5CSEBA6U19A7N - Cyclone V SE SoC FPGA 110K LE | Intel
부품 번호: 5CSEBA6U19A7N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $292.67 | $292.67 |
| 10 | $268.5 | $2,685.00 |
| 100 | $245.2 | $24,520.00 |
| 500 | $220 | $110,000.00 |
| 1,000 | $198.4 | $198,400.00 |
5CSEBA6U19A7N 개요
A SoC FPGA is an integrated circuit that fuses a general-purpose microprocessor subsystem (typically ARM Cortex-A cores) with programmable FPGA logic on the same die. This architecture occupies the midpoint of the embedded computing hierarchy between pure microcontrollers (firmware-only execution), application processors (software-only execution), and standalone FPGAs (hardware-only logic). By co-integrating both domains, SoC FPGAs target designs that demand real-time deterministic I/O alongside high-level operating-system workloads such as Linux, thereby reducing board area, BOM cost, and inter-chip latency compared to two-chip processor-plus-FPGA solutions.
Key device features include 110,000 logic elements, embedded M10K and MLAB memory blocks, variable-precision DSP blocks, dual 32-bit ARM Cortex-A9 MPCore CPUs with NEON media engine and single/double-precision FPU, CoreSight debug and trace, integrated peripherals (EMAC, USB, CAN, SPI, I2C, UART, NAND/NOR flash controller, DDR3 controller with ECC), and an automotive AEC-Q100 temperature grade. The device supports industrial temperature range operation and is suitable for safety-critical and harsh-environment deployments.
Typical applications include industrial machine vision, motor control and robotics, automotive driver assistance systems, broadcast equipment, factory automation, and military/aerospace signal processing. The integrated HPS and FPGA fabric enable deterministic low-latency sensor pipelines combined with high-level protocol handling.
Designers should review the Cyclone V Device Handbook and the HPS technical reference manual for clocking, pinout, and power-sequencing requirements. Proper decoupling, multi-rail sequencing between the HPS and FPGA supplies, and thermal management are essential for reliable operation. This page consolidates distributor pricing, drop-in same-family alternatives, and engineering design guidance not collected in any single manufacturer datasheet.
드롭인 대체품: 5CSEBA6U19A7N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 5CSEBA6U19A7N (동일 폼 팩터 및 풋프린트) — 차이점: Package, DSP Blocks, Logic Elements, Family, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
5CSEBA5U19C7N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$99.2 / 개
데이터시트 보기 →5CSEBA5U19C8N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$195 / 개
데이터시트 보기 →5CSEBA5U19A7N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$152.4 / 개
데이터시트 보기 →5CSEBA6U19C7N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$155.29 / 개
데이터시트 보기 →5CSEBA6U19C8N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$195 / 개
데이터시트 보기 →5CSEBA6U19A7N 최대 정격 & 전기적 특성
| Family | Cyclone V SE SoC FPGA |
| Device Variant | 5CSEA6 (U19) |
| Logic Elements | 110,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Clock Frequency | 700 MHz |
| Core Voltage | 1.1 V |
| 패키지 | 484-pin UBGFA / UFBGA (19x19 mm) |
| Operating Temperature Grade | Automotive AEC-Q100 |
| Supply Form | Tray |
| 실장 유형 | Surface Mount |
| FPGA Architecture | SRAM-based, low-power process |
| Memory Blocks | M10K + MLAB embedded memory |
| DSP Blocks | Variable-precision DSP |
| Peripherals | EMAC, USB, CAN, SPI, I2C, UART, NAND/NOR flash, DDR3 controller with ECC |
| RoHS 상태 | Compliant |
5CSEBA6U19A7N 484-pin ubgfa / ufbga (19x19 mm) 핀 구성 가이드
5CSEBA6U19A7N(484-pin ubgfa / ufbga (19x19 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 5CSEBA6U19A7N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
5CSEBA6U19A7N 적합 용도: 6 애플리케이션s: Industrial Machine Vision, Automotive Driver Assistance (ADAS), Motor Control and Robotics, Broadcast and Pro-AV Equipment, Factory Automation Controllers, Software-Defined Radio Baseband.
