10M40DCF256A7G - MAX 10 FPGA, 40K LE, 256-FBGA | Intel
부품 번호: 10M40DCF256A7G ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $28.9 | $2,890.00 |
| 500 | $24.5 | $12,250.00 |
| 1,000 | $21.8 | $21,800.00 |
10M40DCF256A7G 개요
A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and on-die memory that engineers can reconfigure after manufacturing to implement arbitrary digital logic, DSP pipelines, or glue logic. MAX 10 sits in the low-power, non-volatile family tier - below Cyclone and above MAX V - and is the only non-volatile FPGA family in the Intel low-density lineup, integrating configuration flash, ADC blocks, and dual-configuration images on-chip. This hierarchy (FPGA -> programmable logic -> semi-custom ASIC alternative) makes MAX 10 ideal for volume production where ASSP flexibility is insufficient but full ASIC NRE is uneconomical.
Key features of the 10M40DCF256A7G include integrated dual-configuration flash, up to 16 analog-to-digital converter (ADC) channels at 12-bit resolution, on-chip temperature sensing, and optional Nios II soft-core processor support. The device integrates 178 user I/Os with support for LVDS, LVCMOS, SSTL, and other single-ended and differential I/O standards, while embedded MRAM blocks total approximately 378 Kbits of true RAM without sacrificing logic utilization.
Architecturally, the MAX 10 family combines a logic array fabric with hard IP blocks - including PLLs, embedded memory (M9K blocks), DSP blocks (18x18 multipliers), and a hard ADC subsystem. The 55 nm process node strikes a balance between static power consumption and performance, and the dual-boot configuration flash allows in-field firmware upgrades without external programmer hardware.
Typical applications include industrial motor control and factory automation, automotive body and infotainment subsystems, IoT edge sensor aggregation, video bridging and display controllers, and low-cost ASIC prototyping. The integrated ADC and on-die temperature diode simplify sensor interfacing in industrial IoT nodes, while 40K logic elements provide sufficient capacity for protocol bridging and small DSP functions.
When designing with the 10M40DCF256A7G, engineers must observe the FBGA-256 PCB land pattern (17 mm x 17 mm, 1.0 mm ball pitch) and ensure 8-layer stack-up with microvia-in-pad capability for breakout routing. Quartus Prime software is required for synthesis, place-and-route, and bitstream generation; the Lite Edition supports this device at no cost.
This page synthesizes distributor pricing, drop-in same-package alternatives drawn from the MAX 10 family and Site MPN list, and practical PCB layout and configuration guidance that complement the official datasheet.
드롭인 대체품: 10M40DCF256A7G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10M40DCF256A7G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Family, Operating Temperature, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10M40DCF256C8G
✅ 드롭인✓ 재고 있음
$71.8 / 개
데이터시트 보기 →10M40DCF256C7G
✅ 드롭인✓ 재고 있음
$26.4 / 개
데이터시트 보기 →10M40DCF256I7G
✅ 드롭인✓ 재고 있음
$52.12 / 개
데이터시트 보기 →10M40DAF256I7G
✅ 드롭인✓ 재고 있음
$65.8 / 개
데이터시트 보기 →10M40DAF256C8G
✅ 드롭인✓ 재고 있음
$55.2 / 개
데이터시트 보기 →10M40DAF256C7G
✅ 드롭인✓ 재고 있음
$46.83 / 개
데이터시트 보기 →10M40DCF256A7G 최대 정격 & 전기적 특성
| Family | MAX 10 |
| Logic Elements (LE) | 40,000 |
| Embedded Memory (bits) | 1,290,240 (160 Kbytes) |
| Maximum User I/Os | 178 |
| 패키지 | 256-FBGA (FineLine BGA, 17 mm x 17 mm, 1.0 mm pitch) |
| Process Technology | 55 nm |
| Core Voltage | 1.2 V |
| Maximum Internal Frequency | 472.5 MHz |
| Embedded Memory Type | M9K blocks |
| Configuration Memory | On-chip dual-configuration flash |
| ADC Channels | Up to 16 (12-bit) |
| Operating Temperature Grade | Automotive / -40C to +125C (per Partstack grading) |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
| Lead-Free / Halogen-Free | Yes (per device family) |
10M40DCF256A7G 256-fbga (fineline bga, 17 mm x 17 mm, 1.0 mm pitch) 핀 구성 가이드
10M40DCF256A7G(256-fbga (fineline bga, 17 mm x 17 mm, 1.0 mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10M40DCF256A7G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10M40DCF256A7G 적합 용도: 6 애플리케이션s: Industrial Motor Control, Automotive Infotainment and Body Electronics, IoT Edge Sensor Aggregation, Video Bridging and Display Controllers, ASIC Prototyping and Low-Volume Production, Power Conversion and Digital Control.
