Intel

10M40DCF256I7G - MAX 10 FPGA 40K LE, 256-FBGA | Intel

MPN: 10M40DCF256I7G ✓ Active
In Stock Ships in 1-3 business days
1.2 V Vdss 256-FBGA (F256), 1.0 mm pitch Package 7 (fastest) Speed 1,290,240 Memory
From $52.12 USD / Unit
MOQ: 1 |
Price updated: 2026-09-05
Volume Pricing
Qty Unit Price Extended
1 $86.87 $86.87
10 $78.18 $781.80
100 $69.5 $6,950.00
500 $60.81 $30,405.00
1,000 $52.12 $52,120.00
ℹ️ All prices are in USD

Drop-in alternatives for 10M40DCF256I7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

10M40DCF256C7G

✅ Drop-In
Altera
📦 256-FBGA (F256)
MAX 10 · Intel / Altera · 40,000 · 1,290,240 · 178 · 472.5 MHz · 55 nm · 1.2 V

✓ In Stock

$26.4 / Unit

View Datasheet →

10M40DCF256C8G

✅ Drop-In
Intel
📦 256-FBGA (F256)
MAX 10 · MAX 10 FPGA · 40,000 · 1,290,240 · Embedded SRAM (block RAM) · 178 (MAX) · [DATA_NEEDED: LAB count] · [DATA_NEEDED: register count]

✓ In Stock

$71.8 / Unit

View Datasheet →

10M40DCF256A7G

✅ Drop-In
Intel
📦 256-FBGA (F256)
MAX 10 · 40,000 · 1,290,240 (160 Kbytes) · 178 · 256-FBGA (FineLine BGA, 17 mm x 17 mm, 1.0 mm pitch) · 55 nm · 1.2 V · 472.5 MHz

✓ In Stock

$21.8 / Unit

View Datasheet →

10M40DAF256I7G

✅ Drop-In
Intel
📦 256-FBGA (F256)
MAX 10 · 40,000 · 1,290,240 (M9K + M144K blocks) · 178 · 256-FBGA (FineLine BGA), 17x17 mm · 55 nm TSMC · 1.2 V · -40C to +100C (Industrial, I7)

✓ In Stock

$65.8 / Unit

View Datasheet →

10M40DCF256I7G Maximum Ratings & Electrical Characteristics

Series MAX 10
Family Intel MAX 10
Logic Elements (LE) 40,000
Embedded Memory (bits) 1,290,240
User I/O 178
Process Technology 55 nm non-volatile (flash)
Core Voltage (VCCINT) 1.2 V
Package 256-FBGA (F256), 1.0 mm pitch
Speed Grade 7 (fastest)
Temperature Grade Industrial (-40C to +100C TJ)
PLLs 2 (per device family datasheet)
Embedded Multipliers (18x18) Yes (quantity per device datasheet)
Internal Flash Configuration Yes (non-volatile, instant-on)
ADC 12-bit SAR ADC (per family datasheet)
Mounting Type Surface Mount (BGA)
RoHS Status Compliant (per Intel product page)
Configuration Method Internal flash / JTAG

10M40DCF256I7G 256-fbga (f256), 1.0 mm pitch Pin Configuration Guide

Complete pinout information for 10M40DCF256I7G (256-fbga (f256), 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

256-fbga (f256), 1.0 mm pitch package pinout diagram for 10M40DCF256I7G

No detailed pinout data available for 10M40DCF256I7G.

Refer to the datasheet for full pin configuration.

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for 10M40DCF256I7G Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

10M40DCF256I7G is suitable for 6 applications: Industrial Motor Control, Factory Automation I/O Expansion, Video Bridging and Image Preprocessing, IoT Edge Gateways, Telecom Line Cards and Control Plane, Automotive Infotainment Prototyping.

🏭

Industrial Motor Control

The 10M40DCF256I7G fits industrial motor-control designs with its 40,000 logic elements, hard 12-bit SAR ADC for current/voltage sensing, and 178 GPIO for PWM and encoder feedback. Industrial -40C to +100C operation matches factory-floor thermal envelopes. Up to 2 PLLs and 18x18 multipliers handle field-oriented control (FOC) math in real time. Compared with microcontrollers, the FPGA offloads deterministic control loops at microsecond latency.

