10AX115S2F45I2SG - Arria 10 GX FPGA, 1.15M LE, 1932-BGA | Altera
부품 번호: 10AX115S2F45I2SG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $8450 | $8,450.00 |
| 10 | $8125 | $81,250.00 |
| 50 | $7800 | $390,000.00 |
| 100 | $7450 | $745,000.00 |
| 250 | $7100 | $1,775,000.00 |
10AX115S2F45I2SG 개요
An FPGA (Field Programmable Gate Array) is a programmable logic device consisting of an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect that can be rewired after manufacture to implement arbitrary digital functions. FPGAs occupy the top tier of the digital semiconductor family tree: programmable logic -> logic IC -> integrated circuit, sitting between fixed-function ASICs and software-defined microcontrollers in flexibility vs unit-cost trade-off. The Arria 10 family targets mid-range, transceiver-rich designs balancing logic capacity, DSP throughput, and power efficiency.
Key features of the 10AX115S2F45I2SG include 1,150,000 logic elements, 68,857,856 bits (8,557,232 bytes) of embedded SRAM, 624 user I/O pins routed across multiple I/O banks supporting LVDS, LVTTL, LVCMOS, and high-speed serial protocols, and 24 transceiver channels rated up to 14.1 Gbps for protocols such as PCIe Gen3 x8, 10GbE, CPRI, and SATA. The device also integrates 1,518 DSP blocks for fixed- and floating-point signal processing, a hard memory controller supporting DDR4, DDR3, QDR IV, and RLDRAM III, and fractional PLLs with on-chip oscillators.
The Arria 10 GX architecture is built on TSMC's 20nm low-power process with a monolithic die that combines a logic fabric, embedded transceivers, and hardened IP blocks, reducing power by up to 40% compared to the previous 28nm Stratix V generation. Per the Altera product page, the 10AX115S2F45I2SG is qualified for industrial temperature range (-40C to +100C for case, depending on usage), supports JTAG boundary-scan and configuration via fast passive parallel, active serial, or JTAG interfaces, and is pin-compatible within the Arria 10 GX F45 package family.
Typical applications include high-performance digital signal processing in radar and beamforming systems, 10G/40G Ethernet aggregation switches, PCIe Gen3 accelerator cards, software-defined radio base stations, video broadcast and encoding platforms, and test-and-measurement instrumentation. The wide transceiver bandwidth also suits FPGA prototyping of ASIC designs and high-throughput medical imaging systems. Industrial-grade qualification makes the 10AX115S2F45I2SG suitable for harsh-environment deployments.
When designing with this device, ensure the PCB BGA land pattern matches the 1932-ball FCBGA footprint exactly and that the stackup supports the transceiver channel requirements (typically 6-8 layers with controlled-impedance routing). Thermal management is critical - the 0.9V core can dissipate significant power at full transceiver utilization, and a heatsink or cold-plate interface to the top of the package is typically required. The Quartus Prime design suite must be licensed to generate bitstreams for this device family.
This page consolidates distributor pricing for the 10AX115S2F45I2SG, drop-in compatible alternatives within the Arria 10 family and competitor equivalents, and engineering design notes not aggregated in any single manufacturer document.
드롭인 대체품: 10AX115S2F45I2SG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AX115S2F45I2SG (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, DSP Blocks, Temperature Grade, Transceivers.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AX115S2F45I2LG
✅ 드롭인✓ 재고 있음
$3895 / 개
데이터시트 보기 →10AX115S2F45E2SG
✅ 드롭인✓ 재고 있음
$6975.76 / 개
데이터시트 보기 →10AX115S1F45I1SG
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →10AX115S2F45I1SG
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
10AX090S2F45I2SG
✅ 드롭인✓ 재고 있음
$3750 / 개
데이터시트 보기 →10AX115S3F45I2SG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2020 / 개
데이터시트 보기 →10AX115H2F34I2SG
✅ 드롭인✓ 재고 있음
$3640 / 개
데이터시트 보기 →10AX115S2F45I2SG 최대 정격 & 전기적 특성
| Family | Arria 10 GX |
| Logic Elements | 1,150,000 |
| Embedded Memory (bits) | 68,857,856 |
| User I/O Count | 624 |
| Transceiver Channels | 24 |
| Transceiver Data Rate (max) | 14.1 Gbps |
| DSP Blocks | 1,518 |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| 패키지 | 1932-ball FCBGA |
| Temperature Grade | Industrial |
| Speed Grade | S2 |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant (G suffix) |
| Lead-Free | Yes |
10AX115S2F45I2SG 1932-ball fcbga 핀 구성 가이드
10AX115S2F45I2SG(1932-ball fcbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AX115S2F45I2SG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AX115S2F45I2SG 적합 용도: 7 애플리케이션s: 10G/40G Ethernet Aggregation Switch, PCIe Gen3 Accelerator Card, Software-Defined Radio / Wireless Base Station, Radar and Beamforming Signal Processing, Video Broadcast and Encoding Platform, Test & Measurement Instrumentation, Medical Imaging and Diagnostics.
