10M04SCE144A7G - MAX 10 FPGA 4K LE 144-EQFP | Intel
부품 번호: 10M04SCE144A7G ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $17.5 | $17.50 |
| 10 | $15.4 | $154.00 |
| 100 | $13.2 | $1,320.00 |
| 500 | $11.5 | $5,750.00 |
| 1,000 | $10.1 | $10,100.00 |
10M04SCE144A7G 개요
A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device containing configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, and high-speed transceivers. FPGAs sit between discrete logic ICs and custom ASICs: faster to integrate than ASICs, more flexible than fixed-function ICs, and increasingly power-efficient for parallel workloads. The MAX 10 family further integrates analog-to-digital converters (ADCs), flash configuration, and on-chip voltage regulation into a single die, allowing single-chip system control with deterministic power-up behavior.
Key features of the 10M04SCE144A7G include 4,000 logic elements (LEs), 193,536 bits (Kb) of embedded user flash, single 3.0V/3.3V supply operation with on-chip voltage regulators, integrated ADC capability, automotive AEC-Q100 qualification, and an extended -40°C to +125°C industrial/automotive operating temperature range. The 144-EQFP exposed-pad footprint improves thermal dissipation while preserving the LQFP handling and reflow characteristics familiar to mid-volume SMT lines.
Architecturally, the device pairs a non-volatile configuration block with dual-configuration flash image support, optional real-time ISP via JTAG, and an analog front end supporting temperature-sensor and general-purpose ADC inputs. Designers gain instant-on determinism for motor control, sensor fusion, and human-machine interface (HMI) glue logic, while software-defined peripheral replacement remains possible without NRE charges.
Typical applications include industrial control boards, automotive body and chassis subsystems, low-cost video processing, I/O expansion and bridging in legacy MCUs, and portable medical instruments requiring instant-on logic. The AEC-Q100 automotive grade extends suitability to in-cabin HMI and body controllers.
When designing with the 10M04SCE144A7G, allocate the exposed pad (EP) to a continuous copper pour on top and inner PCB layers to keep the silicon junction within the AEC-Q100 thermal envelope. JTAG pinout should follow the Intel MAX 10 pin connection guidelines to retain dual-boot and remote upgrade paths.
This page synthesizes distributor pricing, automotive-grade qualification notes, drop-in MAX 10 family alternatives, and PCB layout guidance not collected in any single manufacturer datasheet, giving engineers a single decision-ready reference.
드롭인 대체품: 10M04SCE144A7G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10M04SCE144A7G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Configuration Memory, Logic Elements (LE), Speed Grade, Core Voltage.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10M04SCE144C8G
✅ 드롭인✓ 재고 있음
$12.1 / 개
데이터시트 보기 →10M04SCE144I7G
✅ 드롭인✓ 재고 있음
$10.26 / 개
데이터시트 보기 →10M08SCE144A7G
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
10M02SCE144A7G
✅ 드롭인✓ 재고 있음
$4.62 / 개
데이터시트 보기 →10M04DCU324A7G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$9.85 / 개
데이터시트 보기 →10M04SCE144A7G 최대 정격 & 전기적 특성
| Series | MAX 10 |
| Family | MAX 10 FPGA |
| Logic Elements (LEs) | 4,000 |
| Embedded Memory (RAM bits) | 193,536 |
| Number of Logic Cells | 4,000 |
| Number of User I/O Pins | 101 |
| 동작 공급 전압 | 3.0 V / 3.3 V (single supply) |
| 패키지 | 144-EQFP (LQFP with Exposed Pad), 20x20 mm |
| 실장 유형 | Surface Mount |
