5CSEBA4U19C6N - Cyclone V SE SoC FPGA, 40K LE, Dual ARM Cortex-A9 | Intel
부품 번호: 5CSEBA4U19C6N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $126.94 | $126.94 |
| 10 | $115.5 | $1,155.00 |
| 100 | $95.2 | $9,520.00 |
| 500 | $82.1 | $41,050.00 |
| 1,000 | $74.5 | $74,500.00 |
5CSEBA4U19C6N 개요
A System-on-Chip FPGA (SoC FPGA) is an integrated circuit that combines a programmable logic fabric with one or more hard processor cores on the same die. Within the broader taxonomy, SoC FPGAs sit between application processors (CPU-centric) and traditional FPGAs (logic-centric), occupying the hybrid computing niche that demands both deterministic hardware parallelism and software flexibility. Cyclone V SE SoC FPGAs specifically target low-power, cost-sensitive embedded applications where designers want to offload deterministic processing to FPGA fabric while running an OS (typically Linux) on the Cortex-A9 cores.
Key features of the 5CSEBA4U19C6N include approximately 40K logic elements, embedded 18x18 multipliers, M10K memory blocks, a hard memory controller supporting DDR2/DDR3/LPDDR2, and dual ARM Cortex-A9 MPCore CPUs with CoreSight debug and trace. The 'SE' (System Enhanced) suffix in the Cyclone V family indicates the presence of the HPS plus integrated transceivers, distinguishing it from the 'SX' (no HPS) and 'ST' (HPS with transceivers) variants.
The architecture combines a programmable logic fabric manufactured on a low-power 28 nm process with dedicated ARM Cortex-A9 cores, NEON media engines, single/double-precision floating-point units, and a rich set of peripherals (USB, gigabit Ethernet, SD/MMC, UART, SPI, I2C) inside the HPS. This integration reduces bill-of-material cost and board area versus a two-chip solution that pairs a standalone FPGA with a discrete processor.
Typical applications include industrial motor control, factory automation controllers, video surveillance and image processing pipelines, software-defined radio base stations, automotive driver assistance (ADAS) sensor fusion, medical imaging, and embedded vision systems. The 484-UBGA package supports high-I/O designs needing up to 161 FPGA user I/O plus dedicated HPS peripheral pins.
Design consideration: when designing with the 5CSEBA4U19C6N, allocate HPS clock, peripheral, and FPGA-HPS bridge pins according to the device-specific pinout file. Use Intel Quartus Prime with the Cyclone V device support to lock pin assignments, and validate timing closure on the FPGA-HPS AXI/AVALON bridges to avoid bandwidth bottlenecks between cores.
This page synthesizes real-time distributor pricing, same-brand drop-in alternatives from the Cyclone V SE family, and practical hardware design notes that go beyond the manufacturer datasheet bullet list.
드롭인 대체품: 5CSEBA4U19C6N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 5CSEBA4U19C6N (동일 폼 팩터 및 풋프린트) — 차이점: Logic Elements, Package, Operating Temperature, DSP Blocks, Embedded Memory.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
5CSEBA4U19A7N
✅ 드롭인✓ 재고 있음
$99.9 / 개
데이터시트 보기 →5CSEBA4U19I7N
✅ 드롭인✓ 재고 있음
$72 / 개
데이터시트 보기 →5CSEBA4U19C7N
✅ 드롭인✓ 재고 있음
$36.92 / 개
데이터시트 보기 →5CSEBA4U19C8N
✅ 드롭인✓ 재고 있음
$54.75 / 개
데이터시트 보기 →5CSEBA2U19C6N
✅ 드롭인✓ 재고 있음
$74.6 / 개
데이터시트 보기 →5CSEBA4U19C6N 최대 정격 & 전기적 특성
| Family | Cyclone V SE SoC FPGA |
| Logic Elements | 40,000 (40K LE) |
| Hard Processor System (HPS) | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| Maximum HPS Clock Frequency | 925 MHz |
| 패키지 | 484-pin UFBGA / UBGA (19x19 mm) |
| FPGA User I/O | 161 (per Altera product page) |
| Process Technology | TSMC 28 nm low-power |
| Memory Controller | Hard controller for DDR2 / DDR3 / LPDDR2 |
| DSP Blocks | Variable-precision DSP blocks (18x18 multipliers) |
| Embedded Memory | M10K memory blocks |
| Encryption Support | AES encryption (per LCSC listing) |
| Error Detection | SEU error detection and correction support |
| 동작 온도 | 0C to +85C (commercial grade) |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
5CSEBA4U19C6N 484-pin ufbga / ubga (19x19 mm) 핀 구성 가이드
5CSEBA4U19C6N(484-pin ufbga / ubga (19x19 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 5CSEBA4U19C6N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
5CSEBA4U19C6N 적합 용도: 7 애플리케이션s: Industrial Motor Control, Video Surveillance and Image Processing, Software Defined Radio (SDR) Base Station, Automotive ADAS Sensor Fusion, Medical Imaging and Diagnostic Equipment, Factory Automation Controller (PLC), Embedded Vision and Machine Learning Inference.
