ATSAMA5D27C-LD1G-CUR - 500MHz Cortex-A5 MPU, 1Gb LPDDR2 SiP | Microchip
부품 번호: ATSAMA5D27C-LD1G-CUR ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $22.5 | $22.50 |
| 10 | $20.45 | $204.50 |
| 100 | $18.2 | $1,820.00 |
| 500 | $16.5 | $8,250.00 |
| 1,000 | $14.95 | $14,950.00 |
ATSAMA5D27C-LD1G-CUR 개요
A microprocessor (MPU) is an integrated circuit that contains a full CPU core plus system-level peripherals (memory controllers, communication interfaces, timers, and I/O controllers) and is intended to run a full operating system such as Linux or RTOS, distinguishing it from a microcontroller (MCU) which typically integrates Flash and RAM on-chip and runs bare-metal or smaller RTOS workloads. MPU-based designs sit at the next tier up the embedded hierarchy (MPU -> application processor -> system-on-chip -> semiconductor) and dominate human-machine interface (HMI), IoT gateways, and edge-compute applications.
Key features of the ATSAMA5D27C-LD1G-CUR include the ARM Cortex-A5 core with Neon and floating-point extensions, an LCD controller supporting TFT panels, a 1 Gbit LPDDR2 memory subsystem delivering a 32-bit data bus, hardware crypto accelerators (AES, SHA, TRNG), a 10/100 Ethernet MAC with IEEE 1588 support, USB 2.0 high-speed host and device, a Peripheral Touch Controller (PTC), an embedded audio subsystem, and multiple serial interfaces (CAN, UART, SPI, TWI, I2S). The Industrial temperature grade (-40C to +85C) makes it suitable for harsh-environment deployments.
The SiP integration dramatically simplifies PCB design by eliminating the DDR routing complexity, signal integrity concerns, and EMI challenges associated with discrete DRAM. Designers benefit from the 0.8 mm ball pitch package, which supports standard 4-layer PCB manufacturing and reduces total system cost by removing the external memory footprint.
Typical applications include industrial HMI panels, smart home gateways, IoT edge nodes, building automation controllers, barcode scanners, point-of-sale terminals, medical patient monitors, and any battery-powered embedded Linux system. The Cortex-A5 core's efficiency, combined with the 1 Gbit LPDDR2 memory, supports full Linux distributions (including Microchip's Buildroot and Yocto BSPs) with responsive UI rendering.
When designing with this MPU, pay close attention to power rail sequencing (VDDCORE, VDDPLL, VDDUTMII) and provide adequate bulk decoupling near each power pin. The BGA package requires X-ray inspection for reflow verification, and the 0.8 mm pitch demands controlled-impedance routing for high-speed interfaces such as RMII, USB, and SDRAM.
This page synthesizes distributor pricing, drop-in SAMA5D2 family alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a one-stop reference for sourcing and integrating the ATSAMA5D27C-LD1G-CUR.
드롭인 대체품: ATSAMA5D27C-LD1G-CUR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAMA5D27C-LD1G-CUR (동일 폼 팩터 및 풋프린트) — 차이점: Package, Mounting Type, Ethernet, Security, USB.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATSAMA5D27C-LD1G
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
ATSAMA5D28C-LD1G-CUR
✅ 드롭인✓ 재고 있음
$19.4 / 개
데이터시트 보기 →ATSAMA5D27C-CUR
✅ 드롭인✓ 재고 있음
$12.9 / 개
데이터시트 보기 →ATSAMA5D26C-CUR
✅ 드롭인✓ 재고 있음
$6.85 / 개
데이터시트 보기 →ATSAMA5D27C-LD1G-CUR 최대 정격 & 전기적 특성
| Core Architecture | ARM Cortex-A5 with NEON and FPU |
| Maximum CPU Clock | 500 MHz |
| Number of Cores | 1 |
| 데이터 버스 폭 | 32-bit |
| Integrated Memory | 1 Gbit LPDDR2 SDRAM |
| 패키지 | 361-ball TFBGA (16x16 mm), 0.8 mm ball pitch |
| 동작 온도 | -40C to +85C (Industrial) |
| 실장 유형 | Surface Mount (BGA) |
| Series | SAMA5D2 |
| 메모리 유형 | LPDDR2 (System-in-Package) |
| Memory Bus Width | 32-bit |
| LCD Controller | Yes (TFT, up to 2048x2048) |
| Ethernet | 10/100 MAC with IEEE 1588 (EMAC + GMAC) |
| USB | USB 2.0 High-Speed Host and Device |
| Security | AES, SHA, TRNG, secure boot |
| Touch Controller | Peripheral Touch Controller (PTC) |
| RoHS 상태 | Compliant |
ATSAMA5D27C-LD1G-CUR 361-ball tfbga (16x16 mm), 0.8 mm ball pitch 핀 구성 가이드
ATSAMA5D27C-LD1G-CUR(361-ball tfbga (16x16 mm), 0.8 mm ball pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: ATSAMA5D27C-LD1G-CUR.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
ATSAMA5D27C-LD1G-CUR 적합 용도: 6 애플리케이션s: Industrial Human-Machine Interface (HMI), IoT Edge Gateway, Smart Home Hub and Building Automation, Medical Patient Monitor, Point-of-Sale (POS) Terminal, Handheld Barcode Scanner and Mobile Data Terminal.
