be rewired after manufacturing to implement arbitrary digital functions. FPGAs occupy a tier above general-purpose microcontrollers in the programmable-logic hierarchy: CPLD -> FPGA -> SoC FPGA -> ASIC. Stratix IV GX specifically extends this category with multi-gigabit transceivers and embedded transceiver-aware PLLs, enabling high-speed serial protocols without external PHY silicon. Key features of the EP4SGX530KF43C2 include twenty-four integrated 8.5 Gbps transceivers, 880 user I/O pins, 21248 logic array blocks (LABs), dedicated 6.375 Gbps PCIe Gen2 hard IP blocks, and embedded 10-Gigabit Ethernet MAC support. The device also integrates 1,120 embedded 18x18 multipliers for DSP workloads and supports up to 24.88 Mb of M20K block memory plus 4.41 Mb of MLAB memory for distributed buffering. Architecturally, Stratix IV GX uses a fabric of adaptive logic modules (ALMs) with eight inputs and a dedicated routing architecture that minimizes congestion at high utilization. The transceiver blocks include embedded signal-conditioning circuitry (pre-emphasis and equalization) that allows backplane and chip-to-chip links over 40 inches of FR4 without external retimers. Partial reconfiguration and remote update are supported via dedicated configuration controllers. Typical applications include high-end telecommunications line cards, military radar and electronic-warfare baseband processing, ASIC prototyping, medical imaging pre-processing pipelines, and broadcast video switching fabric. The combination of transceivers and large logic density makes the device well suited to designs previously requiring an ASIC plus external PHY. When designing with this device, plan for a multi-rail power system (0.9 V core, 1.1 V PLL, 1.5 V/2.5 V/3.3 V I/O, and a 1.0 V/1.2 V transceiver analog supply) and use the Stratix IV Early Power Estimator to model thermal envelope before PCB layout. The 42.5 mm x 42.5 mm FCBGA requires a multilayer PCB with microvia stack-ups and controlled-impedance routing for the transceiver channels. This page synthesizes distributor pricing, drop-in alternative listings, and practical Stratix IV GX design notes not found in the manufacturer datasheet alone, with all data referenced to the verified Intel/Altera datasheet and current distributor inventories.

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EP4SGX530KF43C2N - 531K LE Stratix IV GX FPGA, 1760-FCBGA | Intel
EP4SGX530KF43C2N

EP4SGX530KF43C2N - 531K LE Stratix IV GX FPGA, 1760-FCBGA | Intel

The Intel EP4SGX530KF43C2N is a high-density, high-performance Stratix IV GX Field-Programmable Gate Array (FPGA) with 531,200 logic elements, 28,033,024 bits of embedded memory, and 880 user I/Os, housed in a 1760-ball Flip-Chip BGA (FCBGA) package. It integrates 24 transceivers operating up to 8.5 Gbps for high-speed serial I/O, making it suitable for high-bandwidth communications and data-acquisition systems. What is an FPGA? A Field-Programmable Gate Array is a reconfigurable integrated circuit that lets designers implement arbitrary digital logic, memory blocks, DSP functions, and serializer/deserializer (SerDes) channels in silicon after fabrication. Stratix IV GX belongs to the high-end tier of FPGAs, sitting between mid-range Cyclone devices and the very high-end Stratix V/V/Agilex families in Intel's programmable-logic taxonomy (FPGA -> programmable logic -> programmable logic device -> digital IC). The 530K logic-element density places it among the largest single-die FPGAs of its generation. Key differentiating features include 24 full-duplex transceiver channels at data rates up to 8.5 Gbps, 21248 Logic Array Blocks (LABs), 1,920 embedded 18x18 multipliers for DSP workloads, embedded hard memory controllers, and dedicated PCle hard IP. The hard PCle Gen1/Gen2 endpoint and root-port blocks save thousands of logic elements while offloading a common high-speed protocol from soft logic. The device targets 0.9V core operation, with selectable speed grade -2 for a balance of timing margin and power. Architecturally, Stratix IV GX uses Intel's 40 nm process node with an adaptive logic module (ALM) that combines fracturable 6-input LUTs with dedicated adders, registers, and carry chains. The 8.5 Gbps transceivers use a hardened PCS/PMA that supports CPRI, OBSAI, Serial RapidIO, 10 GbE (XAUI), PCIe Gen2, and HiGig/Interlaken-style protocols with on-chip channel bonding and clock data recovery. Typical applications include high-end telecommunications line cards (e.g., 40G/100G framer/mapper), radar and electronic-warfare signal-processing front-ends, ASIC prototyping, high-frequency trading accelerators, broadcast video routers, and high-resolution medical imaging. The combination of density, DSP throughput, and 8.5 Gbps serial links is what differentiates it from lower-density Stratix IV E and Stratix IV GT (only transceivers) variants. When designing with this device, plan the PCB escape carefully: the 1760-ball FCBGA needs a multilayer (typically 12+ layer) PCB with stacked via structures and impedance-controlled transceiver channels. Use the Quartus II design software (or newer Intel Quartus Prime) for synthesis, place-and-route, and timing closure; expect hours of compile time at this density. Allocate at least four dedicated transceiver power-supply rails (VCCA, VCCP, VCCR, VCCT) and follow Intel's transceiver layout guidelines for jitter compliance. This page synthesizes distributor pricing, drop-in alternatives within the Stratix IV GX family, and practical design notes not found in the manufacturer datasheet alone.

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