5CSEBA6U19C6N - Cyclone V SE SoC FPGA 110K LE Dual A9 | Altera
부품 번호: 5CSEBA6U19C6N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $258.9 | $258.90 |
| 10 | $245.95 | $2,459.50 |
| 100 | $226.55 | $22,655.00 |
| 500 | $210.4 | $105,200.00 |
| 1,000 | $194.15 | $194,150.00 |
5CSEBA6U19C6N 개요
A Cyclone V SE SoC FPGA is a heterogeneous compute device that combines an ARM Cortex-A9 application processor subsystem with a low-power FPGA fabric on a single die, enabling designers to partition deterministic control, data-path, and interface logic between hardware-accelerated FPGA logic and software running on a Linux or RTOS host. SoC FPGAs sit between pure ASICs and standalone FPGAs in the system-hierarchy and are widely used in industrial vision, motor control, and protocol bridging where both software flexibility and hardware determinism are required.
The 5CSEBA6U19C6N features approximately 110K Logic Elements, embedded M10K memory blocks, variable-precision DSP blocks, integrated PCIe Gen2 hard IP, multi-port memory controllers, and a rich set of user I/O supporting LVDS, LVCMOS, SSTL, and HSTL standards. The HPS block provides dual 800 MHz Cortex-A9 cores, NEON media engine, L1/L2 cache, ARM Mali-400 class GPU option on certain variants, and a coherent interconnect to the FPGA fabric via AXI bridges.
The device is built on TSMC's 28 nm low-power process technology and uses a 925 MHz HPS frequency and -6 industrial speed grade. The 484-pin UBGА (UBGA-484, 19x19 mm) package provides the necessary signal integrity and thermal dissipation for the integrated HPS plus fabric, with a thermal resistance suitable for forced-air or conduction-cooled industrial enclosures.
Typical applications include industrial machine vision and smart cameras, motor control and servo drives, programmable logic controllers (PLCs), industrial Ethernet protocol bridging (EtherCAT, PROFINET, EtherNet/IP), and test & measurement equipment. The combination of ARM Cortex-A9 processing and FPGA acceleration allows real-time analytics, sensor fusion, and high-speed I/O expansion in a single chip.
When designing with this SoC FPGA, ensure that the HPS boot configuration (NAND, QSPI, SD/MMC, eMMC) is selected correctly for the application, that DDR3 memory layout matches the HPS memory controller requirements, and that proper thermal management is implemented to keep junction temperature below 100 C under worst-case workloads. Designers should also plan for board support package (BSP) generation using Altera/Intel SoC EDS and pin-mux assignment via Quartus Prime.
This page synthesizes distributor pricing, drop-in same-family Cyclone V SE alternatives, and practical design notes not found in the manufacturer datasheet alone, giving engineers a single reference for sourcing, replacement, and application guidance.
드롭인 대체품: 5CSEBA6U19C6N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 5CSEBA6U19C6N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Logic Elements, DSP Blocks, Family, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
5CSEBA6U19A7N
✅ 드롭인✓ 재고 있음
$198.4 / 개
데이터시트 보기 →5CSEBA6U19C7N
✅ 드롭인✓ 재고 있음
$155.29 / 개
데이터시트 보기 →5CSEBA6U19I7N
✅ 드롭인✓ 재고 있음
$142.75 / 개
데이터시트 보기 →5CSEBA5U19C6N
✅ 드롭인✓ 재고 있음
$118.2 / 개
데이터시트 보기 →5CSEBA4U19C6N
✅ 드롭인✓ 재고 있음
$74.5 / 개
데이터시트 보기 →5CSEBA2U19C6N
✅ 드롭인✓ 재고 있음
$74.6 / 개
데이터시트 보기 →5CSEBA6U19C6N 최대 정격 & 전기적 특성
| Manufacturer | Altera (Intel) |
| Series | Cyclone V SE SoC FPGA |
| Device Variant | 5CSEA6 (U19 package) |
| Logic Elements | 110K |
| HPS Architecture | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Frequency | 925 MHz |
| FPGA Speed Grade | -6 (industrial) |
| 패키지 | 484-UBGA (UBGА, 19x19 mm) |
| 핀 수 | 484 |
| Process Technology | TSMC 28 nm low-power |
| User I/O | 66 (per Heisener) / configurable LVDS/LVCMOS |
| Hard IP Blocks | PCIe Gen2, multi-port memory controller, ARM Cortex-A9 HPS |
| DSP Blocks | Variable-precision DSP |
| Memory | Embedded M10K blocks |
| 동작 온도 | -40C to +100C (industrial) |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant (per Altera/Intel product page) |
| MSL 레벨 | 3 (per BGA package) |
5CSEBA6U19C6N 484-ubga (ubgА, 19x19 mm) 핀 구성 가이드
5CSEBA6U19C6N(484-ubga (ubgА, 19x19 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 5CSEBA6U19C6N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
5CSEBA6U19C6N 적합 용도: 6 애플리케이션s: Industrial Machine Vision and Smart Cameras, Motor Control and Servo Drives, Programmable Logic Controllers (PLC) and Industrial I/O, Industrial Ethernet Protocol Bridging, Test and Measurement Equipment, Aerospace and Defense Avionics Subsystems.
