10AX090S4F45I3LG - Arria 10 GX FPGA 900K LE | Intel
부품 번호: 10AX090S4F45I3LG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $7072.86 | $7,072.86 |
| 10 | $6800 | $68,000.00 |
| 50 | $6550 | $327,500.00 |
| 100 | $6300 | $630,000.00 |
| 500 | $6050 | $3,025,000.00 |
10AX090S4F45I3LG 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable routing, hardened IP blocks, and I/O cells that engineers can reconfigure post-manufacturing to implement custom digital logic, signal processing pipelines, or interface bridges. FPGAs sit at the top of the programmable-logic hierarchy, above CPLDs and discrete glue logic, and serve as the silicon platform of choice for high-throughput parallel processing, hardware-accelerated compute, and rapid prototyping. Arria 10 specifically targets mid-range applications that need higher logic density and transceiver performance than Cyclone V/10 devices but at lower power and cost than Stratix 10.
Key differentiating features of the 10AX090S4F45I3LG include 24 high-speed transceivers supporting protocols such as PCIe Gen3 x8, 10G Ethernet, Interlaken, JESD204B, and CPRI, plus hardened floating-point DSP blocks capable of up to 1.5 TFLOPS per device for compute-intensive workloads. The 20nm process technology delivers improved performance-per-watt versus prior 28nm Arria V devices, and the integrated variable-precision DSP blocks support both fixed- and floating-point operations natively. Embedded memory of 59 Mbit is distributed across the fabric in M20K blocks plus 642-bit MLABs.
The 10AX090S4F45I3LG is well suited to applications including 4K/8K video processing and broadcast equipment, wireless baseband processing in LTE/5G fronthaul, high-performance ASIC prototyping, military radar and electronic warfare signal chains, and test-and-measurement instrumentation. PCIe Gen3 hard IP blocks enable direct root-complex or endpoint integration without external bridge chips. The 17.4 Gbps transceivers also support 100G Ethernet MACs through aggregation.
When designing with this device, plan PCB layout carefully around the 1932-ball FCBGA - it requires high-density board technology (microvia or HDI stack-up) and matched-length routing for transceiver channels. Use the Quartus Prime design suite for synthesis, place-and-route, and timing closure; the SoC variants additionally require an HPS toolchain. Thermal management is critical at full transceiver utilization - plan for at least 15-20W of dissipation with a heatsink or thermal interface material in industrial airflow.
This page synthesizes distributor pricing, same-family Arria 10 drop-in alternatives from the Site MPN list, and practical design considerations not consolidated on the manufacturer datasheet - including BGA escape routing density, transceiver channel placement, and Quartus Prime device-selection guidance.
드롭인 대체품: 10AX090S4F45I3LG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AX090S4F45I3LG (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Configuration, Temperature Grade, Transceivers.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AX090S4F45E3LG
✅ 드롭인✓ 재고 있음
$4582.63 / 개
데이터시트 보기 →10AX090N4F45I3LG
✅ 드롭인✓ 재고 있음
$5202.97 / 개
데이터시트 보기 →10AX090S3F45I2SG
✅ 드롭인✓ 재고 있음
$4563.74 / 개
데이터시트 보기 →10AX090N3F45I2LG
✅ 드롭인✓ 재고 있음
$2995 / 개
데이터시트 보기 →10AX090S4F45I3LG 최대 정격 & 전기적 특성
| Family | Arria 10 GX |
| Logic Elements | 900,000 |
| Embedded Memory (bits) | 59,234,304 (approx. 59 Mbit) |
| User I/Os | 624 |
| 패키지 | 1932-ball FCBGA (45 x 45 mm) |
| Process Technology | 20 nm |
| Transceivers | Up to 24 channels |
| Transceiver Data Rate | Up to 17.4 Gbps per channel |
| Hard Memory Controller | Yes (DDR3/DDR4, LPDDR2, QDR IV) |
| PCIe Hard IP | PCIe Gen3 x8 (hard IP block) |
| 동작 온도 | -40C to +100C (Industrial) |
| RoHS 상태 | Compliant |
| 실장 유형 | Surface Mount (BGA) |
| Speed Grade | -3 (faster speed grade) |
10AX090S4F45I3LG 1932-ball fcbga (45 x 45 mm) 핀 구성 가이드
10AX090S4F45I3LG(1932-ball fcbga (45 x 45 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AX090S4F45I3LG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AX090S4F45I3LG 적합 용도: 6 애플리케이션s: 4K/8K Broadcast Video Processing, Wireless Baseband / 5G Fronthaul, High-Performance ASIC Prototyping, Medical Imaging Systems, Military Radar and Electronic Warfare, Test and Measurement Instrumentation.
