MPC8555EPXAPF vs MPC8555EPXAQF 比較
詳細な並列比較: MPC8555EPXAPF メーカー: NXP Semiconductors および MPC8555EPXAQF メーカー: NXP Semiconductors。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。
NXP Semiconductors
MPC8555EPXAQF - PowerQUICC III 1GHz e500 MPU | NXP | Networking
MPC8555EPXAQF Nrnd仕様比較
| パラメータ | MPC8555EPXAPF | MPC8555EPXAQF |
|---|---|---|
| ブランド | NXP Semiconductors | NXP Semiconductors |
| カテゴリ | Microcontrollers | Microcontrollers |
| ライフサイクル状態 | ラストバイ | NRND |
| Architecture | PowerPC e500 (Power Architecture) | PowerPC e500 (Power Architecture technology) |
| Core | Single e500 | — |
| データバス幅 | 32-Bit | 32-Bit |
| Maximum Clock Speed | 833 MHz | — |
| Core Supply Voltage | 1.2 V | — |
| I/O Supply Voltage | 2.5 V / 3.3 V | — |
| Package Type | FCPBGA-783 (29 x 29 mm, 1 mm pitch, flip chip) | FCPBGA (Flip Chip Plastic BGA) |
| Package Height | 3.75 mm | — |
| ピン数 | 783 | — |
| 動作温度範囲 | -40 °C to +85 °C (industrial, extended) | — |
| L1 Instruction Cache | 32 KB | — |
| L1 Data Cache | 32 KB | — |
| Memory Controller | DDR / DDR2 up to 333 MHz | [DATA_NEEDED: DDR1/DDR2 support details] |
| Ethernet | Two 10/100 Fast Ethernet MACs | — |
| PCI Interface | PCI / PCI-X bridge (up to 133 MHz) | — |
| Process Technology | 130 nm CMOS | — |
| RoHS ステータス | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS compliance status] |
| Security Engine | SEC 2.0 (Integrated) | — |
| Core Count | — | 1 |
| Core Frequency (Max) | — | 1.0 GHz |
| Supply Voltage (Core) | — | 1.2 V |
| Pin / Ball Count | — | 783 |
| Package Dimensions | — | 29 x 29 mm, 1 mm pitch, 3.75 mm height |
| 実装タイプ | — | Surface Mount |
| 動作温度 | — | [DATA_NEEDED: operating temperature range] |
| Series | — | PowerQUICC III (MPC85xx) |
| Part Marketing Code | — | PQ 37 LITE 8555E |
| Integrated Peripherals | — | [DATA_NEEDED: integrated peripherals list] |
| Ethernet MACs | — | [DATA_NEEDED: number of GbE MACs] |
| MSLレベル | — | [DATA_NEEDED: MSL rating] |