Intel

10M40DCF256I7G - MAX 10 FPGA 40K LE, 256-FBGA | Intel

부품 번호: 10M40DCF256I7G ✓ 활성

재고 있음 영업일 기준 1~3일 내 발송

1.2 V Vdss 256-FBGA (F256), 1.0 mm pitch Package 7 (fastest) Speed 1,290,240 Memory

시작가 $52.12 USD / 개

MOQ: 1 |

가격 업데이트: 2026-09-05

볼륨 가격

수량	단가	합계
1	$86.87	$86.87
10	$78.18	$781.80
100	$69.5	$6,950.00
500	$60.81	$30,405.00
1,000	$52.12	$52,120.00

ℹ️ 모든 가격은 USD 기준입니다

데이터시트 보기 (PDF) 대체품 보기

수량

10M40DCF256I7G 개요

The Intel (formerly Altera) 10M40DCF256I7G is a MAX 10 Field-Programmable Gate Array with 40,000 logic elements, 1,290,240 bits of embedded SRAM, and 178 user I/O, packaged in a 256-ball FineLine BGA (FBGA) and fabricated on a 55 nm non-volatile process. It operates at a core voltage of 1.2 V, supports LVDS/LVCMOS/PCIe interfaces, and includes hard IP blocks such as PLLs, ADCs, and embedded multipliers for signal-processing and control-plane applications.

MAX 10 FPGAs are non-volatile, instant-on programmable logic devices that bridge the gap between traditional CPLDs and low-density FPGAs. They integrate flash configuration memory on-chip, eliminating the need for an external boot PROM. Within the broader programmable logic hierarchy, MAX 10 sits below Cyclone V and above MAX II/MAX V, targeting cost-sensitive, low-power, and board-management applications. With 40K logic elements, the 10M40 variant occupies the upper end of the MAX 10 family, alongside the 10M25, 10M16, 10M08, and 10M02 density grades.

Key features include 4-input look-up tables, 9-Kbit M9K memory blocks, embedded 18x18 multipliers, up to 2 PLLs, an internal flash configuration block, an optional 12-bit SAR ADC, and support for DDR3/LPDDR2 external memory interfaces. The 'I' suffix denotes the industrial temperature grade (-40C to +100C junction) and the speed grade is 7 (fastest commercial speed for this density/package).

The 10M40DCF256I7G uses Intel's Quartus Prime design software with Verilog, VHDL, and SystemVerilog support. Designers leverage IP cores for Nios II soft processors, Ethernet MAC, PCIe Gen1, and MIPI D-PHY. The 55 nm process balances cost, power, and density, while the non-volatile architecture provides instant-on behavior within microseconds of power-up.

Typical applications include industrial motor control, factory automation I/O expansion, video bridging and image preprocessing, IoT edge gateways, telecom line cards, and automotive infotainment prototyping. The internal ADC and analog features are especially useful for sensor aggregation.

When designing, ensure the 256-FBGA PCB land pattern supports the 1.0 mm ball pitch and that all VCCINT/VCCA/VCCIO rails are properly decoupled. JTAG and configuration pins must be terminated per Intel AN 443 for in-system programmability.

This page synthesizes distributor pricing, drop-in alternatives, and design notes not found in the manufacturer datasheet, helping engineers select and source 10M40DCF256I7G quickly.

드롭인 대체품: 10M40DCF256I7G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: 10M40DCF256I7G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Family, Embedded Memory (bits), Configuration Method.

10M40DAF256C7G

Intel

비교 대상: 10M40DCF256I7G →

10M40DAF256I7G

Intel

Package: 256-FBGA (FineLine BGA), 17x17 mm

Process Technology: 55 nm TSMC

Embedded Memory (bits): 1,290,240 (M9K + M144K blocks)

비교 대상: 10M40DCF256I7G →

10M40DCF256A7G

Intel

Package: 256-FBGA (FineLine BGA, 17 mm x 17 mm, 1.0 mm pitch)

Process Technology: 55 nm

Family: MAX 10

비교 대상: 10M40DCF256I7G →

10M40DCF256C7G

Altera

Package: 256-LBGA (FBGA)

