MPC8555EPXAPF vs MPC8555EPXAQF 비교
다음의 상세 나란히 비교: MPC8555EPXAPF 제조: NXP Semiconductors 및 MPC8555EPXAQF 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
NXP Semiconductors
MPC8555EPXAQF - PowerQUICC III 1GHz e500 MPU | NXP | Networking
MPC8555EPXAQF Nrnd사양 비교
| 파라미터 | MPC8555EPXAPF | MPC8555EPXAQF |
|---|---|---|
| 브랜드 | NXP Semiconductors | NXP Semiconductors |
| 카테고리 | Microcontrollers | Microcontrollers |
| 수명 주기 상태 | 최종 구매 | NRND |
| Architecture | PowerPC e500 (Power Architecture) | PowerPC e500 (Power Architecture technology) |
| Core | Single e500 | — |
| 데이터 버스 폭 | 32-Bit | 32-Bit |
| Maximum Clock Speed | 833 MHz | — |
| Core Supply Voltage | 1.2 V | — |
| I/O Supply Voltage | 2.5 V / 3.3 V | — |
| Package Type | FCPBGA-783 (29 x 29 mm, 1 mm pitch, flip chip) | FCPBGA (Flip Chip Plastic BGA) |
| Package Height | 3.75 mm | — |
| 핀 수 | 783 | — |
| 동작 온도 범위 | -40 °C to +85 °C (industrial, extended) | — |
| L1 Instruction Cache | 32 KB | — |
| L1 Data Cache | 32 KB | — |
| Memory Controller | DDR / DDR2 up to 333 MHz | [DATA_NEEDED: DDR1/DDR2 support details] |
| Ethernet | Two 10/100 Fast Ethernet MACs | — |
| PCI Interface | PCI / PCI-X bridge (up to 133 MHz) | — |
| Process Technology | 130 nm CMOS | — |
| RoHS 상태 | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS compliance status] |
| Security Engine | SEC 2.0 (Integrated) | — |
| Core Count | — | 1 |
| Core Frequency (Max) | — | 1.0 GHz |
| Supply Voltage (Core) | — | 1.2 V |
| Pin / Ball Count | — | 783 |
| Package Dimensions | — | 29 x 29 mm, 1 mm pitch, 3.75 mm height |
| 실장 유형 | — | Surface Mount |
| 동작 온도 | — | [DATA_NEEDED: operating temperature range] |
| Series | — | PowerQUICC III (MPC85xx) |
| Part Marketing Code | — | PQ 37 LITE 8555E |
| Integrated Peripherals | — | [DATA_NEEDED: integrated peripherals list] |
| Ethernet MACs | — | [DATA_NEEDED: number of GbE MACs] |
| MSL 레벨 | — | [DATA_NEEDED: MSL rating] |