A3P400-2FGG144 - ProASIC3 Flash FPGA 97 I/O | Microchip
부품 번호: A3P400-2FGG144 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $47.59 | $47.59 |
| 10 | $46.42 | $464.20 |
| 100 | $44.1 | $4,410.00 |
| 500 | $42.15 | $21,075.00 |
| 1,000 | $40.2 | $40,200.00 |
A3P400-2FGG144 개요
A field-programmable gate array (FPGA) is a semiconductor device containing a fabric of programmable logic blocks and interconnects that designers configure in the field, sitting in the system hierarchy between fixed-function ASICs and microprocessor-based solutions. ProASIC3 is Microchip's third-generation flash FPGA family, positioned below the higher-density Igloo2 and PolarFire families for low-to-mid density designs.
Key features include nonvolatile flash programming that delivers Live at Power-Up (LAPU) Level 0 support, making the device instant-on without an external configuration ROM; single-chip operation that reduces bill-of-materials cost and board area; and optional soft ARM processor support for embedded control. The 130-nm, 7-layer metal (6 copper) flash-based CMOS process provides inherent security because configuration data is stored in nonvolatile flash rather than loaded from external memory at each boot.
Technically, the A3P400 offers four I/O banks with independent VCCIBx supplies, allowing mixed-voltage I/O standards within one device, and reprogrammability that supports iterative design and field upgrades. The flash fabric eliminates the configuration-time vulnerability and standby power of SRAM-based competitors in this density class.
Typical applications include industrial control and automation, portable and battery-powered instrumentation, secure embedded systems, space-constrained bridge logic, and power-up-critical designs where the FPGA must be active before a host processor completes initialization.
A key design consideration is I/O bank planning: only I/O standards sharing compatible voltage levels may be assigned to the same bank, so bank voltage allocation should be finalized before pin assignment in Libero SoC.
This page synthesizes distributor pricing, drop-in alternatives from the same 144-ball footprint family, and practical design notes not consolidated in the manufacturer datasheet.
드롭인 대체품: A3P400-2FGG144 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3P400-2FGG144 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Family, Process Technology, RoHS Status, System Gates.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3P600-2FGG144
✅ 드롭인✓ 재고 있음
$30.4 / 개
데이터시트 보기 →A3P250-2FGG144
✅ 드롭인✓ 재고 있음
$27.8 / 개
데이터시트 보기 →A3P1000-2FGG144
✅ 드롭인✓ 재고 있음
$27.2 / 개
데이터시트 보기 →A3P600-2FGG144I
✅ 드롭인✓ 재고 있음
$44.6 / 개
데이터시트 보기 →A3P250-2FGG144I
✅ 드롭인✓ 재고 있음
$24.8 / 개
데이터시트 보기 →A3P600L-1FGG144
✅ 드롭인✓ 재고 있음
$29.4 / 개
데이터시트 보기 →A3P1000L-1FGG144
✅ 드롭인✓ 재고 있음
$29.9 / 개
데이터시트 보기 →A3P400-2FGG144 최대 정격 & 전기적 특성
| Family | ProASIC3 |
| System Gates | 403000 |
| User I/Os | 97 |
| Embedded SRAM | 55296 bits (true dual-port) |
| 패키지 | 144-LBGA (FGG144) |
| Programming Technology | Nonvolatile Flash |
| Process Technology | 130 nm, 7-layer metal (6 copper) CMOS |
| Live at Power-Up | LAPU Level 0 |
| Configuration | Single-chip, no external boot ROM |
| Soft Processor Support | Optional soft ARM support |
| I/O Banks | 4 (independent VCCIBx supplies) |
| Reprogrammability | Yes (in-system reprogrammable flash) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Lead free (per Kynix listing) |
| Speed Grade | -2 |
A3P400-2FGG144 144-lbga (fgg144) 핀 구성 가이드
A3P400-2FGG144(144-lbga (fgg144) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3P400-2FGG144.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3P400-2FGG144 적합 용도: 6 애플리케이션s: Industrial Control and Automation, Secure Embedded Systems, Battery-Powered Portable Instrumentation, Bridge and Glue Logic Replacement, Power-Up-Critical Control Sequencing, Communications Line-Card and Interface Processing.