Process Technology: 55 nm

Family: MAX 10

비교 대상: 10M40DCF256I7G →

10M40DCF256C8G

Intel

Package: 256-FBGA (F256, 17 mm × 17 mm)

Process Technology: 55 nm

Family: MAX 10 FPGA

비교 대상: 10M40DCF256I7G →

10M50DCF256C8G

Intel

Package: 256-pin FBGA (FBGA256), 17x17 mm

Process Technology: TSMC 55 nm embedded flash CMOS

Family: MAX 10

비교 대상: 10M40DCF256I7G →

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

10M40DCF256C7G

✅ 드롭인

Altera

📦 256-FBGA (F256)

MAX 10 · Intel / Altera · 40,000 · 1,290,240 · 178 · 472.5 MHz · 55 nm · 1.2 V

✓ 재고 있음

$26.4 / 개

데이터시트 보기 →

10M40DCF256C8G

✅ 드롭인

Intel

📦 256-FBGA (F256)

MAX 10 · MAX 10 FPGA · 40,000 · 1,290,240 · Embedded SRAM (block RAM) · 178 (MAX)

✓ 재고 있음

$71.8 / 개

데이터시트 보기 →

10M40DCF256A7G

✅ 드롭인

Intel

📦 256-FBGA (F256)

MAX 10 · 40,000 · 1,290,240 (160 Kbytes) · 178 · 256-FBGA (FineLine BGA, 17 mm x 17 mm, 1.0 mm pitch) · 55 nm · 1.2 V · 472.5 MHz

✓ 재고 있음

$21.8 / 개

데이터시트 보기 →

10M40DAF256I7G

✅ 드롭인

Intel

📦 256-FBGA (F256)

MAX 10 · 40,000 · 1,290,240 (M9K + M144K blocks) · 178 · 256-FBGA (FineLine BGA), 17x17 mm · 55 nm TSMC · 1.2 V · -40C to +100C (Industrial, I7)

✓ 재고 있음

$65.8 / 개

데이터시트 보기 →

10M40DCF256I7G 최대 정격 & 전기적 특성

Series	MAX 10
Family	Intel MAX 10
Logic Elements (LE)	40,000
Embedded Memory (bits)	1,290,240
User I/O	178
Process Technology	55 nm non-volatile (flash)
Core Voltage (VCCINT)	1.2 V
패키지	256-FBGA (F256), 1.0 mm pitch
Speed Grade	7 (fastest)
Temperature Grade	Industrial (-40C to +100C TJ)
PLLs	2 (per device family datasheet)
Embedded Multipliers (18x18)	Yes (quantity per device datasheet)
Internal Flash Configuration	Yes (non-volatile, instant-on)
ADC	12-bit SAR ADC (per family datasheet)
실장 유형	Surface Mount (BGA)
RoHS 상태	Compliant (per Intel product page)
Configuration Method	Internal flash / JTAG

10M40DCF256I7G 256-fbga (f256), 1.0 mm pitch 핀 구성 가이드

10M40DCF256I7G(256-fbga (f256), 1.0 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.

10M40DCF256I7G의 256-fbga (f256), 1.0 mm pitch 패키지 핀아웃 다이어그램

다음에 대한 상세 핀아웃 데이터 없음: 10M40DCF256I7G.

다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.

일반적인 애플리케이션

10M40DCF256I7G 적합 용도: 6 애플리케이션s: Industrial Motor Control, Factory Automation I/O Expansion, Video Bridging and Image Preprocessing, IoT Edge Gateways, Telecom Line Cards and Control Plane, Automotive Infotainment Prototyping.

🏭

Industrial Motor Control

The 10M40DCF256I7G fits industrial motor-control designs with its 40,000 logic elements, hard 12-bit SAR ADC for current/voltage sensing, and 178 GPIO for PWM and encoder feedback. Industrial -40C to +100C operation matches factory-floor thermal envelopes. Up to 2 PLLs and 18x18 multipliers handle field-oriented control (FOC) math in real time. Compared with microcontrollers, the FPGA offloads deterministic control loops at microsecond latency.