Industrial Machine Vision and Smart Cameras
The 5CSEBA6U19C6N's Dual ARM Cortex-A9 HPS at 925 MHz runs the Linux vision stack (OpenCV, GigE Vision stack) while its 110K logic elements process Bayer-to-RGB conversion, convolution filters, and edge detection on variable-precision DSP blocks at deterministic throughput. The 484-UBGA package exposes sufficient LVDS pairs to interface directly with MIPI/Sub-LVDS/parallel image sensors without an external bridge ASIC. Estimated: at a typical 30 fps 1080p pipeline, fabric utilization stays around 50-65%, leaving headroom for analytics acceleration.
추천
Motor Control and Servo Drives
The 5CSEBA6U19C6N integrates the HPS for motion-control loop closure (FOC, PI, S-curve profiling) and the FPGA fabric for sub-microsecond current/voltage loop execution in hardware, outperforming pure MCU solutions. Per Cyclone V SE datasheet, the device's PWM generation, quadrature encoder decode, and resolver interface fit comfortably in 110K logic elements, with remaining logic available for EtherCAT slave IP. Estimated: a 4-axis servo using 32 kHz current loop runs at <2% fabric utilization.
추천
Programmable Logic Controllers (PLC) and Industrial I/O
The 5CSEBA6U19C6N serves as the central SoC in industrial PLCs, where the ARM Cortex-A9 host runs a PLC runtime (CODESYS, Beremiz) and the FPGA fabric handles high-speed digital I/O counting, pulse-train generation, and fieldbus protocol offload. According to Altera's industrial reference designs, the HPS Ethernet MAC plus FPGA-based EtherCAT slave IP fits in <30K logic elements, leaving 80K+ for application logic. The 484-UBGA package provides 66+ user I/O supporting isolated 24V industrial signaling.
추천
Industrial Ethernet Protocol Bridging
The 5CSEBA6U19C6N bridges between EtherCAT, PROFINET, EtherNet/IP, and Modbus TCP with simultaneous hardware-assisted protocol stacks running in FPGA logic (cut-through forwarding, distributed-clock processing) and the ARM cores managing diagnostics. Per Cyclone V SE datasheet, two soft 10/100/1000 Ethernet MACs are easily implemented in the fabric, and the HPS supplies two additional Gigabit Ethernet MACs natively. Estimated: a 4-port industrial switch fabric fits in ~40K logic elements.
추천
Test and Measurement Equipment
The 5CSEBA6U19C6N's HPS runs the test UI and statistical analysis in Linux while the FPGA fabric performs high-speed ADC/DAC interfacing, real-time DSP (FFT, FIR filtering), and trigger logic at deterministic latency. Per Altera reference designs, the HPS Gigabit Ethernet MAC streams post-processed data to the host at line rate. The 484-UBGA package supports high-speed LVDS for parallel ADC interface, and the PCIe Gen2 hard IP in the FPGA fabric enables streaming data to a host PC at up to 4 GB/s.
