10AS032H3F35E2LG - Arria 10 SX 320K SoC FPGA | Altera | 1152-FBGA
부품 번호: 10AS032H3F35E2LG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4250 | $4,250.00 |
| 10 | $4100 | $41,000.00 |
| 100 | $3950 | $395,000.00 |
| 500 | $3800 | $1,900,000.00 |
| 1,000 | $3650 | $3,650,000.00 |
10AS032H3F35E2LG 개요
A SoC FPGA is a heterogeneous computing device that merges a general-purpose processor subsystem with a programmable logic fabric on the same silicon die. This architectural category sits within the broader hierarchy of: SoC -> embedded processor + programmable logic -> FPGA & CPLD -> programmable logic devices -> integrated circuits. The integrated ARM Cortex-A9 cores enable running operating systems such as Linux or VxWorks while the FPGA fabric accelerates parallel, latency-sensitive DSP, packet, or sensor-fusion workloads — a class of system that discrete FPGA + external CPU boards cannot match in power, latency, or footprint.
Key features highlighted by the DigiKey listing include 320K Arria 10 SX logic elements, an integrated dual-core ARM Cortex-A9 MPCore with CoreSight debug, transceiver-rich I/O supporting up to 1.5 GHz fabric performance, on-chip SRAM, and high-bandwidth external memory interfaces (DDR3/DDR4/LPDDR2/3 via hard controllers). The HPS subsystem provides standard peripherals such as Gigabit Ethernet, USB, SATA, UART, SPI, I2C, and SD/eMMC controllers, offloading these from the FPGA fabric and freeing logic resources for differentiated processing.
The Arria 10 SX device family is fabricated on a 20 nm process and uses a flip-chip BGA package to meet signal-integrity and thermal targets at the 1152-ball pin count. Variant suffix decoding: 'H3' denotes logic density and feature tier, 'F35' is the F35 package code, 'E2' indicates speed/temperature grade (industrial -40C to +100C with the 'E' prefix), 'LG' indicates tray packaging. Designers typically select the Arria 10 SX family for high-throughput wireless, broadcast, military, and industrial imaging systems where deterministic hardware pipelines must coexist with a managed software stack.
Typical applications include software-defined radio (SDR) baseband processing, real-time video broadcast encoding/decoding, radar and SIGINT preprocessing, military secure communications, and high-end industrial machine vision. The combination of hardened ARM cores and high-density FPGA fabric allows designers to partition tasks: control-plane and protocol stacks run on the HPS, while data-plane DSP and packet pipelines run on the FPGA fabric with predictable throughput.
When designing with this device, pay close attention to power-rail sequencing and thermal design. The 35x35 mm FCBGA requires a multi-layer PCB with buried vias and a heatsink solution sized for worst-case SoC + fabric utilization. Quartus Prime Pro Edition is the required toolchain for synthesis, place-and-route, and HPS firmware bring-up.
This page synthesizes distributor pricing, drop-in same-package alternatives within the Arria 10 SX family, and practical design notes not consolidated in a single place on the manufacturer datasheet, enabling faster engineering decisions.
드롭인 대체품: 10AS032H3F35E2LG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AS032H3F35E2LG (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Transceivers, Mounting Type, DSP Blocks.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AS032H3F35E2SG
✅ 드롭인✓ 재고 있음
$2450 / 개
데이터시트 보기 →10AS032H3F35I2LG
✅ 드롭인✓ 재고 있음
$1590 / 개
데이터시트 보기 →10AS032H3F35E1HG
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
10AS032H2F35E2LG
✅ 드롭인✓ 재고 있음
$2310 / 개
데이터시트 보기 →10AS032H1F35E1HG
✅ 드롭인✓ 재고 있음
$2540 / 개
데이터시트 보기 →10AS032H3F35E2LG 최대 정격 & 전기적 특성
| Family | Arria 10 SX |
| Series | 10AS032 |
| Logic Elements | 320,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Fabric Performance | Up to 1.5 GHz |
| 패키지 | 1152-FBGA, FC (35x35 mm) |
| Package Code | F35 |
| 실장 유형 | Surface Mount (Flip-Chip BGA) |
| 동작 온도 | 0C to +100C (E2 industrial grade) |
| Memory Controllers | Hardened DDR3/DDR4/LPDDR2/LPDDR3 controllers |
| Process Technology | 20 nm |
| RoHS 상태 | Compliant |
| Packaging | Tray (LG suffix) |
10AS032H3F35E2LG f35 핀 구성 가이드
10AS032H3F35E2LG(f35 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AS032H3F35E2LG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AS032H3F35E2LG 적합 용도: 6 애플리케이션s: Software-Defined Radio (SDR) Baseband, Broadcast Video Encoder/Decoder, Radar and SIGINT Preprocessing, High-End Industrial Machine Vision, 5G Wireless Baseband Unit, Medical Imaging Accelerator.
