Intel

5CSXFC6C6U23C7N - Cyclone V SX SoC FPGA, 110K LE, 672-UBGA | Intel

부품 번호: 5CSXFC6C6U23C7N ✓ 활성

재고 있음 영업일 기준 1~3일 내 발송

672-UBGA (23x23 mm) Package 800 MHz Speed 5,140 Kbits Memory

시작가 $215.8 USD / 개

MOQ: 1 |

가격 업데이트: 2026-09-05

볼륨 가격

수량	단가	합계
1	$280.96	$280.96
10	$263.4	$2,634.00
100	$244.5	$24,450.00
500	$228.1	$114,050.00
1,000	$215.8	$215,800.00

ℹ️ 모든 가격은 USD 기준입니다

데이터시트 보기 (PDF) 대체품 보기

수량

5CSXFC6C6U23C7N 개요

The Intel 5CSXFC6C6U23C7N is a Cyclone V SX System-on-Chip FPGA integrating a dual-core ARM Cortex-A9 MPCore hard processor system with CoreSight debug fabric and an 110K-logic-element FPGA fabric, housed in a 672-pin UBGA (23x23 mm) package. It targets embedded compute and DSP applications where software execution, hardware acceleration, and low-power operation must coexist on a single die. The device combines a 32-bit application processor subsystem, on-chip peripherals, and high-speed serial transceivers in a cost-optimized 28-nm low-power process.

A System-on-Chip (SoC) FPGA is a hybrid device that pairs a programmable logic fabric with one or more hard processor cores on the same silicon die. The hard processors execute an operating system and control-plane code, while the FPGA fabric accelerates parallel datapaths, custom peripherals, and time-critical DSP. This architecture reduces board area, BOM cost, and inter-chip latency compared with a discrete CPU-plus-FPGA solution, and is widely adopted in industrial control, video processing, motor drive, and machine-vision designs.

The 5CSXFC6C6U23C7N integrates approximately 110K logic elements, 5,140 Kbits of embedded memory, 224 18x18 multipliers, and six 3.125 Gbps transceivers. The hard processor system runs up to 800 MHz per core with 32 KB I-cache, 32 KB D-cache per core, and a 512 KB shared L2 cache. Peripherals include USB 2.0, Gigabit Ethernet, CAN, UART, SPI, I2C, and DDR2/DDR3 controller with ECC support.

Architecturally, the device uses a column-based ALM fabric with adaptive logic modules supporting 8-input fracturable look-up tables, providing an efficient mix of register-rich and arithmetic-intensive paths. The transceiver block delivers up to 3.125 Gbps per channel for PCIe Gen2 x1/x2, gigabit Ethernet, and serial RapidIO links, while the variable-precision DSP blocks enable single-cycle 18x18 or dual-cycle 27x27 multiply-accumulate operations.

Typical applications include industrial machine vision, motor control and drives, software-defined radio baseband, broadcast video processing, and ruggedized military/aerospace platforms. The combination of hard ARM cores, deterministic low-latency fabric, and integrated transceivers lets one device replace a multi-chip CPU+FPGA design in space-constrained embedded systems.

Designers should note that this member of the Cyclone V SX family uses the U672 package and operates over the commercial 0C to 85C junction temperature range with a core speed grade of -7. Pin-compatible migration paths include the lower-logic-density 5CSXFC5C6U23C7N and 5CSXFC4C6U23C7N, and the lower-speed -6 grade 5CSXFC6C6U23C6N for cost reduction.

This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, helping engineers select the correct Cyclone V SX variant and avoid costly board respins.

드롭인 대체품: 5CSXFC6C6U23C7N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: 5CSXFC6C6U23C7N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Logic Elements, Process Technology, DSP Blocks.

5CSXFC4C6U23C7N

Intel

Package: 672-pin UFBGA (U23, 23x23 mm)

Operating Temperature: Commercial (0C to +85C)

Logic Elements: 40,000

비교 대상: 5CSXFC6C6U23C7N →

5CSXFC5C6U23C7N

Intel

Package: 672-UBGA (UFBGA) 23x23 mm

Operating Temperature: 0C to +85C (commercial)

Logic Elements: 85,000

비교 대상: 5CSXFC6C6U23C7N →

5CSXFC5D6F31I7N

Intel

Package: 896-ball FBGA (31 x 31 mm)

Operating Temperature: -40 C to +100 C (Industrial, TJ)

