10M25DCF256C7G - MAX 10 FPGA, 25K LE, 256-BGA | Intel / Altera
부품 번호: 10M25DCF256C7G ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.65 | $346.50 |
| 100 | $29.2 | $2,920.00 |
| 500 | $25.4 | $12,700.00 |
| 1,000 | $22.1 | $22,100.00 |
| 3,000 | $18.75 | $56,250.00 |
10M25DCF256C7G 개요
A Field-Programmable Gate Array (FPGA) is a class of programmable logic device (PLD) that allows hardware designers to configure digital logic, embedded multipliers, memory blocks, and high-speed I/O after manufacturing. MAX 10 sits within Intel's broader programmable logic hierarchy as a low-power, small-form-factor family optimized for bridging, I/O expansion, motor control, and industrial control applications. As a member of the FPGA & CPLD product category, it occupies the low-density end of Intel's FPGA portfolio, alongside the higher-density Cyclone and high-performance Stratix families.
Key features of the 10M25DCF256C7G include up to 25000 logic elements (LEs), 178 (18x18) hardware multipliers for DSP operations, 2,112 Kbits of embedded SRAM, 25 Kbytes of user flash memory, and an integrated 12-bit ADC. The 256-FBGA package exposes 178 user I/O pins, supporting LVDS, LVCMOS, SSTL, and other single-ended and differential I/O standards. The device operates from a 1.2V core supply with support for 3.3V/2.5V LVCMOS I/O banks, making it suitable for mixed-voltage bridging scenarios.
Architecturally, MAX 10 devices combine a lookup-table (LUT)-based logic fabric with embedded flash for instant-on behavior, eliminating the external boot PROM required by SRAM-based FPGAs. The dual-configuration flash subsystem enables field upgrades and A/B fallback configurations, while the embedded ADC and temperature-sensing diode support industrial monitoring functions without external analog components.
Typical applications include industrial motor control (CNC, robotics, drives), factory automation and PLC I/O expansion, video bridging and image-sensor interfaces, automotive driver-assistance subsystems, low-density communications backplanes, and portable instrumentation. The 25K LE density positions this device for moderate-complexity glue logic, protocol bridging (I2C/SPI to parallel buses), and small DSP functions.
When designing with the 10M25DCF256C7G, note that the 256-FBGA package is 17x17 mm with a 1.0 mm ball pitch; PCB layout requires high-density interconnect (HDI) stack-ups with laser-drilled microvias. Quartus Prime Prime Lite or Standard edition is required for design entry, synthesis, place-and-route, and programming. The 'C' speed grade and '7G' suffix indicate commercial temperature range (0C to +85C) with lead-free / RoHS-compliant lead finish.
This product page consolidates distributor stock and pricing, parametric comparison with same-package alternatives in the MAX 10 family, and PCB/thermal design notes that are not covered in the manufacturer's datasheet alone.
드롭인 대체품: 10M25DCF256C7G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10M25DCF256C7G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Embedded Memory, Operating Temperature, Integrated ADC.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10M25DAF256C7G
✅ 드롭인✓ 재고 있음
$38.75 / 개
데이터시트 보기 →10M25DAF256C8G
✅ 드롭인✓ 재고 있음
$45.3 / 개
데이터시트 보기 →10M25DAF256I7G
✅ 드롭인✓ 재고 있음
$60.3 / 개
데이터시트 보기 →10M16DCF256C7G
✅ 드롭인✓ 재고 있음
$11.75 / 개
데이터시트 보기 →10M16DAF256C7G
✅ 드롭인✓ 재고 있음
$13.8 / 개
데이터시트 보기 →10M25DCF256C7G 최대 정격 & 전기적 특성
| Series | MAX 10 |
| Family | MAX 10 (non-volatile FPGA) |
| Manufacturer | Intel (formerly Altera) |
| Process Technology | 55 nm TSMC embedded flash |
| Logic Elements (LE) | 25,000 |
| Embedded Memory | 691,200 bits (1,728 Kbits M9K / 86 M144K blocks) |
| Embedded Multipliers (18x18) | 178 |
| User Flash Memory | 25 Kbytes |
| User I/O Pins | 178 |
| 패키지 | 256-ball FBGA, 17x17 mm, 1.0 mm pitch |
| 동작 온도 | 0C to +85C (Commercial) |
| Speed Grade | C7 |
| Core Voltage | 1.2 V |
| I/O Standard Support | LVCMOS, LVTTL, LVDS, SSTL, PCI, HSTL |
| Integrated ADC | 12-bit SAR ADC (1 Msps) |
| Configuration Method | On-die flash, dual-configuration support |
| RoHS / Lead-Free | Yes (lead-free finish, per '7G' suffix) |
| 실장 유형 | Surface Mount (BGA) |
10M25DCF256C7G 256-ball fbga, 17x17 mm, 1.0 mm pitch 핀 구성 가이드
10M25DCF256C7G(256-ball fbga, 17x17 mm, 1.0 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10M25DCF256C7G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10M25DCF256C7G 적합 용도: 6 애플리케이션s: Industrial Motor Control, Factory Automation PLC I/O Expansion, Video Bridging and Image-Sensor Interfaces, Automotive Driver-Assistance Subsystems, Low-Density Communications Backplanes, Portable Test and Measurement Instrumentation.