10G/40G Ethernet Aggregation Switch
The 10AX115S2F45I2SG is well-suited for 10G/40G Ethernet aggregation switches because its 24 transceivers operate up to 14.1 Gbps - exceeding the 10.3125 Gbps line rate required for 10GbE (10GBASE-R) and supporting multiple 10G SFP+ uplinks or a single 40G QSFP uplink. The hard PCIe Gen3 x8 IP enables direct attachment to a switch CPU or co-processor. The 1,150,000 logic elements support deep packet buffers, lookup tables, and Quality-of-Service queues at line rate. Placed as the central fabric processor with 1932-ball FCBGA, the design typically uses DDR4 external memory via the hard memory controller; for top-of-rack designs, the industrial temperature grade permits deployment in thermally constrained switch chassis.
추천
PCIe Gen3 Accelerator Card
The 10AX115S2F45I2SG is widely deployed in FPGA accelerator cards (e.g., for AI inference, compression, or financial compute) because it integrates PCIe Gen3 x8 hard IP and exposes 24 transceivers at up to 14.1 Gbps - covering both PCIe and any auxiliary 10G/40G links. The 1,518 DSP blocks accelerate fixed- and floating-point workloads, while 68,857,856 bits of embedded SRAM provide on-die storage for activation maps and intermediate results. Typical designs place the FPGA as the central compute element with DDR4 attached via the hard memory controller, communicating with the host CPU through x8 Gen3; the industrial temperature grade allows deployment in air-cooled server chassis without derating.
추천
Software-Defined Radio / Wireless Base Station
The 10AX115S2F45I2SG is a strong fit for software-defined radio (SDR) baseband processing and small-cell LTE/5G base stations because its 24 transceivers up to 14.1 Gbps directly interface CPRI, OBSAI, and JESD204B/C fronthaul links to RFICs and DACs/ADCs. The 1,518 DSP blocks deliver hundreds of GMACs of FIR and FFT throughput, essential for channelization, crest-factor reduction, and digital predistortion. The hard memory controller supports DDR4/QDR-IV for high-bandwidth sample buffers. Deployments use the FPGA between the RF front end and the baseband CPU; the industrial temperature grade permits unheated outdoor small-cell enclosures.
추천
Radar and Beamforming Signal Processing
The 10AX115S2F45I2SG excels in phased-array radar, electronic-warfare, and beamforming signal processing where thousands of FIR filter taps must run in real time. With 1,518 DSP blocks operating at 20nm efficiency, the device delivers the GMAC throughput needed for sub-microsecond beam updates across large arrays. The 24 transceivers up to 14.1 Gbps aggregate to multi-GSPS sample rates when multiple channels are deserialized through JESD204B/C ADCs. Designs typically route digital beam data through DDR4 buffers before downlink transmission; the industrial temperature grade allows deployment in avionics, ground-mobile, and shipboard radar enclosures.
추천
Video Broadcast and Encoding Platform
The 10AX115S2F45I2SG is used in broadcast contribution encoders and 4K/8K video processing because its 1,150,000 logic elements and 1,518 DSP blocks implement multi-stream HEVC/H.264 codecs, color-space conversion, and frame-rate conversion in a single device. The 24 transceivers connect to 12G-SDI or SMPTE ST 2022/2110 IP-based broadcast interfaces, while the hard memory controller interfaces DDR4 for reference frame buffers. Studio and master-control deployments rely on the industrial temperature grade to operate in air-cooled equipment racks without thermal derating. The 1932-ball FCBGA fits typical ATX form-factor cards.
추천
Test & Measurement Instrumentation
The 10AX115S2F45I2SG is found in high-end oscilloscopes, logic analyzers, protocol analyzers, and arbitrary waveform generators because its 24 transceivers at up to 14.1 Gbps allow multi-channel acquisition at multi-GSPS rates when paired with high-speed ADCs/DACs over JESD204B/C. The 1,150,000 logic elements implement real-time triggers, deep acquisition memory addressing, and protocol decoding across PCIe, USB 3.x, SATA, and Ethernet. The hard PCIe Gen3 x8 IP enables direct integration into modular instrument chassis. The industrial temperature grade permits deployment in lab and production-floor environments, and the 1932-ball FCBGA supports dense front-panel I/O.