추천

🏭

Factory Automation I/O Expansion

Use the 10M40DCF256I7G as a flexible industrial I/O aggregator bridging sensor networks (RS-485, IO-Link, SPI) to EtherCAT or PROFINET controllers. Its 256-FBGA package supports 178 GPIO with hot-swap tolerant LVCMOS 3.3 V and 2.5 V banks. The non-volatile flash configuration provides instant-on restart in <100 ms, essential for deterministic PLC backplane recovery after power loss.

추천

10M25DCF256I7G · Intel 10M40DAF256I7G · Intel

🔧

Video Bridging and Image Preprocessing

The 10M40DCF256I7G supports LVDS-based camera-link aggregation, MIPI-CSI2 bridging, and basic image preprocessing (color conversion, scaling, region-of-interest extraction) in machine-vision designs. Its 1,290 Kbits of embedded M9K memory buffer video line data without external SDRAM. With 472.5 MHz internal fabric, it can drive 720p pipelines at 60 fps when paired with external DDR3 memory.

추천

10M40DCF484I7G · Intel 10M16DCF256I7G · Intel

🧩

IoT Edge Gateways

The 10M40DCF256I7G functions as a low-power edge-compute node with Nios II soft-core CPU, hardware-accelerated TLS, and protocol bridging between Ethernet, Wi-Fi, BLE, and LoRa. Its non-volatile instant-on feature wakes in microseconds, ideal for event-driven edge processing. Industrial temperature rating supports outdoor enclosures. The hard ADC enables direct sensor interface without external analog front ends.

추천

10M08DCF256I7G · Intel 10M25DCF256I7G · Intel

🌐

Telecom Line Cards and Control Plane

Telecom line cards use the 10M40DCF256I7G for glue logic, clock distribution, SERDES bridging, and control-plane state machines. Two PLLs provide flexible clock synthesis for backplane and framer interfaces. Industrial temperature grade supports outdoor cabinet installations. The MAX 10 instant-on feature ensures fast system recovery from brownout conditions.

추천

10M40DCF256C7G · Altera 10M25DCF484I7G · Intel

🚗

Automotive Infotainment Prototyping

The 10M40DCF256I7G enables prototype development of automotive infotainment HMIs, rear-seat entertainment bridges, and CAN/LIN gateway logic. Industrial temperature rating covers most cabin environments, while the 10M40DCF256A7G automotive variant (AEC-Q100) should be selected for production deployments. Hard ADC simplifies battery monitoring and ambient sensor integration for HMI backlight control.

추천

10M40DCF256A7G · Intel 10M16DCF256I7G · Intel

추천 제품 요약

10M40DCF256C7G Altera 사용처: Industrial Motor Control, Telecom Line Cards and Control Plane 10M16DCF256I7G Intel 사용처: Industrial Motor Control, Video Bridging and Image Preprocessing, Automotive Infotainment Prototyping 10M25DCF256I7G Intel 사용처: Factory Automation I/O Expansion, IoT Edge Gateways 10M40DAF256I7G Intel 사용처: Factory Automation I/O Expansion 10M40DCF484I7G Intel 사용처: Video Bridging and Image Preprocessing 10M08DCF256I7G Intel 사용처: IoT Edge Gateways 10M25DCF484I7G Intel 사용처: Telecom Line Cards and Control Plane 10M40DCF256A7G Intel 사용처: Automotive Infotainment Prototyping

What is the 10M40DCF256I7G?

The 10M40DCF256I7G is an Intel MAX 10 Field-Programmable Gate Array with 40,000 logic elements, 1,290,240 bits of embedded SRAM, and 178 user I/O, housed in a 256-ball FineLine BGA (FBGA) package. It is fabricated on a 55 nm non-volatile process and operates from a 1.2 V core supply, supporting industrial-grade temperatures from -40C to +100C junction per the Altera/Intel datasheet.

What is the operating temperature range of 10M40DCF256I7G?

The 10M40DCF256I7G is rated for industrial temperature operation with a junction range of -40C to +100C, denoted by the 'I' suffix in the ordering code. This makes it suitable for factory automation, outdoor telecom, and other harsh-environment designs where commercial-grade 0C-85C parts are inadequate.

How many logic elements does the 10M40DCF256I7G have?

