A3PE3000-2FGG484I - 3M-Gate Flash FPGA 341 I/O BGA-484 | Microchip
부품 번호: A3PE3000-2FGG484I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $132.5 | $132.50 |
| 10 | $122 | $1,220.00 |
| 100 | $109.8 | $10,980.00 |
| 500 | $98.6 | $49,300.00 |
| 1,000 | $89.4 | $89,400.00 |
A3PE3000-2FGG484I 개요
A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip flash memory rather than an external configuration PROM. Within the programmable logic hierarchy (FPGA -> programmable logic device -> programmable SoC), flash FPGAs occupy a distinct niche: they power up instantly with no configuration time, require no external boot device, and offer inherent single-chip security advantages over SRAM FPGAs that must load their bitstream at power-on.
Key features of the A3PE3000-2FGG484I include nonvolatile flash programming (instant-on, single-chip solution), live field upgradability via on-board flash programming, optional soft ARM support, and low total cost of ownership through elimination of configuration memory. The ProASIC3E family adds enhanced I/O and memory resources versus base ProASIC3, and the 484-BGA package provides 341 I/O for wide-bus and high-pin-count interface designs.
Technically, the ProASIC3E architecture uses a sea-of-gates logic fabric built from VersaTiles, each configurable as combinational logic or a D flip-flop, connected by a hierarchical routing fabric. The family datasheet (ProASIC3E Flash Family FPGAs with Optional Soft ARM Support, 162 pages) documents the embedded SRAM blocks, PLL support, and I/O banks operating at multiple voltage standards.
Typical applications include industrial automation and motor control, aerospace and defense systems, medical equipment, communications infrastructure line cards, and secure single-chip designs where configuration bitstream interception is a concern.
Design consideration: verify I/O bank voltage planning early - the 341 I/Os are arranged in banks that must share compatible VCCI levels, and BGA escape routing on a 1 mm pitch needs careful fanout strategy.
This page synthesizes distributor pricing, drop-in alternatives, comparison tables, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: A3PE3000-2FGG484I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3PE3000-2FGG484I (동일 폼 팩터 및 풋프린트) — 차이점: Package, Family, Process Technology, RoHS Status, System Gates.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
M1A3PE3000-2FGG484I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
A3PE3000-2FG484I
✅ 드롭인✓ 재고 있음
$59.6 / 개
데이터시트 보기 →A3PE3000-FGG484I
✅ 드롭인✓ 재고 있음
$1451.56 / 개
데이터시트 보기 →A3PE3000L-FGG484I
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →A3PE1500-2FGG484I
✅ 드롭인✓ 재고 있음
$195 / 개
데이터시트 보기 →A3PE3000-2FGG484I 최대 정격 & 전기적 특성
| Logic Cells | 75264 |
| System Gates | 3000000 |
| User I/O | 341 |
| Family | ProASIC3E (Flash) |
| Configuration Memory | Nonvolatile on-chip Flash |
| Speed Grade | -2 |
| 패키지 | 484-Ball FBGA |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +100C (Industrial, I suffix) |
| Programming | In-system, live field upgrade |
| Soft Processor Support | Optional soft ARM support |
| Configuration Bits | 516096 |
| RoHS 상태 | Compliant (green package per manufacturer data) |
A3PE3000-2FGG484I 484-ball fbga 핀 구성 가이드
A3PE3000-2FGG484I(484-ball fbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3PE3000-2FGG484I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3PE3000-2FGG484I 적합 용도: 6 애플리케이션s: Industrial Automation and Motor Control, Aerospace and Defense Processing, Communications Infrastructure Line Cards, Medical Equipment Control Logic, Secure Single-Chip Embedded Systems, Test and Measurement Instrumentation.
Industrial Automation and Motor Control
The A3PE3000-2FGG484I fits industrial automation because its -40C to +100C industrial rating, 3M gates of fabric, and 341 I/Os support multi-axis motor control, PWM generation, and fieldbus interface logic in one chip. Its nonvolatile flash configuration means drives and PLC modules start instantly at power-on with no configuration device to fail in electrically noisy factory environments. Placed as the main sequencing and interface FPGA between industrial Ethernet PHYs and gate-driver circuits, the 341 user I/Os consolidate encoder, PWM, and safety interconnect that would otherwise need multiple CPLDs, reducing BOM count while the live field-upgrade feature allows on-site firmware updates without hardware access.
추천
Aerospace and Defense Processing
Defense and aerospace subsystems favor the A3PE3000-2FGG484I because its flash-based configuration has no bitstream-load window vulnerable to upset or interception, a recognized advantage over SRAM FPGAs in secure platforms. The 484-ball FBGA with 341 I/Os supports wide parallel buses to ADCs, memories, and backplanes in avionics interface cards, while the 3M-gate fabric implements glue logic, bus bridging, and custom protocol engines. The related M1A3PE3000-2FGG484I variant provides an upgraded supply flow for high-reliability programs using the same footprint, so a defense board can be sourced with consistent mechanical and electrical interchangeability across build phases and obsolescence mitigation plans.
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Communications Infrastructure Line Cards
Telecom and networking line cards use the A3PE3000-2FGG484I as system glue: bridging backplane buses to MACs, framer devices, and microprocessors. The 341 I/Os accommodate wide data paths at 1.5V-3.3V logic levels across multiple I/O banks, and the ProASIC3E enhanced I/O resources documented in the family datasheet support the level-shifting flexibility that mixed-voltage legacy line cards demand. Instant-on flash configuration lets a card become active within milliseconds of shelf insertion, an operational benefit in hot-swap slots where SRAM FPGA boot delay would delay service bring-up. Designers should budget I/O bank voltages early since bank grouping constrains which signals can co-locate on the same VCCI rail.