Industrial Motor Control
The 5CSEBA4U19C6N's dual ARM Cortex-A9 HPS running at 925 MHz executes real-time motion-control loops while the 40K LE FPGA fabric handles deterministic PWM generation, encoder decoding, and field-oriented control (FOC) math via 18x18 multipliers. The hard DDR3 controller feeds the HPS with parameter tables for velocity and current profiles; the M10K memory buffers high-speed current-sense samples without CPU intervention. The 484-UBGA 19x19 mm package fits within 50x50 mm drive PCBs and exposes 161 user I/O for multi-axis inverter switching.
추천
Video Surveillance and Image Processing
The 5CSEBA4U19C6N ingests MIPI or parallel camera streams into the FPGA fabric, where variable-precision DSP blocks perform real-time filtering, motion detection, and H.264 pre-processing at full frame rate. The dual ARM Cortex-A9 cores run Linux to handle network streaming (gigabit Ethernet), ONVIF, and analytics such as object detection. The 925 MHz HPS clock plus 40K LE fabric balance pixel pipeline throughput against CPU-side decision latency, and the 484-UBGA package supports high-pin-count parallel sensor interfaces.
추천
Software Defined Radio (SDR) Base Station
The 5CSEBA4U19C6N's integrated transceivers interface directly with ADC/DAC front ends, while the FPGA fabric implements digital up/down-conversion, channelization, and crest-factor reduction. The dual ARM Cortex-A9 cores execute the upper-layer MAC and protocol stack under Linux, with DDR3-backed buffering for sample bursts. The 40K LE fabric is sufficient for 4-channel narrowband SDR; the 161 user I/O plus HPS peripherals (USB, Ethernet, SPI) provide ample connectivity for backhaul and control.
추천
Automotive ADAS Sensor Fusion
The 5CSEBA4U19C6N (commercial grade) serves as a development platform, while the AEC-Q100-qualified 5CSEBA4U19A7N drop-in variant is the production target for ADAS sensor-fusion ECUs. The FPGA fabric fuses radar, camera, and LiDAR pre-processed data using 18x18 multipliers for matrix math, while the HPS runs an AUTOSAR-compatible real-time OS plus perception algorithms. SEU error detection and correction are critical for safety; the 484-UBGA package supports ASIL-B functional-safety architectures.
추천
Medical Imaging and Diagnostic Equipment
The 5CSEBA4U19C6N's FPGA fabric accelerates ultrasound beamforming, CT image reconstruction (filtered back-projection), or MRI pulse-sequence control in real time. The dual ARM Cortex-A9 HPS runs the user interface, DICOM stack, and network connectivity on Linux. The hard DDR3 controller handles large frame buffers; AES encryption protects patient data at rest. The 484-UBGA package with 161 user I/O supports multiple transducer probe connectors and high-speed ADC interfaces.
추천
Factory Automation Controller (PLC)
The 5CSEBA4U19C6N's dual ARM Cortex-A9 cores execute ladder-logic-to-soft-PLC translation and EtherCAT / PROFINET fieldbus stacks, while the 40K LE FPGA fabric implements deterministic I/O scanning, high-speed counters, and PWM outputs at microsecond resolution. The 161 user I/O plus HPS peripherals (USB, gigabit Ethernet, SD/MMC) provide connectivity for HMI panels, sensor networks, and cloud gateways. The 0-85C commercial range suits IP65-sealed control cabinets; pair with 5CSEBA4U19I7N for non-cooled enclosures.
추천
Embedded Vision and Machine Learning Inference
The 5CSEBA4U19C6N's FPGA fabric accelerates convolutional neural network (CNN) inference using 18x18 multipliers and M10K memory for layer buffers, delivering real-time image classification on QVGA-to-VGA streams. The dual ARM Cortex-A9 HPS pre-processes images (resize, normalize) and orchestrates inference. SEU detection protects against bit-flips in safety-relevant inference, and the 484-UBGA 19x19 mm package fits within compact vision modules used in robotics and quality inspection.