Industrial Human-Machine Interface (HMI)
The ATSAMA5D27C-LD1G-CUR is ideally suited for industrial HMI panels combining the 500 MHz Cortex-A5 core with integrated TFT LCD controller. The 1 Gbit LPDDR2 SiP eliminates the need for an external memory chip and its complex PCB routing, enabling 4-layer PCB designs that meet industrial cost targets. The LCD controller supports up to 2048x2048 panels, allowing direct drive of 7- to 12-inch displays used in factory-automation terminals. Compared with discrete-DRAM designs, the SiP variant reduces EMI by keeping all DDR signals internal to the package, easing CE/UL industrial compliance testing.
추천
IoT Edge Gateway
Edge gateways benefit from the ATSAMA5D27C-LD1G-CUR's dual 10/100 Ethernet MAC with IEEE 1588 precision time protocol support, USB 2.0 high-speed host, and CAN-FD peripherals. The Cortex-A5 core runs full Linux with networking stacks (iptables, MQTT, OPC-UA), while the 1 Gbit LPDDR2 provides headroom for TLS handshakes and edge-AI inference workloads. Industrial temperature grade -40C to +85C enables outdoor or factory-floor deployment. The SiP integration reduces gateway height profile for DIN-rail mounted enclosures.
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Smart Home Hub and Building Automation
The ATSAMA5D27C-LD1G-CUR provides the processing and connectivity foundation for smart-home hubs integrating Zigbee, Thread, BLE, Wi-Fi, and Z-Wave protocols via USB or SPI-attached radios. The 500 MHz Cortex-A5 with NEON SIMD accelerates protocol-stack encryption (AES), while the 1 Gbit LPDDR2 hosts containerized services (Home Assistant, MQTT broker). The Peripheral Touch Controller and embedded audio subsystem enable built-in voice control and capacitive-button interfaces. Industrial temperature grade supports unheated equipment rooms and outdoor enclosures.
추천
Medical Patient Monitor
Medical patient monitors benefit from the ATSAMA5D27C-LD1G-CUR's hardware AES/SHA/TRNG crypto for HIPAA-compliant data-at-rest protection, the Cortex-A5 deterministic interrupt latency for real-time waveform sampling, and the integrated LCD controller driving bedside TFT panels. The 1 Gbit LPDDR2 SiP stores patient waveform history (ECG, SpO2) without external memory. The hardware cryptographic accelerators accelerate TLS 1.3 for EHR upload. Note: medical applications require IEC 60601-1 certification that the MPU does not provide alone.
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Point-of-Sale (POS) Terminal
POS terminals leverage the ATSAMA5D27C-LD1G-CUR's dual Ethernet MAC for payment-network redundancy, USB 2.0 high-speed for receipt printers and barcode scanners, and the LCD controller driving customer-facing displays. The hardware crypto accelerators accelerate EMV-chip and contactless (NFC) transaction security. The 1 Gbit LPDDR2 SiP handles TLS handshakes and PCI-PTS encrypted buffer storage. The industrial temperature grade ensures reliable operation in retail environments with fluctuating ambient temperatures.
