A3PE3000-FGG324I - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
부품 번호: A3PE3000-FGG324I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $262 | $2,620.00 |
| 100 | $238 | $23,800.00 |
| 500 | $215 | $107,500.00 |
| 1,000 | $198 | $198,000.00 |
A3PE3000-FGG324I 개요
A Field Programmable Gate Array (FPGA) is a semiconductor device that implements user-defined digital logic through a configurable fabric of logic blocks, routing resources, and I/O cells. The ProASIC3E sits in the flash-FPGA branch of this hierarchy: unlike SRAM-based FPGAs, it stores its configuration in nonvolatile flash, making it a single-chip, Instant-On solution that needs no external configuration device.
Key features include nonvolatile flash programming with reprogrammability, 1.5 V core operation on a 130 nm process, embedded memory, and low total cost of ownership (TOC) as a cost-effective ASIC replacement. The industrial temperature grade (-40 C to +125 C ambient, denoted by the I suffix) supports harsh-environment deployment.
Technically, the device uses the ProASIC3EVersaTile architecture, where each versatile cell can be configured as combinational logic, a flip-flop, or small memory, giving designers fine-grained control. The fifth-generation flash switch technology provides security benefits because configuration data cannot be easily read back, which matters in avionics, networking, and consumer designs where IP protection is required.
Typical applications include ASIC prototyping and bridging, industrial control, networking and communications line cards, avionics subsystems, and high-reliability consumer platforms. The 221 available user I/Os allow wide parallel bus interfaces and glueless connection to processors and memories.
A key design consideration is power supply sequencing and decoupling: the 1.5 V core rail requires stable, low-ripple supplies, and the BGA-324 footprint demands careful via-fanout planning during PCB layout.
This page synthesizes distributor pricing context, verified drop-in alternatives, and practical design notes that go beyond the raw specifications listed in the manufacturer datasheet.
드롭인 대체품: A3PE3000-FGG324I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3PE3000-FGG324I (동일 폼 팩터 및 풋프린트) — 차이점: Package, Family, Operating Temperature, RoHS Status, System Gates.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3PE3000-FG324I
✅ 드롭인✓ 재고 있음
$1 / 개
데이터시트 보기 →A3PE3000-2FGG324
✅ 드롭인✓ 재고 있음
$216 / 개
데이터시트 보기 →A3PE3000L-FGG324I
✅ 드롭인✓ 재고 있음
$62.65 / 개
데이터시트 보기 →M1A3PE3000-FGG324I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
A3PE3000-2FGG324I
✅ 드롭인✓ 재고 있음
$1 / 개
데이터시트 보기 →A3PE3000-FGG324I 최대 정격 & 전기적 특성
| Family | ProASIC3E (ProASIC3E Flash Family) |
| System Gates | 3000000 gates |
| Logic Elements (CLBs) | 75264 |
| Total User I/O | 221 |
| Embedded Memory | 516096 bits |
| Maximum Frequency | 350 MHz |
| Core Supply Voltage | 1.5 V |
| Technology | 130 nm CMOS, nonvolatile flash |
| 패키지 | 324-BGA (FBGA/PBGA324), 19 x 19 mm |
| Ball Pitch | 1 mm |
| Package Height | 1.63 mm |
| 동작 온도 | -40 C to +125 C (Industrial, I grade) |
| Configuration Memory | Nonvolatile flash, reprogrammable, Instant-On |
| 실장 유형 | Surface Mount |
A3PE3000-FGG324I 1.63 mm 핀 구성 가이드
A3PE3000-FGG324I(1.63 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3PE3000-FGG324I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3PE3000-FGG324I 적합 용도: 6 애플리케이션s: ASIC Prototyping and Bridge Logic, Networking and Communications Equipment, Industrial Control and Automation, Avionics and Defense Subsystems, Medical and Instrumentation, Consumer and Computing Platforms.
ASIC Prototyping and Bridge Logic
The A3PE3000-FGG324I is positioned by Microchip as a cost-effective ASIC replacement, and its 3 million gates with 75264 versatile cells give enough capacity for glue logic, bus bridges, and medium-complexity control fabrics. The 221 user I/Os connect wide parallel buses to processors and memories without external translation logic, and the nonvolatile flash configuration means the prototype powers up instantly like the final ASIC would. Because the fabric runs at up to 350 MHz, interface logic for 100-200 MHz bus domains closes timing with modest pipelining. Reprogrammability allows iterating RTL fixes in minutes, which is the core economic advantage over a mask ASIC when volumes do not justify NRE.
추천
Networking and Communications Equipment
Microchip's ProASIC3E datasheet explicitly targets the networking/communications market. In line cards, the A3PE3000-FGG324I serves as fabric glue between MACs, PHYs, and backplane connectors, where its 221 I/O support parallel LVCMOS/LVTTL buses and the embedded 516096-bit memory implements FIFOs and small lookup tables. The nonvolatile flash fabric avoids the configuration-brownout exposure of SRAM FPGAs in carrier equipment, and the industrial -40 C to +125 C range covers telecom outdoor cabinets. With 1.5 V core consumption on a 130 nm process, static power stays low across the many always-on line-card rails, reducing chassis thermal budget pressure in dense racks.
