A3P1000L-1FGG144 - ProASIC3L Low Power Flash FPGA | Microchip
MPN: A3P1000L-1FGG144 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $42.5 | $42.50 |
| 10 | $39.8 | $398.00 |
| 100 | $35.6 | $3,560.00 |
| 500 | $32.4 | $16,200.00 |
| 1,000 | $29.9 | $29,900.00 |
Drop-in alternatives for A3P1000L-1FGG144 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
A3P1000L-1FGG144I
✅ Drop-In📋 Reference alternative (not in catalog)
A3P1000L-1FGG144YI
✅ Drop-In📋 Reference alternative (not in catalog)
A3P1000-1FGG144T
✅ Drop-In✓ In Stock
$75 / Unit
View Datasheet →A3P1000-2FGG144
✅ Drop-In✓ In Stock
$27.2 / Unit
View Datasheet →A3P1000-2FGG144I
✅ Drop-In✓ In Stock
$27.2 / Unit
View Datasheet →A3P1000L-1FGG144 Maximum Ratings & Electrical Characteristics
| Logic Elements | 24576 |
| Equivalent System Gates | 1000000 |
| User I/O | 97 |
| Family | ProASIC3L (Flash*Freeze) |
| Core Supply Voltage Range | 1.14 V to 1.575 V |
| Core Voltage Options | 1.2 V to 1.5 V |
| Speed Grade | -1 |
| Configuration Memory | On-chip Flash (non-volatile, instant-on) |
| Operating Temperature | 0C to +85C (TJ) |
| Package | 144-LBGA / 144-FPBGA (13x13 mm) |
| Mounting Type | Surface Mount |
| Packaging | Tray |
| RoHS Status | ROHS3 Compliant |
| Product Status | Active |
| Manufacturer Lead Time | 8 weeks |
A3P1000L-1FGG144 144-lbga / 144-fpbga (13x13 mm) Pin Configuration Guide
Complete pinout information for A3P1000L-1FGG144 (144-lbga / 144-fpbga (13x13 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3P1000L-1FGG144.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3P1000L-1FGG144 is suitable for 6 applications: Industrial Automation and Control, Portable and Battery-Powered Instruments, Power Sequencing and Board Management, Secure Single-Chip Embedded Controllers, Communications and Networking Line Cards, Medical and Diagnostic Equipment.
Industrial Automation and Control
The A3P1000L-1FGG144 fits industrial automation control nodes that need deterministic, instant-on logic without an external configuration device. Its 24,576 logic elements and 97 user I/O provide enough capacity for sensor aggregation, state machines, and motor-interface glue logic, while the on-chip flash fabric boots within microseconds of power application - critical in factory equipment where I/O must be valid immediately at power-up. The 1.14 V to 1.575 V core supply supports 1.2 V and 1.5 V rails common in modern industrial boards. In a typical topology, the FPGA sits between a microcontroller and field-side drivers, implementing safety interlocks and sequencing that must never depend on software boot time; the flash-based fabric keeps this logic fail-safe and reprogrammable in the field.
Recommended
Portable and Battery-Powered Instruments
Battery-powered instruments benefit directly from the L suffix on the A3P1000L: Flash*Freeze technology drops the device into an ultra-low static power standby state while preserving logic state and I/O, then resumes full operation in microseconds on a wake event. In a handheld data logger, the FPGA can manage display scanning, sensor front-end timing, and power gating, then enter Flash*Freeze between measurement windows. The wide 1.14 V to 1.575 V core tolerance allows direct operation from a single-cell Li-ion rail through a small buck regulator, and the absence of external configuration flash removes boot current spikes and one BOM line. The 13x13 mm, 1.0 mm-pitch 144-ball package keeps board area compact for handheld enclosures while remaining reworkable.
Recommended
Power Sequencing and Board Management
Complex boards with multiple rails need power sequencing that is valid the instant power arrives - before any processor boots. The A3P1000L-1FGG144 is well suited because its flash configuration is non-volatile and instant-on: 24,576 logic elements implement sequencer state machines, brown-out monitors, and enable-chain logic, while 97 user I/O drive enable pins and monitor POWERGOOD signals across many regulators. Unlike SRAM FPGAs, the device cannot be caught un-configured during startup, so sequencing behaves identically across every power cycle. Place the FPGA on the earliest auxiliary rail, feed it with a precision supervisor, and assign I/O banks to the voltage domains they control. Flash*Freeze also lets the sequencer idle at near-zero static power in normal operation.
Recommended
Secure Single-Chip Embedded Controllers
Flash-based ProASIC3L devices store their bitstream in non-volatile on-chip flash cells, which are inherently harder to read out than SRAM configuration memories, supporting designs where configuration confidentiality matters. The A3P1000L-1FGG144 with 1,000,000 gates and 24,576 logic elements can host a soft processor, encryption wrappers, and custom peripherals in one chip, eliminating the external boot flash that would otherwise expose the configuration image on a readable bus. Typical uses include secure industrial gateways, metering front ends, and anti-tamper control logic. Design the security boundary around the JTAG port - disable or lock it after production programming - and use the 97 user I/O for tamper-detect inputs. Reprogrammability permits in-field security updates without socketed parts.
