10AS048K3F35I2LG - Arria 10 SX SoC FPGA 480K LE | Intel / Altera
부품 번호: 10AS048K3F35I2LG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $5200 | $5,200.00 |
| 10 | $4950 | $49,500.00 |
| 100 | $4500 | $450,000.00 |
| 500 | $4100 | $2,050,000.00 |
| 1,000 | $3850 | $3,850,000.00 |
10AS048K3F35I2LG 개요
An SoC FPGA is a heterogeneous compute device that fuses a general-purpose application processor subsystem with a programmable logic fabric, allowing deterministic hardware acceleration alongside OS-managed software. Within the broader taxonomy, SoC FPGAs sit between pure FPGAs and ASSPs, inheriting the flexibility of programmable logic and the ease of programming of a Linux-capable application processor, which makes them a standard choice for protocol bridging, motor control, and high-bandwidth DSP pipelines.
Key features include 480K logic elements, embedded 20K-block M20K memory, hardened IEEE 754 single-precision floating-point DSP blocks, up to 1.5 GHz HPS clock, integrated multi-protocol transceivers up to 14.1 Gbps, PCI Express Gen3 hard IP, and hardened memory controllers for DDR4, DDR3, LPDDR3, and QDRII+. The device also provides a security manager with bitstream authentication, hardware AES, and side-channel attack resistance.
The 1152-FBGA (FC, 35x35) package integrates a high-pin-count flip-chip BGA suitable for high-speed serial interfaces and dense parallel memory buses, while the industrial temperature grade (-40C to +100C) supports ruggedized deployments. Compared with discrete FPGA-plus-microcontroller designs, the Arria 10 SX reduces board area, BOM, and latency between HPS and fabric, simplifying system architecture and improving energy efficiency.
Typical applications include wireless baseband and radio units, medical imaging accelerators, broadcast and Pro AV signal processing, defense radar and EW preprocessing, industrial machine vision, and high-performance networking line cards. The combination of low-latency fabric plus a multi-core ARM subsystem suits workloads that need both deterministic hardware and rich software stacks running concurrently.
When designing with this device, allocate sufficient PCB layers for the FCBGA breakout and follow Intel's recommended decoupling strategy; provide matched-length routing for DDR4 channels and observe transceiver channel placement rules to maximize signal integrity. Use the Quartus Prime toolchain with the Arria 10 device support and the SoC EDS kit for HPS bring-up.
This page synthesizes distributor pricing, drop-in alternatives drawn from the Arria 10 SX family, and practical design notes not found in the manufacturer datasheet, providing an engineer-ready view of the 10AS048K3F35I2LG.
드롭인 대체품: 10AS048K3F35I2LG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AS048K3F35I2LG (동일 폼 팩터 및 풋프린트) — 차이점: Package, Logic Elements, Mounting Type, Operating Temperature, Package Code.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AS048K3F35I2SG
✅ 드롭인✓ 재고 있음
$1995 / 개
데이터시트 보기 →10AS048K3F35E2LG
✅ 드롭인✓ 재고 있음
$3495 / 개
데이터시트 보기 →10AS048K3F35E2SG
✅ 드롭인✓ 재고 있음
$2720 / 개
데이터시트 보기 →10AS048K2F35I2LG
✅ 드롭인✓ 재고 있음
$2650 / 개
데이터시트 보기 →10AS048K2F35I2SG
✅ 드롭인✓ 재고 있음
$3450 / 개
데이터시트 보기 →10AS048K2F35E2LG
✅ 드롭인✓ 재고 있음
$4150 / 개
데이터시트 보기 →10AS048K2F35E2SG
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →10AS048K3F35I2LG 최대 정격 & 전기적 특성
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 480K |
| Processor Core | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Clock | 1.5 GHz |
| 패키지 | 1152-FBGA, FC (35x35 mm) |
| Package Code | BGA, Square |
| Number of Terminals | 1152 |
| Form of Terminal | Ball |
| Temperature Grade | Industrial |
| 동작 온도 | -40C to +100C |
| 실장 유형 | Surface Mount |
| Device Family | 10AS048 (F35 speed grade) |
| Transceivers | Up to 14.1 Gbps (multi-protocol) |
| PCI Express | Gen3 hard IP |
| Memory Interfaces | DDR4, DDR3, LPDDR3, QDRII+ |
| RoHS 상태 | Compliant |
| Lead Free | Yes |
10AS048K3F35I2LG bga, square 핀 구성 가이드
10AS048K3F35I2LG(bga, square 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AS048K3F35I2LG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AS048K3F35I2LG 적합 용도: 6 애플리케이션s: Wireless Baseband Processing, Medical Imaging Accelerator, Broadcast and Pro AV Signal Processing, Industrial Machine Vision, Defense Radar and EW Preprocessing, High-Performance Networking Line Card.
Wireless Baseband Processing
The 10AS048K3F35I2LG is well suited to wireless baseband and radio unit processing because its dual ARM Cortex-A9 HPS runs the L1/L2 protocol stack while the 480K-logic-element fabric implements FFT, channel estimation, and Turbo/LDPC decoding in deterministic hardware. With transceivers up to 14.1 Gbps and hardened PCI Express Gen3, the part handles CPRI or eCPRI backhaul interfaces alongside the radio datapath without an external bridge chip. Designers place the HPS on the JESD204B or CPRI side and offload bit-level processing to fabric DSP blocks, reducing latency well below what a discrete MCU+FPGA architecture achieves and keeping BOM and PCB area lower for 4G/5G small-cell deployments.
