A3P1000L-1FGG144 - ProASIC3L Low Power Flash FPGA | Microchip
부품 번호: A3P1000L-1FGG144 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $42.5 | $42.50 |
| 10 | $39.8 | $398.00 |
| 100 | $35.6 | $3,560.00 |
| 500 | $32.4 | $16,200.00 |
| 1,000 | $29.9 | $29,900.00 |
A3P1000L-1FGG144 개요
A Flash FPGA is a field-programmable gate array whose configuration is stored in on-chip flash cells rather than volatile SRAM, so it boots instantly at power-up with no external configuration device. Within the programmable logic hierarchy, the ProASIC3L sits in Microchip (formerly Microsemi/Actel) ProASIC3 family and targets low total cost of ownership designs that need single-chip, secure, reprogrammable logic.
Key features include a wide 1.14 V to 1.575 V core supply supporting 1.2 V to 1.5 V core operation, Flash*Freeze technology for near-zero static power in standby, instant-on flash configuration, and reprogrammability without external boot flash. The 97 available user I/O support common single-ended standards with industrial-friendly drive characteristics.
Technically, the device is built on a flash-based CMOS fabric with a sea-of-modules architecture; the speed grade -1 designates the standard performance bin, while the L suffix denotes the low-power ProASIC3L variant with Flash*Freeze mode. Deterministic flash routing avoids configuration-pull-up glitches at startup, a benefit over SRAM FPGAs for control and power-sequencing logic.
Typical applications include industrial automation control, portable and battery-powered instrumentation, power sequencing and glue logic, and secure single-chip embedded controllers.
Design consideration: because the -1 speed grade is the slowest bin, verify timing closure for high-frequency interfaces and prefer faster grades such as -2 where clock rates exceed roughly 100 MHz equivalents.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: A3P1000L-1FGG144 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3P1000L-1FGG144 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Family, RoHS Status, System Gates.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3P1000L-1FGG144I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
A3P1000L-1FGG144YI
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
A3P1000-1FGG144T
✅ 드롭인✓ 재고 있음
$75 / 개
데이터시트 보기 →A3P1000-2FGG144
✅ 드롭인✓ 재고 있음
$27.2 / 개
데이터시트 보기 →A3P1000-2FGG144I
✅ 드롭인✓ 재고 있음
$27.2 / 개
데이터시트 보기 →A3P1000L-1FGG144 최대 정격 & 전기적 특성
| Logic Elements | 24576 |
| Equivalent System Gates | 1000000 |
| User I/O | 97 |
| Family | ProASIC3L (Flash*Freeze) |
| Core Supply Voltage Range | 1.14 V to 1.575 V |
| Core Voltage Options | 1.2 V to 1.5 V |
| Speed Grade | -1 |
| Configuration Memory | On-chip Flash (non-volatile, instant-on) |
| 동작 온도 | 0C to +85C (TJ) |
| 패키지 | 144-LBGA / 144-FPBGA (13x13 mm) |
| 실장 유형 | Surface Mount |
| Packaging | Tray |
| RoHS 상태 | ROHS3 Compliant |
| Product Status | Active |
| Manufacturer Lead Time | 8 weeks |
A3P1000L-1FGG144 144-lbga / 144-fpbga (13x13 mm) 핀 구성 가이드
A3P1000L-1FGG144(144-lbga / 144-fpbga (13x13 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3P1000L-1FGG144.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3P1000L-1FGG144 적합 용도: 6 애플리케이션s: Industrial Automation and Control, Portable and Battery-Powered Instruments, Power Sequencing and Board Management, Secure Single-Chip Embedded Controllers, Communications and Networking Line Cards, Medical and Diagnostic Equipment.
Industrial Automation and Control
The A3P1000L-1FGG144 fits industrial automation control nodes that need deterministic, instant-on logic without an external configuration device. Its 24,576 logic elements and 97 user I/O provide enough capacity for sensor aggregation, state machines, and motor-interface glue logic, while the on-chip flash fabric boots within microseconds of power application - critical in factory equipment where I/O must be valid immediately at power-up. The 1.14 V to 1.575 V core supply supports 1.2 V and 1.5 V rails common in modern industrial boards. In a typical topology, the FPGA sits between a microcontroller and field-side drivers, implementing safety interlocks and sequencing that must never depend on software boot time; the flash-based fabric keeps this logic fail-safe and reprogrammable in the field.
추천
Portable and Battery-Powered Instruments
Battery-powered instruments benefit directly from the L suffix on the A3P1000L: Flash*Freeze technology drops the device into an ultra-low static power standby state while preserving logic state and I/O, then resumes full operation in microseconds on a wake event. In a handheld data logger, the FPGA can manage display scanning, sensor front-end timing, and power gating, then enter Flash*Freeze between measurement windows. The wide 1.14 V to 1.575 V core tolerance allows direct operation from a single-cell Li-ion rail through a small buck regulator, and the absence of external configuration flash removes boot current spikes and one BOM line. The 13x13 mm, 1.0 mm-pitch 144-ball package keeps board area compact for handheld enclosures while remaining reworkable.
추천
Power Sequencing and Board Management
Complex boards with multiple rails need power sequencing that is valid the instant power arrives - before any processor boots. The A3P1000L-1FGG144 is well suited because its flash configuration is non-volatile and instant-on: 24,576 logic elements implement sequencer state machines, brown-out monitors, and enable-chain logic, while 97 user I/O drive enable pins and monitor POWERGOOD signals across many regulators. Unlike SRAM FPGAs, the device cannot be caught un-configured during startup, so sequencing behaves identically across every power cycle. Place the FPGA on the earliest auxiliary rail, feed it with a precision supervisor, and assign I/O banks to the voltage domains they control. Flash*Freeze also lets the sequencer idle at near-zero static power in normal operation.