Industrial Motor Control
The 10M40DCF256A7G is widely deployed in industrial motor-control inverters and servo drives because its 40,000 logic elements comfortably host field-oriented control (FOC) state machines and space-vector PWM modulators without external DSP chips. The on-die 12-bit ADC with up to 16 channels digitizes phase currents and DC-bus voltage directly, while the integrated temperature diode eliminates an external thermistor for IGBT-module thermal monitoring. Designers benefit from 178 user I/Os to interface with opto-isolated gate drivers, encoder inputs (EnDat/BISS), and CAN/RS-485 fieldbuses on a single 256-FBGA. Quartus Prime's Qsys tool accelerates peripheral integration, and the dual-configuration flash enables secure field firmware updates.
추천
Automotive Infotainment and Body Electronics
Within automotive infotainment head units and body-control modules, the 10M40DCF256A7G bridges LVDS display panels, MOST or Ethernet networks, and analog audio paths. Its 472.5 MHz fabric headroom supports H.264 decode pre-processing, and the 256-FBGA's compact 17x17 mm footprint fits behind a 7-inch display. The MAX 10 family's on-chip flash and ADC reduce external component count - critical for AEC-Q100-style reliability budgets - and the 178 I/Os comfortably service touch-panel, rotary-encoder, and HVAC-bus interfaces. Designers can migrate to higher-density 10M50 variants without changing PCB layout when feature lists grow.
추천
IoT Edge Sensor Aggregation
For IoT edge gateways aggregating multiple sensor streams, the 10M40DCF256A7G offers the unique combination of an integrated ADC, hardware I2C/SPI/UART controllers, and soft-core Nios II processor support without external boot flash. Its 40K LEs handle protocol translation (for example Modbus to MQTT), local decision logic, and TLS-acceleration primitives, while the 1.29 Mbit of embedded RAM buffers burst-mode sensor traffic. The 256-FBGA is amenable to industrial-mini-ITX form factors, and Quartus Prime Lite Edition enables zero-license development for prototype runs.
추천
Video Bridging and Display Controllers
The 10M40DCF256A7G is frequently used as a video bridge converting parallel RGB or OpenLDI to MIPI-DSI, HDMI, or LVDS panels. Its 472.5 MHz fabric drives 720p60 with line-buffers in M9K RAM, and the 256-FBGA delivers the I/O count needed for 24-bit color plus control signals. On-chip configuration flash means instant-on display at boot - valuable for kiosk and digital-signage installations. Designers can swap in the lower-cost 10M25 for 480p applications using the same PCB footprint.
추천
ASIC Prototyping and Low-Volume Production
The 10M40DCF256A7G provides an affordable platform for ASIC prototyping when full mask NRE is uneconomical. Its 40K LEs emulate typical control-plane ASICs, the 1.29 Mbit of RAM models moderate SRAM blocks, and Quartus Prime supports incremental compilation for fast design iteration. The 256-FBGA's 1.0 mm pitch is hand-solderable with hot air for lab rework, simplifying engineering bring-up. For production volumes under 10K units per year, MAX 10 avoids the $500K+ ASIC NRE typical of 28 nm designs.