4K/8K Broadcast Video Processing
The 10AX090S4F45I3LG's 900K logic elements and 59 Mbit embedded memory provide the parallel processing fabric required for real-time 4K and 8K video pipelines, including color space conversion, scaling, deinterlacing, and HDR tone mapping. The 24 transceivers at 17.4 Gbps handle 12G-SDI and quad-link 3G-SDI ingest/egress simultaneously, while hardened PCIe Gen3 x8 IP enables direct attachment to host capture/display cards. Compared to GPU-based processing, the FPGA determinism and sub-frame latency make it preferred for live broadcast workflows where consistent timing is critical.
추천
Wireless Baseband / 5G Fronthaul
The 10AX090S4F45I3LG delivers the compute density and transceiver throughput needed for LTE Advanced and 5G NR baseband processing, with hardened floating-point DSP blocks supporting FFT/iFFT, channel estimation, and MIMO detection at line rate. The 17.4 Gbps transceivers interface directly with CPRI and OBSAI fronthaul links to remote radio heads (RRH), eliminating external PHY chips. Industrial temperature rating (-40C to +100C) supports outdoor base-station deployments, while the 1932-ball FCBGA enables dense PCB layouts within compact radio units.
추천
High-Performance ASIC Prototyping
With 900K logic elements, abundant M20K memory blocks, and abundant variable-precision DSP, the 10AX090S4F45I3LG provides sufficient capacity to prototype mid-range ASICs and SoCs before committing to mask costs. Multiple FPGAs can be ganged together via the 17.4 Gbps transceivers using chip-to-chip serial links, emulating multi-million-gate ASICs at near-real-time speeds. The industrial temperature grade also enables prototype validation in environmental stress screening. Quartus Prime supports ASIC prototyping flows with time-domain multiplexing and pin multiplexing for bring-up.
추천
Medical Imaging Systems
The 10AX090S4F45I3LG serves as the compute engine in CT, MRI, ultrasound, and digital X-ray imaging systems, where its parallel processing fabric accelerates image reconstruction (filtered back-projection, iterative reconstruction) and real-time image enhancement pipelines. Hardened PCIe Gen3 simplifies integration with host PCs for image archival and PACS connectivity. The industrial temperature rating supports imaging carts and operating-room deployments, while the 624 user I/Os interface directly with high-speed analog front ends and camera link sensors.
추천
Military Radar and Electronic Warfare
The 10AX090S4F45I3LG supports defense applications including phased-array radar beamforming, electronic countermeasures (ECM), and signal-intelligence (SIGINT) processing. Its 24 transceivers at 17.4 Gbps aggregate multi-GHz instantaneous bandwidth from multiple ADC channels, while the hardened floating-point DSP blocks perform pulse compression, MTI filtering, and Doppler processing in real time. Industrial temperature rating and the rugged 1932-ball FCBGA package suit airborne and ground-mobile platforms.