Industrial Motor Control
The 10M25DCF256C7G is well-suited for industrial motor control because it combines 25K logic elements with 178 (18x18) hardware multipliers, enough to implement field-oriented control (FOC) loops for PMSM and AC induction motors. The integrated 12-bit SAR ADC digitizes current-sense amplifier outputs at 1 Msps, eliminating an external ADC for three-phase current sampling. MAX 10's 256-FBGA variant exposes 178 user I/O pins, enabling direct interfacing to opto-isolated gate drivers, incremental encoders (QEP), Hall sensors, and RS-485/RS-232 service ports without external muxing. The on-die flash supports instant-on field upgrades of motor-control firmware, critical for production-line servicing.
추천
Factory Automation PLC I/O Expansion
In PLC and distributed-I/O subsystems, the 10M25DCF256C7G provides 178 user I/O pins across its 256-FBGA package, enough to fan out 32-64 isolated digital I/O channels with PWM and counter functions. The MAX 10 instant-on behavior (sub-10 ms configuration from on-die flash) ensures deterministic boot for fail-safe I/O startup, a requirement in IEC 61131-3 PLC architectures. Dual-configuration flash allows A/B firmware fallback for safe field upgrades. The 1.2V core with 3.3V LVCMOS I/O bank compatibility supports direct interfacing to 24V-tolerant opto-isolators with simple resistive dividers.
추천
Video Bridging and Image-Sensor Interfaces
The 10M25DCF256C7G's LVDS I/O support and 178 user I/O count make it suitable as a bridge between CMOS image sensors, MIPI-CSI receivers, parallel RGB displays, and HDMI/DVI transmitters. 178 (18x18) multipliers enable real-time image scaling, color-space conversion (YUV to RGB), and simple edge-detection preprocessing at low frame rates. The MAX 10 256-FBGA variant's 1.0 mm ball pitch and 17x17 mm footprint fit compact vision modules used in machine-vision cameras and entry-level industrial inspection.
추천
Automotive Driver-Assistance Subsystems
For entry-level ADAS functions such as rear-view camera processing, ultrasonic-sensor fusion, and LED-headlight matrix control, the 10M25DCF256C7G provides the logic density, multiplier count, and I/O bandwidth required. The 25K LEs and 178 (18x18) multipliers can implement simple computer-vision kernels (Sobel, Canny edges) at VGA resolution. However, for AEC-Q100 qualified operation, engineers should select the industrial-grade 10M25DAF256I7G instead, which extends the temperature range to -40C to +100C junction. The MAX 10 dual-configuration flash supports fail-safe OTA firmware updates.
추천
Low-Density Communications Backplanes
In telecom and industrial backplanes, the 10M25DCF256C7G serves as a low-latency glue-logic device, implementing protocol bridging between I2C/SPI/UART management buses and parallel FPGA or ASIC interfaces. 25K LEs accommodate simple state machines, packet buffers in distributed RAM, and clock-domain-crossing FIFOs. The 256-FBGA variant's 178 user I/O count allows direct connection to backplane connectors with multiple parallel data buses, LVDS SERDES lanes, and clock distribution networks without external bus switches.
