H5ANAG4NBJR-VKC - 16Gb DDR4 SDRAM FBGA-78 | SK hynix
부품 번호: H5ANAG4NBJR-VKC ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $19.75 | $19.75 |
| 10 | $18.2 | $182.00 |
| 100 | $16.9 | $1,690.00 |
| 500 | $15.6 | $7,800.00 |
| 1,000 | $14.4 | $14,400.00 |
H5ANAG4NBJR-VKC 개요
A DDR4 SDRAM is a synchronous dynamic random-access memory that transfers data on both clock edges (double data rate), synchronizing to a host memory controller through CK/CK# differential clocking. Within the memory hierarchy, DDR4 DRAM sits in the family of volatile semiconductor memory (DRAM -> SDRAM -> DDR SDRAM -> DDR4 SDRAM -> DDR5 SDRAM), and it remains the dominant main-memory technology in servers, workstations, and industrial compute platforms.
Key features identified across the SK hynix NBJR DDR4 family include an extended operating temperature range from -40 C to +95 C case temperature with auto self-refresh, a data mask (DM) function for partial writes, an asynchronous reset function for fast state recovery, dynamic on-chip termination (ODT), ZQ calibration for output impedance matching, write leveling for fly-by topology signal integrity, and CRC (command/address parity) protection. The VKC suffix denotes the SK hynix commercial speed grade within the DDR4 binning system; exact speed-bin parameters are listed in the specifications table below where verified.
Architecturally, the device uses an 8n-prefetch DDR4 core with bank groups, allowing burst transfers to be interleaved across banks for higher effective bandwidth while the internal core runs at a fraction of the I/O rate. DDR4 lowers the core operating voltage relative to DDR3, cutting memory subsystem power by roughly 20% for the equivalent bandwidth, per SK hynix DDR4 product literature.
Typical applications include server DIMMs and memory modules, industrial computing and network processing line cards, embedded compute modules that support DDR4 memory-down designs, and test-and-measurement systems buffering high-rate data streams. The -40 C to +95 C industrial option makes the NBJR family especially relevant for outdoor telecom and factory-automation environments.
Design consideration: maintain the DDR4 routing rules for fly-by command/address topology, and enable ZQ calibration and dynamic ODT per the JEDEC DDR4 specification to guarantee signal integrity at rated data rates; always consult the SK hynix part-number decoder to confirm speed bin, temperature grade, and package for the exact suffix ordered.
This page synthesizes distributor stock data, drop-in family alternatives, and practical design notes in one place - information not consolidated in the raw manufacturer datasheet.
드롭인 대체품: H5ANAG4NBJR-VKC — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: H5ANAG4NBJR-VKC (동일 폼 팩터 및 풋프린트) — 차이점: RoHS Status, Density, Package, Interface, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
H5ANAG4NBJR-UHC
✅ 드롭인✓ 재고 있음
$8.09 / 개
데이터시트 보기 →H5ANAG4NBJR-RDC
✅ 드롭인✓ 재고 있음
$5.75 / 개
데이터시트 보기 →H5ANAG4NBJR-PBC
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →H5ANAG6NBJR-VKC
✅ 드롭인✓ 재고 있음
$15 / 개
데이터시트 보기 →H5ANAG8NBJR-VKC
✅ 드롭인✓ 재고 있음
$8.6 / 개
데이터시트 보기 →H5ANAG4NBJR-VKC 사양
| Product Type | DDR4 SDRAM |
| Density | 16 Gb |
| 패키지 | FBGA-78 (7.5 mm x 11 mm) |
| 동작 온도 범위 | -40 C to +95 C (case, industrial with auto self-refresh) |
| Speed Grade | VKC (commercial speed bin - see SK hynix part number decoder) |
| Data Mask Function | Yes |
| Asynchronous Reset | Yes |
| Dynamic ODT | Yes |
| ZQ Calibration | Yes |
| Write Leveling | Yes |
| CRC / CA Parity | Yes |
| Auto Self-Refresh | Yes |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant (per distributor listing) |
H5ANAG4NBJR-VKC fbga-78 (7.5 mm x 11 mm) 핀 구성 가이드
H5ANAG4NBJR-VKC(fbga-78 (7.5 mm x 11 mm) 패키지)의 핀 구성입니다. 핀 번호, 기능, 연결 다이어그램은 제조사 데이터시트에 정의되어 있습니다. 정확한 풋프린트와 솔더링 지침은 해당 문서를 참조하십시오.