추천
Medical Imaging Accelerator
The 10AS048K3F35I2LG fits medical imaging systems such as CT, MRI, and ultrasound reconstruction because its 480K logic elements combined with hardened single-precision floating-point DSP blocks deliver the throughput required for back-projection and beamforming pipelines. The dual ARM Cortex-A9 MPCore hosts the patient interface, DICOM stack, and safety diagnostics while the FPGA fabric accelerates the compute kernels. PCI Express Gen3 hard IP links the SoC to a host workstation or to a multi-board imaging chassis at line rate. Industrial temperature rating (-40C to +100C) supports imaging carts and mobile diagnostic enclosures.
추천
Broadcast and Pro AV Signal Processing
Broadcast studios and professional AV installations benefit from the 10AS048K3F35I2LG because its high-speed transceivers and abundant DSP bandwidth handle 4K/8K video scaling, color-space conversion, and SDI/HDMI bridging in a single device. The dual ARM cores run control software and network stacks while the FPGA fabric processes pixel pipelines in real time. PCI Express Gen3 connects to capture or playback host cards, and the industrial temperature grade fits the wide environmental range of OB vans and stadium installations. The integrated SoC reduces bill-of-materials count compared with a separate MCU plus FPGA approach.
추천
Industrial Machine Vision
The 10AS048K3F35I2LG suits industrial machine vision systems because the FPGA fabric executes image pre-processing, edge detection, and convolutional inference at line rate while the ARM cores orchestrate PLC comms, EtherCAT masters, and HMI logic. CoaXPress, Camera Link, or GigE Vision inputs are absorbed through transceiver channels and fabric IP. The 1152-FBGA package allows dense PCB integration with industrial-grade cameras, while industrial temperature operation tolerates factory-floor environments. Designers replace host PCs with this single SoC to cut system cost, latency, and footprint in high-speed inspection lines.
추천
Defense Radar and EW Preprocessing
Defense radar and electronic warfare systems leverage the 10AS048K3F35I2LG for its combination of high-throughput DSP blocks, low-latency fabric, and multi-gigabit transceivers that handle wide-bandwidth A/D converter feeds in real time. The dual ARM Cortex-A9 runs mission software, threat libraries, and network interfaces while FPGA fabric performs pulse compression, CFAR detection, and digital RF memory functions. PCI Express Gen3 links to host processors, and the SoC integration shrinks SWaP-C for size-, weight-, and power-constrained platforms. Industrial temperature operation supports ground-vehicle and shipboard installations.
추천
High-Performance Networking Line Card
The 10AS048K3F35I2LG is appropriate for high-performance networking line cards because its transceivers support 10G/25G/40G Ethernet and OTN rates, the FPGA fabric implements packet processing and encryption offload, and the ARM cores manage control plane and management agents. PCI Express Gen3 hard IP connects to a switch fabric ASIC, and hardened memory controllers support DDR4 for deep packet buffers. Industrial temperature supports carrier-grade networking equipment deployed in uncontrolled environments. Designers benefit from SoC integration by eliminating an external CPU for many line-card functions.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AS048K3F35I2LG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AS048K3F35I2SG | 10AS048K3F35E2LG | 10AS048K3F35E2SG | 10AS048K2F35I2LG | 10AS048K2F35I2SG |
|---|---|---|---|---|---|---|
| Package | 1152-FBGA (35x35) | 1152-FBGA (35x35) - same | 1152-FBGA (35x35) - same | 1152-FBGA (35x35) - same | 1152-FBGA (35x35) - same | 1152-FBGA (35x35) - same |
| Brand | Altera (Intel) | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same |
| Logic Elements | 480K | 480K | 480K | 480K | 480K | 480K |
| Speed Grade | K3 (F35 fastest) | K3 | K3 | K3 | K2 (slower) | K2 (slower) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Extended (-40C to +125C) | Extended (-40C to +125C) | Industrial | Industrial |
| Packaging Form | Tray | Tray | Tray | Tray | Tray | Tray |
| HPS | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| Lifecycle Status | Active | Active | Active | Active | Active | Active |
주요 차별점
- Fastest speed grade in the Arria 10 SX 480K F35 family (vs 10AS048K2F35I2LG)
- Industrial temperature grade coverage (vs 10AS048K3F35E2LG)
- SoC integration eliminates external processor (vs Discrete MCU + Arria 10 GX)
설계 노트
The 1152-ball FCBGA at 35x35 mm requires a high-density PCB stack-up. Use Intel's pin connection guidelines to plan escape routing; follow the recommended 1.0 mm pitch BGA breakout with vias-in-pad for inner rows. Plan for at least 12 PCB layers to maintain signal-integrity for 14.1 Gbps transceivers and DDR4 channels. Provide continuous ground reference planes under the BGA and stitch vias around the perimeter for thermal and electrical performance.
The Arria 10 SX dissipates significant power under fabric load. Use the heatsink or cold-plate reference designs in the Arria 10 thermal management user guide; measure junction temperature with the on-die thermal diode in your application. For typical wireless baseband workloads at 1.5 GHz HPS clock plus 70-80% fabric utilisation, plan for a 25-40W power envelope and provide forced-air cooling or a heat-spreader.
Do not mix the K2 and K3 speed grades freely across designs without re-running timing closure in Quartus Prime. Confirm transceiver channel placement rules before PCB layout, since invalid channel placement prevents the design from compiling. For HPS bring-up, configure boot mode straps correctly and validate reference clock stability before JTAG attachment.
규정 준수 정보
RoHS and lead-free compliance from Altera material attributes. AEC-Q100 not applicable - this is a high-performance FPGA, not an automotive-qualified IC.