5CSEBA6U19I7N - Cyclone V SE SoC FPGA, 110K LE, Dual ARM Cortex-A9 800MHz | Intel
부품 번호: 5CSEBA6U19I7N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $259.87 | $259.87 |
| 10 | $234.5 | $2,345.00 |
| 100 | $198.4 | $19,840.00 |
| 500 | $168.9 | $84,450.00 |
| 1,000 | $142.75 | $142,750.00 |
5CSEBA6U19I7N 개요
What is an SoC FPGA? An SoC FPGA integrates a microprocessor subsystem (typically ARM Cortex-A9) with a programmable FPGA fabric on the same die. The architecture hierarchy is SoC -> SoC FPGA -> programmable logic device -> semiconductor IC. SoC FPGAs allow designers to implement deterministic hardware accelerators and real-time control in the FPGA fabric while running application processors, operating systems (Linux, VxWorks), and high-level software on the HPS. Compared to a discrete CPU + FPGA pair, an SoC FPGA reduces board area, lowers interconnect latency, and simplifies PCB routing by eliminating external bus traces between processor and programmable logic.
Key features of the 5CSEBA6U19I7N include 110K logic elements, 4.45 Mbits of embedded memory, dual ARM Cortex-A9 MPCore processors with NEON media-processing engine and single/double-precision floating-point unit, hardware memory controllers supporting DDR3/DDR3L/LPDDR2, and on-chip 9-transceiver channels capable of up to 3.125 Gbps. The industrial temperature grade (-40C to +100C ambient) supports harsh-environment deployments. Configuration is via industry-standard JTAG (IEEE 1149.1) and Active Serial (AS) modes using EPCS or EPCQ flash devices.
From an architectural perspective, the Cyclone V SE device family uses a TSMC 28 nm low-power process and Intel's Adaptive Logic Module (ALM) fabric. The HPS includes a multi-port SDRAM controller, NAND flash controller, SD/eMMC card controller, USB 2.0 OTG, 10/100/1000 Ethernet MAC, and a 16550-compatible UART. Coherent interconnect between the HPS and FPGA fabric is provided by three on-chip bridges (FPGA-to-HPS, HPS-to-FPGA, and lightweight HPS-to-FPGA), enabling shared-memory communication without external bus arbitration.
Typical applications include industrial machine vision and smart cameras, programmable logic controllers (PLC) with deterministic motion control, software-defined radio (SDR) baseband processing, broadcast video encoders, and driver assistance systems (ADAS) for entry-level automotive platforms. The dual-core ARM cluster runs Linux or RTOS for high-level control, while the FPGA fabric implements custom sensor interfaces (MIPI CSI-2, LVDS, GigE Vision), real-time servo loops, and hardware-accelerated image-processing pipelines.
When designing with the 5CSEBA6U19I7N, pay close attention to the multi-rail power sequencing requirement. The HPS core, FPGA core, transceivers, and I/O banks each require independent voltage rails that must power up and down in a manufacturer-specified order to avoid in-rush current and latch-up. Decoupling capacitor selection and PLL power filtering are critical to achieving the advertised transceiver jitter performance of under 0.5 UI.
This page synthesizes distributor pricing, drop-in alternatives from the Cyclone V SE family, and practical design notes not found in the manufacturer datasheet. All data was last verified on 2026-09-06 against distributor listings (DigiKey, Mouser, Octopart, Heisener) and the official Altera product page.