Recommended
Communications and Networking Line Cards
In networking equipment, the A3P1000L-1FGG144 serves as line-card glue logic: frame-buffer control, LED or status supervision, hot-swap event handling, and bridging between a host CPU and PHY devices. The -1 speed grade covers control-plane and moderate-throughput tasks, while 97 user I/O accommodate parallel buses to MACs, framer devices, and backplane connectors. Instant-on behavior ensures the card signals present-in-service as soon as power is applied, and flash reprogrammability allows feature updates during maintenance windows without changing hardware. The 13x13 mm BGA conserves line-card real estate, and the 1.14 V to 1.575 V core range tolerates supply droop from shared backplane rails when properly decoupled with bulk and 0.1 uF ceramics at each supply ball.
Recommended
Medical and Diagnostic Equipment
Diagnostic instruments such as benchtop analyzers and portable monitoring devices use the A3P1000L-1FGG144 for sensor timing, acquisition sequencing, and interface bridging. The flash fabric delivers deterministic, software-independent timing for ADC sampling windows - important where measurement repeatability is regulated - and the 24,576 logic elements comfortably implement multi-channel capture pipelines. Low standby power through Flash*Freeze extends battery life in portable monitors, and single-chip configuration reduces the component count that must be qualified for medical manufacturing. Use the 97 user I/O for front-end control, isolation-buffer interfacing, and front-panel functions, and partition safety-critical cutoff logic into the FPGA so it cannot be affected by an application-processor crash or slow boot.
Recommended
Recommended Products Summary
Engineering reference data for A3P1000L-1FGG144 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3P1000L-1FGG144I | A3P1000L-1FGG144YI | A3P1000-1FGG144T | A3P1000-2FGG144 | A3P1000-2FGG144I |
|---|---|---|---|---|---|---|
| Package | 144-FBGA (FGG144, 13x13 mm) | 144-FBGA - same | 144-FBGA - same | 144-FBGA - same | 144-FBGA - same | 144-FBGA - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Logic Elements | 24576 | 24576 | 24576 | 24576 | 24576 | 24576 |
| User I/O | 97 | 97 | 97 | 97 | 97 | 97 |
| Speed Grade | -1 | -1 | -1 | -1 | -2 (faster) | -2 (faster) |
| Flash*Freeze Low-Power Mode | Yes | Yes | Yes | No | No | No |
| Operating Temperature | 0C to +85C (TJ) | -40C to +100C (TJ), industrial | Extended Y bin | Commercial | Commercial | Industrial |
| Core Supply Voltage | 1.14 V to 1.575 V | 1.14 V to 1.575 V | 1.14 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V |
| Lifecycle Status | Active | Active | Active | Active | Active | Active |
Key Differentiators
- Flash*Freeze ultra-low standby power (vs A3P1000-2FGG144)
- Wider core supply tolerance (vs A3P1000-1FGG144T)
- Industrial temperature upgrade path (vs A3P1000L-1FGG144I)
- Lower unit cost at equal capacity (vs A3P1000-2FGG144)
Design Notes
The A3P1000L-1FGG144 core tolerates 1.14 V to 1.575 V, but static and dynamic current scale strongly with core voltage - running at 1.2 V instead of 1.5 V significantly reduces power, which matters for the low-power intent of the L variant. Provide independent core and I/O bank rails, decouple every supply ball with 0.1 uF ceramics plus local bulk capacitance. Because the device is flash-configured at power-up, ensure the core rail is monotonic and within specification before system READY signals are released.
The FGG144 package is a 13x13 mm fine-pitch BGA; plan an HDI-capable fan-out with via-in-pad or dog-bone escape routing on the inner ball rows. Follow the ProASIC3L datasheet land-pattern recommendation for ball pitch and mask opening. Dedicate solid ground planes beneath the die for return paths, and route JTAG (TDI, TDO, TMS, TCK) with series termination and access to a production programming header for FlashPro in-circuit updates.
The -1 speed grade is the slowest bin in the ProASIC3L family: verify timing closure with Libero static timing analysis before committing, and do not assume SRAM-FPGA-class fabric frequencies. Second, Flash*Freeze mode requires proper entry/exit sequencing per the datasheet - I/O states are held, but wake sources must be qualified. Third, the commercial 0C to +85C (TJ) rating means junction, not ambient; compute junction temperature from estimated core power and the package theta-JA before finalizing enclosure thermal design.
Compliance Information
ROHS3 Compliant per Microchip USA product data. Lead-free tray packaging. REACH, halogen-free, and conflict-minerals declarations not stated in provided data - request official compliance package from Microchip.