추천
Aerospace and Defense Avionics Subsystems
The 5CSEBA6U19C6N serves in DO-254/DO-178 friendly avionics designs where the FPGA fabric implements deterministic I/O and signal conditioning while the ARM Cortex-A9 HPS runs a DAL-C/D real-time OS for display, controls, and network stacks. According to Intel's Cyclone V SoC military-grade literature, the device's -40C to 100C industrial temperature window supports avionics bay thermal envelopes. The 28 nm low-power process provides SEU/SEL behavior suited for safety-critical designs when paired with mitigation IP.
추천
추천 제품 요약
엔지니어링 참조 데이터: 5CSEBA6U19C6N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 5CSEBA6U19A7N | 5CSEBA6U19C7N | 5CSEBA6U19I7N | 5CSEBA5U19C6N | 5CSEBA4U19C6N | 5CSEBA2U19C6N |
|---|---|---|---|---|---|---|---|
| Package | 484-UBGA (U19, 19x19 mm) | 484-UBGA (U19, 19x19 mm) - same | 484-UBGA (U19, 19x19 mm) - same | 484-UBGA (U19, 19x19 mm) - same | 484-UBGA (U19, 19x19 mm) - same | 484-UBGA (U19, 19x19 mm) - same | 484-UBGA (U19, 19x19 mm) - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 110K | 110K | 110K | 110K | ~85K (-23%) | ~49K (-55%) | ~25K (-77%) |
| Speed Grade | -6 | -7 (faster) | -7 (faster) | -7 (faster) | -6 | -6 | -6 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to 85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) extended | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| HPS Frequency | 925 MHz | 925 MHz | 925 MHz | 925 MHz | 925 MHz | 925 MHz | 925 MHz |
| HPS Architecture | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Lifecycle Status | Active | Active | Active | Active | Active | Active | Active |
주요 차별점
- Highest logic density in the U19 package variant (vs 5CSEBA5U19C6N)
- Same-package upgrade path with -7 speed grade (vs 5CSEBA6U19C7N)
- Full industrial -40C to 100C junction temperature range (vs 5CSEBA6U19A7N)
설계 노트
Estimated: The 5CSEBA6U19C6N in the UBGА-484 (19x19 mm) package has a typical theta_JA in the 8-12 C/W range when mounted on a JEDEC 4-layer PCB with thermal vias. With worst-case industrial junction Tj of 100 C and ambient of 85 C inside an enclosure, allowable power dissipation is ~1.5 W. At full HPS + fabric utilization the device can dissipate 4-6 W, so a heatsink, heat-spreader, or forced-air cooling is required. Place thermal vias under the package center array per Cyclone V hardware design guidelines, and avoid placing the device in still-air corners of the enclosure.
Use a 6+ layer PCB with dedicated power and ground planes for the UBGА-484 package. Estimated: BGA escape routing at 0.8 mm pitch typically requires 4 routing layers with 4 mil trace/space. Place decoupling capacitors (0.1 uF + 1 uF + 10 uF) within 100 mil of every power pin, with the smallest values closest to the balls. Match the HPS DDR3 layout per Intel's EMIF pin assignment and length-matching rules; mismatched HPS memory will cause Linux boot failures that look like software bugs. Include JTAG/AS configuration header per Intel Cyclone V hardware reference.
Do not assume all UBGА-484 Cyclone V SE SoC parts are drop-in across speed grades and temperature ranges - the OPN suffix letters (A/C/I for temperature, 6/7/8 for speed) encode real parametric differences. Quartus Prime Fitter reports will close at different worst-case fMAX for each speed grade. Always re-run Timing Analyzer when substituting a -6 with a -7 or an industrial with a commercial device. Also note that older Altera-format datasheet pinout differs in pin numbering convention from the Intel-format datasheet; verify pin numbers in Quartus Pin Planner before finalizing schematic.
규정 준수 정보
RoHS compliance per Altera/Intel product page. AEC-Q100 not applicable for industrial FPGA - part targets industrial automation, not automotive-qualified designs. REACH, halogen-free, and conflict-mineral data not in the provided sources.