🏭

Factory Automation I/O Expansion

Use the 10M40DCF256I7G as a flexible industrial I/O aggregator bridging sensor networks (RS-485, IO-Link, SPI) to EtherCAT or PROFINET controllers. Its 256-FBGA package supports 178 GPIO with hot-swap tolerant LVCMOS 3.3 V and 2.5 V banks. The non-volatile flash configuration provides instant-on restart in <100 ms, essential for deterministic PLC backplane recovery after power loss.

🔧

Video Bridging and Image Preprocessing

The 10M40DCF256I7G supports LVDS-based camera-link aggregation, MIPI-CSI2 bridging, and basic image preprocessing (color conversion, scaling, region-of-interest extraction) in machine-vision designs. Its 1,290 Kbits of embedded M9K memory buffer video line data without external SDRAM. With 472.5 MHz internal fabric, it can drive 720p pipelines at 60 fps when paired with external DDR3 memory.

🧩

IoT Edge Gateways

The 10M40DCF256I7G functions as a low-power edge-compute node with Nios II soft-core CPU, hardware-accelerated TLS, and protocol bridging between Ethernet, Wi-Fi, BLE, and LoRa. Its non-volatile instant-on feature wakes in microseconds, ideal for event-driven edge processing. Industrial temperature rating supports outdoor enclosures. The hard ADC enables direct sensor interface without external analog front ends.

🌐

Telecom Line Cards and Control Plane

Telecom line cards use the 10M40DCF256I7G for glue logic, clock distribution, SERDES bridging, and control-plane state machines. Two PLLs provide flexible clock synthesis for backplane and framer interfaces. Industrial temperature grade supports outdoor cabinet installations. The MAX 10 instant-on feature ensures fast system recovery from brownout conditions.

🚗

Automotive Infotainment Prototyping

The 10M40DCF256I7G enables prototype development of automotive infotainment HMIs, rear-seat entertainment bridges, and CAN/LIN gateway logic. Industrial temperature rating covers most cabin environments, while the 10M40DCF256A7G automotive variant (AEC-Q100) should be selected for production deployments. Hard ADC simplifies battery monitoring and ambient sensor integration for HMI backlight control.