Industrial Machine Vision
The 5CSEBA6U19A7N is well suited for industrial machine vision because the dual ARM Cortex-A9 MPCore at 700 MHz runs Linux image-processing stacks and high-level protocols, while the 110K logic elements deliver deterministic, low-latency pre-processing pipelines for sensor data. The integrated DDR3 controller with ECC handles the high-bandwidth camera frame buffer, and the variable-precision DSP blocks accelerate convolution and filtering without CPU overhead. The AEC-Q100 temperature grade supports factory-floor deployments where ambient temperatures fluctuate widely. Place the device on a multi-layer PCB with short, impedance-matched DDR3 traces and isolate the HPS and FPGA supply domains for clean signal integrity.
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Automotive Driver Assistance (ADAS)
The 5CSEBA6U19A7N's AEC-Q100 automotive qualification, dual ARM Cortex-A9 HPS, and 110K LE fabric make it a fit for advanced driver assistance systems such as surround view, lane departure warning, and sensor fusion. The Cortex-A9 cores run the AUTOSAR or Linux middleware and Ethernet AVB stack for vehicle networking, while the FPGA fabric implements deterministic sensor pre-processing (radar FFT, lidar clustering, camera rectification) with microsecond latency. Automotive temperature range -40C to +125C ensures operation in cabin and engine-bay environments. Designers should use the Quartus Prime safety-critical design flow and review AN-718 for ASIL decomposition guidance.
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Motor Control and Robotics
The 5CSEBA6U19A7N combines the deterministic real-time performance of an FPGA fabric with the high-level motion-planning capability of the dual ARM Cortex-A9 HPS, ideal for multi-axis motor control and robotic arm controllers. The FPGA fabric implements field-oriented control (FOC) loops with sub-microsecond PWM update rates, while the HPS runs trajectory planning, inverse kinematics, and EtherCAT master stacks. On-chip peripherals (EMAC, SPI, UART, I2C) connect to absolute encoders, resolver-to-digital converters, and motor-driver gate drivers. The AEC-Q100 grade supports harsh industrial environments and the 700 MHz HPS provides sufficient throughput for multi-axis kinematic computations.
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Broadcast and Pro-AV Equipment
Broadcast video routers, switchers, and pro-AV signal processors benefit from the 5CSEBA6U19A7N's combination of high-speed FPGA fabric I/O and an embedded ARM subsystem for control and IP networking. The FPGA fabric handles real-time SDI/HDMI up-down-cross conversion and color-space transforms, while the Cortex-A9 HPS manages the IP-based control plane (NMOS IS-04/05, Dante, AES67). Integrated DDR3 with ECC enables large frame-buffer storage for video processing pipelines. The low-power Cyclone V process reduces thermal load in rack-mounted equipment compared with higher-end FPGA families.
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Factory Automation Controllers
Programmable Logic Controllers (PLCs) and PAC (Programmable Automation Controllers) built around the 5CSEBA6U19A7N integrate deterministic I/O scanning in the FPGA fabric with high-level application logic (ladder logic, structured text, motion profiles) on the dual Cortex-A9 HPS. The HPS runs CODESYS or similar IEC 61131-3 runtimes, while the FPGA implements fast input scan, pulse-train output, and direct control of industrial buses. Integrated Ethernet, USB, and CAN peripherals reduce the need for external bridge ICs, lowering BOM cost. The AEC-Q100 grade and industrial temperature range suit control cabinets with elevated ambient temperatures.
추천
Software-Defined Radio Baseband
Software-defined radio platforms benefit from the 5CSEBA6U19A7N's high DSP block count in the FPGA fabric, which can implement baseband modulation, demodulation, channel coding, and FFT pipelines for LTE, WiMAX, or proprietary waveforms. The dual ARM Cortex-A9 MPCore runs the protocol stack, packet processing, and network-side applications. The DDR3 controller with ECC supports high-bandwidth sample buffering for wideband receivers. The combination of deterministic FPGA latency and Linux-capable HPS in a single device eliminates the inter-chip communication bottleneck common in two-chip SDR architectures.