The 10M40DCF256I7G integrates 40,000 logic elements (LEs) on a 55 nm flash-based MAX 10 fabric. This places it in the upper-middle density tier of the MAX 10 family, above 10M25 and below Cyclone V devices. Designers should consult the device handbook for exact adaptive logic module (ALM) and LAB counts when targeting specific IP.

What package does the 10M40DCF256I7G use?

The 10M40DCF256I7G is supplied in a 256-ball FineLine BGA (F256) package with 1.0 mm ball pitch per the Altera package specifications. The 'F256' code identifies the FBGA package outline; the 'CF' middle code indicates this is the commercial/industrial pinout variant with 178 usable GPIO across 8 I/O banks.

Does the 10M40DCF256I7G contain an internal ADC?

Yes, the MAX 10 family includes a hard 12-bit successive-approximation ADC block that the 10M40DCF256I7G inherits. The ADC supports up to 16 analog input channels and is configured in Quartus Prime. Specific channel count and sample-rate caps for the 10M40 density must be confirmed in the MAX 10 device datasheet.

What is the difference between 10M40DCF256I7G and 10M40DCF256C8G?

The 10M40DCF256I7G and 10M40DCF256C8G share the same 40K-LE MAX 10 die, 256-FBGA package, and 178 GPIO. The 'I7G' code indicates industrial temperature grade (-40C to +100C) with speed grade 7, while 'C8G' indicates commercial temperature grade (0C to +85C) with speed grade 8 (slower). They are pin-compatible drop-in alternatives; choose I7G for industrial and C8G for cost-sensitive commercial designs.

Is the 10M40DCF256I7G in stock at distributors?

As of 2026-09-05, the 10M40DCF256I7G is listed by DigiKey and Mouser with limited stock. Distributor listings should be checked live for current inventory. Authorized franchised distributors are recommended over independent brokers for traceability and counterfeit avoidance. Lead times typically range from stock to several weeks for factory orders.

What is the price of the 10M40DCF256I7G?

As of 2026-09-05, the 10M40DCF256I7G unit price is approximately $86.87 at qty 1, decreasing to around $52.12 at qty 1000. Pricing varies by distributor, packaging option (tray vs tape-and-reel), and current market conditions. Bulk quotes can be requested directly through authorized distributors for OEM volumes.

Where can I download the 10M40DCF256I7G datasheet?

The official 10M40DCF256I7G datasheet and ordering part number details can be downloaded from the Intel Altera product page at https://www.altera.com/products/fpga/max/10/10m40-f256/10M40DCF256I7G. The MAX 10 device datasheet family also covers this OPN's electrical characteristics, pinout, and package mechanical drawings.

Where is the pinout for 10M40DCF256I7G located?

The 10M40DCF256I7G pinout is published in the MAX 10 device family datasheet under the 'F256 package pin tables' section, accessible via the Intel Altera product page. Designers should use Quartus Prime's Pin Planner tool with the F256 package and 10M40 device selected to map signals to specific balls and I/O banks.

What is the best drop-in replacement for 10M40DCF256I7G?

The most direct drop-in replacement for the 10M40DCF256I7G in the same 256-FBGA footprint is the 10M40DCF256C8G (commercial temp grade, slower speed grade 8), followed by the 10M40DCF256C7G (commercial temp, fastest speed 7). All three share the same ball map, I/O count, and configuration interface, enabling drop-in PCB compatibility.

10M40DCF256I7G vs 10M40DCF256A7G - which is better for industrial use?

For industrial use, the 10M40DCF256I7G is the better choice because the 'I' suffix denotes the industrial -40C to +100C temperature grade. The 10M40DCF256A7G is the automotive-grade variant (-40C to +125C with AEC-Q100 screening), which is over-specified and more expensive for general industrial applications. Both share the same 256-FBGA pinout.

When should I choose 10M40DCF256I7G over 10M40DAF256I7G?

Choose the 10M40DCF256I7G when you need the 256-FBGA package with 178 GPIO; choose the 10M40DAF256I7G (256-FBGA, but DA-series indicating different feature mix) when your design can use the alternate package variant. Both share the 40K-LE MAX 10 die, so logic capacity is identical - the difference is the I/O configuration and peripheral mix.

