10CX220YF672E6G - Cyclone 10 GX 220K LE FPGA | Intel
부품 번호: 10CX220YF672E6G ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1200 | $1,200.00 |
| 10 | $1140 | $11,400.00 |
| 100 | $1080 | $108,000.00 |
| 500 | $990 | $495,000.00 |
| 1,000 | $925 | $925,000.00 |
10CX220YF672E6G 개요
An FPGA (Field-Programmable Gate Array) is a reconfigurable digital integrated circuit that combines programmable logic blocks, programmable interconnect, and dedicated hard IP blocks such as transceivers, memory controllers, and DSP blocks. Within the broader semiconductor taxonomy, FPGAs sit alongside microcontrollers, DSPs, and ASICs as programmable logic devices, occupying the role of hardware-accelerated parallel processing in modern electronic systems. Cyclone 10 GX specifically targets mid-range applications requiring transceivers and DSP at low power.
Key features include 220,000 logic elements, 13,752,320 bits of embedded memory, 236 hardware multipliers (18x18), and integrated 12.5 Gbps transceivers. The device is fabricated on TSMC's 20nm process, delivering a favorable performance-per-watt ratio. It supports high-speed external memory interfaces including DDR3, DDR4, LPDDR3, and QDR II+/QDR IV, plus 1.4 Gbps LVDS I/O for legacy parallel connectivity.
Architecturally, the Cyclone 10 GX combines a fabric of adaptive logic modules (ALMs), embedded SRAM blocks, DSP slices, and hardened PCI Express Gen2 controllers. Hardened IP reduces soft-logic overhead and lowers power consumption compared to soft implementations, while the 20nm process enables higher integration and tighter timing margins than prior 28nm Cyclone generations.
Typical applications include industrial machine vision and video processing, broadcast and professional video equipment, wireless backhaul infrastructure, PCIe-based accelerator cards, and high-speed prototyping platforms. The integrated 12.5 Gbps transceivers make it particularly well-suited for protocols such as CPRI, 10GbE (via XAUI), and JESD204B/C.
When designing with this FPGA, consider power estimation using the Intel Early Power Estimator (EPE) before PCB layout, and ensure the 672-ball FCBGA footprint includes proper microvia stack-up and ball-pitch escape routing. Thermal management is essential at sustained high transceiver utilization; a heatsink or airflow is typically required.
This page consolidates distributor pricing, drop-in alternatives, and design notes not assembled in the manufacturer datasheet, giving engineers a single reference for sourcing, replacement, and integration decisions.
드롭인 대체품: 10CX220YF672E6G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10CX220YF672E6G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Process Technology, Logic Elements, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10CX220YF672I6G
✅ 드롭인✓ 재고 있음
$365 / 개
데이터시트 보기 →10CX220YF672E5G
✅ 드롭인✓ 재고 있음
$342 / 개
데이터시트 보기 →10CX150YF672E6G
✅ 드롭인✓ 재고 있음
$124.9 / 개
데이터시트 보기 →10CX220YF672E6G 최대 정격 & 전기적 특성
| Family | Cyclone 10 GX |
| Logic Elements | 220,000 |
| Embedded Memory Bits | 13,752,320 |
| Hardware Multipliers (18x18) | 236 |
| Transceiver Data Rate (max) | 12.5 Gbps |
| PCIe Hard IP | PCI Express Gen2 x4 (hardened) |
| External Memory Interface | DDR3/DDR4/LPDDR3/QDR II+/QDR IV up to 72-bit, 1,866 Mbps |
| LVDS Data Rate | 1.4 Gbps |
| Process Technology | TSMC 20nm |
| 패키지 | 672-ball FCBGA (F672) |
| Operating Temperature Grade | E (Extended, -40C to +100C) |
| Speed Grade | 6 |
| RoHS 상태 | Compliant |
| Configuration Scheme | AS, PS, JTAG |
10CX220YF672E6G 672-ball fcbga (f672) 핀 구성 가이드
10CX220YF672E6G(672-ball fcbga (f672) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10CX220YF672E6G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10CX220YF672E6G 적합 용도: 6 애플리케이션s: Industrial Machine Vision & Video Processing, Broadcast & Professional Video Equipment, Wireless Backhaul Infrastructure, PCIe Accelerator Cards & High-Speed Prototyping, Test & Measurement Instrumentation, High-Speed Data Acquisition & Signal Processing.
Industrial Machine Vision & Video Processing
The 10CX220YF672E6G fits industrial machine vision because its 220K logic elements and 236 18x18 hardware multipliers deliver the parallel DSP throughput required for Bayer demosaic, color matrix conversion, and edge-detection pipelines running at full HD or 4K line rates. The hardened 12.5 Gbps transceivers connect directly to Camera Link HS, CoaXPress, or 10GigE Vision hosts without a soft MAC, reducing logic utilization and latency. Engineers typically place a frame buffer in the 13.7 Mbit embedded memory and use the PCIe Gen2 hard IP to deliver frames to a host CPU over a x4 edge connector.
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Broadcast & Professional Video Equipment
For broadcast routers, video format converters, and 12G-SDI gear, the 10CX220YF672E6G provides enough logic and DSP to handle real-time up/down/cross-conversion between SD, HD, 3G, and 12G-SDI streams. The 12.5 Gbps transceivers map directly to SDI physical interfaces (SMPTE 259/292/424/2082) and to AES67/Dante audio-over-IP backbones. The hardened PCIe Gen2 endpoint simplifies integration with host CPUs for control-plane software running on Linux.