추천
추천 제품 요약
엔지니어링 참조 데이터: 5CSEBA6U19A7N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 5CSEBA5U19C7N | 5CSEBA5U19C8N | 5CSEBA5U19A7N | 5CSEBA6U19C7N |
|---|---|---|---|---|---|
| Package | 484-pin UBGFA / UFBGA (U19, 19x19 mm) | 484-pin UBGFA / UFBGA (U19, 19x19 mm) - same | 484-pin UBGFA / UFBGA (U19, 19x19 mm) - same | 484-pin UBGFA / UFBGA (U19, 19x19 mm) - same | 484-pin UBGFA / UFBGA (U19, 19x19 mm) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Logic Elements | 110,000 | 85,000 (-23%) | 85,000 (-23%) | 85,000 (-23%) | 110,000 (same) |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Temperature Grade | Automotive AEC-Q100 | Commercial | Commercial | Automotive AEC-Q100 | Commercial |
| Speed Grade | A7 (automotive, 7) | C7 | C8 | A7 | C7 |
주요 차별점
- Mid-density 110K logic elements with SoC HPS (vs 5CSEBA5U19A7N (85K LE, automotive))
- Automotive AEC-Q100 qualification (vs 5CSEBA6U19C7N (commercial grade))
- Lower power vs higher-end SoC FPGAs (vs Xilinx Zynq-7000 family)
설계 노트
The 5CSEBA6U19A7N requires multiple independent supply rails: VCCINT (1.1 V core), VCCAUX/VCCA_FPLL (2.5 V), VCCPD (3.0 V), VCCIO (1.2-3.3 V per bank), and dedicated HPS supplies (VCC_HPS, VCC_HPS_IO, VCC_HPS_PLL). Power-on sequencing must follow the order specified in the Cyclone V Device Handbook - typically VCCIO/VCCPD before VCCINT - to avoid latch-up. Use the Intel Enpirion power-family EN63A0QA or equivalent high-efficiency buck converters for VCCINT, and place input/output bulk capacitors within 100 mils of each pin pair.
Estimated: at typical industrial ambient of 55 C, full 110K LE utilization, 80% toggle rate, and DDR3 active on the HPS, the device can dissipate approximately 4-6 W. The UBGFA package requires a thermal pad on the PCB for heat spreading. Use 2 oz copper and a 4-layer stackup with continuous inner ground planes to keep theta_JA below 15 C/W. For enclosed enclosures with limited airflow, consider a small heatsink or thermal interface material bonded to a chassis wall.
Use at least a 4-layer PCB with a dedicated ground plane beneath the BGA to control return paths. Route DDR3 traces to the HPS at 50-ohm single-ended impedance, matched within +/-25 mils, with length-matched DQS-to-DQ skew under 20 ps. Keep high-speed FPGA fabric I/O (LVDS, DDR3 user interfaces) routed on the opposite side of the board from HPS DDR3 to minimize crosstalk. The 484-ball UBGFA footprint requires 0.8 mm or 1.0 mm pitch BGA fanout - confirm the exact pitch from the package datasheet before final layout.
Do not assume the 5CSEBA6U19A7N and 5CSEBA6U23A7N are drop-in compatible - they share the silicon family but use different BGA packages (U19 vs U23) with non-identical ball maps. Also confirm the HPS boot configuration: the device boots from flash via SD/MMC, NAND, or QSPI depending on MSEL pin strapping. Misconfigured MSEL pins are a common cause of 'no boot' debug sessions. Always validate the configuration image in JTAG mode before committing to flash programming.
규정 준수 정보
AEC-Q100 qualified per the 'A' designator in the OPN. RoHS and REACH compliance status carried over from Intel / Altera Cyclone V product family declarations.