Logic Elements: 85,000

비교 대상: 5CSXFC6C6U23C7N →

5CSXFC6C6U23A7N

Intel

Package: 672-pin UBGAFBGA (23 x 23 mm)

Operating Temperature: Automotive grade (per part number decode A)

Process Technology: TSMC 28 nm Low Power

비교 대상: 5CSXFC6C6U23C7N →

5CSXFC6C6U23C6N

Intel

Package: 672-UBGA (UFBGA) 23x23 mm

Operating Temperature: 0 C to +85 C (commercial)

DSP Blocks: approximately 112

비교 대상: 5CSXFC6C6U23C7N →

5CSXFC6C6U23C8N

Intel

Package: 672-pin UFBGA (UBGA), 23x23 mm

Operating Temperature: -40C to +100C (industrial grade, code C)

Process Technology: 28 nm low-power (TSMC)

비교 대상: 5CSXFC6C6U23C7N →

5CSXFC6C6U23C8NES

Intel

Package: 672-pin UBGА (23x23 mm)

비교 대상: 5CSXFC6C6U23C7N →

5CSXFC6C6U23I7LN

Altera

Operating Temperature: -40C to +100C (Industrial)

Logic Elements: 110K

DSP Blocks: Variable-precision, supports 18x18 and 27x27 multipliers

비교 대상: 5CSXFC6C6U23C7N →

5CSXFC6C6U23I7N

Intel

Package: 672-pin UBG-A (23x23 mm)

Operating Temperature: -40C to +100C (industrial)

Process Technology: 28 nm

비교 대상: 5CSXFC6C6U23C7N →

5CSXFC6C6U23I7NTS

Intel

Package: 672-pin UBGA (U23) 23x23 mm

Operating Temperature: -40 C to +100 C (Industrial, I7)

Logic Elements: 110 K

비교 대상: 5CSXFC6C6U23C7N →

✅ 드롭인

Intel

📦 672-UBGA (U672)

Cyclone V SX SoC FPGA · 85,000 · Dual ARM Cortex-A9 MPCore with CoreSight · 800 MHz · 1.1 V · 28 nm low-power · 896-ball FBGA (31 x 31 mm) · 1.0 mm

✓ 재고 있음

$138.2 / 개

데이터시트 보기 →

5CSXFC6C6U23C7N 최대 정격 & 전기적 특성

Family	Cyclone V SX SoC FPGA
Logic Elements	110,000
Hard Processor Cores	Dual ARM Cortex-A9 MPCore
Processor Max Frequency	800 MHz
Embedded Memory	5,140 Kbits
18x18 Multipliers	224
Transceivers	6 (up to 3.125 Gbps)
User I/O Pins	145
패키지	672-UBGA (23x23 mm)
Speed Grade	-7 (fastest)
동작 온도	0C to 85C (commercial)
Process Technology	28 nm low-power
실장 유형	Surface Mount
RoHS 상태	Compliant
Hard Cache (L2 shared)	512 KB

5CSXFC6C6U23C7N 672-ubga (23x23 mm) 핀 구성 가이드

5CSXFC6C6U23C7N(672-ubga (23x23 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.

5CSXFC6C6U23C7N의 672-ubga (23x23 mm) 패키지 핀아웃 다이어그램

다음에 대한 상세 핀아웃 데이터 없음: 5CSXFC6C6U23C7N.

다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.

일반적인 애플리케이션

5CSXFC6C6U23C7N 적합 용도: 6 애플리케이션s: Industrial Machine Vision Systems, Motor Control and Industrial Drives, Software-Defined Radio Baseband, Broadcast Video Processing, Ruggedized Military and Aerospace Platforms, Embedded IoT Edge Gateways.

🏭

Industrial Machine Vision Systems

The 5CSXFC6C6U23C7N is purpose-built for industrial machine vision, where the dual ARM Cortex-A9 cores run the vision pipeline (OpenCV, halcon, custom CNN inference) while the 110K-logic-element fabric accelerates image preprocessing such as Bayer demosaicing, color space conversion, and Sobel/LoG filters in real time. The 5,140 Kbits of embedded memory buffers full-HD frames at 60 fps, while 224 18x18 multipliers compute convolutions in a single cycle. Six integrated 3.125 Gbps transceivers stream raw sensor data from CoaXPress or 10 GigE Vision cameras into the FPGA fabric without an external PHY, reducing BOM cost and PCB area.

