A3P600L-1FG484 - ProASIC3L FPGA 600K Gates | Microchip
부품 번호: A3P600L-1FG484 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $72.4 | $724.00 |
| 100 | $66.2 | $6,620.00 |
| 500 | $61.8 | $30,900.00 |
| 1,000 | $58.9 | $58,900.00 |
A3P600L-1FG484 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks and programmable interconnects that the designer reconfigures after manufacturing. Within the programmable logic hierarchy, the ProASIC3L sits in the flash-based FPGA class, distinguished from SRAM FPGAs by its non-volatile configuration: the design is stored on-chip, so no external configuration PROM or boot sequence is required, and the device powers up instantly and securely.
Key features of the A3P600L-1FG484 include a low-power core operating from 1.2V (the L suffix denotes the low-power core voltage option), a 600K-gate flash fabric with abundant embedded block RAM, 235 available user I/Os for wide bus interfaces, and single-chip operation that reduces total cost of ownership. The 130nm process with flash cells also gives strong security against design cloning compared with bitstream-download SRAM FPGAs.
Technically, the ProASIC3L architecture provides VersaTile logic elements that can be configured as combinational logic, D flip-flops, or small memories, plus dedicated embedded memory blocks and optional support for common memory and bus interfaces. The 1.2V core delivers reduced dynamic power, making the device attractive for power-sensitive designs that still need FPGA-scale logic density.
Typical applications include industrial automation and motor control glue logic, communications line cards, medical instrumentation, and aerospace-adjacent low-power control systems, where non-volatile, instant-on programmable logic with moderate density is required.
When designing with this part, budget power around the 1.2V core rail and verify I/O bank voltage compatibility with adjacent circuitry, and confirm that your CAD flow (Libero SoC) supports the -1 speed grade.
This page adds information gain beyond the datasheet by synthesizing distributor stock signals, drop-in alternative options within the ProASIC3L FG484 family, and practical design notes.
드롭인 대체품: A3P600L-1FG484 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3P600L-1FG484 (동일 폼 팩터 및 풋프린트) — 차이점: System Gates, Package, Technology, Core Supply Voltage, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3P600L-1FGG484
✅ 드롭인✓ 재고 있음
$30.4 / 개
데이터시트 보기 →A3P600L-1FGG484I
✅ 드롭인✓ 재고 있음
$17.1 / 개
데이터시트 보기 →A3P600L-FG484I
✅ 드롭인✓ 재고 있음
$45.6 / 개
데이터시트 보기 →A3P600L-FGG484I
✅ 드롭인✓ 재고 있음
$41.35 / 개
데이터시트 보기 →A3P600L-FG484
✅ 드롭인✓ 재고 있음
$85.9 / 개
데이터시트 보기 →A3P600-1FGG484
✅ 드롭인✓ 재고 있음
$52.4 / 개
데이터시트 보기 →A3P1000-1FGG484T
✅ 드롭인✓ 재고 있음
$33.9 / 개
데이터시트 보기 →A3P600L-1FG484 최대 정격 & 전기적 특성
| Family | ProASIC3L (flash-based FPGA) |
| System Gates | 600K |
| Logic Elements (LEs) | 7KLEs (per Mouser listing) |
| Number of I/Os | 235 |
| Core Voltage | 1.2 V |
| 동작 공급 전압 | 1.2 V |
| Core Voltage Range (family) | 1.2 V to 1.5 V |
| Process Technology | 130 nm flash |
| Maximum Frequency | 892.86 MHz |
| Speed Grade | -1 |
| 패키지 | 484-pin FBGA (FG484) |
| 장착 스타일 | SMD/SMT |
| Packaging | Tray |
| Minimum Operating Temperature | 0 C |
| Maximum Operating Temperature | +70 C |
| Configuration Type | Non-volatile flash (single-chip) |
| Total User Flash Memory Bits (per DigiKey listing) | 110592 |
A3P600L-1FG484 484-pin fbga (fg484) 핀 구성 가이드
A3P600L-1FG484(484-pin fbga (fg484) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3P600L-1FG484.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3P600L-1FG484 적합 용도: 6 애플리케이션s: Industrial Automation and Control, Communications Line Cards, Medical Instrumentation, Low-Power Embedded Systems, Aerospace-Adjacent Control Systems, Test and Measurement Equipment.
Industrial Automation and Control
The A3P600L-1FG484 fits industrial automation control nodes that need flexible glue logic, sequencers, and bus bridging with low static power. Its 600K-gate flash fabric and 235 user I/Os allow wide parallel interfaces to PLC backplanes, motor-drive encoders, and sensor arrays, while the 1.2V core reduces dynamic power in always-on cabinets. Because configuration is stored in on-chip flash, the FPGA boots instantly at power-up with no external loader, increasing system availability. Implement the design in Microchip Libero SoC targeting the -1 speed grade and verify I/O bank voltages against 3.3V or 2.5V field-side logic before tape-out.
추천
Communications Line Cards
In telecommunications and networking line cards, the A3P600L-1FG484 serves as protocol bridging, framing, and backplane interface logic. The 600K-gate capacity is sufficient for parallel-to-serial bridging, memory controllers, and moderate datapath functions, while the 484-ball FBGA provides 235 I/Os for wide buses to PHY devices. The flash-based fabric avoids configuration-bus exposure, improving platform security, and instant-on operation shortens link bring-up time compared with SRAM FPGAs that wait for bitstream loading. Designers should budget the 1.2V core supply with adequate decoupling and verify timing at the -1 speed grade in Libero SoC for the target interface rates.