추천
Medical Equipment Control Logic
Medical imaging and diagnostic equipment benefit from the A3PE3000-2FGG484I's deterministic instant-on behavior and large I/O count. Patient-positioning controllers, detector interface boards, and front-end timing systems use the 3M-gate fabric for sensor aggregation and safety interlock logic, while the flash configuration survives power cycling without a bootloader - important in equipment that must be ready on demand in clinical settings. The industrial -40C to +100C temperature range comfortably covers medical equipment ambient requirements, and single-chip operation without external configuration memory simplifies design-in of failure-mode documentation for regulatory submissions. Field upgrades via live programming support in-service software revisions.
추천
Secure Single-Chip Embedded Systems
Applications requiring configuration confidentiality choose the A3PE3000-2FGG484I because the bitstream never leaves the chip: flash cells are programmed in-system and encrypted load paths typical of SRAM FPGAs are unnecessary. Anti-tamper-sensitive and IP-protected designs in payment terminals, industrial licensing, and proprietary instruments use the 3M-gate fabric to embed soft ARM processors (family-documented optional soft ARM support) alongside custom logic, achieving system-on-chip integration. With 341 I/Os the part absorbs memory controllers, sensor buses, and host interfaces, and the absence of an external configuration device removes a physical attack surface. Designers should pair the FPGA with secure storage for application data only.
추천
Test and Measurement Instrumentation
Bench and automated test instruments use the A3PE3000-2FGG484I for timing generation, trigger distribution, and instrument bus interfacing. The -2 speed grade provides the fabric performance needed for fine-grained timing adjustments across the 341 I/Os, which easily cover multi-channel digital probe interfaces and relay-control matrices. Because the design reprograms in-system, instrument manufacturers ship one PCB and differentiate SKUs in firmware - the flash configuration updates live in the field. Instant-on startup means the instrument front panel is responsive immediately after power-on, and no configuration PROM adds a failure point in environments with frequent power cycling such as manufacturing test stations.
추천
추천 제품 요약
엔지니어링 참조 데이터: A3PE3000-2FGG484I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | M1A3PE3000-2FGG484I | A3PE3000-2FG484I | A3PE3000-FGG484I | A3PE3000L-FGG484I | A3PE1500-2FGG484I |
|---|---|---|---|---|---|---|
| Package | 484-Ball FBGA | 484-Ball FBGA - same | 484-BGA (FG code) - same footprint | 484-Ball FBGA - same | 484-Ball FBGA - same | 484-Ball FBGA - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3000000 | 3000000 | 3000000 | 3000000 | 3000000 | 1500000 (-50%) |
| Speed Grade | -2 | -2 | -2 | -1 (slower) | -1 (low power) | -2 |
| Configuration | Nonvolatile on-chip Flash | Nonvolatile on-chip Flash | Nonvolatile on-chip Flash | Nonvolatile on-chip Flash | Nonvolatile on-chip Flash | Nonvolatile on-chip Flash |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (I suffix) | Industrial (I suffix) | Industrial (I suffix) | Industrial (I suffix) | Industrial (I suffix) |
| Power Profile | Standard | Standard | Standard | Standard | Low power (reduced static) | Standard (smaller fabric, less total power) |
| Soft ARM Support | Optional soft ARM support | Yes (same family) | Yes | Yes | Yes | Yes (reduced fabric headroom) |
주요 차별점
- Highest fabric capacity in the 484-ball package options on this page (vs A3PE1500-2FGG484I)
- Faster speed grade than the standard non-2 variant (vs A3PE3000-FGG484I)
- Lower static power option available on the same die (vs A3PE3000-2FG484I)
- Identical-die high-reliability supply path (vs M1A3PE3000-2FGG484I)
설계 노트
The 484-ball FBGA uses a 1.0 mm ball pitch in a 23 x 23 mm body, so plan fanout with via-in-pad or dogbone escapes on 0.3-0.4 mm microvias for inner-row balls. Group power/ground ball clusters to create via farms under the package center, and reserve at least two full signal layers for fabric I/O escape before routing the -2 speed grade timing-critical nets first. Verify the exact mechanical drawing and ball A1 orientation in the ProASIC3E datasheet package section before generating the land pattern.
Plan I/O bank voltages before pin assignment: the 341 user I/Os are organized in banks that share a common VCCI rail, so mixed 3.3V/2.5V/1.8V interfaces must be mapped to matching banks in Libero SoC, not adjusted later. Estimated: with a typical 1.5V core rail and multiple I/O rails, generate clean rails with sequenced DC-DC converters and add 100 uF bulk plus 0.1 uF per bank decoupling; confirm exact core current figures in the manufacturer datasheet power calculator rather than from estimates.
Do not treat the FGG and FG package codes as freely interchangeable without checking the mechanical drawing - lead finish and orderable-code conventions differ between Microsemi-legacy and current Microchip part numbers. Also confirm speed grade compatibility when migrating designs: a -2 design compiled for timing may fail static timing on a -1 part (e.g., A3PE3000-FGG484I). Always re-run timing analysis in Libero SoC after any MPN change, even for pin-identical variants.
At -2 speed grade, preserve setup/hold margins by keeping clock distribution symmetric: use the on-chip PLL and global routing resources rather than cascading fabric logic in clock paths, and length-match source-synchronous bus groups on the PCB. Estimated: keep single-ended stubs under 10 mm and add 22-33 ohm series termination on fast output banks to control reflections into the BGA field. Reference the manufacturer datasheet I/O section for bank-specific drive and slew settings.
규정 준수 정보
FGG package code denotes lead-free green package per Microchip distributor listings. Verify REACH and full material declarations on the Microchip product page.