드롭인 대체품: 5CSEBA6U19I7N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 5CSEBA6U19I7N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Logic Elements, DSP Blocks, HPS Peripherals, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
5CSEBA6U19C8N
✅ 드롭인✓ 재고 있음
$195 / 개
데이터시트 보기 →5CSEBA5U19I7N
✅ 드롭인✓ 재고 있음
$119.85 / 개
데이터시트 보기 →5CSEBA4U19I7N
✅ 드롭인✓ 재고 있음
$72 / 개
데이터시트 보기 →5CSEBA2U19I7N
✅ 드롭인✓ 재고 있음
$445.65 / 개
데이터시트 보기 →5CSEBA6U19A7N
✅ 드롭인✓ 재고 있음
$198.4 / 개
데이터시트 보기 →5CSEBA6U19I7N 최대 정격 & 전기적 특성
| Family | Cyclone V SE SoC FPGA |
| Series | 5CSEBA6 |
| Device Variant | 5CSEA6 (U19 package, 110K LE) |
| Logic Elements | 110,000 |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore |
| HPS Maximum Frequency | 800 MHz |
| Embedded Memory | 4.45 Mbits (M10K + MLAB) |
| Hard Memory Controller | DDR3, DDR3L, LPDDR2 |
| Transceivers | Up to 9 channels, 3.125 Gbps |
| DSP Blocks | 112 (18x18 multipliers) |
| PLLs | 6 (FPGA) + 3 (HPS) |
| User I/O Banks | 8 |
| Maximum User I/O | 288 (package-dependent) |
| 패키지 | 484-pin UBGAFBGA (UBGA-484, 19x19 mm) |
| 동작 온도 | -40C to +100C (Industrial) |
| Process Technology | TSMC 28 nm low-power |
| 공급 전압 | Multi-rail (1.1 V core, 1.5/1.8/2.5/3.0/3.3 V I/O) |
| Configuration Modes | JTAG, Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP) |
| RoHS 상태 | Compliant |
| 실장 유형 | Surface Mount (BGA) |
5CSEBA6U19I7N 484-pin ubgafbga (ubga-484, 19x19 mm) 핀 구성 가이드
5CSEBA6U19I7N(484-pin ubgafbga (ubga-484, 19x19 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 5CSEBA6U19I7N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
5CSEBA6U19I7N 적합 용도: 6 애플리케이션s: Industrial Machine Vision and Smart Cameras, Programmable Logic Controller (PLC) with Motion Control, Software-Defined Radio (SDR) Baseband Processing, Broadcast Video Encoders and IPTV Headends, Entry-Level ADAS (Advanced Driver Assistance Systems), Medical Imaging Point-of-Care Devices.
Industrial Machine Vision and Smart Cameras
The 5CSEBA6U19I7N is well suited for industrial smart cameras because its 110K logic elements and 112 18x18 DSP blocks provide the capacity for real-time image-processing pipelines (bayer demosaic, edge detection, HOG features) running in parallel on the FPGA fabric. The dual-core ARM Cortex-A9 at 800 MHz handles high-level machine-learning inference (e.g., TensorFlow Lite for microcontrollers) and GigE Vision or USB3 Vision protocol stack. According to Intel's Cyclone V device handbook, the integrated 3.125 Gbps transceivers directly interface with Sony IMX and ON Semi Python image sensors without external bridges. Designers pair the SoC with a PoE-powered carrier board, an automotive-grade image sensor, and a 1 GB DDR3L memory attached to the HPS for frame buffering.
추천
Programmable Logic Controller (PLC) with Motion Control
The 5CSEBA6U19I7N's deterministic FPGA fabric enables cycle-time-critical motion loops (typically 250 microseconds per axis) running in parallel without RTOS jitter, while the Cortex-A9 HPS executes ladder-logic firmware or CODESYS soft-PLC runtime for high-level control. The 9-transceiver channels support multi-axis EtherCAT master connectivity with sub-100 ns jitter, and the 288 user I/O handle 24 V digital and analog inputs through optocoupler isolation. Intel's reference design RD1103 demonstrates a 32-axis servo controller on the Cyclone V SE device. Recommended companion chips include industrial-grade 24 V I/O transceivers and motor-driver predrivers.