추천
Medical Instrumentation
Medical diagnostic and monitoring instruments benefit from the A3P600L-1FG484 as non-volatile control and acquisition logic. The 600K-gate flash fabric implements sensor-interface sequencers, filter acceleration, and display-driving glue logic, while the single-chip flash configuration avoids external memory that complicates regulatory documentation. Its 1.2V core keeps dynamic power low in benchtop instruments, and the 0C to +70C rating suits controlled clinical environments. Use the 235 I/Os for parallel acquisition buses to ADC front ends, and implement a clean power tree with low-noise regulation; for extended-temperature designs select the industrial-grade A3P600L-1FGG484I in the same footprint.
추천
Low-Power Embedded Systems
Battery-powered and power-constrained embedded systems use the A3P600L-1FG484 where the L-suffix 1.2V core reduces dynamic power relative to standard 1.5V-core ProASIC3 parts. The 600K-gate fabric replaces multiple ASSPs and glue chips, consolidating the bill of materials, and the flash configuration eliminates boot current and configuration-storage power entirely. With 235 user I/Os the device can hub sensor interfaces, displays, and communication peripherals in a single programmable die. Instantiate only required logic to minimize switching activity, and use Libero SoC power analysis with the -1 speed grade to validate the power budget against the 1.2V rail specification.
추천
Aerospace-Adjacent Control Systems
Ground-based aerospace test equipment and low-orbit-tolerance control systems adopt ProASIC3L flash FPGAs for their configuration read-back immunity and single-chip reliability: the on-chip flash stores the design without external configuration PROMs, reducing part count and failure points versus SRAM FPGA loading chains. The A3P600L-1FG484 supplies 600K gates and 235 I/Os for telemetry framing, motor/gimbal control loops, and sensor aggregation. Note the commercial 0C to +70C rating of this specific suffix; programs requiring wider ranges should use the industrial A3P600L-1FGG484I or qualified space-grade variants in the same package family. Verify timing closure in Libero SoC for the -1 speed grade.
추천
Test and Measurement Equipment
Benchtop and modular test instruments use the A3P600L-1FG484 as timing-generation and channel-control logic. The 600K-gate fabric implements trigger state machines, pattern generators, and register-file interfaces to the instrument CPU, while the 892.86 MHz family speed capability supports fast internal clocking paths where needed. The 484-ball FBGA delivers 235 I/Os to front-end channels, and flash configuration means the instrument is operational immediately at power-on, reducing perceived startup latency. Designers should route the 1.2V core plane with solid decoupling, keep configuration logic internal to leverage flash security, and target the -1 speed grade constraints in Libero SoC.
추천
추천 제품 요약
엔지니어링 참조 데이터: A3P600L-1FG484 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3P600L-1FGG484 | A3P600L-1FGG484I | A3P600L-FG484I | A3P1000-1FGG484T |
|---|---|---|---|---|---|
| Package | 484-ball FBGA (FG484) | 484-ball FBGA (FG484) - same | 484-ball FBGA (FG484) - same | 484-ball FBGA (FG484) - same | 484-ball FBGA (FG484) - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600K | 600K | 600K | 600K | ~1M |
| User I/O | 235 | 235 | 235 | 235 | 235 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Lead Finish | Standard FG finish | Lead-free (GG) | Lead-free (GG) | Standard FG finish | Lead-free (GG) |
| Process Technology | 130 nm flash | 130 nm flash | 130 nm flash | 130 nm flash | 130 nm flash |
| Configuration | Non-volatile flash, single-chip | Non-volatile flash, single-chip | Non-volatile flash, single-chip | Non-volatile flash, single-chip | Non-volatile flash, single-chip |
주요 차별점
- Lowest-power core option in 600K-gate FG484 class (vs A3P600-1FGG484)
- Commercial-temperature cost optimization (vs A3P600L-1FGG484I)
- Footprint-compatible upgrade path to 1M gates (vs A3P1000-1FGG484T)
설계 노트
Power the A3P600L-1FG484 core from a clean 1.2V rail; the L-suffix device is optimized at this voltage for low dynamic power. Estimated: dynamic power scales roughly with Vcore squared, so 1.2V vs a 1.5V-core ProASIC3 saves on the order of 36 percent core dynamic power for identical logic activity. I/O banks are powered separately - verify each bank voltage matches the connected external logic family (e.g., 3.3V or 2.5V) in Libero SoC before layout. Use solid core-plane decoupling with bulk and 0.1uF ceramic capacitors at ball vias.
The 484-ball FBGA requires a fine-pitch BGA land pattern with via-in-pad or dogbone escape routing; plan at least signal layers for the inner ball rows of the 484-ball array. Follow the land-pattern and mechanical dimensions in the ProASIC3L family datasheet package section from Microchip. Place 0.1uF decoupling capacitors on the underside of the board directly beneath ball vias for core and I/O banks. SnapEDA provides footprint files for Altium, KiCad, OrCAD and other CAD tools to reduce footprint error risk.
Two common mistakes: (1) confusing FG484 vs FGG484 - if your soldering process requires lead-free (RoHS) assemblies, order the FGG suffix; the plain FG device may not meet lead-free process requirements. (2) ignoring temperature grade - this commercial 0C to +70C part must not be used where industrial range is required; use A3P600L-1FGG484I instead. Also confirm the -1 speed grade timing at target clock rates in Libero SoC; ProASIC3L -1 devices are slower than higher speed grades, and timing closure failures discovered late force speed-grade or device migrations.
규정 준수 정보
Distributor listings for the plain -1FG484 do not state RoHS/lead-free status explicitly; Microchip offers the lead-free RoHS variants under the FGG484 suffix (e.g., A3P600L-1FGG484, A3P600L-1FGG484I). Verify compliance on the Microchip product page before selecting this suffix for lead-free assembly.
