10AX090S4F45I3SG - Arria 10 GX FPGA 900K LE, 1932-FCBGA
부품 번호: 10AX090S4F45I3SG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $5906.32 | $5,906.32 |
| 10 | $5650 | $56,500.00 |
| 50 | $5300 | $265,000.00 |
| 100 | $4980 | $498,000.00 |
| 500 | $4520 | $2,260,000.00 |
10AX090S4F45I3SG 개요
An FPGA (Field Programmable Gate Array) is a semiconductor device based on a matrix of configurable logic blocks (CLBs) connected via programmable interconnects. Unlike fixed-function ASICs, FPGAs can be reconfigured post-manufacture to implement arbitrary digital logic, DSP functions, or memory interfaces. Arria 10 devices occupy the mid-range position in Intel's FPGA portfolio - above Cyclone V/10 and below Stratix 10 - delivering a balance of performance, power efficiency (~20W-40W typical), and cost for bandwidth-intensive applications.
Key features of the 10AX090S4F45I3SG include the integrated Hard Processor System (HPS) option, hardened memory controllers supporting DDR4/DDR3/QDR-IV, and the Adaptive Logic Module (ALM) architecture. The -I3 speed grade combined with industrial temperature range (-40C to +100C) makes it suitable for harsh-environment deployments including industrial automation, military/aerospace prototypes, and outdoor wireless infrastructure.
Architecture-wise, the Arria 10 family uses a monolithic die with 20nm Tri-Gate transistors, providing roughly 2x the density and 40% lower power versus the prior 28nm Arria V generation. The transceiver blocks support data rates from 1.5 Gbps up to 12.5 Gbps with internal PCS hardening for PCIe, Ethernet, and CPRI/OBSAI. Partial reconfiguration is supported, allowing live logic swapping in operational systems.
Typical applications include wireless baseband processing, military secure communications, high-performance computing acceleration, video broadcast infrastructure, and 10G/40G Ethernet network interface cards. The integrated transceivers and substantial logic capacity make it a strong fit for systems where multiple parallel high-speed links must be aggregated alongside significant DSP or packet processing workloads.
When designing with the 10AX090S4F45I3SG, careful attention must be paid to PCB layout for the 1932-ball FCBGA package. Ball pitch is 1.0mm with the F45 (45mm) body, requiring microvia or laser-drilled HDI stackups. Power delivery requires a multi-rail solution (typically 0.9V core, 1.2V/1.5V/2.5V/3.3V I/O) with high-frequency decoupling placed immediately adjacent to the BGA balls. Quartus Prime software is required for synthesis, place-and-route, and bitstream generation.
This page synthesizes distributor pricing, pin-compatible Arria 10 drop-in variants, and practical design notes not consolidated on a single manufacturer page.