추천

⚡

Motor Control and Industrial Drives

In motor control and AC drive applications, the 5CSXFC6C6U23C7N leverages its dual ARM Cortex-A9 cores to execute the FOC (field-oriented control) loop and communication stacks (EtherCAT, PROFINET, CANopen) while the FPGA fabric implements deterministic PWM generation, dead-time compensation, and encoder interface logic with sub-microsecond jitter. The 800 MHz HPS clock provides sufficient headroom for 50 microsecond control loops at 20 kHz switching frequency. Hardware multipliers accelerate Park/Clarke transforms and SVPWM modulation, freeing the CPU for safety diagnostics, while integrated peripherals (CAN, UART, SPI) interface to power-stage gate drivers and isolated current sensors.

추천

5CSXFC6C6U23A7N · Intel 5CSEBA5U23C7N · Intel

🌐

Software-Defined Radio Baseband

The 5CSXFC6C6U23C7N is well suited to SDR baseband processing, where the dual ARM Cortex-A9 cores execute protocol stacks and modem control while the FPGA fabric implements digital up/down conversion, pulse shaping, and channelization filters in hardware. The six 3.125 Gbps transceivers interface directly to RF ADCs/DACs (such as the AD9680 or AD9144 family) and support CPRI/OBSAI fronthaul links to remote radio heads. The 224 DSP blocks provide the multiply-accumulate throughput needed for LTE, WiMAX, or custom waveforms up to 20 MHz instantaneous bandwidth, and the 5,140 Kbits of block RAM holds hundreds of FIR filter taps.

추천

AD9680BCPZ-500 · Analog Devices 5CSXFC5D6F31I7N · Intel

📺

Broadcast Video Processing

In broadcast video infrastructure, the 5CSXFC6C6U23C7N combines the FPGA fabric for real-time video processing (scaling, deinterlacing, color correction, HDR tone mapping) with the ARM cores for control plane and stream management (SMPTE 2022, NMOS IS-04/05, RIST). The 145 user I/O pins accept 3G-SDI, HDMI, or DisplayPort streams via external serializers, while the integrated transceivers support SMPTE 424M coaxial SDI at 3 Gbps per channel. Embedded memory stores multiple frame buffers for pipelined 4K processing, and the 28 nm low-power process keeps junction temperature manageable in fanless broadcast equipment.

추천

5CSXFC6C6U23C6N · Intel 10M50DAF484C7G · Intel

✈️

Ruggedized Military and Aerospace Platforms

The 5CSXFC6C6U23C7N is deployed in military and aerospace platforms where SWaP-C (size, weight, power, cost) constraints rule out multi-chip solutions. The dual ARM Cortex-A9 cores run secure operating systems (VxWorks, INTEGRITY, LynxOS-178) for mission computing, while the FPGA fabric implements custom sensor interfaces, MIL-STD-1553 bus controllers, and signal-processing pipelines for radar, electronic warfare, or SIGINT applications. The integrated transceivers support Serial RapidIO and PCIe Gen2 for high-speed sensor data ingest, and the 145 user I/O pins accept LVDS and RS-422 directly. The 28 nm low-power process minimizes thermal load in sealed enclosures.

추천

5CSXFC5C6U23I7N · Intel 5CSXFC4C6U23I7N · Intel

🔧

Embedded IoT Edge Gateways

For IoT edge gateways, the 5CSXFC6C6U23C7N combines Linux-class application processing on the ARM Cortex-A9 cores (running Docker containers, MQTT brokers, time-series databases) with FPGA-accelerated protocol bridging (Modbus, BACnet, LoRaWAN baseband, custom industrial protocols). The integrated Gigabit Ethernet MAC enables direct WAN connectivity, while USB 2.0 and CAN peripherals support fieldbus attachment. The FPGA fabric offloads packet filtering, encryption (AES/SHA), and timestamp correlation at line rate, and the 28 nm process keeps power consumption below 10 W typical - suitable for fanless DIN-rail enclosures in industrial IoT deployments.

추천

5CSXFC2C6U23C7N · Intel 5CSEBA6U19I7N · Intel

추천 제품 요약

What is the 5CSXFC6C6U23C7N?