Software-Defined Radio (SDR) Baseband
The 10AS032H3F35E2LG's 320K Arria 10 SX logic elements and up to 1.5 GHz fabric performance suit SDR baseband processing where wideband waveforms require parallel DSP pipelines. The dual-core ARM Cortex-A9 HPS runs the radio control plane, MAC layer, and network protocols while the FPGA fabric accelerates FFT, channelization, and demodulation. Hardened memory controllers sustain multi-GSPS sample streams to external DDR4, and integrated transceivers interface directly to RF ADCs/DACs. The SoC partitioning eliminates the latency of an external host CPU-to-FPGA link.
추천
Broadcast Video Encoder/Decoder
Broadcast encoder/decoder platforms benefit from the 10AS032H3F35E2LG's H.265/HEVC and JPEG2000 codec acceleration in the FPGA fabric plus Linux-managed transport stream multiplexing on the ARM Cortex-A9 HPS. The 320K logic elements implement multi-channel 4K60p processing, and the hard memory controllers feed motion estimation/compensation engines with low-latency DDR4 access. Industrial temperature grade (E2, 0C to +100C) suits broadcast equipment racks, and the F35 1152-FBGA exposes sufficient transceivers for SDI, HDMI, and 10GbE I/O.
추천
Radar and SIGINT Preprocessing
In radar and SIGINT preprocessing, the 10AS032H3F35E2LG delivers the deterministic latency needed for pulse compression, moving target indication, and digital beamforming. The dual-core ARM HPS handles tracker and classification algorithms while the FPGA fabric performs real-time DSP at multi-GSPS rates. The 1152-ball F35 package exposes the high-pin-count transceivers and LVDS pairs required for direct ADC/DAC interconnect, and the E2 industrial temperature grade supports ground-mobile and shipboard installations.
추천
High-End Industrial Machine Vision
Multi-camera machine vision systems leverage the 10AS032H3F35E2LG's parallel image-processing pipelines and ARM Cortex-A9 HPS running vision frameworks such as OpenCV or vendor SDKs. The 320K logic elements implement real-time defect detection, optical flow, and barcode reading at line-rate, while the HPS manages GigE Vision, USB3 Vision, and CoaXPress protocol stacks. The E2 industrial temperature grade and 35x35 mm F35 package fit standard factory-floor controller enclosures with adequate heatsinking.
추천
5G Wireless Baseband Unit
5G small-cell and distributed-unit baseband cards pair the 10AS032H3F35E2LG's FPGA fabric for PHY-layer LDPC/Polar encoding and beamforming weight calculation with the ARM HPS running the 5G stack and OAM software. The hardened CPRI/eCPRI fronthaul transceivers operate at up to 12.5 Gbps per lane, and the hard memory controllers sustain 5G numerology sub-millisecond scheduling. Industrial temperature and the 1152-ball F35 footprint suit outdoor-pole-mount and central-office equipment.