추천
Medical Imaging and Diagnostics
The 10AX115S2F45I2SG is used in MRI, CT, ultrasound, and PET imaging systems where real-time image reconstruction (FFT, back-projection, beamforming) and high-speed serial I/O are required. The 1,518 DSP blocks accelerate FIR and FFT pipelines at sub-millisecond latency, while 24 transceivers up to 14.1 Gbps aggregate high-speed ADC sample streams from detector arrays. The 1,150,000 logic elements handle data formatting, compression, and DICOM framing. The hard memory controller attaches DDR4 buffers for image volumes. Medical deployments leverage the industrial temperature grade for scanner-room installations.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AX115S2F45I2SG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AX115S2F45I2LG | 10AX115S2F45E2SG | 10AX115S1F45I1SG | 10AX115S2F45I1SG | 10AX090S2F45I2SG |
|---|---|---|---|---|---|---|
| Package | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 900,000 |
| Speed Grade | S2 | S2 | S2 | S1 | S2 | S2 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Extended (0C to +100C) | Industrial | Industrial | Industrial |
| Transceiver Channels | 24 | 24 | 24 | 24 | 24 | 24 |
| User I/O Count | 624 | 624 | 624 | 624 | 624 | 624 |
| Lead-Free Finish | Yes (G suffix) | Yes (LG suffix) | Yes (G suffix) | Yes (G suffix) | Yes (G suffix) | Yes (G suffix) |
주요 차별점
- Highest density Arria 10 GX in the F45 package (vs 10AX090S2F45I2SG)
- Hard PCIe Gen3 x8 IP block (vs 10AX090S2F45I2SG)
- Industrial temperature grade qualification (vs 10AX115S2F45E2SG)
- Speed-grade 2 balance between Fmax and power (vs 10AX115S3F45I2SG)
설계 노트
Estimated: At full transceiver utilization (24 channels at 14.1 Gbps with PRBS-31) and high toggle-rate logic, the 10AX115S2F45I2SG can dissipate 30-45 W on a typical design. The 1932-ball FCBGA requires a thermal interface to either a heatsink or cold-plate through the top of the package; refer to the Altera Arria 10 GX Thermal Design Guide for theta_JA vs airflow curves. Without forced airflow (>200 LFM), the device will thermally throttle. A 6-layer PCB with internal copper planes stitched under the BGA footprint is recommended for heat spreading.
Estimated: The 1932-ball FCBGA has a fine 1.0 mm ball pitch, requiring laser-drilled microvias and sequential lamination. Plan for an 8-10 layer stackup with controlled-impedance traces for transceivers (100-ohm differential for 10-14 Gbps) and DDR4 (single-ended 50-ohm, differential 100-ohm). Use length-matching within 0.127 mm for all high-speed serial pairs and DDR4 address/command/clock groups; the Quartus Prime pin planner will output the exact rules per pin once the design is loaded.
The 10AX115S2F45I2SG requires a multi-rail power system: 0.9 V core (high current, often 30+ A at full load), 1.8 V/2.5 V auxiliary, and per-bank I/O voltages (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V). Power-on sequencing is required - core voltage must ramp before auxiliary supplies per the device handbook. Use a Power Management IC (PMIC) or controller designed for Altera/Intel FPGA power sequencing. Decoupling: place 0402/0201 ceramic capacitors at every power pin, plus bulk polymer/tantalum capacitors near the package perimeter.
Transceiver channels 0-23 are located on specific bank groups; consult the F45 package pin connection guidelines to map serial I/O to board layout. Reference clocks (refclk) must be routed as 100-ohm differential pairs with length matching and isolated from noisy signals. The PCIe Gen3 x8 hard IP uses dedicated transceiver channels; reserve these in the floorplan early. JTAG, MSEL configuration pins, and configuration mode straps must be pulled correctly per the Configuration Handbook before power-up.
Common pitfalls with the 10AX115S2F45I2SG include: (1) mixing up I2 vs E2 temperature grades in production; (2) mis-wiring MSEL pins causing configuration failure; (3) under-sizing the heatsink for high-utilization designs leading to thermal throttling; (4) using standard HASL PCB finish instead of ENIG which can cause BGA solder joint defects; (5) violating DDR4 write leveling / read calibration timing causing intermittent data corruption. Always validate with Quartus Prime's PowerPlay and Timing Analyzer before tape-out.
규정 준수 정보
RoHS compliant per the 'G' suffix in the Altera ordering scheme (lead-free solder ball finish). Halogen-free per Altera's material declaration. AEC-Q100 is not applicable for FPGAs of this complexity - this is a commercial/industrial-grade device. Conflict minerals compliance is documented in Altera/Intel's annual CMRT filing.