What are the key specifications of 10M40DCF256I7G that engineers should know?

The 10M40DCF256I7G key specifications are: 40,000 logic elements, 1,290,240 bits of embedded SRAM (in M9K blocks), 178 user I/O across 8 banks, 256-FBGA package at 1.0 mm pitch, 1.2 V VCCINT core, industrial -40C to +100C temperature grade, speed grade 7, on-chip flash configuration, and a hard 12-bit SAR ADC. It uses the Quartus Prime design toolchain.

엔지니어링 참조 데이터: 10M40DCF256I7G — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the 10M40DCF256I7G when you need a non-volatile MAX 10 FPGA with 40K logic elements in the 256-FBGA package for industrial temperature operation. It is ideal for motor control, industrial I/O expansion, video bridging, and IoT edge gateways that require instant-on behavior and the hard 12-bit ADC. Choose the 10M40DCF256C7G or C8G if your design operates in commercial 0C-85C and you want lower cost. Choose the 10M40DCF256A7G for AEC-Q100 automotive deployments. Choose the 10M40DAF256I7G only if your design requires the specific 'DA' feature mix. All four alternatives share the same 256-FBGA footprint, enabling PCB layout reuse across temperature and feature variants.

대체품과의 비교

파라미터	이 제품	10M40DCF256C7G	10M40DCF256C8G	10M40DCF256A7G	10M40DAF256I7G
Package	256-FBGA (F256)	256-FBGA (F256)	256-FBGA (F256)	256-FBGA (F256)	256-FBGA (F256)
Brand	Intel	Intel	Intel	Intel	Intel
Logic Elements	40,000	40,000	40,000	40,000	40,000
Embedded Memory (bits)	1,290,240	1,290,240	1,290,240	1,290,240	1,290,240
User I/O	178	178	178	178	178
Temperature Grade	Industrial (-40C to +100C)	Commercial (0C to +85C)	Commercial (0C to +85C)	Automotive (-40C to +125C TJ, AEC-Q100)	Industrial (-40C to +100C)
Speed Grade	7	7	8 (slower)	7	7
Core Voltage	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V

주요 차별점

Industrial temperature grade at speed grade 7 (vs 10M40DCF256C8G)
Industrial vs over-spec'd automotive grade (vs 10M40DCF256A7G)
Standard 'DC' feature mix vs 'DA' variant (vs 10M40DAF256I7G)

설계 노트

The 256-FBGA package uses a 1.0 mm ball pitch and requires a 4-6 layer PCB with microvia stack-ups. Per Intel AN 443, all VCCINT and VCCA pins must be decoupled with 0.1 uF and 10 uF ceramic capacitors placed within 100 mils of the respective balls. Use a continuous GND plane under the BGA and stitch vias around the perimeter for thermal dissipation. PCB land-pattern tolerances should follow IPC-7351 for BGA packages.

The 10M40DCF256I7G requires separate VCCINT (1.2 V core), VCCA (2.5 V analog/pll), and VCCIO (1.2 V-3.3 V per bank) rails. A power-on sequence is recommended: VCCINT first, then VCCA, then VCCIO. Failure to sequence correctly can cause in-rush currents and latch-up. Estimated core current at full 40K-LE utilization is approximately 0.5-1 A depending on toggle rate; verify against the Quartus Prime PowerPlay early estimator for production designs.

Assign high-speed differential pairs (LVDS) to banks with dedicated SERDES support and route with 100 ohm differential impedance and length matching within 20 mils. JTAG pins (TCK, TMS, TDI, TDO) should be pulled to known states per the MAX 10 handbook to prevent spurious configuration. Keep the CLK clock input traces short and reference them to a continuous ground plane to minimize jitter and EMI.

Do not confuse the MAX 10 'DC' suffix with 'DA' - they share the 256-FBGA footprint but have different I/O bank counts, ADC channels, and PLL counts. Always verify the OPN's feature matrix in the MAX 10 device handbook before PCB layout finalization. The 10M40DCF256I7G has 8 I/O banks; older MAX 10 designs migrated from 10M25 may assume only 6 banks.