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Wireless Backhaul Infrastructure
The 10CX220YF672E6G targets CPRI and OBSAI fronthaul and backhaul links in small-cell and pico-cell base stations. The integrated 12.5 Gbps transceivers support CPRI line rates up to option 7 (9.83 Gbps) with margin, and the 220K LEs carry PHY-layer scrambling, deframing, and fronthaul-switching functions. Industrial temperature grade and the F672 package's thermal headroom suit outdoor cabinet installations. The hardened PCIe Gen2 endpoint connects to baseband SoCs over a short board trace.
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PCIe Accelerator Cards & High-Speed Prototyping
For PCIe Gen2 x4 or x8 accelerator cards in edge servers, the 10CX220YF672E6G's hardened PCIe Gen2 endpoint removes the soft-logic PCIe IP overhead and frees 220K LEs for user accelerators such as FFT engines, custom DSP filters, or ML inference datapaths. The 13.7 Mbit embedded memory supports tile buffers and partial coefficient caches. The 1.4 Gbps LVDS interface enables multi-channel high-speed ADC/DAC daughter-card hookups over standard board-to-board connectors.
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Test & Measurement Instrumentation
The 10CX220YF672E6G is well suited to protocol-aware test instruments, logic analyzers, and protocol exercisers where multi-gigabit transceivers drive pattern generation and error injection at line rate. The 220K LEs hold protocol-aware state machines for PCIe, SATA, 10GbE, and CPRI, while the 236 DSP blocks accelerate signal-integrity metrics like eye-opening computation and jitter decomposition. LVDS banks connect to legacy parallel probe pods and front-panel GPIO without external transceivers.
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High-Speed Data Acquisition & Signal Processing
The 10CX220YF672E6G pairs high-speed ADC/DAC front-ends with on-FPGA DSP for radar, sonar, and electronic-warfare subsystems. The 12.5 Gbps transceivers carry JESD204B/C ADC data to the FPGA fabric, while the 236 DSP blocks implement digital down-conversion, pulse compression, and FFT-based spectral analysis. The hardened DDR4 controller sustains the data bandwidth from the 13.7 Mbit embedded memory and large external buffers into a host CPU over PCIe.
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추천 제품 요약
엔지니어링 참조 데이터: 10CX220YF672E6G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10CX220YF672I6G | 10CX220YF672E5G | 10CX150YF672E6G |
|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 672-ball FCBGA (F672) | 672-ball FCBGA (F672) | 672-ball FCBGA (F672) | 672-ball FCBGA (F672) |
| Logic Elements | 220,000 | 220,000 | 220,000 | 150,000 (-32%) |
| Embedded Memory (bits) | 13,752,320 | 13,752,320 | 13,752,320 | 8,097,280 (-41%) |
| 18x18 Multipliers | 236 | 236 | 236 | 156 (-34%) |
| Transceiver Data Rate | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps |
| Speed Grade | 6 | 6 | 5 (slower Fmax) | 6 |
| Temperature Grade | Extended (-40C to +100C) | Industrial (-40C to +100C, longer reliability) | Extended (-40C to +100C) | Extended (-40C to +100C) |
주요 차별점
- Drop-in industrial-temperature alternative in the same F672 footprint (vs 10CX220YF672I6G)
- Smaller die in the same F672 package for cost-optimized designs (vs 10CX150YF672E6G)
- Speed grade 5 alternative for lower-power designs in the same F672 package (vs 10CX220YF672E5G)
설계 노트
Estimated: at full transceiver utilization (12.5 Gbps on all channels) plus sustained DSP block usage, the 10CX220YF672E6G can dissipate 8-12 W of core power. The F672 FCBGA has no exposed top heatsink pad; thermal relief comes from internal package balls. Mount a heatsink with thermal interface material on the top of the package, and route multiple thermal vias under the BGA footprint to inner copper planes. Without airflow, derate transceiver count or operating frequency by approximately 30%.
The 672-ball FCBGA requires a microvia (laser-drilled or plasma-etched) stack-up because the 1.0mm ball pitch is too fine for conventional through-hole vias on the BGA pads. Use a 1-2-1 or 1-3-1 build-up stack-up with 1oz copper on outer layers, and follow Intel's Cyclone 10 GX pin connection guidelines for decoupling capacitor placement: 0.1uF and 0.01uF X7R MLCCs adjacent to each VCC/VCCPT/VCCA power pin pair, plus bulk 47uF-100uF polymer capacitors per power rail.
Transceiver channels exceeding 10 Gbps require controlled-impedance stripline routing with continuous reference planes and tight length matching. For 12.5 Gbps transceivers, target 100-ohm differential impedance with no more than 50 mil of total length mismatch between P and N traces. Place AC-coupling capacitors within 200 mil of the FPGA ball, and avoid routing high-speed lanes across plane splits or signal vias. Use the Intel Cyclone 10 GX Transceiver Toolkit to validate signal integrity on a coupon board before committing to layout.
Do not assume the 'E' suffix in 10CX220YF672E6G only refers to temperature grade - it is also a speed grade qualifier. The trailing '6' is the speed grade (6); the E is the temperature grade. Some PCB libraries mistakenly treat the device as speed grade 6 in an Industrial package and miss the E (Extended) vs I (Industrial) distinction. Verify in the Intel ordering code guide before generating artwork. Also note that FPGAs require configuration memory - typically an EPCQ-L or active serial flash - which must be dimensioned for the Cyclone 10 GX bitstream size and any optional data sections.
규정 준수 정보
RoHS and REACH compliance per Intel FPGA product declaration. AEC-Q100 not applicable (industrial/consumer FPGA, not automotive-grade). Lead-free FCBGA ball composition per Intel MSL3/JEDEC J-STD-020 reflow compatibility.