Industrial Control and Automation
The A3P400-2FGG144 fits industrial PLC I/O modules, motor control interfaces, and factory automation boards that need flexible glue logic with deterministic power-up behavior. Its 97 user I/Os across 4 independently supplied banks accept mixed-voltage signals (for example, 3.3V sensors and 2.5V backplane logic) without level shifters, and the flash fabric retains its configuration through brownouts, avoiding reconfiguration delays after power dips common on factory floors. Implemented between sensor connectors and a host processor, the FPGA aggregates, debounces, and pre-processes I/O; the 55,296 bits of true dual-port SRAM buffer data between domains. Its single-chip, no-boot-ROM design also raises overall line availability, and the 144-ball BGA footprint supports compact DIN-rail module layouts.
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Secure Embedded Systems
For security-sensitive designs such as authentication boards, secure key storage front ends, and anti-tamper controllers, the A3P400-2FGG144 offers a structural advantage: configuration resides in on-chip flash, so no bitstream traverses an external bus during boot, closing the configuration-intercept window exploited on SRAM FPGAs. LAPU Level 0 means logic is active within microseconds of power application, enabling the FPGA to gate access to other components before a host processor completes reset. Designers typically implement bus monitoring, challenge-response interfaces, and flash-memory access control in the 403K-gate fabric, using the 55,296-bit dual-port SRAM for session buffers. The single-chip solution removes the external PROM that would otherwise be a probing point, per Microchip ProASIC3 security positioning in datasheet DS50003269.
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Battery-Powered Portable Instrumentation
Handheld meters, portable data loggers, and field instruments benefit from the ProASIC3 flash fabric's low static behavior and instant-on operation. Because the A3P400-2FGG144 requires no external configuration device, board area and boot energy are saved, and the instrument can begin acquiring measurements immediately when a trigger or probe is connected rather than after a multi-hundred-millisecond bitstream load. Designers place the FPGA between analog front-end circuits and a low-power MCU, using the flash fabric for timing generation, threshold detection, and interface conversion across its 97 I/Os, with I/O banks set to the front-end voltage to avoid level shifters. The 144-ball FGG144 package, roughly square and compact, suits dense handheld PCBs; the low-power A3P400L-class variants provide further power optimization paths within compatible tooling.
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Bridge and Glue Logic Replacement
The A3P400-2FGG144 is a natural replacement for obsolete bus-interface ASSPs, legacy bridge ASICs, and boards full of 7400-series glue logic. Its 403,000-gate flash fabric absorbs address decoders, bus width converters, protocol translators, and interrupt controllers in one reprogrammable device, and because the design file is editable, late ECOs no longer require board respins. The 97 user I/Os with 4 voltage banks let one chip span a 5V-tolerant-typed legacy bus on one side and a 2.5V or 3.3V processor bus on the other, with bank supplies configured to match each domain. Live at Power-Up Level 0 operation ensures decoded chip selects are valid from the first microsecond, which matters for processors that drive bus cycles immediately after reset release.
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Power-Up-Critical Control Sequencing
Systems that must control or monitor power rails from the first milliseconds, such as backplane managers, baseband boards, and avionic-style controllers, rely on the A3P400-2FGG144's LAPU Level 0 behavior. The FPGA is functional roughly as fast as its internal flash stabilizes, so it can sequence enable pins, monitor power-good signals, and hold a processor in reset while rails stabilize, all without waiting for a bitstream download. Engineers implement multi-rail sequencers with fault latching in the flash fabric, using the 55,296 bits of dual-port SRAM to log fault events for host retrieval. Compared with a CPLD-plus-supervisor chipset, one ProASIC3 device covers sequencing logic and post-fault housekeeping, and the 144-ball BGA provides enough I/O to monitor more than a dozen rails with margin, per the ProASIC3 datasheet LAPU specification.
