10AX090N4F45I3LG - Arria 10 GX FPGA, 900K LE, 1932-FCBGA | Altera
부품 번호: 10AX090N4F45I3LG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $6503.71 | $6,503.71 |
| 10 | $6178.52 | $61,785.20 |
| 25 | $5853.34 | $146,333.50 |
| 50 | $5528.15 | $276,407.50 |
| 100 | $5202.97 | $520,297.00 |
10AX090N4F45I3LG 개요
A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic fabric, routing, and I/O can be programmed by the end user after manufacture. FPGAs sit in the broader programmable logic hierarchy (PAL/CPLD -> FPGA -> SoC FPGA) and belong to the wider digital logic and parallel-processing IC category, sitting alongside ASICs and ASSPs in modern digital design. Arria 10 devices in particular bridge mid-range FPGAs and high-end transceivers, enabling 25G/40G optical links and floating-point DSP pipelines in a single device.
Key differentiating specifications of this variant include the industrial temperature grade (-40C to +100C), the speed grade -3 (mid-tier, balance of performance and power), the F45 package code (1932-ball FCBGA at 45 mm), and the N4 logic structure designation. These four letter-digit groups distinguish it from other 10AX090 variants - for example 10AX090N3F45I3SG (commercial speed grade -3 with 24 transceivers), 10AX090N3F40I2LG (F40 40 mm package), or 10AX090N2F45I1SG (lower density).
The Arria 10 architecture integrates a hardened ARM Cortex-A9 MPCore processor subsystem (in SoC variants), 20+ Gbps transceivers, 1.5 Gbps LVDS I/O, and variable-precision DSP blocks capable of single-precision floating-point operations. The 14 nm Tri-Gate process technology enables a tight balance between performance-per-watt and absolute throughput.
Typical applications include 40G/100G optical transport, wireless baseband processing, radar and electronic warfare beamforming, video broadcast infrastructure, and ASIC prototyping. The high logic density and transceiver bandwidth make it suitable for high-throughput data pipelines.
When designing with this part, ensure your PCB has a 1932-ball BGA footprint with proper escape routing, a multi-rail power delivery network (typically 0.85V core, 1.2V/1.8V/2.5V/3.3V auxiliary), and thermal management sized for the -3 speed grade's higher power dissipation. Use the Quartus Prime design suite for synthesis, place-and-route, and timing closure.
This page synthesizes real-time distributor pricing, drop-in alternative inventory, and field-verified design notes that are not collected together in any single manufacturer document.
드롭인 대체품: 10AX090N4F45I3LG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AX090N4F45I3LG (동일 폼 팩터 및 풋프린트) — 차이점: Package, DSP Blocks, Speed Grade, Transceivers, Logic Elements.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AX090N3F45I3LG
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
10AX090N3F45I2LG
✅ 드롭인✓ 재고 있음
$2995 / 개
데이터시트 보기 →10AX090N2F45I2LG
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →10AX090N2F45I1SG
✅ 드롭인✓ 재고 있음
$6450 / 개
데이터시트 보기 →10AX090N4F40I3LG
✅ 드롭인✓ 재고 있음
$3290 / 개
데이터시트 보기 →10AX066N2F40E1SG
✅ 드롭인✓ 재고 있음
$3350 / 개
데이터시트 보기 →10AX090N4F45I3LG 최대 정격 & 전기적 특성
| Series | Arria 10 GX |
| Family | 10AX090 |
| Logic Elements | 900,000 |
| Embedded Memory Bits | 59,234,304 |
| User I/Os | 768 |
| 패키지 | 1932-BBGA, FCBGA |
| Package Code | F45 |
| Ball Count | 1932 |
| Process Technology | 14 nm Tri-Gate |
| Logic Structure | N4 |
| Speed Grade | -3 |
| 동작 온도 | -40C to +100C (Industrial) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
10AX090N4F45I3LG 핀 구성
| 핀 1 | VCC — Core supply (0.85 V typical) - position approximate; see device datasheet pin tables for exact ball map |
| 핀 2 | GND — Ground reference |
| 핀 3 | IO_BANK_1A — User I/O in bank 1A |
| 핀 4 | IO_BANK_1B — User I/O in bank 1B |
일반적인 애플리케이션
10AX090N4F45I3LG 적합 용도: 6 애플리케이션s: 100G Optical Transport Platform, Wireless Baseband Processing, Radar and Electronic Warfare Beamforming, Broadcast Video Infrastructure, ASIC Prototyping and Emulation, Medical Imaging (CT/MRI Reconstruction).
100G Optical Transport Platform
The 10AX090N4F45I3LG drives 100G OTU4 optical transport cards where its 900K logic elements implement the MAC, PCS, and forward-error-correction (FEC) blocks, while the Arria 10 GX transceivers deliver up to 28.05 Gbps per lane for 4x25G or 4x28G optical interfaces. The 768 user I/Os comfortably fan out to multiple SFP+/QSFP cages plus a backplane. Placed as the line-card processor, it eliminates the need for an external FEC ASSP. Compared with smaller Arria 10 variants, the 900K LE density removes multi-FPGA partitioning at 100G line rate.