추천
Portable Test and Measurement Instrumentation
Portable T&M instruments benefit from the 10M25DCF256C7G's combination of low static power (compared to SRAM-based FPGAs without a boot PROM) and integrated ADC for direct sensor signal conditioning. The MAX 10 instant-on flash configuration reduces bill-of-materials by eliminating external SPI boot PROMs, reducing PCB area in handheld oscilloscopes, data loggers, and field multimeters. 25K LEs and 178 (18x18) multipliers can implement FIR filters, FFT engines, and statistical signal processing for measurement front-ends. The 256-FBGA package suits multi-layer portable instrument PCBs.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10M25DCF256C7G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10M25DAF256C7G | 10M25DAF256C8G | 10M25DAF256I7G | 10M16DCF256C7G | 10M16DAF256C7G |
|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 256-ball FBGA (17x17 mm, 1.0 mm pitch) | 256-ball FBGA (17x17 mm, 1.0 mm pitch) - same | 256-ball FBGA (17x17 mm, 1.0 mm pitch) - same | 256-ball FBGA (17x17 mm, 1.0 mm pitch) - same | 256-ball FBGA (17x17 mm, 1.0 mm pitch) - same | 256-ball FBGA (17x17 mm, 1.0 mm pitch) - same |
| Logic Elements | 25,000 | 25,000 | 25,000 | 25,000 | 16,000 (-36%) | 16,000 (-36%) |
| (18x18) Multipliers | 178 | 178 | 178 | 178 | 45 (-75%) | 45 (-75%) |
| Embedded Memory (bits) | 691,200 | 691,200 | 691,200 | 691,200 | 270,000 (-61%) | 270,000 (-61%) |
| Speed Grade | C7 (commercial) | C7 | C8 (faster) | I7 (industrial) | C7 | C7 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | -40C to +100C (industrial) | 0C to +85C | 0C to +85C |
| Integrated ADC | 12-bit SAR, 1 Msps | 12-bit SAR, 1 Msps | 12-bit SAR, 1 Msps | 12-bit SAR, 1 Msps | 12-bit SAR, 1 Msps | 12-bit SAR, 1 Msps |
주요 차별점
- Higher logic capacity than 10M16 256-FBGA variants (vs 10M16DCF256C7G)
- Commercial temperature grade optimization (vs 10M25DAF256I7G)
- C7 speed grade for typical timing closure (vs 10M25DAF256C8G)
설계 노트
Estimated: the 256-ball FBGA package is 17x17 mm with a 1.0 mm ball pitch; PCB design requires an HDI stack-up with laser-drilled microvias. Use a 4-1-4 (4-layer top/bottom, 1 core) or 6-layer stack-up with 1 oz copper. Place 0.1uF decoupling capacitors on every VCCIO/VCC/VCCA pin, plus bulk 10uF capacitors on each power rail within 5 mm of the BGA. Matched-length routing is required for LVDS pairs; reference Intel AN 532 for MAX 10 PCB layout guidelines.
Estimated: MAX 10 devices in the 256-FBGA package typically dissipate 1-3 W in typical industrial control applications. Theta-JA for this package is approximately 15 C/W on a JEDEC 4-layer test board. Continuous operation at industrial temperatures (-40C to +100C junction) requires the 'I' suffix variant (e.g., 10M25DAF256I7G); commercial 'C' grade parts are rated to 0C-85C ambient only.
Do not confuse the 10M25DCF256C7G with the 10M25DAF256C7G without consulting the MAX 10 ordering code PDF - the DC vs DA suffix difference is feature-related (configuration flash, ADC channel count, and PLL availability vary). Always run Quartus Prime fitter pre-checks to verify pinout compatibility. The 'G' suffix indicates lead-free finish; pre-'G' parts are Pb-bearing and not RoHS-compliant.
규정 준수 정보
The '7G' suffix per Intel MAX 10 ordering guide indicates lead-free / RoHS-compliant finish. Commercial 'C' temperature grade; industrial 'I' grade parts (e.g., 10M25DAF256I7G) required for -40C operation. AEC-Q100 qualification is not applicable for non-automotive-grade ordering codes; check with Intel for AEC-Q100 status if needed.