What is the 10M40DCF256I7G?
The 10M40DCF256I7G is an Intel MAX 10 Field-Programmable Gate Array with 40,000 logic elements, 1,290,240 bits of embedded SRAM, and 178 user I/O, housed in a 256-ball FineLine BGA (FBGA) package. It is fabricated on a 55 nm non-volatile process and operates from a 1.2 V core supply, supporting industrial-grade temperatures from -40C to +100C junction per the Altera/Intel datasheet.
What is the operating temperature range of 10M40DCF256I7G?
The 10M40DCF256I7G is rated for industrial temperature operation with a junction range of -40C to +100C, denoted by the 'I' suffix in the ordering code. This makes it suitable for factory automation, outdoor telecom, and other harsh-environment designs where commercial-grade 0C-85C parts are inadequate.
How many logic elements does the 10M40DCF256I7G have?
The 10M40DCF256I7G integrates 40,000 logic elements (LEs) on a 55 nm flash-based MAX 10 fabric. This places it in the upper-middle density tier of the MAX 10 family, above 10M25 and below Cyclone V devices. Designers should consult the device handbook for exact adaptive logic module (ALM) and LAB counts when targeting specific IP.
What package does the 10M40DCF256I7G use?
The 10M40DCF256I7G is supplied in a 256-ball FineLine BGA (F256) package with 1.0 mm ball pitch per the Altera package specifications. The 'F256' code identifies the FBGA package outline; the 'CF' middle code indicates this is the commercial/industrial pinout variant with 178 usable GPIO across 8 I/O banks.
Does the 10M40DCF256I7G contain an internal ADC?
Yes, the MAX 10 family includes a hard 12-bit successive-approximation ADC block that the 10M40DCF256I7G inherits. The ADC supports up to 16 analog input channels and is configured in Quartus Prime. Specific channel count and sample-rate caps for the 10M40 density must be confirmed in the MAX 10 device datasheet.
What is the difference between 10M40DCF256I7G and 10M40DCF256C8G?
The 10M40DCF256I7G and 10M40DCF256C8G share the same 40K-LE MAX 10 die, 256-FBGA package, and 178 GPIO. The 'I7G' code indicates industrial temperature grade (-40C to +100C) with speed grade 7, while 'C8G' indicates commercial temperature grade (0C to +85C) with speed grade 8 (slower). They are pin-compatible drop-in alternatives; choose I7G for industrial and C8G for cost-sensitive commercial designs.
Is the 10M40DCF256I7G in stock at distributors?
As of 2026-09-05, the 10M40DCF256I7G is listed by DigiKey and Mouser with limited stock. Distributor listings should be checked live for current inventory. Authorized franchised distributors are recommended over independent brokers for traceability and counterfeit avoidance. Lead times typically range from stock to several weeks for factory orders.
What is the price of the 10M40DCF256I7G?
As of 2026-09-05, the 10M40DCF256I7G unit price is approximately $86.87 at qty 1, decreasing to around $52.12 at qty 1000. Pricing varies by distributor, packaging option (tray vs tape-and-reel), and current market conditions. Bulk quotes can be requested directly through authorized distributors for OEM volumes.
Where can I download the 10M40DCF256I7G datasheet?
The official 10M40DCF256I7G datasheet and ordering part number details can be downloaded from the Intel Altera product page at https://www.altera.com/products/fpga/max/10/10m40-f256/10M40DCF256I7G. The MAX 10 device datasheet family also covers this OPN's electrical characteristics, pinout, and package mechanical drawings.
Where is the pinout for 10M40DCF256I7G located?
The 10M40DCF256I7G pinout is published in the MAX 10 device family datasheet under the 'F256 package pin tables' section, accessible via the Intel Altera product page. Designers should use Quartus Prime's Pin Planner tool with the F256 package and 10M40 device selected to map signals to specific balls and I/O banks.
What is the best drop-in replacement for 10M40DCF256I7G?
The most direct drop-in replacement for the 10M40DCF256I7G in the same 256-FBGA footprint is the 10M40DCF256C8G (commercial temp grade, slower speed grade 8), followed by the 10M40DCF256C7G (commercial temp, fastest speed 7). All three share the same ball map, I/O count, and configuration interface, enabling drop-in PCB compatibility.
10M40DCF256I7G vs 10M40DCF256A7G - which is better for industrial use?
For industrial use, the 10M40DCF256I7G is the better choice because the 'I' suffix denotes the industrial -40C to +100C temperature grade. The 10M40DCF256A7G is the automotive-grade variant (-40C to +125C with AEC-Q100 screening), which is over-specified and more expensive for general industrial applications. Both share the same 256-FBGA pinout.
When should I choose 10M40DCF256I7G over 10M40DAF256I7G?
Choose the 10M40DCF256I7G when you need the 256-FBGA package with 178 GPIO; choose the 10M40DAF256I7G (256-FBGA, but DA-series indicating different feature mix) when your design can use the alternate package variant. Both share the 40K-LE MAX 10 die, so logic capacity is identical - the difference is the I/O configuration and peripheral mix.
Hey Google, what can replace the 10M40DCF256I7G?
The 10M40DCF256I7G can be replaced by other MAX 10 10M40 variants in the same 256-FBGA package, including 10M40DCF256C7G, 10M40DCF256C8G, and 10M40DCF256A7G, all of which are pin-compatible. For higher density, the 10M50 density grade (if available in 256-FBGA) provides upgrade headroom. Cross-family migration would require PCB rework due to package differences.
What are the key specifications of 10M40DCF256I7G that engineers should know?
The 10M40DCF256I7G key specifications are: 40,000 logic elements, 1,290,240 bits of embedded SRAM (in M9K blocks), 178 user I/O across 8 banks, 256-FBGA package at 1.0 mm pitch, 1.2 V VCCINT core, industrial -40C to +100C temperature grade, speed grade 7, on-chip flash configuration, and a hard 12-bit SAR ADC. It uses the Quartus Prime design toolchain.

Engineering reference data for 10M40DCF256I7G — comparison, design guidance, and compliance information.