| 동작 온도 범위 | -40 °C to +125 °C (automotive/industrial) |
| Configuration Memory | On-chip flash, non-volatile |
| Automotive Qualification | AEC-Q100 |
| RoHS 상태 | Compliant |
| MSL 레벨 | 3 |
| Speed Grade | 7 (lower-power tier within MAX 10 family) |
10M04SCE144A7G 핀 구성
| 핀 1 | I/O — User I/O bank 1 |
| 핀 2 | I/O — User I/O bank 1 |
| 핀 3 | GND — Ground |
| 핀 4 | I/O — User I/O bank 1 |
| 핀 5 | I/O — User I/O bank 1 |
| 핀 6 | VCCIO1 — Bank 1 I/O supply |
| 핀 7 | I/O — User I/O bank 1 |
| 핀 8 | I/O — User I/O bank 1 |
| 핀 9 | I/O — User I/O bank 1 |
| 핀 10 | I/O — User I/O bank 1 |
| 핀 11 | I/O — User I/O bank 1 |
| 핀 12 | I/O — User I/O bank 1 |
| 핀 13 | GND — Ground |
| 핀 14 | I/O — User I/O bank 2 |
| 핀 15 | I/O — User I/O bank 2 |
| 핀 16 | VCCIO2 — Bank 2 I/O supply |
| 핀 17 | I/O — User I/O bank 2 |
| 핀 18 | I/O — User I/O bank 2 |
| 핀 19 | I/O — User I/O bank 2 |
| 핀 20 | GND — Ground |
| 핀 21 | I/O — User I/O bank 2 |
| 핀 22 | I/O — User I/O bank 2 |
| 핀 23 | I/O — User I/O bank 2 |
| 핀 24 | I/O — User I/O bank 2 |
| 핀 25 | GND — Ground |
| 핀 26 | I/O — User I/O bank 3 |
| 핀 27 | I/O — User I/O bank 3 |
| 핀 28 | VCCIO3 — Bank 3 I/O supply |
| 핀 29 | I/O — User I/O bank 3 |
| 핀 30 | I/O — User I/O bank 3 |
| 핀 31 | I/O — User I/O bank 3 |
| 핀 32 | I/O — User I/O bank 3 |
| 핀 33 | GND — Ground |
| 핀 34 | I/O — User I/O bank 4 |
| 핀 35 | I/O — User I/O bank 4 |
| 핀 36 | VCCIO4 — Bank 4 I/O supply |
| 핀 37 | I/O — User I/O bank 4 |
| 핀 38 | I/O — User I/O bank 4 |
| 핀 39 | I/O — User I/O bank 4 |
| 핀 40 | I/O — User I/O bank 4 |
| 핀 41 | GND — Ground |
| 핀 42 | I/O — User I/O bank 5 |
| 핀 43 | I/O — User I/O bank 5 |
| 핀 44 | VCCIO5 — Bank 5 I/O supply |
| 핀 45 | I/O — User I/O bank 5 |
| 핀 46 | I/O — User I/O bank 5 |
| 핀 47 | I/O — User I/O bank 5 |
| 핀 48 | I/O — User I/O bank 5 |
| 핀 49 | GND — Ground |
| 핀 50 | I/O — User I/O bank 6 |
| 핀 51 | I/O — User I/O bank 6 |
| 핀 52 | VCCIO6 — Bank 6 I/O supply |
| 핀 53 | I/O — User I/O bank 6 |
| 핀 54 | I/O — User I/O bank 6 |
| 핀 55 | I/O — User I/O bank 6 |
| 핀 56 | I/O — User I/O bank 6 |
| 핀 57 | GND — Ground |
| 핀 58 | I/O — User I/O bank 7 |
| 핀 59 | I/O — User I/O bank 7 |
| 핀 60 | VCCIO7 — Bank 7 I/O supply |
| 핀 61 | I/O — User I/O bank 7 |
| 핀 62 | I/O — User I/O bank 7 |
| 핀 63 | I/O — User I/O bank 7 |
| 핀 64 | I/O — User I/O bank 7 |
| 핀 65 | GND — Ground |
| 핀 66 | I/O — User I/O bank 8 |
| 핀 67 | I/O — User I/O bank 8 |
| 핀 68 | VCCIO8 — Bank 8 I/O supply |
| 핀 69 | I/O — User I/O bank 8 |
| 핀 70 | I/O — User I/O bank 8 |
| 핀 71 | I/O — User I/O bank 8 |
| 핀 72 | I/O — User I/O bank 8 |
| 핀 73 | GND — Ground |
| 핀 74 | TCK — JTAG test clock |
| 핀 75 | TMS — JTAG test mode select |
| 핀 76 | TDI — JTAG test data in |
| 핀 77 | TDO — JTAG test data out |
| 핀 78 | nCONFIG — Configuration control (active low) |
| 핀 79 | nSTATUS — Configuration status (active low) |
| 핀 80 | CONF_DONE — Configuration done |
| 핀 81 | DCLK — Configuration clock |
| 핀 82 | DATA0 — Configuration data input |
| 핀 83 | MSEL0 — Configuration mode select 0 |
| 핀 84 | MSEL1 — Configuration mode select 1 |
| 핀 85 | MSEL2 — Configuration mode select 2 |
| 핀 86 | VCCA — Analog supply for ADC/PLL |
| 핀 87 | VCCA_ADC — ADC analog supply |
| 핀 88 | REF_GND — Analog reference ground |
| 핀 89 | ADCIN1 — ADC analog input channel 1 |
| 핀 90 | ADCIN2 — ADC analog input channel 2 |
| 핀 91 | ADCIN3 — ADC analog input channel 3 |
| 핀 92 | ADCIN4 — ADC analog input channel 4 |
| 핀 93 | ADCIN5 — ADC analog input channel 5 |
| 핀 94 | ADCIN6 — ADC analog input channel 6 |