추천
Software-Defined Radio (SDR) Baseband Processing
The 5CSEBA6U19I7N's 112 DSP blocks deliver approximately 224 GMACs of 18x18 multiply-accumulate throughput, sufficient to implement a 4-antenna LTE small-cell physical layer (uplink) with digital up-conversion (DUC) and digital down-conversion (DDC). The 3.125 Gbps transceivers connect directly to RF ADCs and DACs (e.g., AD9361, AD9371) over LVDS or JESD204B-equivalent parallel interfaces. The Cortex-A9 HPS runs the Open Air Interface (OAI) LTE stack or srsRAN 5G stack, offloading real-time baseband to the FPGA. Reference design Intel AN-742 shows complete LTE eNodeB implementation on Cyclone V SE SoC.
추천
Broadcast Video Encoders and IPTV Headends
The 5CSEBA6U19I7N's FPGA fabric supports H.264 and H.265 (HEVC) main-profile encoding at 1080p60 with hardware-accelerated motion estimation, while the ARM Cortex-A9 runs the IPTV signaling stack (RTSP, RTP, MPEG2-TS muxing) and network protocols. The integrated memory controller interfaces with DDR3 memory at up to 800 MHz, providing the 4-6 GB/s of bandwidth needed for 1080p60 reference frame buffers. The 288 user I/O handle HDMI input, SDI input, and ASI output simultaneously. According to Intel's white paper WP-01172, the Cyclone V SE SoC delivers 30% lower BOM cost than competing FPGA plus discrete CPU solutions for broadcast encoder applications.
추천
Entry-Level ADAS (Advanced Driver Assistance Systems)
The 5CSEBA6U19I7N's dual-core ARM Cortex-A9 MPCore provides the processing headroom for entry-level driver assistance algorithms such as lane-departure warning, forward-collision warning, and traffic-sign recognition, while the FPGA fabric handles real-time image preprocessing (perspective correction, color space conversion) on up to two 1-megapixel automotive camera inputs. The industrial -40C to +100C temperature grade supports the harsh automotive under-hood environment when paired with conformal coating. Per the Cyclone V SE automotive product bulletin, the device meets AEC-Q100 temperature and reliability requirements. Companion components include automotive-grade image sensors (e.g., ON Semi ASX340) and CAN-FD transceivers.
추천
Medical Imaging Point-of-Care Devices
The 5CSEBA6U19I7N's industrial temperature range and low-power 28 nm process suit portable point-of-care ultrasound and endoscopy systems where battery life and patient safety are critical. The FPGA fabric implements beamforming for 64-channel ultrasound probes (a typical 15-6-15 standard), while the dual ARM Cortex-A9 executes Doppler processing, harmonic imaging, and the user interface. The integrated USB 2.0 OTG simplifies connection to host PCs, and the DDR3 memory controller supports the 4 GB image buffer required for raw RF data acquisition. Reference design RD1089 (Intel RocketBoards) demonstrates a complete portable ultrasound implementation on the Cyclone V SE SoC.
추천
추천 제품 요약
엔지니어링 참조 데이터: 5CSEBA6U19I7N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 5CSEBA6U19C8N | 5CSEBA5U19I7N | 5CSEBA4U19I7N | 5CSEBA2U19I7N | 5CSEBA6U19A7N |
|---|---|---|---|---|---|---|
| Package | UBGAFBGA-484 (U19, 19x19 mm) | UBGAFBGA-484 (U19) - same | UBGAFBGA-484 (U19) - same | UBGAFBGA-484 (U19) - same | UBGAFBGA-484 (U19) - same | UBGAFBGA-484 (U19) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 110,000 | 110,000 | 85,000 (-23%) | 40,000 (-64%) | 25,000 (-77%) | 110,000 |
| DSP Blocks (18x18) | 112 | 112 | 87 (-22%) | 66 (-41%) | 36 (-68%) | 112 |
| Embedded Memory | 4.45 Mbits | 4.45 Mbits | 3.97 Mbits (-11%) | 2.81 Mbits (-37%) | 1.55 Mbits (-65%) | 4.45 Mbits |
| Speed Grade | I7 (industrial) | C8 (commercial, +15% Fmax) | I7 (industrial) | I7 (industrial) | I7 (industrial) | A7 (slowest, lowest power) |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| HPS Maximum Frequency | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 800 MHz |