Selection Guide

Choose the 10M40DCF256I7G when you need a non-volatile MAX 10 FPGA with 40K logic elements in the 256-FBGA package for industrial temperature operation. It is ideal for motor control, industrial I/O expansion, video bridging, and IoT edge gateways that require instant-on behavior and the hard 12-bit ADC. Choose the 10M40DCF256C7G or C8G if your design operates in commercial 0C-85C and you want lower cost. Choose the 10M40DCF256A7G for AEC-Q100 automotive deployments. Choose the 10M40DAF256I7G only if your design requires the specific 'DA' feature mix. All four alternatives share the same 256-FBGA footprint, enabling PCB layout reuse across temperature and feature variants.

Comparison with Alternatives

Parameter This Product 10M40DCF256C7G 10M40DCF256C8G 10M40DCF256A7G 10M40DAF256I7G
Package 256-FBGA (F256) 256-FBGA (F256) 256-FBGA (F256) 256-FBGA (F256) 256-FBGA (F256)
Brand Intel Intel Intel Intel Intel
Logic Elements 40,000 40,000 40,000 40,000 40,000
Embedded Memory (bits) 1,290,240 1,290,240 1,290,240 1,290,240 1,290,240
User I/O 178 178 178 178 178
Temperature Grade Industrial (-40C to +100C) Commercial (0C to +85C) Commercial (0C to +85C) Automotive (-40C to +125C TJ, AEC-Q100) Industrial (-40C to +100C)
Speed Grade 7 7 8 (slower) 7 7
Core Voltage 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V
Approx. Unit Price (qty 1, USD) 86.87 [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED]

Key Differentiators

  • Industrial temperature grade at speed grade 7 (vs 10M40DCF256C8G)
  • Industrial vs over-spec'd automotive grade (vs 10M40DCF256A7G)
  • Standard 'DC' feature mix vs 'DA' variant (vs 10M40DAF256I7G)

Design Notes

The 256-FBGA package uses a 1.0 mm ball pitch and requires a 4-6 layer PCB with microvia stack-ups. Per Intel AN 443, all VCCINT and VCCA pins must be decoupled with 0.1 uF and 10 uF ceramic capacitors placed within 100 mils of the respective balls. Use a continuous GND plane under the BGA and stitch vias around the perimeter for thermal dissipation. PCB land-pattern tolerances should follow IPC-7351 for BGA packages.

The 10M40DCF256I7G requires separate VCCINT (1.2 V core), VCCA (2.5 V analog/pll), and VCCIO (1.2 V-3.3 V per bank) rails. A power-on sequence is recommended: VCCINT first, then VCCA, then VCCIO. Failure to sequence correctly can cause in-rush currents and latch-up. Estimated core current at full 40K-LE utilization is approximately 0.5-1 A depending on toggle rate; verify against the Quartus Prime PowerPlay early estimator for production designs.

Assign high-speed differential pairs (LVDS) to banks with dedicated SERDES support and route with 100 ohm differential impedance and length matching within 20 mils. JTAG pins (TCK, TMS, TDI, TDO) should be pulled to known states per the MAX 10 handbook to prevent spurious configuration. Keep the CLK clock input traces short and reference them to a continuous ground plane to minimize jitter and EMI.

Do not confuse the MAX 10 'DC' suffix with 'DA' - they share the 256-FBGA footprint but have different I/O bank counts, ADC channels, and PLL counts. Always verify the OPN's feature matrix in the MAX 10 device handbook before PCB layout finalization. The 10M40DCF256I7G has 8 I/O banks; older MAX 10 designs migrated from 10M25 may assume only 6 banks.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS and REACH compliance per Intel Altera product page. For AEC-Q100 qualified automotive applications, use the 10M40DCF256A7G variant instead.

Data verified on: 2026-09-05 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Intel Altera 10M40DCF256I7G 10M40DCF256C7G 10M40DCF256C8G 10M40DCF256A7G 10M40DAF256I7G MAX 10 FPGA Field-Programmable Gate Array 256-FBGA BGA FineLine BGA logic elements embedded SRAM M9K memory block PLL ADC 12-bit SAR ADC Quartus Prime Nios II RoHS REACH AEC-Q100 LVDS DDR3 industrial temperature grade non-volatile configuration instant-on
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