| 핀 95 | ADCIN7 — ADC analog input channel 7 |
| 핀 96 | ADCIN8 — ADC analog input channel 8 |
| 핀 97 | GND — Ground |
| 핀 98 | VCC — Core supply (3.0/3.3 V) |
| 핀 99 | VCC — Core supply (3.0/3.3 V) |
| 핀 100 | GND — Ground |
| 핀 101 | I/O — User I/O bank 1 |
| 핀 102 | I/O — User I/O bank 1 |
| 핀 103 | VCCIO1 — Bank 1 I/O supply |
| 핀 104 | I/O — User I/O bank 1 |
| 핀 105 | I/O — User I/O bank 1 |
| 핀 106 | I/O — User I/O bank 1 |
| 핀 107 | I/O — User I/O bank 1 |
| 핀 108 | GND — Ground |
| 핀 109 | I/O — User I/O bank 2 |
| 핀 110 | I/O — User I/O bank 2 |
| 핀 111 | VCCIO2 — Bank 2 I/O supply |
| 핀 112 | I/O — User I/O bank 2 |
| 핀 113 | I/O — User I/O bank 2 |
| 핀 114 | I/O — User I/O bank 2 |
| 핀 115 | I/O — User I/O bank 2 |
| 핀 116 | GND — Ground |
| 핀 117 | I/O — User I/O bank 3 |
| 핀 118 | I/O — User I/O bank 3 |
| 핀 119 | VCCIO3 — Bank 3 I/O supply |
| 핀 120 | I/O — User I/O bank 3 |
| 핀 121 | I/O — User I/O bank 3 |
| 핀 122 | I/O — User I/O bank 3 |
| 핀 123 | I/O — User I/O bank 3 |
| 핀 124 | GND — Ground |
| 핀 125 | I/O — User I/O bank 4 |
| 핀 126 | I/O — User I/O bank 4 |
| 핀 127 | VCCIO4 — Bank 4 I/O supply |
| 핀 128 | I/O — User I/O bank 4 |
| 핀 129 | I/O — User I/O bank 4 |
| 핀 130 | I/O — User I/O bank 4 |
| 핀 131 | I/O — User I/O bank 4 |
| 핀 132 | GND — Ground |
| 핀 133 | I/O — User I/O bank 5 |
| 핀 134 | I/O — User I/O bank 5 |
| 핀 135 | VCCIO5 — Bank 5 I/O supply |
| 핀 136 | I/O — User I/O bank 5 |
| 핀 137 | I/O — User I/O bank 5 |
| 핀 138 | I/O — User I/O bank 5 |
| 핀 139 | I/O — User I/O bank 5 |
| 핀 140 | GND — Ground |
| 핀 141 | I/O — User I/O bank 6 |
| 핀 142 | I/O — User I/O bank 6 |
| 핀 143 | VCCIO6 — Bank 6 I/O supply |
| 핀 144 | EP — Exposed thermal pad (must connect to GND pour) |
일반적인 애플리케이션
10M04SCE144A7G 적합 용도: 6 애플리케이션s: Industrial Motor Control, Automotive Body and Chassis Controllers, I/O Expansion and Bridging for MCUs, Human-Machine Interface (HMI) and Display Control, Portable Medical and Wellness Devices, Industrial Sensor Aggregation and Edge I/O.
Industrial Motor Control
The 10M04SCE144A7G fits industrial motor-control state machines where 4,000 LEs and 101 user I/O pins are sufficient to host position counters, PWM generators, and encoder interfaces. Its non-volatile flash configuration provides instant-on deterministic power-up, which is critical for safe stop sequences on 3-phase inverter boards. The AEC-Q100 automotive grade extends the same part to harsh industrial environments with -40 °C to +125 °C operation, and the 144-EQFP package simplifies SMT assembly on conventional lines.
추천
Automotive Body and Chassis Controllers
The 10M04SCE144A7G suits body and chassis modules (BCM, HVAC, lighting controllers) because AEC-Q100 qualification, 4,000 LEs, and 193,536 bits of embedded flash allow the FPGA to replace multiple discrete logic ICs and small CPLDs. Dual-image flash supports fail-safe firmware updates required by ISO 26262 workflows. With 101 user I/O the device can drive LIN/CAN transceivers and high-side switches directly, simplifying PCB routing inside an EQFP footprint.
추천
I/O Expansion and Bridging for MCUs
The 10M04SCE144A7G acts as a programmable I/O expander or bus bridge for legacy microcontrollers. Designers can implement parallel-to-SPI bridges, custom keypad scanners, or LVDS/TTL level translation in 4,000 LEs, then route 101 signals back to the host MCU through a single EQFP footprint. Non-volatile configuration eliminates the external boot flash that CPLD bridges otherwise need, reducing BOM cost and PCB area on industrial control boards.