The 5CSXFC6C6U23C7N is an Intel Cyclone V SX System-on-Chip FPGA integrating a dual-core ARM Cortex-A9 MPCore hard processor system (up to 800 MHz) with 110K logic elements and six 3.125 Gbps transceivers, packaged in a 672-pin UBGA. According to the Cyclone V device datasheet, the SX series combines HPS peripherals (USB 2.0, GbE, CAN, DDR controller) with the FPGA fabric on a 28 nm low-power die, targeting embedded compute and DSP designs.

How many logic elements does the 5CSXFC6C6U23C7N have?

The 5CSXFC6C6U23C7N contains approximately 110,000 logic elements organized into adaptive logic modules (ALMs). Each ALM contains an 8-input fracturable LUT, two dedicated adders, and four registers. The SX variant also pairs this fabric with 5,140 Kbits of embedded memory (M9K/M10K blocks) and 224 18x18 hardware multipliers for DSP pipelines.

What package does the 5CSXFC6C6U23C7N use?

The 5CSXFC6C6U23C7N ships in a 672-pin Ultra FineLine BGA (UBGA) measuring 23 mm x 23 mm with 1.0 mm ball pitch. The 'U23' suffix in the part number decodes as the U672 package and 23x23 mm body. The UBGA provides 145 user I/O pins plus dedicated HPS and transceiver balls, all accessible through the same footprint shared with other Cyclone V SX U672 variants.

What is the difference between 5CSXFC6C6U23C7N and 5CSXFC6C6U23C6N?

The 5CSXFC6C6U23C7N uses speed grade -7 (fastest timing closure), while the 5CSXFC6C6U23C6N uses speed grade -6 (slower, lower cost). Both share the same 110K-logic-element SX SoC architecture, 672-UBGA package, and identical pinout, making the C6N a drop-in replacement when the design meets the -6 timing constraints. Choose C7N for maximum Fmax in critical DSP paths.

Where can I buy the 5CSXFC6C6U23C7N?

The 5CSXFC6C6U23C7N is available through authorized distributors including DigiKey, Mouser, TrustedParts, and Heisener. As of 2026-09-06, Heisener lists in stock at approximately $280.96 unit price for qty 1. Octopart aggregates real-time stock and pricing from 1+ distributors, useful for comparing lead times when authorized channels run low.

What is the price of 5CSXFC6C6U23C7N?

The 5CSXFC6C6U23C7N unit price is approximately $280.96 at qty 1, decreasing to about $215.80 at qty 1000, as of 2026-09-06. Pricing is volume-tiered; bulk orders of 500+ units can yield 15-20% savings. Cyclone V SX pricing has remained relatively stable, though long-lead quotes are recommended for production volumes exceeding 5,000 units.

What is the lead time for 5CSXFC6C6U23C7N?

The 5CSXFC6C6U23C7N typically ships within 3-5 business days from authorized stock (as of 2026-09-06). Lead time for non-stocked quantities or large production orders may extend to 8-12 weeks depending on Intel fab allocation. Heisener estimates delivery of Mar 22 - Mar 27 for expedited shipping from current stock.

Is 5CSXFC6C6U23C7N in stock?

Yes, the 5CSXFC6C6U23C7N is currently in stock at Heisener (7,328 units reported as of 2026-09-06) and other authorized distributors. Real-time stock visibility is best obtained through DigiKey, Mouser, TrustedParts, or Octopart aggregator pages. For production scheduling, request a vendor-managed inventory (VMI) agreement or safety stock commitment.

What are the key specifications of 5CSXFC6C6U23C7N that engineers should know?

The 5CSXFC6C6U23C7N delivers 110K logic elements, 5,140 Kbits embedded memory, 224 18x18 multipliers, and 6 transceivers at 3.125 Gbps on a 28 nm low-power die. The hard processor system runs dual ARM Cortex-A9 cores at up to 800 MHz with 512 KB shared L2 cache. Package is 672-UBGA (23x23 mm), speed grade -7 commercial, and the device is RoHS-compliant. These specs position it as the mid-density Cyclone V SX flagship for industrial embedded designs.

What is the difference between 5CSXFC6C6U23C7N and 5CSXFC5C6U23C7N?

The 5CSXFC6C6U23C7N offers 110K logic elements while the 5CSXFC5C6U23C7N provides approximately 85K logic elements (lower density, lower cost). Both share the same 672-UBGA U672 footprint, SX SoC architecture with dual ARM Cortex-A9 cores, and identical pinout, so PCB layout carries over directly. Choose C6 (110K) for logic-rich designs; choose C5 (85K) for cost-sensitive designs that fit in lower density.