드롭인 대체품: 10AX090S4F45I3SG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AX090S4F45I3SG (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Transceivers, Mounting Type, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AX090S4F45I3LG
✅ 드롭인✓ 재고 있음
$6050 / 개
데이터시트 보기 →10AX090S4F45E3LG
✅ 드롭인✓ 재고 있음
$4582.63 / 개
데이터시트 보기 →10AX090S3F45I2SG
✅ 드롭인✓ 재고 있음
$4563.74 / 개
데이터시트 보기 →10AX090S3F45I2LG
✅ 드롭인✓ 재고 있음
$4050 / 개
데이터시트 보기 →10AX090S2F45I2SG
✅ 드롭인✓ 재고 있음
$3750 / 개
데이터시트 보기 →10AX090S2F45E2SG
✅ 드롭인✓ 재고 있음
$2050 / 개
데이터시트 보기 →10AX090S4F45I3SG 최대 정격 & 전기적 특성
| Family | Arria 10 GX |
| Logic Elements | 900,000 |
| Embedded Memory (bits) | 59,234,304 |
| Maximum User I/O | 624 |
| Process Technology | TSMC 20nm Tri-Gate |
| Hard Processor System (HPS) | Integrated (dual-core ARM Cortex-A9 MPCore) |
| Memory Controllers | Hardened DDR4/DDR3/QDR-IV controllers |
| 패키지 | 1932-ball FCBGA, F45 (45mm) |
| Speed Grade | -3 (commercial fast / industrial fast) |
| Temperature Grade | Industrial (-40C to +100C junction) |
| Configuration | Active serial (AS) / passive serial (PS) / JTAG |
| 실장 유형 | Surface Mount (HDI required) |
| RoHS 상태 | Compliant |
| REACH Status | Compliant |
| Lead-Free | Yes |
| 할로겐 프리 | Yes |
| Design Tool | Intel Quartus Prime |
10AX090S4F45I3SG 1932-ball fcbga, f45 (45mm) 핀 구성 가이드
10AX090S4F45I3SG(1932-ball fcbga, f45 (45mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AX090S4F45I3SG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AX090S4F45I3SG 적합 용도: 6 애플리케이션s: Wireless Baseband Processing, 10G/40G Ethernet Aggregation, Military Secure Communications, High-Performance Computing Acceleration, Video Broadcast and Studio Infrastructure, Industrial Automation and Machine Vision.
Wireless Baseband Processing
The 10AX090S4F45I3SG fits wireless baseband processing because its 900K logic elements and high-speed transceivers (up to 12.5 Gbps per channel) can handle multiple CPRI/OBSAI links simultaneously alongside baseband DSP functions. In typical LTE or 5G NR base station designs, the device performs FFT/iFFT, channel coding/decoding, and digital up/down-conversion. The industrial temperature range supports outdoor radio units mounted on cell towers. Compared to ASICs, the FPGA design flexibility allows late-stage algorithm updates for evolving 3GPP standards.
추천
10G/40G Ethernet Aggregation
The 10AX090S4F45I3SG serves as a network aggregator or smart-NIC because it combines multiple 10G Ethernet MACs with custom packet-processing pipelines in a single device. The integrated transceivers handle 10G BASE-R PHY interfaces without external gear, while the 900K logic elements provide headroom for protocol offloads (e.g., VxLAN, Geneve, IPSec). Industrial temperature allows deployment in carrier-grade equipment rooms. Quartus Prime includes MAC, PCS, and Interlaken IP cores that accelerate design-in for network OEMs.
추천
Military Secure Communications
The 10AX090S4F45I3SG fits military secure radio systems where high DSP throughput, encryption acceleration, and extended operating temperature are required simultaneously. The integrated transceivers support tactical radio waveforms including wideband HF/VHF/UHF links, while the 59 Mbits of embedded memory hold pre-computed crypto tables and waveform samples. Industrial temperature grade handles the -40C to +100C envelope typical of vehicle-mounted and dismounted radio platforms. FPGA-based designs allow for SUO/SUA modifications throughout the platform lifecycle.
추천
High-Performance Computing Acceleration
The 10AX090S4F45I3SG is well suited as an OpenCL/CUDA-style compute accelerator for HPC workloads because it offers 900K logic elements plus 288 DSP blocks (Arria 10 typical for 090 family) that can execute parallel arithmetic. Industrial temperature makes it viable for lab and datacenter-adjacent HPC clusters. Compared to GPU acceleration, the FPGA approach provides deterministic latency and lower per-watt performance for streaming workloads such as financial Monte Carlo simulation or genomic sequence alignment.
추천
Video Broadcast and Studio Infrastructure
The 10AX090S4F45I3SG handles uncompressed video processing for broadcast and studio applications because its transceiver bandwidth and DSP resources can sustain 4K/8K video pipelines at 60 fps. Typical use cases include SDI-to-IP gateways (SMPTE ST 2110), video walls, and HDR/WCG color-space converters. Industrial temperature supports broadcast equipment rooms with variable HVAC conditions. Quartus Prime's video and image processing IP suite (VIP) provides ready-made scalers, deinterlacers, and color converters.
