EP1S40F1020C7 - 41,250-Cell Stratix FPGA, 1020-BGA | Intel / Altera
부품 번호: EP1S40F1020C7 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 100 | $1595 | $159,500.00 |
| 500 | $1480 | $740,000.00 |
| 1,000 | $1380 | $1,380,000.00 |
EP1S40F1020C7 개요
An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that can be electrically reconfigured to implement arbitrary digital circuits. FPGAs sit in the programmable logic category between fixed-function ASICs (application-specific integrated circuits) and software-running microcontrollers: they offer hardware-level parallelism and timing precision without the mask-set cost of an ASIC. Modern FPGAs further embed hard IP such as DSP slices, block RAM, PLLs, and multi-gigabit transceivers, making them suitable for DSP, high-speed serial I/O, and custom processor implementations.
Key features of the EP1S40F1020C7 include 4,697 CLBs (M512/M4K/M-RAM blocks totaling 773 user I/O), dedicated DSP blocks for high-throughput arithmetic, an embedded TriMatrix memory architecture, and up to 420.17 MHz internal clock performance. The 1020-ball FineLine BGA package at 33 × 33 mm with a 1 mm ball pitch is designed for high-density PCB designs and supports high-speed differential signaling across multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL).
Architecturally, the Stratix family is built around Logic Array Blocks (LABs) of 10 LEs each, with a routing hierarchy of FastTrack Interconnect. Each DSP block delivers up to eight 9 × 9-bit multipliers or one 36 × 36-bit multiplier per clock. The TriMatrix memory provides three block sizes (M512, M4K, M-RAM) optimized for different FIFO and buffer depths, enabling efficient on-chip data storage without external SRAM.
Typical applications include high-speed digital signal processing (software-defined radio, radar), telecommunications backhaul (protocol bridging, channel cards), ASIC prototyping, image and video processing pipelines, and industrial control. The wide logic capacity and embedded DSP blocks make the EP1S40F1020C7 well suited to designs that previously required custom ASICs but at prototype or low-volume budgets.
When designing with this device, ensure that the 1020-ball FBGA PCB layout uses 1 mm-pitch escape routing with microvia or via-in-pad technology for reliable assembly. Power-rail sequencing must respect the 1.5 V core and dedicated PLL supply domains to avoid latch-up, and JTAG boundary-scan should be enabled in production for board-level test. Designers should also note that the Stratix family has been succeeded by Stratix II/III/IV/V and Cyclone families; new designs should consider these newer device families unless pin-compatibility with an existing Stratix board is required.
This page synthesizes distributor pricing, drop-in Stratix alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with an at-a-glance decision framework for legacy Stratix designs.
드롭인 대체품: EP1S40F1020C7 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1S40F1020C7 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature, DSP Blocks, Embedded Memory.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1S40F1020C6
✅ 드롭인✓ 재고 있음
$1380 / 개
데이터시트 보기 →EP1S40F1020C6N
✅ 드롭인✓ 재고 있음
$695 / 개
데이터시트 보기 →EP1S40F1020C5
✅ 드롭인✓ 재고 있음
$165 / 개
데이터시트 보기 →EP1S40F1020C5N
✅ 드롭인✓ 재고 있음
$280 / 개
데이터시트 보기 →EP1S30F1020C7
✅ 드롭인✓ 재고 있음
$575 / 개
데이터시트 보기 →EP1S40F1020C7 최대 정격 & 전기적 특성
| Family | Stratix |
| Logic Elements | 41,250 |
| Typical Gates | 412,500 |
| CLBs | 4,697 |
| Embedded Memory Bits | 3,423,744 |
| Maximum User I/O | 773 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| 동작 온도 | 0 C to 85 C (Commercial) |
| 패키지 | 1020-ball FC-FBGA (33 x 33 mm, 1 mm pitch) |
| 실장 유형 | Surface Mount |
| Maximum Internal Clock | 420.17 MHz |
| DSP Blocks | Yes (dedicated 9x9 / 18x18 / 36x36 multipliers) |
| TriMatrix Memory | M512 / M4K / M-RAM blocks |
EP1S40F1020C7 1020-ball fc-fbga (33 x 33 mm, 1 mm pitch) 핀 구성 가이드
EP1S40F1020C7(1020-ball fc-fbga (33 x 33 mm, 1 mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1S40F1020C7.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1S40F1020C7 적합 용도: 6 애플리케이션s: ASIC Prototyping and Emulation, High-Speed Digital Signal Processing, Telecommunications Backhaul and Protocol Bridging, Image and Video Processing Pipelines, Industrial Control and High-Speed Data Acquisition, Software-Defined Radio (SDR) Baseband.
ASIC Prototyping and Emulation
The EP1S40F1020C7's 41,250 logic elements, 3,423,744 bits of embedded memory, and 412,500 typical gates make it well suited to ASIC prototyping and logic emulation. Engineers can map large portions of an ASIC RTL into the Stratix fabric to validate functionality and timing before committing to a mask set. The 1020-ball FBGA exposes up to 773 user I/O pins, which is enough to bring out wide ASIC buses for parallel bring-up. Dedicated DSP blocks accelerate multiplier-heavy RTL paths. Use Quartus II synthesis and the SOPC Builder for IP integration; the device's high I/O count supports multiple probe buses for in-circuit emulation.
추천
High-Speed Digital Signal Processing
The EP1S40F1020C7 integrates dedicated DSP blocks capable of 9x9, 18x18, and 36x36-bit multiplications per clock cycle, making it well suited to FFT, FIR, and I/Q processing pipelines. Combined with 3.4 Mbits of TriMatrix memory, the device can hold coefficient tables and data buffers on-chip, eliminating external SRAM latency. The 420 MHz internal clock sustains real-time baseband processing for software-defined radio and radar front-ends. Designers can pipeline multiple DSP blocks for sustained throughput above 10 GMACs.
