A3P600L-FGG484I - 600K Gate ProASIC3L FPGA | Microchip
부품 번호: A3P600L-FGG484I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $61.25 | $61.25 |
| 10 | $55.1 | $551.00 |
| 100 | $48.9 | $4,890.00 |
| 500 | $44.2 | $22,100.00 |
| 1,000 | $41.35 | $41,350.00 |
A3P600L-FGG484I 개요
What is an FPGA? A field-programmable gate array is an integrated circuit whose logic fabric can be reconfigured after manufacturing to implement custom digital functions. ProASIC3L uses non-volatile flash programming, so it is instantly live at power-up, unlike SRAM FPGAs that require an external configuration memory. In the product hierarchy, the A3P600L is a low-power flash FPGA, which sits within the ProASIC3L family, then the FPGA category, then programmable logic devices, and finally semiconductors.
Key features include a 1.2 V to 1.5 V core supply range, advanced 130 nm CMOS technology, 600,000 system gates, 13,824 D-flip-flops, 235 user I/Os, and Flash*Freeze low-power mode that reduces standby current significantly. The 484-ball FBGA package with 1 mm pitch and 2.23 mm height supports dense board integration in industrial, aerospace, communication, and medical systems.
Technically, the flash-based architecture eliminates configuration PROMs, reduces board space and BOM cost, provides design security against cloning, and supports ARM Cortex-M1 soft processors on M1 variants. It offers secure in-system programming, instant-on operation, and low static power, which are important for battery-powered and high-reliability applications.
Typical applications include industrial automation and motor control, aerospace and defense avionics, communication infrastructure, medical device signal processing, and IoT edge gateways, where instant-on behavior, low static power, and high reliability are essential.
When designing with this device, use a 1.2 V or 1.5 V core supply with proper decoupling capacitors, assign I/O bank voltages according to the interface standard, and follow BGA layout guidelines for routing and thermal relief. For low-power systems, enable Flash*Freeze mode during idle periods.
This page synthesizes distributor availability, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers an information-gain resource for faster design and sourcing decisions.
드롭인 대체품: A3P600L-FGG484I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3P600L-FGG484I (동일 폼 팩터 및 풋프린트) — 차이점: Package, Technology, RoHS Status, Configuration Memory, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3P600-FGG484I
✅ 드롭인✓ 재고 있음
$55.3 / 개
데이터시트 보기 →M1A3P600L-FGG484I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
A3P600L-1FGG484I
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$17.1 / 개
데이터시트 보기 →A3P600L-FGG484
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$54.9 / 개
데이터시트 보기 →A3P600L-FG484I
✅ 드롭인✓ 재고 있음
$45.6 / 개
데이터시트 보기 →A3P600L-FGG484I 최대 정격 & 전기적 특성
| Product Series | ProASIC3L |
| FPGA Family | Flash FPGA |
| Total System Gates | 600000 |
| Logic Elements | 13824 |
| User I/Os | 235 |
| Maximum System Performance | 350 MHz |
| Core Supply Voltage | 1.2 V to 1.5 V |
| Technology Node | 130 nm CMOS |
| Package Type | 484-ball FBGA (PBGA484) |
| Package Dimensions | 23 mm x 23 mm |
| Package Height | 2.23 mm |
| Ball Pitch | 1 mm |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant (Green) |
| Configuration | Non-volatile flash, instant-on |
| Low Power Mode | Flash*Freeze |
A3P600L-FGG484I 2.23 mm 핀 구성 가이드
A3P600L-FGG484I(2.23 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3P600L-FGG484I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3P600L-FGG484I 적합 용도: 6 애플리케이션s: Industrial Automation and Motor Control, Aerospace and Defense Avionics, Communication Infrastructure, Medical Device Signal Processing, IoT Edge Gateway and Smart Home, Test and Measurement Instrumentation.
Industrial Automation and Motor Control
The A3P600L-FGG484I fits industrial automation because its 235 user I/Os can directly interface with incremental encoders, Hall sensors, gate drivers, and industrial transceivers. With 13,824 logic elements, designers can implement high-speed PWM generators, PID control loops, and safe-stop logic in one instant-on FPGA. The flash-based architecture eliminates external boot memory and reduces system startup time, which is valuable in safety-critical machinery. Operating from a 1.2V to 1.5V core, the device can be adapted to low-power fieldbus nodes while maintaining 350 MHz performance for fast current-loop controllers.
추천
Aerospace and Defense Avionics
Aerospace and defense systems demand instant-on, non-volatile configuration and high reliability, exactly what the A3P600L-FGG484I provides. The flash-based ProASIC3L FPGA does not require an external configuration PROM, reducing board space and single-point failures. With 600K system gates and 235 I/Os, it can handle avionics data buses, telemetry formatting, discrete I/O consolidation, and safety interlocks. The 484-ball FBGA package with 1 mm pitch is suitable for rugged, density-constrained boards. Its low static power also helps manage thermal budgets in sealed avionics enclosures.