다음에 대한 상세 핀아웃 데이터 없음: H5ANAG4NBJR-VKC.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
H5ANAG4NBJR-VKC 적합 용도: 6 애플리케이션s: Server Memory Modules (RDIMM/LRDIMM), Industrial Computing and Factory Automation, Networking and Telecom Line Cards, Embedded Compute Modules (COM Express / SMARC), Test and Measurement Data Buffering, Surveillance and Video Analytics Systems.
Server Memory Modules (RDIMM/LRDIMM)
Server platforms require the highest available DRAM density per module slot, and the H5ANAG4NBJR-VKC's 16Gb single-die capacity allows 16 GB per 8-deep module rank with fewer components than multi-die solutions. SK hynix DDR4 parts use 8n prefetch and bank-group architecture to sustain high bandwidth across many parallel chips on a fly-by command/address topology, which is why write leveling and CRC support in this device are essential for module-level signal integrity. Placed on registered DIMMs, the DRAM operates behind a register/PLL chip (such as SPD/Register combos) that buffers CA bus loading; the dynamic ODT feature then matches impedance as ranks are added or removed. Thermal design is the main constraint: memory ranks share airflow, so the -40 C to +85 C industrial spec range with auto self-refresh adds margin for hot-aisle datacenter conditions.
추천
Industrial Computing and Factory Automation
Industrial PCs, PLC head units, and edge gateways operate in environments where ambient temperature swings from sub-zero warehouses to hot control cabinets. The H5ANAG4NBJR family's documented -40 C to +95 C case temperature range with auto self-refresh lets a single DRAM selection cover both extremes without heater circuits. SK hynix DDR4 documentation specifies that all DRAM specifications are maintained at case temperatures from -40 C to +85 C, with extended operation to +95 C, which maps directly to conduction-cooled industrial designs. The asynchronous reset function allows the host CPU to rapidly clear the DRAM state after a watchdog event, while the data mask function supports partial-word updates common in PLC data tables. Memory-down designs benefit from the compact FBGA-78 footprint for vibration-resistant, connector-free assembly.
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Networking and Telecom Line Cards
Network processors, switching ASICs, and telecom DSPs use DDR4 SDRAM as packet buffer and flow-table memory, where sustained bandwidth and deterministic refresh behavior matter more than peak latency. The H5ANAG4NBJR-VKC's x4 organization enables wide multi-chip interleaving on 72-bit ECC buses (18 chips per rank), improving effective bandwidth through bank-group interleaving. CRC and CA parity protection on the command/address bus, supported by this device, guard against soft errors in electrically noisy chassis environments - a documented NBJR family feature. Outdoor telecom cabinets drive the temperature requirement: the -40 C to +85 C industrial specification with extension to +95 C case covers uncooled deployments. Dynamic ODT simplifies multi-rank memory-down topologies by allowing the controller to change termination strength on the fly without board changes.
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Embedded Compute Modules (COM Express / SMARC)
Computer-on-module vendors embed DDR4 memory-down on COM Express and SMARC carriers where every square millimeter counts. The FBGA-78 (7.5 x 11 mm) package of the H5ANAG4NBJR-VKC provides 16Gb in one of the smallest DDR4 footprints available, allowing 4 GB per chip pair and 8 GB systems within a small module area. Because DDR4 reduces operating voltage relative to DDR3 by roughly 20% for equivalent bandwidth per SK hynix, module thermal budgets remain feasible under passive heatsinks. The ZQ calibration and write leveling functions automate impedance and timing compensation during boot, simplifying BIOS memory-training across component speed bins and vendors. Designers should route length-matched DQ/DQS fly-by CA topology and reserve the RZQ precision resistor placement per the SK hynix device operation document to guarantee training success.
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Test and Measurement Data Buffering
Oscilloscope, logic analyzer, and RF signal-capture platforms stream high-rate ADC data into deep DDR4 buffers. The H5ANAG4NBJR-VKC's bank-group architecture allows interleaved burst transfers that sustain the sustained write throughput required for gapless capture at converter rates. The data mask function lets the acquisition engine skip filling unused sample windows without full-burst rewrites, improving effective buffer utilization. Because bench instruments run in climate-controlled rooms, the commercial VKC speed grade is the economical choice, though the same-package -PBC industrial variant is available if the design is later ported to field equipment. Wide x4 organization enables deep interleaving across many chips on a 288-bit acquisition bus; designers must size decoupling and termination to DDR4 specs, since buffer write bursts load the power rail heavily and dynamically.