추천
Telecommunications Backhaul and Protocol Bridging
Telecom backhaul cards benefit from the EP1S40F1020C7's 773 user I/O and high-speed differential signaling support (LVDS, HSTL, SSTL). The device can bridge multiple telecom protocols (SONET/SDH framer, Ethernet MAC, custom serializer/deserializer) by mapping each protocol to a separate I/O bank. The TriMatrix memory allows deep FIFO buffering between asynchronous clock domains. Up to 420 MHz fabric clock enables wire-speed processing of OC-192/STM-64-class payloads with margin.
추천
Image and Video Processing Pipelines
The 41,250 logic elements and 3.4 Mbits of embedded memory enable real-time image processing pipelines such as HD-SDI capture, color-space conversion, scaling, and overlay composition. The 773 user I/O pins can ingest parallel Camera Link or DVI streams and drive HDMI/DVI outputs. DSP blocks accelerate convolution kernels and motion-estimation arithmetic. The 1020-ball FBGA exposes enough I/O for multi-stream HD pipelines with embedded frame buffers in TriMatrix memory.
추천
Industrial Control and High-Speed Data Acquisition
Industrial control systems with high-speed data acquisition (multi-MHz ADC sampling, encoder feedback, deterministic actuation) benefit from the EP1S40F1020C7's parallel I/O count and DSP throughput. The 773 user I/O can capture data from multiple synchronized ADC channels while the TriMatrix memory buffers bursts. The 0-85 °C commercial temperature range covers most factory-floor enclosures; for harsher environments, the EP1S40F1020I industrial variant is recommended. Hardware determinism makes the device preferable to microcontrollers for closed-loop control.
추천
Software-Defined Radio (SDR) Baseband
SDR baseband designs benefit from the EP1S40F1020C7's DSP density and high fabric clock. Up- and down-conversion chains, channelizers, and demodulators can be implemented entirely in fabric with margin. The TriMatrix memory holds complex sample buffers and channel coefficients; the 1020-ball FBGA exposes enough LVDS pairs to interface directly to high-speed ADC/DAC front-ends. Engineers can reconfigure the SDR personality in seconds via JTAG, enabling multi-mode radio platforms.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1S40F1020C7 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1S40F1020C6 | EP1S40F1020C6N | EP1S40F1020C5 | EP1S40F1020C5N | EP1S30F1020C7 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 1020-ball FC-FBGA (33 x 33 mm, 1 mm pitch) | 1020-ball FC-FBGA (33 x 33 mm, 1 mm pitch) - same | 1020-ball FC-FBGA (33 x 33 mm, 1 mm pitch) - same | 1020-ball FC-FBGA (33 x 33 mm, 1 mm pitch) - same | 1020-ball FC-FBGA (33 x 33 mm, 1 mm pitch) - same | 1020-ball FC-FBGA (33 x 33 mm, 1 mm pitch) - same |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 33,880 |
| Speed Grade | 7 (fastest) | 6 | 6 | 5 (slowest) | 5 (slowest) | 7 |
| Embedded Memory Bits | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 2,213,376 |
| Maximum User I/O | 773 | 773 | 773 | 773 | 773 | 773 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Highest speed grade in 1020-ball FBGA EP1S40 family (vs EP1S40F1020C6)
- Maximum logic density in original Stratix family in this package (vs EP1S30F1020C7)
- Dedicated DSP blocks and TriMatrix memory in original 130 nm Stratix (vs EP1K50 / ACEX family)
설계 노트
The 1020-ball FineLine BGA package uses a 1 mm ball pitch on a 33 x 33 mm substrate. Per Stratix handbook layout guidelines, escape routing must use microvia or via-in-pad (VIPPO) technology for reliable breakout. Without microvias, signal escape from inner balls is impractical at 1 mm pitch. Plan a minimum 6 PCB layers with dedicated power/ground planes beneath the device; insufficient decoupling will cause simultaneous-switching-noise (SSN) issues on high-speed I/O banks. Estimate: at 1.5 V core and 0.85 V PLL supply, expect ~10-15 W typical core power for high-utilization designs.
The EP1S40F1020C7 requires a 1.5 V core supply plus a separate analog PLL supply (also typically 1.5 V) plus I/O bank reference voltages (VREF) for HSTL/SSTL standards. Power-rail sequencing should bring the core up before the I/O banks to avoid latch-up; consult the Stratix handbook section on power management for the canonical sequence. Bulk decoupling of at least 220 uF per supply domain plus 0.1 uF and 0.01 uF high-frequency caps at every supply pin is recommended. Estimated: a high-utilization design at 420 MHz can exceed 20 W dynamic power.
Do not assume all Stratix EP1S40F1020 speed grades are interchangeable at the binary bitstream level - the SOF (SRAM Object File) is speed-grade specific, and loading a C7 bitstream on a C5 device will fail configuration. Always regenerate the programming file for the actual target speed grade. Also note that the original Stratix family uses 1.5 V core while Stratix III/IV/V use lower core voltages; mixing families on a multi-FPGA board requires level translation. Configuration schemes (Passive Serial, Passive Parallel Synchronous, Active Serial via EPC16/EPC64) must match the chosen configuration device generation.
규정 준수 정보
RoHS / lead-free status not explicitly stated in the Verified Web Data for EP1S40F1020C7. N-suffixed variants (C6N, C5N) are typically lead-free finishes. AEC-Q100 not applicable (FPGA, not automotive-qualified discrete).