추천
Industrial Control and Automation
In factory automation and process control, the A3PE3000-FGG324I consolidates PLC I/O handling, encoder interfaces, and deterministic state machines into one device. Its 350 MHz toggle capability easily handles multi-MHz encoder counting and PWM generation, while the industrial temperature grade of -40 C to +125 C survives cabinet environments near drives and motors. The flash configuration survives power cycling and field reprogramming via JTAG, so firmware updates roll out without swapping external configuration memories. Single-chip operation also reduces the BOM and improves reliability metrics compared to an SRAM FPGA plus flash pair, which matters for long-lifetime industrial MTBF targets.
추천
Avionics and Defense Subsystems
Microchip targets the avionics market with the ProASIC3E family, and the A3PE3000-FGG324I fits interface adaptation, sensor aggregation, and discrete I/O conditioning in flight hardware. The nonvolatile flash configuration is Instant-On, so subsystems are live at power application, and flash cells resist readback, supporting anti-tamper and IP-security requirements common in defense programs. For programs requiring military screening, the pin-identical M1A3PE3000-FGG324I swaps onto the same PCB. The 221 I/Os handle ARINC-style discrete, serial, and parallel interfaces, and the 324-ball 19 x 19 mm BGA suits conformally coated boards where rework minimization favors mature, single-chip flash fabrics.
추천
Medical and Instrumentation
Bench instruments and medical diagnostic hardware use the A3PE3000-FGG324I for timing generation, detector front-end glue logic, and bus interfacing between ADCs/FPGAs and host processors. The 3M-gate fabric with 516096 bits of embedded memory implements calibration tables and decimation pipelines, while the deterministic flash fabric avoids configuration-latency artifacts at power-up, useful in instruments that must be ready within fixed boot budgets. The 1.5 V core and low static power keep self-heating small inside enclosed benchtop chassis, and the industrial temperature range comfortably covers laboratory ambient swings. The FBGA324 footprint supports high I/O density in compact instrument mainboards.
추천
Consumer and Computing Platforms
The ProASIC3E family datasheet lists consumer and computing among its target markets, and the A3PE3000-FGG324I fits set-top, display, and peripheral platforms that need bridge or co-processor logic at ASIC-like unit cost. At roughly 198 USD at 1000 pieces (as of 2026-09-02 reference pricing), it undercuts mask ASIC NRE for mid-volume products while providing 3M gates and 221 I/O for video bus bridging, memory interfacing, and custom protocol handling. Instant-On flash configuration removes boot-sequence dependencies, and field reprogrammability allows feature updates in deployed units via JTAG in manufacturing or service.
추천
추천 제품 요약
엔지니어링 참조 데이터: A3PE3000-FGG324I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3PE3000-FG324I | A3PE3000-2FGG324 | A3PE3000L-FGG324I | M1A3PE3000-FGG324I |
|---|---|---|---|---|---|
| Package | FBGA-324 (19 x 19 mm) | FBGA-324 - same | FBGA-324 - same | FBGA-324 - same | FBGA-324 - same |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| User I/O | 221 | 221 | 221 | 221 | 221 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Speed Grade | Standard (-F) | Standard | -2 (faster, 310 MHz class) | Low-power grade | Standard |
| Configuration | Nonvolatile flash, Instant-On | Nonvolatile flash | Nonvolatile flash | Nonvolatile flash | Nonvolatile flash |
주요 차별점
- Nonvolatile flash, single-chip Instant-On configuration (vs A3PE3000-FG324I)
- Green lead-free FBGA with industrial grade (vs A3PE3000-FG324I)
- Cost path for higher-reliability screening (vs M1A3PE3000-FGG324I)
- Low-power migration without redesign (vs A3PE3000L-FGG324I)
설계 노트
The A3PE3000-FGG324I operates from a 1.5 V core with separate I/O supply rails selected per bank. Design the power tree so core current is supplied from a low-noise DC-DC or LDO capable of the current computed by Microchip's Libero SoC power estimator for your specific design - flash FPGAs have design-dependent power, so never copy another project's numbers. Decouple each supply pin pair with at least 0.1 uF plus bulk capacitance; the 324-ball BGA places many supply balls across the array, so distribute decoupling under the package.
Fan out the FBGA-324 with a 1 mm pitch footprint using via-in-pad or dog-bone escape on the outer two ball rows and routed escapes deeper in the array. 19 x 19 mm with 221 used I/Os is routable on 4-6 layers; reserve inner layers for power/ground planes to minimize simultaneous-switching noise on the 221 I/O. Generate the footprint from the ProASIC3E datasheet ball-map tables or import Microchip's Libero-provided footprint rather than drafting it by hand, to avoid ball-map transposition errors.
Flash FPGAs are Instant-On, so I/Os drive their configured levels almost immediately at power application - if another device on the bus is slower to initialize, add bus-keeper resistors or enable I/O weak pull-ups/downs to avoid contention. Also remember JTAG programming shares pins: route TMS/TDI/TDO/TCK to a header even in production, and honor the datasheet's I/O bank sequencing requirements to prevent latch-up during mixed-rail power-up.
규정 준수 정보
The FGG suffix denotes Microchip's green package program, but explicit RoHS/REACH certificate data for this exact orderable MPN was not present in the verified web data - confirm on the Microchip product page. AEC-Q100 not applicable for this FPGA family grade.