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Communication Infrastructure
In communication infrastructure, the A3P600L-FGG484I can implement packet parsing, serial backplane interfaces, clock domain crossing, and protocol bridging. Its 235 user I/Os allow many single-ended and differential standards to be assigned dynamically, while the 350 MHz performance supports line-rate processing for moderate-bandwidth links. The low-power L variant is particularly beneficial in remote radio heads and small-cell backhaul equipment where heat dissipation is limited. The secure flash configuration also prevents unauthorized bitstream readback, a key concern for network equipment deployed at the edge.
추천
Medical Device Signal Processing
The A3P600L-FGG484I suits medical devices that require deterministic real-time processing and long-term reliability. Its flash-based instant-on behavior ensures immediate response at power-up, which is useful for patient monitoring and infusion pumps. The 13,824 logic elements can implement digital filters, sensor sequencing, and alarm logic without a processor. The low-power ProASIC3L core reduces heat in compact medical enclosures, while the 484-FBGA package supports high channel counts for multi-sensor data acquisition. Designers can combine the FPGA with external ADCs and signal-conditioning front-ends.
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IoT Edge Gateway and Smart Home
For IoT edge gateways, the A3P600L-FGG484I provides a balance of logic density, low power, and instant-on security. The Flash*Freeze low-power mode enables the FPGA to sit idle with minimal current draw while waiting for sensor events, then wake quickly to process data. With 235 I/Os, it can aggregate various sensor buses, such as SPI, I2C, UART, and custom parallel interfaces. The non-volatile configuration reduces BOM cost and startup time for battery-powered gateways. Its design security features protect IP in distributed edge nodes.
추천
Test and Measurement Instrumentation
The A3P600L-FGG484I is well suited for test and measurement equipment because its 235 user I/Os and 350 MHz performance enable high-speed data acquisition, trigger logic, and pattern generation. The 13,824 logic elements can store configuration registers, implement counters and state machines, and interface with ADC/DAC front ends. The flash-based design allows immediate instrument startup and secure field updates. In benchtop instruments, the low-power L variant helps minimize fan noise and heat buildup, while the 484-ball BGA package supports dense multi-channel board layouts.
추천
추천 제품 요약
엔지니어링 참조 데이터: A3P600L-FGG484I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3P600-FGG484I | M1A3P600L-FGG484I | A3P600L-1FGG484I |
|---|---|---|---|---|
| Package | 484-FBGA (23x23 mm) | 484-FBGA (23x23 mm) | 484-FBGA (23x23 mm) | 484-FBGA (23x23 mm) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Supply Voltage | 1.2V to 1.5V | 1.5V | 1.2V to 1.5V | 1.2V to 1.5V |
| Total System Gates | 600K | 600K | 600K | 600K |
| Logic Elements | 13,824 | 13,824 | 13,824 | 13,824 |
| User I/O Count | 235 | 235 | 235 | 235 |
| Low Power Mode | Flash*Freeze | No | Flash*Freeze | Flash*Freeze |
| ARM Cortex-M1 | No | No | Yes | No |
주요 차별점
- Low-power ProASIC3L architecture with Flash*Freeze mode (vs A3P600-FGG484I)
- All 13,824 logic elements available for user logic (vs M1A3P600L-FGG484I)
- Instant-on non-volatile flash configuration (vs A3P600L-FG484I)
설계 노트
Estimated: For a 600K-gate FPGA, dynamic power depends on switching activity; at 1.2V core and 50MHz, expect roughly 100-300mW typical. Use the core supply pins with 0.1uF and 1uF decoupling capacitors per bank, and connect all GND balls to a solid low-impedance ground plane. Enable Flash*Freeze for standby to reduce static current.
The 484-ball FBGA package with 1mm pitch requires careful BGA breakout routing. Use via-in-pad only if your assembly process supports it; otherwise route inner rows through dog-bone vias. Keep differential pairs matched and maintain controlled impedance for high-speed I/O. Reference the Microchip layout guidelines for ProASIC3L.
Verify I/O bank supply voltages, programming headers, and JTAG security settings. For flash-based FPGAs, the configuration is non-volatile and instantly live, so design security should be locked after production programming. Leaving JTAG enabled during field operation can expose the design to unauthorized readback. Also confirm the exact industrial temperature range from the datasheet before deployment.
Estimated: The FBGA-484 package thermal resistance is not stated in the verified web data. For high utilization and high ambient temperature, add thermal vias under the package pad and connect to a large copper pour on the opposite side. Maintain the junction temperature below the datasheet maximum by estimating power from switching activity and I/O load.
규정 준수 정보
Jotrin and other listings describe the package as GREEN/FBGA-484, indicating a RoHS-compliant, lead-free finish. No explicit REACH, halogen-free, or conflict minerals statement was found in the verified web data.