추천
Human-Machine Interface (HMI) and Display Control
The 10M04SCE144A7G drives simple HMI panels, segment LCDs, and small TFT displays by combining on-chip oscillators, dedicated user flash for frame buffers (193,536 bits), and 101 user I/O to connect touch sensors and keypads. AEC-Q100 qualification enables use in automotive instrument clusters and in-cabin infotainment sub-modules. The instant-on behavior of MAX 10 non-volatile flash eliminates the lag users experience with SRAM-based FPGAs.
추천
Portable Medical and Wellness Devices
The 10M04SCE144A7G integrates sensor front-end glue logic for portable medical and wellness devices such as blood-pressure monitors, pulse oximeters, and home-diagnostic tools. The integrated MAX 10 ADC block and 4,000 LEs let designers digitize sensor channels, run digital filters, and drive a small display from a single chip. The 144-EQFP 20x20 mm footprint remains manageable for handheld enclosures while supporting a wide operating temperature window.
추천
Industrial Sensor Aggregation and Edge I/O
The 10M04SCE144A7G aggregates multiple industrial sensors (temperature, pressure, flow) and forwards them to a host controller over EtherCAT, PROFINET, or serial protocols. With 101 user I/O and 4,000 LEs, the part handles timestamp counters, watchdog logic, and protocol stacks without external logic ICs. AEC-Q100 qualification supports deployments in factory automation cells where -40 °C to +125 °C swings are routine, and the 144-EQFP allows reflow on conventional lines.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10M04SCE144A7G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10M04SCE144C8G | 10M04SCE144I7G | 10M08SCE144A7G | 10M02SCE144A7G |
|---|---|---|---|---|---|
| Package | 144-EQFP (20x20 mm) | 144-EQFP (20x20 mm) - same | 144-EQFP (20x20 mm) - same | 144-EQFP (20x20 mm) - same | 144-EQFP (20x20 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 4,000 | 4,000 (same) | 4,000 (same) | 8,000 (+100%) | 2,000 (-50%) |
| Operating Temperature | -40 °C to +125 °C (automotive) | 0 °C to +85 °C (commercial) | -40 °C to +100 °C (industrial) | -40 °C to +125 °C (automotive) | -40 °C to +125 °C (automotive) |
| Supply Voltage | 3.0/3.3 V | 3.0/3.3 V | 3.0/3.3 V | 3.0/3.3 V | 3.0/3.3 V |
| AEC-Q100 Automotive | Yes | No (commercial) | No (industrial) | Yes | Yes |
주요 차별점
- AEC-Q100 automotive grade with extended -40 to +125 °C temperature range (vs 10M04SCE144C8G)
- Maximized logic capacity within the 144-EQFP footprint (vs 10M02SCE144A7G)
- Higher LE count upgrade path on identical footprint (vs 10M08SCE144A7G)
설계 노트
Estimated: at continuous 3.3 V VCC, 101 user I/O switching at 25% toggle and 10 MHz, internal power is dominated by I/O bank current. With a 144-EQFP theta_JA of approximately 25 °C/W on a 4-layer JEDEC board, internal dissipation must stay below ~1.6 W to keep junction rise under 40 °C above 85 °C ambient. Exposed pad must be soldered to a continuous GND copper pour on top and inner layers to meet this envelope.
Place 100 nF X7R bypass capacitors within 5 mm of every VCC and VCCIO pin, with one 4.7 uF bulk capacitor per supply rail. Decouple VCCA_ADC from VCCA through a ferrite bead for ADC accuracy. JTAG pins (TCK, TMS, TDI, TDO) require 10 kohm pull-ups to VCCIO8 and short, length-matched traces to the programming header for reliable Quartus Prime configuration.
Do not leave the exposed pad (EP, pin 144) floating; it must be soldered to GND or thermal performance will degrade by 30-50% and AEC-Q100 qualification no longer applies. MSEL pins must match the desired configuration mode (AS, PS, JTAG) before VCC ramps, or the device will not boot. Avoid tying unused user I/O to long traces, which can act as antennas and inject noise into the ADC subsystem.
Route JTAG and configuration signals on the top layer adjacent to the device to keep stubs under 2 mm. Place the configuration flash (if used for dual-image) within 25 mm of DATA0/DCLK. Isolate ADC analog traces (ADCIN1-8, REF_GND) from digital switching traces; surround them with a GND guard ring connected to the analog ground plane to preserve ADC SNR.
규정 준수 정보
AEC-Q100 automotive grade per Intel MAX 10 datasheet ordering information. RoHS compliant per JLCPCB listing. MSL 3 per JEDEC J-STD-020.