Can 5CSXFC5C6U23C7N replace 5CSXFC6C6U23C7N?

The 5CSXFC5C6U23C7N is a same-package, same-speed-grade drop-in replacement for the 5CSXFC6C6U23C7N when your design fits within approximately 85K logic elements (about 23% lower density). Both share the U672 footprint and dual ARM Cortex-A9 SoC architecture, allowing direct PCB substitution. If your design requires more than 85K LE, you cannot downgrade; instead migrate to the higher-density 5CSXFC6 family.

When should I choose 5CSXFC6C6U23C7N over a discrete CPU+FPGA design?

Choose the 5CSXFC6C6U23C7N over a discrete CPU+FPGA design when board space, BOM cost, or inter-chip latency matters. The hard ARM Cortex-A9 cores eliminate an external processor and its associated power, clock, and trace complexity, while the shared die reduces FPGA-to-CPU latency to nanoseconds versus hundreds of nanoseconds across a board-level bus. It is ideal for industrial machine vision, motor control, and broadcast video pipelines.

Where to download 5CSXFC6C6U23C7N datasheet PDF?

The official Cyclone V device datasheet PDF is available from Intel at https://www.intel.com/content/www/us/en/content-details/652152/cyclone-v-device-datasheet.html. The datasheet covers all Cyclone V E, GX, GT, SE, SX, and ST variants in approximately 93 pages. For pin-out-specific information, also download the Cyclone V SX Family Pin Connection Guidelines from the same Intel documentation portal.

Where to find 5CSXFC6C6U23C7N pinout?

The 5CSXFC6C6U23C7N pinout is documented in the Cyclone V Device Datasheet (pin information appendix) and the Cyclone V SX Family Pin Connection Guidelines, both available on the Intel FPGA documentation portal. The 672-UBGA package follows Intel's standard BGA ball map with dedicated HPS, transceiver, configuration, and user I/O balls. Quartus Prime Pin Planner can import the pinout directly using device 5CSXFC6C6U23.

What is the best cross-brand equivalent for 5CSXFC6C6U23C7N?

The closest cross-brand drop-in equivalent for the 5CSXFC6C6U23C7N is the Xilinx Zynq-7000 series in the CLG484 package, such as XC7Z020-1CLG484C, which offers dual ARM Cortex-A9 cores with 85K logic cells in a comparable SoC FPGA configuration. However, pin-for-pin compatibility does NOT exist between Cyclone V SX and Zynq-7000 because the BGA ball maps differ; migration requires PCB redesign. For true drop-in compatibility, stay within the Intel Cyclone V SX U672 family (5CSXFC5/4/2 variants).

엔지니어링 참조 데이터: 5CSXFC6C6U23C7N — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the 5CSXFC6C6U23C7N when you need the maximum logic density (110K LE) and the fastest speed grade (-7) in the Cyclone V SX U672 family for commercial (0C-85C) embedded SoC applications. The 800 MHz dual ARM Cortex-A9 HPS handles Linux and control-plane tasks, while the FPGA fabric accelerates parallel DSP and custom peripherals in industrial machine vision, motor control, or SDR designs. Downgrade to 5CSXFC5C6U23C7N (-23% logic) or 5CSXFC4C6U23C7N (-55% logic) if your design fits in lower density, saving $60-$115 per unit. For cost reduction on less timing-critical designs, use 5CSXFC6C6U23C6N (-6 speed grade, ~12% cheaper). For automotive or industrial extended temperature, select 5CSXFC6C6U23A7N (-40C to 125C). All these parts share the U672 footprint, enabling direct PCB substitution across the family without board rework.

대체품과의 비교

파라미터	이 제품	5CSXFC6C6U23C6N	5CSXFC5C6U23C7N	5CSXFC4C6U23C7N	5CSXFC6C6U23A7N
Brand	Intel (Altera)	Intel (Altera)	Intel (Altera)	Intel (Altera)	Intel (Altera)
Package	672-UBGA (U672) 23x23 mm	672-UBGA (U672) 23x23 mm - same	672-UBGA (U672) 23x23 mm - same	672-UBGA (U672) 23x23 mm - same	672-UBGA (U672) 23x23 mm - same
Logic Elements	110,000	110,000 (same)	85,000 (-23%)	49,000 (-55%)	110,000 (same)
Speed Grade	-7	-6 (slower)	-7 (same)	-7 (same)	-7 (same)
Temperature Grade	Commercial (0C to 85C)	Commercial (same)	Commercial (same)	Commercial (same)	Automotive (-40C to 125C)
Transceivers	6 x 3.125 Gbps	6 x 3.125 Gbps (same)	6 x 3.125 Gbps (same)	6 x 3.125 Gbps (same)	6 x 3.125 Gbps (same)
Embedded Memory (Kbits)	5,140	5,140 (same)	3,970 (-23%)	3,160 (-39%)	5,140 (same)
18x18 Multipliers	224	224 (same)	174 (-22%)	112 (-50%)	224 (same)
Approx. Unit Price (qty 1)	$280.96	$245 (lower, slower grade)	$215 (lower density)	$165 (lowest density)	$310 (auto grade premium)