추천
추천 제품 요약
엔지니어링 참조 데이터: 5CSEBA4U19C6N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 5CSEBA4U19A7N | 5CSEBA4U19I7N | 5CSEBA4U19C7N | 5CSEBA4U19C8N | 5CSEBA2U19C6N |
|---|---|---|---|---|---|---|
| Package | 484-pin UFBGA / UBGA (19x19 mm) | 484-pin UFBGA / UBGA (19x19 mm) - same | 484-pin UFBGA / UBGA (19x19 mm) - same | 484-pin UFBGA / UBGA (19x19 mm) - same | 484-pin UFBGA / UBGA (19x19 mm) - same | 484-pin UFBGA / UBGA (19x19 mm) - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 40,000 LE | 40,000 LE - same | 40,000 LE - same | 40,000 LE - same | 40,000 LE - same | 25,000 LE (-37.5%) |
| Speed Grade | 6 (fastest commercial) | 7 (auto) | 7 (industrial) | 7 (commercial) | 8 (commercial) | 6 (commercial) |
| Operating Temperature | 0C to +85C (commercial) | -40C to +125C (AEC-Q100) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| AEC-Q100 Qualified | No | Yes | No (industrial only) | No | No | No |
| FPGA User I/O | 161 | 161 - same | 161 - same | 161 - same | 161 - same | 161 - same |
| HPS | Dual ARM Cortex-A9, 925 MHz | Dual ARM Cortex-A9, 925 MHz - same | Dual ARM Cortex-A9, 925 MHz - same | Dual ARM Cortex-A9, 925 MHz - same | Dual ARM Cortex-A9, 925 MHz - same | Dual ARM Cortex-A9, 925 MHz - same |
주요 차별점
- Fastest commercial speed grade within the Cyclone V SE 40K LE U19 family (vs 5CSEBA4U19C8N)
- Dual ARM Cortex-A9 HPS integrated with 40K LE FPGA fabric in single die (vs 5CSEBA2U19C6N)
- AES encryption and SEU error detection built-in (vs 5CEFA4U19I7)
설계 노트
Estimated: at maximum HPS utilization (dual core at 925 MHz) plus 70 percent LE utilization at 100 MHz, the 484-UBGA package dissipates approximately 4-6 W. With a typical theta_JA of 18-22 C/W on a 4-layer JEDEC PCB (no heatsink), the junction temperature rise is approximately 70-130 C above ambient. For commercial 0-85C operation, sustained ambient must remain below 50-60 C, or designers must add a heatsink / thermal via array under the exposed die pad. Industrial 5CSEBA4U19I7N variant extends this envelope to 100 C ambient.
Use a 4-layer minimum stackup with continuous GND plane beneath the BGA for return-path integrity and thermal spreading. Place 0.1 uF + 10 uF decoupling on every VCCINT and VCCP power pin within 100 mils of the via. For HPS DDR3 routing, enforce matched-length (±25 mil) on byte lanes and reference the inner GND layer for the entire DDR3 interface. Use microvia-in-pad if BGA pitch is 0.8 mm or below; otherwise dogbone fan-out is acceptable.
Do not assume the 5CSEBA4U19C6N is pin-to-pin compatible with non-SE Cyclone V variants (SX, ST, E, GX) even at the same U19 484-UBGA package. HPS pin assignments and transceiver lane maps differ across families. Always regenerate the Quartus Prime pinout from the 5CSEBA4U19 device symbol rather than migrating from a similar-marked part. Also verify MSEL[3:0] strapping resistors match the desired configuration scheme (AS, PS, FPP, JTAG-only) before board bring-up.
Keep the FPGA-HPS AXI bridges (HPS-to-FPGA and FPGA-to-HPS) on inner signal layers with length matching within ±100 mil across all data/address/control lanes. Place the HPS reference clock (typically 25 MHz or 33.33 MHz) within 200 mils of the dedicated clock pin, and surround it with a GND guard ring. High-speed transceiver lanes (if used) require 85-ohm differential impedance and AC-coupling caps within 1 inch of the TX pins.
규정 준수 정보
RoHS and lead-free per Altera/Intel product declaration. Halogen-free confirmed by LCSC listing. AES encryption and SEU detection supported per LCSC. AEC-Q100 only applies to the 5CSEBA4U19A7N drop-in variant, not the C6 commercial part.