추천
Secure Single-Chip Embedded Controllers
Flash-based ProASIC3L devices store their bitstream in non-volatile on-chip flash cells, which are inherently harder to read out than SRAM configuration memories, supporting designs where configuration confidentiality matters. The A3P1000L-1FGG144 with 1,000,000 gates and 24,576 logic elements can host a soft processor, encryption wrappers, and custom peripherals in one chip, eliminating the external boot flash that would otherwise expose the configuration image on a readable bus. Typical uses include secure industrial gateways, metering front ends, and anti-tamper control logic. Design the security boundary around the JTAG port - disable or lock it after production programming - and use the 97 user I/O for tamper-detect inputs. Reprogrammability permits in-field security updates without socketed parts.
추천
Communications and Networking Line Cards
In networking equipment, the A3P1000L-1FGG144 serves as line-card glue logic: frame-buffer control, LED or status supervision, hot-swap event handling, and bridging between a host CPU and PHY devices. The -1 speed grade covers control-plane and moderate-throughput tasks, while 97 user I/O accommodate parallel buses to MACs, framer devices, and backplane connectors. Instant-on behavior ensures the card signals present-in-service as soon as power is applied, and flash reprogrammability allows feature updates during maintenance windows without changing hardware. The 13x13 mm BGA conserves line-card real estate, and the 1.14 V to 1.575 V core range tolerates supply droop from shared backplane rails when properly decoupled with bulk and 0.1 uF ceramics at each supply ball.
추천
Medical and Diagnostic Equipment
Diagnostic instruments such as benchtop analyzers and portable monitoring devices use the A3P1000L-1FGG144 for sensor timing, acquisition sequencing, and interface bridging. The flash fabric delivers deterministic, software-independent timing for ADC sampling windows - important where measurement repeatability is regulated - and the 24,576 logic elements comfortably implement multi-channel capture pipelines. Low standby power through Flash*Freeze extends battery life in portable monitors, and single-chip configuration reduces the component count that must be qualified for medical manufacturing. Use the 97 user I/O for front-end control, isolation-buffer interfacing, and front-panel functions, and partition safety-critical cutoff logic into the FPGA so it cannot be affected by an application-processor crash or slow boot.
추천
추천 제품 요약
엔지니어링 참조 데이터: A3P1000L-1FGG144 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3P1000L-1FGG144I | A3P1000L-1FGG144YI | A3P1000-1FGG144T | A3P1000-2FGG144 | A3P1000-2FGG144I |
|---|---|---|---|---|---|---|
| Package | 144-FBGA (FGG144, 13x13 mm) | 144-FBGA - same | 144-FBGA - same | 144-FBGA - same | 144-FBGA - same | 144-FBGA - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Logic Elements | 24576 | 24576 | 24576 | 24576 | 24576 | 24576 |
| User I/O | 97 | 97 | 97 | 97 | 97 | 97 |
| Speed Grade | -1 | -1 | -1 | -1 | -2 (faster) | -2 (faster) |
| Flash*Freeze Low-Power Mode | Yes | Yes | Yes | No | No | No |
| Operating Temperature | 0C to +85C (TJ) | -40C to +100C (TJ), industrial | Extended Y bin | Commercial | Commercial | Industrial |
| Core Supply Voltage | 1.14 V to 1.575 V | 1.14 V to 1.575 V | 1.14 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V |
| Lifecycle Status | Active | Active | Active | Active | Active | Active |
주요 차별점
- Flash*Freeze ultra-low standby power (vs A3P1000-2FGG144)
- Wider core supply tolerance (vs A3P1000-1FGG144T)
- Industrial temperature upgrade path (vs A3P1000L-1FGG144I)
- Lower unit cost at equal capacity (vs A3P1000-2FGG144)
설계 노트
The A3P1000L-1FGG144 core tolerates 1.14 V to 1.575 V, but static and dynamic current scale strongly with core voltage - running at 1.2 V instead of 1.5 V significantly reduces power, which matters for the low-power intent of the L variant. Provide independent core and I/O bank rails, decouple every supply ball with 0.1 uF ceramics plus local bulk capacitance. Because the device is flash-configured at power-up, ensure the core rail is monotonic and within specification before system READY signals are released.
The FGG144 package is a 13x13 mm fine-pitch BGA; plan an HDI-capable fan-out with via-in-pad or dog-bone escape routing on the inner ball rows. Follow the ProASIC3L datasheet land-pattern recommendation for ball pitch and mask opening. Dedicate solid ground planes beneath the die for return paths, and route JTAG (TDI, TDO, TMS, TCK) with series termination and access to a production programming header for FlashPro in-circuit updates.
The -1 speed grade is the slowest bin in the ProASIC3L family: verify timing closure with Libero static timing analysis before committing, and do not assume SRAM-FPGA-class fabric frequencies. Second, Flash*Freeze mode requires proper entry/exit sequencing per the datasheet - I/O states are held, but wake sources must be qualified. Third, the commercial 0C to +85C (TJ) rating means junction, not ambient; compute junction temperature from estimated core power and the package theta-JA before finalizing enclosure thermal design.
규정 준수 정보
ROHS3 Compliant per Microchip USA product data. Lead-free tray packaging. REACH, halogen-free, and conflict-minerals declarations not stated in provided data - request official compliance package from Microchip.