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Wireless Baseband Processing
In 4G/5G baseband units, the 10AX090N4F45I3LG's variable-precision DSP blocks execute single-precision floating-point operations required for channel estimation, MIMO detection, and FFT/iFFT pipelines. The 14 nm Tri-Gate process delivers the performance-per-watt needed for outdoor radio units. With 900K logic elements, a single device can host multiple LTE carriers or one 5G NR carrier. Compared with DSP-only ASSPs, the FPGA's reconfigurability supports multi-standard base stations across LTE, 5G NR, and proprietary waveforms.
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Radar and Electronic Warfare Beamforming
Phased-array radar and electronic-warfare systems use the 10AX090N4F45I3LG to perform digital beamforming across thousands of antenna elements. The Arria 10 GX transceivers handle the ADC/DAC JESD204B/C links, while the 900K logic elements implement beam-steering weights, calibration, and pulse compression. The industrial temperature range (-40C to +100C) suits outdoor radar installations. Compared with ASIC-based alternatives, the FPGA enables rapid waveform updates without re-spinning silicon.
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Broadcast Video Infrastructure
In 4K/8K broadcast studios and contribution encoders, the 10AX090N4F45I3LG handles multi-stream HEVC/H.264 encoding, deinterlacing, color-space conversion, and SDI/HDMI aggregation. The 768 user I/Os support multiple 12G-SDI links (4x for 8K), and the embedded memory (59 Mbits) buffers multi-frame look-ahead for encoder pipeline latency hiding. Industrial temperature grade suits outdoor broadcast vans. Compared with ASIC encoders, the FPGA enables codec parameter tuning per broadcaster.
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ASIC Prototyping and Emulation
The 10AX090N4F45I3LG is a workhorse in ASIC prototyping farms where multiple FPGAs partition a large ASIC RTL design. The 900K logic elements map approximately 18-22 million ASIC gates (with 4-5x logic over-subscription), and the 28 Gbps transceivers connect to high-speed protocol bridges. Compared with dedicated emulation systems, Arria 10 GX delivers 4-8x faster bring-up at lower cost per gate. The industrial temperature range supports bring-up labs without special cooling.
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Medical Imaging (CT/MRI Reconstruction)
In CT and MRI scanners, the 10AX090N4F45I3LG accelerates image reconstruction algorithms (filtered back-projection, iterative reconstruction) using its variable-precision DSP blocks. The high logic count and memory bandwidth enable real-time reconstruction at full scanner data rates. The 14 nm process keeps power dissipation manageable in the scanner-room thermal envelope. Compared with GPU-based reconstruction, FPGA implementations offer deterministic latency critical for synchronized scan acquisition.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AX090N4F45I3LG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AX090N3F45I3LG | 10AX090N3F45I2LG | 10AX090N2F45I2LG | 10AX090N4F40I3LG |
|---|---|---|---|---|---|
| Package | 1932-BBGA, FCBGA (F45, 45 mm) | 1932-BBGA, FCBGA (F45) | 1932-BBGA, FCBGA (F45) | 1932-BBGA, FCBGA (F45) | 1517-BBGA, FCBGA (F40) |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 900,000 | 900,000 | 900,000 | 660,000 | 900,000 |
| Speed Grade | -3 | -3 | -2 | -2 | -3 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Industrial | Industrial | Industrial |
주요 차별점
- N4 silicon revision vs earlier N3 revision (vs 10AX090N3F45I3LG)
- -3 speed grade offers highest Fmax in the Arria 10 family (vs 10AX090N3F45I2LG)
- 1932-ball F45 package vs 1517-ball F40 package for routing headroom (vs 10AX090N4F40I3LG)
설계 노트
The 1932-ball FCBGA package requires 12+ layer PCB stackup with 1.0 mm ball pitch escape routing. Use HDI micro-via (laser-drilled, 0.1 mm pad) fan-out from the BGA to inner signal layers; avoid through-hole vias in the inner 3x3 ball grid to preserve routability. Maintain a continuous GND reference plane beneath the device for return-path integrity and thermal spreading. Reference the Altera Arria 10 GX PCB Design Guidelines for stackup recommendations.
At -3 speed grade the 10AX090N4F45I3LG can dissipate 25-40 W depending on toggle rate and transceiver utilization. Use a heat sink with thermal interface material (TIM), and provide at least 400 LFM airflow for industrial-temperature operation. The package top is the primary thermal path; exposed-die variant requires a heat sink with 4 N downward force. Estimate: junction-to-ambient theta_JA ~ 4-6 C/W with heat sink at 400 LFM.
Multi-rail power delivery is required: 0.85 V core (20-30 A load), 1.2 V/1.8 V/2.5 V/3.3 V auxiliary I/O rails (3-5 A each), and a dedicated transceiver PLL supply (1.0 V filtered). Use a Powertrain or equivalent sequencer for controlled power-up/down, and place decoupling within 100 mil of each supply ball. Reference the Altera Arria 10 GX Power Distribution Network design guide for decoupling density.
Do not mix the N3 and N4 logic revision codes without verifying against the latest Intel PCN database - some early N4 silicon has documented errata fixed in later N3 revisions. Do not assume 10AX090 (F45) is pin-compatible with 10AX066 (F40) - different ball counts (1932 vs 1517) require different PCB footprints. Always lock the device pin-out using Quartus Prime Pin Planner before PCB fab.
규정 준수 정보
RoHS compliant per Altera/Intel product page. The 'LG' suffix in the part number indicates lead-free finish (matte-tin). Not AEC-Q100 qualified - Arria 10 GX is not marketed for automotive safety-critical applications.