주요 차별점

Highest-density SX variant with full -7 speed grade (vs 5CSXFC5C6U23C7N)
Fastest speed grade in the U672 family (vs 5CSXFC6C6U23C6N)
Commercial temperature range at lower cost than automotive (vs 5CSXFC6C6U23A7N)

설계 노트

The 5CSXFC6C6U23C7N requires a multi-rail power supply: typically 0.85V core (VCC), 1.1V PLL auxiliary (VCCA_PLL), 1.8V/2.5V/3.3V I/O banks (VCCIO), and 1.5V DDR3 termination (VTT). Use the Intel Cyclone V PowerPlay Early Power Estimator (EPE) spreadsheet to estimate dynamic and static power before final schematic design. For typical 110K LE designs at 25% toggle rate and 100 MHz, total power is approximately 3-5 W; provision 2x headroom for the regulator. Decouple every VCC pin with 0.1 uF and 10 uF capacitors placed within 5 mm of the BGA ball, as recommended in Intel application note AN521.

Estimated: at 5 W total power dissipation in the 672-UBGA package, theta_JA on a JEDEC 4-layer test board is approximately 15 C/W, giving a 75 C junction rise above ambient. For commercial temperature grade (0C to 85C junction), the maximum ambient is approximately 10 C without airflow or heatsink. Mount the device on a 4+ layer PCB with continuous inner ground plane and consider a 1 m/s airflow for industrial environments. The exposed thermal pad (if present on package) must be soldered to the PCB ground pour for optimal heat spreading.

Route all six transceiver channels with controlled 100 ohm differential impedance (Microstrip or Stripline) and length-match each P/N pair to within 150 um. Maintain at least 3x trace spacing between transceiver pairs to minimize crosstalk. Power pins for transceivers (VCCH_GXB) require dedicated filtering with ferrite beads - never share decoupling with digital VCC. The HPS DDR3 interface requires impedance-matched fly-by routing with VTT termination resistors; consult Intel External Memory Interface Handbook Volume 3 for full routing guidance.

Common pitfalls: (1) Do not confuse the U672 UBGA (commercial) with the F672 FBGA (industrial) - they have different ballmaps and are NOT pin-compatible despite similar package code prefix. (2) The C7N speed grade requires Quartus Prime 13.0 or later for full timing closure support. (3) Configuration via passive serial (PS) mode requires a valid AS configuration scheme reset sequence; missing the nCONFIG pulse can lock the device. (4) Leave at least 20% LE and 30% memory headroom for design iterations and post-route optimization.

규정 준수 정보

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

무연

Yes

무할로겐

Unknown

분쟁 광물

Compliant

RoHS compliant per Intel product page. The -A7N suffix variant (5CSXFC6C6U23A7N) is AEC-Q100 qualified for automotive applications; standard C7N is commercial grade and not AEC-Q100. MSL level and halogen-free status not explicitly listed in verified data.

데이터 검증일: 2026-09-06 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

출처: Distributor, Distributor, Distributor, Octopart, Manufacturer Datasheet, Manufacturer Product Page

5CSXFC6C6U23C7N - Cyclone V SX SoC FPGA, 110K LE, 672-UBGA | Intel

5CSXFC6C6U23C7N 개요

이 시리즈의 변형

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

5CSXFC6C6U23C6N

5CSXFC5C6U23C7N

5CSXFC4C6U23C7N

5CSXFC6C6U23A7N

5CSXFC5D6F31I7N

추천 대체품 (동일 카테고리 & 패키지)

5CSXFC6C6U23C7N 672-ubga (23x23 mm) 핀 구성 가이드

일반적인 애플리케이션

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선택 가이드

대체품과의 비교

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