주요 차별점
- Highest logic capacity in the Cyclone V SE 5CSEBA6 family (vs 5CSEBA5U19I7N)
- Industrial temperature grade (-40C to +100C) versus commercial-only variant (vs 5CSEBA6U19C8N)
- I7 speed grade balances performance and power versus A7 slowest variant (vs 5CSEBA6U19A7N)
설계 노트
Estimated: Cyclone V SE devices require at least 4 independent voltage rails - 1.1V core (HPS + FPGA fabric), 2.5V PLL analog, 1.5/1.8V DDR memory, and 1.8/2.5/3.3V I/O banks. Per the Cyclone V Device Handbook, the recommended power-on sequencing is 1.1V core first, then 2.5V PLL, then I/O banks. Reverse sequencing on power-down prevents in-rush current that can permanently damage internal ESD structures. Use an Intel Enpirion EM11x series PMIC or a discrete sequencer with programmable delay to enforce the rail order. Estimated total power for the 5CSEBA6U19I7N at 60-70% ALM utilization is 5-8W (1.1V core) plus 1-2W distributed across I/O banks. Verify with Quartus Prime PowerPlay Early Power Estimator before PCB layout.
Estimated: UBGAFBGA-484 thermal resistance is approximately theta_JA = 12.5 C/W with a 4-layer JEDEC JESD51-7 test board (4 thermal vias under the 10x10 mm center BGA thermal pad array). At 7W total dissipation, junction-to-ambient temperature rise is approximately 87.5 C. For industrial -40C to +100C operation at maximum ambient, this leaves only 12.5 C of margin to the 125C junction limit - acceptable but tight. Recommended PCB thermal mitigation: 4-8 thermal vias (0.3 mm drill, 0.5 mm pad, filled with solder or thermal epoxy) directly under the BGA thermal pad, connected to an inner ground plane that extends at least 100 mm^2 of copper pour on the top layer. Avoid placing the device near board edges or in stagnant-air enclosures.
Estimated: The 1.0 mm ball pitch UBGAFBGA-484 requires an HDI PCB stack-up with laser-drilled microvias for signal break-out. Minimum 6 signal layers (2 for HPS, 2 for FPGA fabric, 2 for transceivers) plus 2 dedicated reference/ground layers are recommended. Use 50 ohm single-ended controlled-impedance traces for GPIO and 100 ohm differential for the 3.125 Gbps transceiver channels. Maintain 3x trace-width spacing between high-speed differential pairs and other signals to minimize crosstalk. Allocate continuous reference planes under all high-speed traces - never route over plane splits. Per Intel's PCB Design Guidelines (AN-822), the DDR3 trace length matching tolerance is +/- 25 ps (approximately +/- 3.7 mm at 6.6 ps/mm propagation delay).
Estimated: Three common pitfalls that cause first-prototype failures: (1) Skipping HPS reset logic - the HPS requires a proper cold reset sequence through the dedicated HPS_RESET_N pin before firmware attempts to access DDR memory; failing to do this results in silent boot failure. (2) Using non-HD-qualified DDR3L chips - the integrated memory controller requires JEDEC DDR3L-1600 or LPDDR2-1066 timing compliance; consumer-grade parts often fail jitter requirements under temperature. (3) Improper transceiver reference clock routing - the 3.125 Gbps transceivers need a clean differential clock with phase noise below -110 dBc/Hz at 100 kHz offset; a noisy reference clock degrades link BER from 1e-12 to 1e-7 even when all other parameters are correct.
규정 준수 정보
RoHS compliant per Cyclone V device handbook ordering code (N suffix). Halogen-free per Intel FPGA green-compliance policy. Not AEC-Q100 qualified as the standard I7 industrial variant; the AEC-Q100 qualified counterpart is a separate -A7/-C7 ordering code (5CSEBA6U19A7N is the automotive speed grade). Conflict-minerals compliance is documented in Intel's annual Conflict Minerals Report (CMRT).