추천
Power Conversion and Digital Control
Digital power-conversion designs - telecom rectifiers, server VRMs, and solar inverters - leverage the 10M40DCF256A7G's high-speed fabric to run digital peak-current-mode control loops at 200 kHz+ switching frequencies. The 472.5 MHz internal clock enables fine-grained DPWM resolution, while the on-die ADC samples inductor current and output voltage in real time. The integrated temperature sensor and dual-configuration flash support in-field efficiency-table tuning - a common requirement for 80 PLUS Titanium server PSUs. The 256-FBGA's thermal pad simplifies heatsinking for high-current applications.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10M40DCF256A7G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10M40DCF256C8G | 10M40DCF256C7G | 10M40DCF256I7G | 10M40DAF256I7G | 10M40DAF256C8G | 10M40DAF256C7G |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-FBGA (17x17 mm, 1.0 mm pitch) | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same |
| Logic Elements | 40,000 | 40,000 | 40,000 | 40,000 | 40,000 | 40,000 | 40,000 |
| Embedded Memory (bits) | 1,290,240 | 1,290,240 | 1,290,240 | 1,290,240 | 1,290,240 | 1,290,240 | 1,290,240 |
| Maximum User I/Os | 178 | 178 | 178 | 178 | 178 | 178 | 178 |
| Speed Grade | A7 (DCF) | C8 (-8) | C7 (-7) | I7 (-7 industrial) | I7 (-7 DAF industrial) | C8 (-8 DAF) | C7 (-7 DAF) |
| Temperature Grade | Automotive grade | Commercial | Commercial | Industrial | Industrial | Commercial | Commercial |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| On-chip Configuration Flash | Yes (dual-image) | Yes (dual-image) | Yes (dual-image) | Yes (dual-image) | Yes (dual-image) | Yes (dual-image) | Yes (dual-image) |
주요 차별점
- On-chip dual-configuration flash eliminates external boot PROM (vs AMD/Xilinx Spartan-7 XC7S25)
- Integrated 12-bit ADC with up to 16 channels (vs Lattice ECP5 LFE5U-25F)
- Same 256-FBGA footprint as lower-density MAX 10 variants (vs 10M25DCF256A7G (25K LE))
설계 노트
The 256-FBGA uses a 1.0 mm ball pitch on a 17x17 mm body - routing requires at least a 4-layer stack-up with 0.4 mm microvias or 0.2 mm laser vias in-pad. Escape routing on the top layer uses 0.1 mm trace/space with HDI stack-up; the inner layers fan out to a 0.5 mm pitch BGA break-out. Recommended: 8-layer 1-2-1 HDI stack-up with dedicated ground/power planes directly under the device. Maintain a continuous thermal pad via array (0.3 mm drill, 1.0 mm pitch) to the internal ground plane for heat dissipation.
Estimated: the MAX 10 core draws approximately 100-300 mA from a 1.2 V supply depending on utilization; I/O banks draw from VCCIO rails which must be decoupled with 0.1 uF X7R ceramics placed within 2 mm of each bank pin, plus 10 uF bulk near the regulator. A 1.2 V LDO (such as TPS7A4701) or DC-DC converter with +/-3% tolerance is recommended. Per the MAX 10 handbook, VCCA (analog 2.5 V) and VCC_ONE (1.2 V analog) must be powered before or simultaneously with VCCINT to avoid latch-up.
Do not confuse the 256-FBGA with the 256-CSBGA used by AMD/Xilinx Spartan-7 - the ball maps are not pin-compatible despite identical ball count. Also note that MAX 10 configuration is instant-on from internal flash; you do NOT need to drive MSEL pins for AS configuration mode like older Cyclone families. Finally, ensure the JTAG chain order matches the Quartus Prime programmer file when multiple MAX 10 devices share a JTAG bus.
규정 준수 정보
RoHS and REACH compliant per Intel product declaration. Temperature grade listed as automotive per Partstack grading. AEC-Q100 qualification status inferred from automotive temperature grade designation - formal AEC-Q100 certificate should be requested from Intel for safety-critical designs.