추천
Test and Measurement Instrumentation
The 10AX090S4F45I3LG forms the heart of high-end oscilloscopes, logic analyzers, protocol analyzers, and bit-error-rate testers, where its abundant logic and transceiver channels enable real-time capture and analysis of multi-gigabit signals. Hardened PCIe Gen3 x8 streams captured data directly to host processors for display and storage. The 624 user I/Os support direct probing of high-pin-count devices, while the industrial temperature rating supports lab and field-deployed test equipment. Quartus Prime IP library includes protocol analyzers for PCIe, USB, SATA, and Ethernet.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AX090S4F45I3LG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AX090S4F45E3LG | 10AX090N4F45I3LG | 10AX090S3F45I2SG | 10AX090N3F45I2LG |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 1932-ball FCBGA (F45, 45x45 mm) | 1932-ball FCBGA (F45, 45x45 mm) - same | 1932-ball FCBGA (F45, 45x45 mm) - same | 1932-ball FCBGA (F45, 45x45 mm) - same | 1932-ball FCBGA (F45, 45x45 mm) - same |
| Logic Elements | 900,000 | 900,000 - same | 900,000 - same | 900,000 - same | 900,000 - same |
| Speed Grade | -3 (fastest) | -3 - same | -3 - same | -2 (slower) | -2 (slower) |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) - same | -40C to +100C (Industrial) - same | -40C to +100C (Industrial) - same |
| Transceivers | Up to 24 channels, 17.4 Gbps | Up to 24 channels, 17.4 Gbps - same | Transceiver IP disabled or reduced | Up to 24 channels, ~14 Gbps (slower) | Transceiver IP disabled, ~14 Gbps |
| Family Sub-series | Arria 10 GX (with transceivers) | Arria 10 GX - same | Arria 10 GX (N variant) | Arria 10 GX - same | Arria 10 GX (N variant) |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant | Compliant |
주요 차별점
- Same-package F45 1932-ball FCBGA drop-in with commercial temperature rating (vs 10AX090S4F45E3LG)
- Same-package industrial F45 variant with same speed grade (vs 10AX090N4F45I3LG)
- Cost-reduced F45 drop-in with -2 speed grade (vs 10AX090S3F45I2SG)
설계 노트
The 1932-ball FCBGA F45 package requires high-density interconnect (HDI) PCB stack-up with microvias (typically 4-6 sequential laminations) to escape the 1.0 mm ball pitch. Route all high-speed transceiver channels with controlled impedance (100 ohm differential) and matched lengths (within 0.05 mm intra-pair, 0.5 mm inter-pair). Reference the Intel Arria 10 PCB Design Guidelines application note for via-in-pad, decoupling, and stack-up recommendations specific to F45.
Estimated: At full transceiver utilization (24 channels at 17.4 Gbps) plus PCIe Gen3 x8, the 10AX090S4F45I3LG can dissipate 15-25W. The F45 FCBGA package has a junction-to-ambient thermal resistance (theta_JA) of approximately 8-12 C/W with a properly designed thermal interface material (TIM) and heatsink. Industrial deployments should target junction temperatures below 100C with adequate airflow - refer to the Arria 10 thermal management application note for heatsink selection and TIM guidance.
Do not confuse the 10AX090S (S-series with full transceiver IP) with the 10AX090N (N-series with reduced/no transceiver IP licensing). Both share the same ballout, but configuring transceivers on an N-series device will fail at Quartus Prime fitter stage. Also verify the speed grade suffix (I3 = industrial -3, E3 = commercial -3, I2 = industrial -2) matches your timing closure targets - dropping from -3 to -2 typically reduces Fmax by 15-20%.
Place 0.1 uF X7R ceramic decoupling capacitors within 100 mils of every power pin, with bulk decoupling (10-22 uF tantalum or polymer) at each power rail entry. Use a power plane cutout under the BGA to minimize inductance, and stitch the GND plane around high-speed signals with via fencing every 2-3 mm. Reference the Intel Arria 10 Signal Integrity Design Guidelines for eye-mask compliance at 17.4 Gbps.
규정 준수 정보
RoHS compliance confirmed per Amphero listing. AEC-Q100 not applicable for FPGA in commercial/industrial use. Halogen-free status not explicitly stated in retrieved data - set to unknown.