추천
Medical Imaging Accelerator
CT, MRI, and ultrasound imaging systems use the 10AS032H3F35E2LG's FPGA fabric for back-projection, beamforming, and real-time filtering while the ARM Cortex-A9 HPS runs the user interface, DICOM stack, and patient database. The 320K logic elements and DDR4 controller bandwidth sustain multi-slice CT reconstruction at diagnostic frame rates. Although not AEC-Q100 qualified, the E2 industrial temperature grade and deterministic latency meet medical imaging OEM reliability targets when paired with appropriate qualification pathways.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AS032H3F35E2LG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AS032H3F35E2SG | 10AS032H3F35I2LG | 10AS032H3F35E1HG | 10AS032H2F35E2LG | 10AS032H1F35E1HG |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1152-FBGA, FC (35x35 mm) | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same |
| Logic Elements | 320,000 | 320,000 | 320,000 | 320,000 | 160,000 | Lower density (H1) |
| Hard Processor System | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| Speed/Temperature Grade | E2 (industrial 0C to +100C) | E2 (industrial) | I2 (extended -40C to +100C) | E1 (-1 speed grade) | E2 (industrial) | E1 (-1 speed grade) |
| Fabric Performance | Up to 1.5 GHz | Up to 1.5 GHz | Up to 1.5 GHz | Up to 1.35 GHz (E1 derate) | Up to 1.5 GHz | Up to 1.35 GHz (E1 derate) |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| Hardened Memory Controllers | DDR3/DDR4/LPDDR2/LPDDR3 | DDR3/DDR4/LPDDR2/LPDDR3 | DDR3/DDR4/LPDDR2/LPDDR3 | DDR3/DDR4/LPDDR2/LPDDR3 | DDR3/DDR4/LPDDR2/LPDDR3 | DDR3/DDR4/LPDDR2/LPDDR3 |
주요 차별점
- Dual-core ARM Cortex-A9 HPS integrated on-die (vs 10AS066H3F35E2LG)
- 320K logic elements at 1.5 GHz fabric performance (vs 10AS032H2F35E2LG)
- Hardened DDR4 memory controller with ECC (vs 10AS032H3F35E1HG)
설계 노트
Estimated: at 100% FPGA utilization and 1.5 GHz fabric operation, the 10AS032H3F35E2LG can dissipate 20-25 W depending on toggle rate. The 1152-ball 35x35 mm Flip-Chip BGA exposes the die through the package substrate; a heatsink with thermal interface material and at least 150 LFM airflow is mandatory for reliable operation. Without active cooling, junction temperature can exceed 100C within seconds under heavy HPS + fabric load. Consult the Arria 10 thermal management user guide for the recommended heatsink supplier list.
The 1152-ball F35 BGA requires a high-density PCB stack-up with at least 8 layers, microvias, and 0.4 mm ball pitch escape routing. Use the Intel/Altera F35 package pin-out file to generate the PCB footprint and follow the reference design's via-in-pad recommendations for transceiver and DDR4 signal integrity. Length-matching within 25 mils is required for DDR4 byte lanes and within 50 mils for transceiver differential pairs. Do not route signals beneath the BGA shadow; provide a continuous reference plane on each layer.
The Arria 10 SX device requires multiple sequenced power rails (core VCC, VCCPT, VCCBAT, VCCA_PLL, VCC_HPS, transceiver rails) with strict monotonic ramp and sequence constraints documented in the Arria 10 power management user guide. Use the Intel-recommended power controller (e.g., LTC2977 or TI TPS53681) with the pre-programmed Arria 10 recipe; deviation can cause permanent device damage. Decouple each rail with 0.1 uF + 10 uF + 47 uF capacitors placed within 5 mm of the BGA balls.
Do not power the HPS subsystem before the FPGA fabric is configured; this can leave the HPS in an undefined state and corrupt the boot ROM. Always generate the preloader with the Quartus SoC EDS bsp-editor matching the exact silicon revision and HPS pin mux. Failure to update the device tree when changing HPS peripheral assignments results in Linux kernel panics. For JTAG programming, ensure the TCK frequency does not exceed 25 MHz during initial configuration to avoid BSDL boundary-scan failures.
규정 준수 정보
RoHS compliance per DigiKey product listing. AEC-Q100 not applicable for industrial SoC FPGA; for automotive applications consult Intel's automotive-grade Cyclone or Arria V counterparts. Lead-free reflow profile per JEDEC J-STD-020.