추천
Industrial Automation and Machine Vision
The 10AX090S4F45I3SG drives multi-camera machine vision inspection systems because its 900K LE provide ample parallelism for image preprocessing, defect detection, and conveyor line synchronization. Integrated transceivers support CoaXPress, Camera Link, and GigE Vision aggregation. Industrial temperature allows deployment on factory floors where ambient temperature may swing with production cycles. The FPGA approach enables rapid iteration on proprietary vision algorithms without expensive ASIC NRE.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AX090S4F45I3SG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AX090S4F45I3LG | 10AX090S4F45E3LG | 10AX090S3F45I2SG | 10AX090S2F45I2SG |
|---|---|---|---|---|---|
| Package | 1932-ball FCBGA F45 | 1932-ball FCBGA F45 - same | 1932-ball FCBGA F45 - same | 1932-ball FCBGA F45 - same | 1932-ball FCBGA F45 - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 |
| Speed Grade | -3 | -3 | -3 | -2 | -2 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Extended | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Embedded Memory (bits) | 59,234,304 | 59,234,304 | 59,234,304 | 59,234,304 | 59,234,304 |
| Maximum User I/O | 624 | 624 | 624 | 624 | 624 |
| RoHS Compliant | Yes | Yes | Yes | Yes | Yes |
주요 차별점
- Industrial temperature grade at fastest speed bin (vs 10AX090S4F45E3LG)
- Highest speed grade option in Arria 10 family (vs 10AX090S3F45I2SG)
- Lead-free shipping designation compatibility (vs 10AX090S4F45I3SG vs LG variant)
설계 노트
The 1932-ball FCBGA F45 package has a 1.0mm ball pitch and requires a high-density interconnect (HDI) PCB stack-up with microvias or laser-drilled vias to fan out from the inner balls. Use a 1-2-1 or 2-4-2 HDI stack-up with at least 4 build-up layers. Outer-layer pad diameter and via-in-pad designs must follow Intel's recommended land patterns in the Arria 10 package documentation. Failure to use HDI will result in breakout routing errors and signal integrity degradation.
Estimated: at typical operation (50% logic utilization, mid transceivers), the 10AX090S4F45I3SG consumes ~25-35W. The device requires a multi-rail power delivery network: 0.9V core (SmartVID), 1.2V/1.5V/2.5V/3.3V I/O banks, separate analog rails for transceivers (1.0V, 1.5V), and an auxiliary rail. Use Intel's PowerPlay Early Power Estimator (EPE) spreadsheet for board-level power budget. Decoupling capacitors must be placed as close as possible to the BGA balls with short, wide traces.
Industrial-grade Arria 10 FPGAs support up to +100C junction temperature but require careful thermal management above 20W total power dissipation. The 1932-ball FCBGA package relies on a heat spreader attached via thermal interface material (TIM). For high-power designs, integrate a heatsink or active cooling. Estimated junction-to-ambient thermal resistance for a typical 4-layer board with heat spreader is 1.5-2.5 C/W; verify with the Arria 10 thermal characterization data before finalizing cooling design.
Do not assume generic BGA layout rules apply - the Arria 10 F45 pinout has signal integrity constraints for transceiver channels, including length matching within a transceiver bank and impedance-controlled routing for high-speed serial links. Mis-mating transceiver pin pairs will cause bit error rates at 10 Gbps+ that are very difficult to debug post-layout. Use Quartus Prime pin planner to validate all assignments before generating the bitstream. Configuration mode pins (MSEL) must be set correctly or the device will not boot.
규정 준수 정보
RoHS and REACH compliance confirmed by lead-free 'G' suffix in MPN. AEC-Q100 not applicable for FPGAs (different qualification standard applies). Intel publishes full material declaration (FMD) documents for this family upon customer request.