추천
Surveillance and Video Analytics Systems
AI-enabled NVRs and smart-camera hubs use DDR4 as working memory for multi-stream video decode plus neural inference frame buffers. The H5ANAG4NBJR-VKC provides 16Gb per chip, letting a 16-camera analytics appliance reach 8 GB with four components, conserving PCB area in 1U chassis. The asynchronous reset and auto self-refresh features support reliable operation around power events common in surveillance installations, while CRC-protected command/address signaling maintains integrity inside densely populated encoder boards. Temperature range is a differentiator: edge cabinets without active cooling can exceed +85 C internally, and the documented -40 C to +95 C case capability of the NBJR industrial range covers this scenario. Designers should verify controller support for dynamic ODT rank switching when mixing buffered and non-buffered topologies in compact encoder hardware.
추천
추천 제품 요약
엔지니어링 참조 데이터: H5ANAG4NBJR-VKC — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | H5ANAG4NBJR-UHC | H5ANAG4NBJR-RDC | H5ANAG4NBJR-PBC | H5ANAG6NBJR-VKC | H5ANAG8NBJR-VKC |
|---|---|---|---|---|---|---|
| Package | FBGA-78 (7.5 x 11 mm) | FBGA-78 (7.5 x 11 mm) - same | FBGA-78 (7.5 x 11 mm) - same | FBGA-78 (7.5 x 11 mm) - same | FBGA-78 (7.5 x 11 mm) - same | FBGA-78 (7.5 x 11 mm) - same |
| Brand | SK Hynix | SK Hynix | SK Hynix | SK Hynix | SK Hynix | SK Hynix |
| Density | 16 Gb | 16 Gb | 16 Gb | 16 Gb | 16 Gb | 16 Gb |
| Organization | x4 | x4 | x4 | x4 | x8 | x16 |
| Interface | DDR4 SDRAM | DDR4 SDRAM | DDR4 SDRAM | DDR4 SDRAM | DDR4 SDRAM | DDR4 SDRAM |
| Speed Bin (suffix decode) | VKC | UHC | RDC | PBC | VKC | VKC |
| Feature Set (DM / Reset / ODT / ZQ / Write Leveling / CRC) | All supported | All supported (NBJR family) | All supported (NBJR family) | All supported (NBJR family) | All supported (NBJR family) | All supported (NBJR family) |
주요 차별점
- 16Gb single-die density (vs H5AN8G4NAFR-VKC)
- Industrial temperature option in same footprint (vs H5ANAG4NBJR-PBC)
- x4 organization for maximum ECC-bus interleave (vs H5ANAG8NBJR-VKC)
설계 노트
DDR4 uses a fly-by command/address/clock topology: CA and clock signals see staggered arrival times at each DRAM, which the controller must compensate via write leveling - a function the H5ANAG4NBJR-VKC supports natively. Route length-matched DQ/DQS groups per byte lane, and terminate CA with on-die termination rather than external resistor networks. Enable ZQ calibration with the precision RZQ resistor (typically 240 ohm per DDR4 convention - confirm exact value in the SK hynix datasheet) placed close to the ZQ ball with a solid ground return. Skipping or mis-tuning calibration is the leading cause of memory-training failures at speed.
Per SK hynix DDR4 documentation, all DRAM specifications are supported with case temperature maintained between -40 C and +85 C, with extended operation allowed between +85 C and +95 C case temperature. In fanless or sealed enclosures, model case temperature - not ambient - using theta_JC-style conduction paths through the BGA balls to the PCB; a memory-down design on a 4-layer board relies on copper planes as the primary heat spreader. Above +85 C, auto self-refresh maintains data integrity, but refresh overhead (and thus effective bandwidth) increases, so verify your throughput margin in extended-temperature operation.
Suffix codes matter: SK hynix part numbers encode speed bin and temperature grade in the suffix (VKC, UHC, RDC, PBC), and the same package hosts x4/x8/x16 organizations (AG4/AG6/AG8). Ordering the wrong suffix or organization yields a part that physically fits the footprint but fails to meet timing or bus-width requirements. Always verify the exact suffix with the SK hynix part number decoder (available on the SK hynix Downloads portal) before releasing the BOM, and treat second-source qualification as a board-level exercise requiring ball-map and timing comparison.
규정 준수 정보
RoHS compliance indicated by distributor listing context for the NBJR family (which is described as lead-free and halogen-free in historical family documentation); exact REACH, lead-free, and halogen-free status for the -VKC suffix should be confirmed against the SK hynix product compliance database.