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Handheld Barcode Scanner and Mobile Data Terminal
Handheld battery-powered scanners use the ATSAMA5D27C-LD1G-CUR's LPDDR2 SiP for the lowest active and standby power among the SAMA5D2 family. The Cortex-A5 with NEON SIMD accelerates 1D/2D barcode decode, while the LCD controller drives scan-feedback displays. The Peripheral Touch Controller eliminates external touch ICs, reducing BOM cost. The SiP integration minimizes PCB area, enabling compact handheld form factors. Linux support allows Python-based business-logic application development with full networking stacks.
추천
추천 제품 요약
엔지니어링 참조 데이터: ATSAMA5D27C-LD1G-CUR — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAMA5D27C-LD1G | ATSAMA5D28C-LD1G-CUR | ATSAMA5D27C-CUR | ATSAMA5D26C-CUR |
|---|---|---|---|---|---|
| Package | 361-TFBGA (16x16 mm) | 361-TFBGA (16x16 mm) - same | 361-TFBGA (16x16 mm) - same | 361-TFBGA (16x16 mm) - same | 361-TFBGA (16x16 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Core | Cortex-A5 500 MHz | Cortex-A5 500 MHz | Cortex-A5 500 MHz | Cortex-A5 500 MHz | Cortex-A5 500 MHz |
| Integrated Memory | 1 Gbit LPDDR2 | 1 Gbit LPDDR2 | 2 Gbit LPDDR2 | 1 Gbit LPDDR2 | 1 Gbit LPDDR2 |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| Ethernet | Dual 10/100 MAC with 1588 | Dual 10/100 MAC with 1588 | Dual 10/100 MAC with 1588 | Dual 10/100 MAC with 1588 | Single 10/100 MAC with 1588 |
| LCD Controller | Yes (TFT) | Yes (TFT) | Yes (TFT) | Yes (TFT) | Yes (TFT) |
주요 차별점
- Highest-density LPDDR2 SiP in SAMA5D2 family (vs ATSAMA5D28C-LD1G-CUR)
- Dual Ethernet MAC with hardware 1588 timestamping (vs ATSAMA5D26C-CUR)
- True LPDDR2 power profile versus DDR2 alternative (vs ATSAMA5D27C-D1G-CU)
설계 노트
The ATSAMA5D27C-LD1G-CUR requires multiple sequenced power rails (VDDCORE, VDDPLL, VDDUTMII, VDDUTMIC, VDDBU). Per the SAMA5D2 datasheet, VDDCORE must reach 1.1V nominal before VDDBU backup rail is released, and VDDPLL must be the last to ramp to maintain PLL lock integrity. Use Microchip's recommended PMIC (MIC2800 or similar) for turn-key sequencing. Estimated: a typical 500 MHz active application draws approximately 200 mA on VDDCORE, so derate power-rail regulators to at least 25% above peak current with 22 uF ceramic bulk decoupling near each power pin group.
The 361-ball TFBGA package uses 0.8 mm ball pitch, which is compatible with standard 4-layer PCB manufacturing using laser-drilled microvias. Use NSMD (Non-Solder Mask Defined) land pads of 0.4 mm diameter with 0.4 mm solder-mask openings for optimum solder joint reliability. Place 0.1 uF and 10 uF decoupling capacitors within 2 mm of each power-pin cluster. Estimate: matched-impedance routing of the DDR interface is not required since the LPDDR2 is internal to the SiP, simplifying PCB stack-up.
Route high-speed differential pairs (USB, Ethernet RMII/RGMII) with 90 ohm differential impedance on the top layer over a continuous ground plane. Keep trace lengths matched within 150 mil for USB 2.0 and within 50 mil for RMII. The 16x16 mm TFBGA requires a 6x6 ball matrix escape via microvia-in-pad (VIP) for inner-row signals; alternate rows should fan out via dog-bone fan-out to the second layer. Estimated: total BGA escape routing requires 4 routing layers at minimum.
Do not confuse the ATSAMA5D27C-LD1G-CUR (361-TFBGA, LPDDR2 SiP) with the ATSAMA5D27C-D1G-CU (289-TFBGA, DDR2 SiP) - their ball maps differ and they cannot be interchanged on the same PCB. Verify boot-mode strap resistors (BMS, JTAGSEL) before first power-up; incorrect strapping can lock the MPU in JTAG mode. Estimate: the boot time from power-on to Linux prompt is approximately 3-5 seconds depending on kernel configuration and initramfs size.
규정 준수 정보
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified; not intended for automotive safety-critical applications. Industrial temperature grade -40C to +85C.