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Communications Line-Card and Interface Processing
Line cards, backplane adapters, and communication interface boards use the A3P400-2FGG144 for framing, multiplexing, and status aggregation between PHY devices and higher-layer processors. The 97 user I/Os accommodate parallel PHY interfaces, LED/status buses, and management links simultaneously, with the 4 I/O banks mapped to the differing voltage domains typical of mixed 2.5V/3.3V telecom boards. The 55,296 bits of true dual-port SRAM implement FIFOs and elastic buffers between clock domains, a frequent requirement when crossing system and line timing. Because the device is field-reprogrammable, interface firmware updates can be shipped as design images without board changes. Per the Microchip migration application note, I/O banks are consistently organized across A3P400, A3P600, and A3P1000, so a design can scale density upward on the identical FGG144 footprint as channel counts grow.
추천
추천 제품 요약
엔지니어링 참조 데이터: A3P400-2FGG144 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3P600-2FGG144 | A3P250-2FGG144 | A3P1000-2FGG144 | A3P600L-1FGG144 |
|---|---|---|---|---|---|
| Package | 144-LBGA (FGG144) | 144-LBGA (FGG144) - same | 144-LBGA (FGG144) - same | 144-LBGA (FGG144) - same | 144-LBGA (FGG144) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 403000 | ~600000 | ~250000 | ~1000000 | ~600000 |
| Family / Fabric | ProASIC3 flash | ProASIC3 flash | ProASIC3 flash | ProASIC3 flash | ProASIC3L flash (low power) |
| Speed Grade | -2 | -2 | -2 | -2 | -1 (slower) |
| Live at Power-Up | LAPU Level 0 | LAPU supported | LAPU supported | LAPU supported | LAPU supported |
| Programming / Configuration | Nonvolatile flash, single-chip, no boot ROM | Nonvolatile flash, single-chip | Nonvolatile flash, single-chip | Nonvolatile flash, single-chip | Nonvolatile flash, single-chip |
주요 차별점
- Instant-on single-chip flash configuration (vs SRAM-based FPGAs of similar density (external boot PROM required))
- Pin-compatible density scaling (vs A3P600-2FGG144)
- Cost-optimized density point (vs A3P1000-2FGG144)
- Low-power variant availability (vs A3P600L-1FGG144)
설계 노트
The 144-ball FGG144 BGA requires a controlled PCB stack-up with via-in-pad or dog-bone fanout on 0.8 mm (or finer) ball pitch. Plan power delivery with dedicated planes for the core supply and each of the 4 I/O bank VCCIBx rails, placing a 0.1 uF ceramic decoupling capacitor within a few millimeters of each bank supply pair, plus bulk capacitance at the board entry. Follow the Microchip ProASIC3 PCB layout guidelines in the family datasheet and reference designs for ball-map breakout patterns to keep escape routing symmetrical.
I/O bank planning is a power-domain decision: only I/O standards with compatible voltage levels may share one VCCIBx bank, per the Microchip migration application note for A3P400-class devices. Before running place-and-route in Libero SoC, tabulate every external interface (MCU bus, PHY, connector) by voltage standard and assign banks accordingly; rework after pin lock is costly. Estimated: budget bank current as sum of simultaneous switching I/O times load charge, and verify against the datasheet supply-current tables rather than assuming worst-case values.
LAPU Level 0 means user logic is live almost immediately at power application, so input pins are driven before board rails fully settle; add external pull resistors on critical FPGA inputs so board-level behavior is defined during brownout. Also, do not assume SRAM-FPGA design habits: there is no configuration PROM to re-image, so field upgrades require in-system flash programming access (JTAG or designated programming pins) that must be routed and kept accessible on the PCB. Verify ProASIC3-specific timing with Libero static timing analysis at the -2 speed grade rather than reusing -1 numbers.
규정 준수 정보
Kynix lists A3P400-2FGG144 as LEAD FREE. DigiKey categorizes the part within its RoHS-compliant FPGA catalog. Full REACH and halogen-free status not stated in provided data.
