EP1S60F1020C7N - Stratix 60 FPGA, 57120 LEs, 1020-BGA | Intel
부품 번호: EP1S60F1020C7N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2227.38 | $2,227.38 |
| 10 | $2050 | $20,500.00 |
| 100 | $1850 | $185,000.00 |
| 500 | $1700 | $850,000.00 |
| 1,000 | $1580 | $1,580,000.00 |
EP1S60F1020C7N 개요
An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs), embedded memory blocks, DSP slices, and programmable I/O cells, all connected by a hierarchy of programmable routing. FPGAs sit between general-purpose CPUs/GPUs and fixed-function ASICs: they deliver hardware-level parallelism and deterministic latency for data-path acceleration, while remaining reprogrammable in the field. Stratix devices were Altera's first-generation high-performance FPGA family, succeeded by Stratix II, III, IV, V, 10, and Agilex families, but EP1S60 parts remain in long-lifecycle industrial, military, and communications designs.
Key features include 57,120 logic elements organized into 5,712 Logic Array Blocks (LABs), 6 embedded PLL clock managers, dedicated 18x18 multipliers for DSP, 12 transceiver channels supporting up to 840 Mbps LVDS, and TriMatrix memory architecture (MRAM blocks up to 4 Mbit). The device is rated for commercial operating temperature (0 °C to 85 °C) and supports in-system programmability via JTAG and active serial configuration.
The EP1S60F1020C7N uses a 1.5 V core, 1.5 V/1.8 V/2.5 V/3.3 V I/O banks with on-chip termination and calibration, and a dedicated configuration block supporting passive serial (PS), passive parallel synchronous (PPS), passive parallel asynchronous (PPA), and JTAG modes. The Stratix architecture pioneered embedded hard IP such as the DSP blocks and high-speed memory interfaces, allowing the EP1S60 to implement DDR SDRAM controllers, LVDS I/O, and multi-standard bus interfaces at the time of release.
Typical applications include telecommunications line cards and baseband processing, military/aerospace signal processing, high-performance industrial imaging and machine vision, ASIC prototyping, and high-throughput data-acquisition systems. The high pin count and large logic capacity make the EP1S60 well-suited to designs that need many parallel interfaces plus significant on-chip buffering.
When designing with this device, pay attention to the Stratix-specific configuration scheme and the EP1S60 130 nm power budget. Designers upgrading legacy designs should evaluate Stratix II (EP2S60) or Cyclone IV as lower-power successors; the EP1S60F1020C7N itself is a mature, long-availability part but is not recommended for new battery-powered or thermally constrained designs.
This page synthesizes distributor stock, parametric specifications, drop-in alternatives from the same Stratix family, and practical design notes not found in a single distributor listing.
드롭인 대체품: EP1S60F1020C7N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1S60F1020C7N (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade, Package, Operating Temperature, Family, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1S60F1020C7
✅ 드롭인✓ 재고 있음
$1750 / 개
데이터시트 보기 →EP1S60F1020C6N
✅ 드롭인✓ 재고 있음
$195 / 개
데이터시트 보기 →EP1S60F1020C5N
✅ 드롭인✓ 재고 있음
$2050 / 개
데이터시트 보기 →EP1S60F1020
✅ 드롭인✓ 재고 있음
$3995 / 개
데이터시트 보기 →EP1S60F1020C6
✅ 드롭인✓ 재고 있음
$105 / 개
데이터시트 보기 →EP1S60F1020C5
✅ 드롭인✓ 재고 있음
$171 / 개
데이터시트 보기 →EP1S60F1020C7N 최대 정격 & 전기적 특성
| Series | Stratix |
| Family | Stratix (EP1S) |
| Logic Elements (LE) | 57120 |
| Logic Array Blocks (LABs) | 5712 |
| Embedded Memory (bits) | 5,215,104 |
| Maximum User I/O | 773 |
| 패키지 | 1020-ball FC-FBGA |
| Package Size | 33 mm x 33 mm, 1.0 mm pitch |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| 동작 온도 | 0 °C to 85 °C (Commercial) |
| Speed Grade | C7 |
| Maximum Internal Frequency | 420.17 MHz |
| Embedded PLLs | 6 |
| DSP Blocks (18x18 multipliers) | Yes |
| Configuration Modes | PS, PPS, PPA, JTAG |
| 실장 유형 | Surface Mount |
EP1S60F1020C7N 33 mm x 33 mm, 1.0 mm pitch 핀 구성 가이드
EP1S60F1020C7N(33 mm x 33 mm, 1.0 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1S60F1020C7N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1S60F1020C7N 적합 용도: 6 애플리케이션s: Telecommunications Line Cards, Military / Aerospace Signal Processing, ASIC Prototyping, High-Performance Industrial Imaging, High-Throughput Data Acquisition, Software Defined Radio Baseband.
Telecommunications Line Cards
The EP1S60F1020C7N fits telecom line-card applications because it combines 57,120 LEs with 5,215,104 bits of embedded memory and 773 user I/Os, all on a 130 nm Stratix fabric that runs at Fmax up to 420 MHz. In a typical line card, the FPGA implements packet classification, traffic shaping, and SERDES framer glue logic between network processors and optical transceivers. The 6 on-chip PLLs provide the multiple low-jitter clock domains needed for TDM, SONET/SDH, and Ethernet backplanes, while the dedicated 18x18 multipliers accelerate Reed-Solomon and CRC offload. Compared to ASIC turn, the Stratix approach gives carriers a reprogrammable platform that survives evolving protocol stacks without board respin.
추천
Military / Aerospace Signal Processing
The EP1S60F1020C7N is widely deployed in military signal-processing boards because of its high logic density, commercial-temperature qualification path, and the long-term availability commitment from Intel/Altera for the Stratix family. With 5,712 LABs, embedded DSP blocks, and 12 transceiver channels, the device can implement radar pulse compression, electronic-warfare channelizers, and secure communications encryption on a single die. The 1020-ball FC-FBGA package is ruggedized by the customer's substrate and underfill process for vibration and thermal cycling. The wide operating-temperature screening path (commercial 0 °C to 85 °C here; industrial variants available as EP1S60F1020I7N) lets the same design support COTS military and aerospace platforms.
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ASIC Prototyping
The EP1S60F1020C7N's combination of 57,120 LEs, 5 Mbit of embedded memory, and 773 user I/Os makes it a strong vehicle for ASIC prototyping where the target ASIC has up to ~3-5 M gates. Designers map their ASIC RTL into one or more Stratix FPGAs, validate functional and timing behavior at near-real speeds, and produce a working hardware platform months before tape-out. The 1020-ball FC-FBGA exposes enough I/O to bring out wide processor buses, DDR memory interfaces, and SERDES links to daughter cards for full system bring-up. Compared to ASIC emulation boxes, the EP1S60 offers lower per-unit cost for small-volume prototypes, at the trade-off of lower MHz and split synthesis flows.
추천
High-Performance Industrial Imaging
The EP1S60F1020C7N is suitable for industrial machine-vision and high-speed imaging because it can absorb multi-channel Camera Link or LVDS camera streams into on-chip memory and process pixels in real time. The 12 LVDS channels support up to 840 Mbps per pair, allowing multiple 10-tap Camera Link cameras to be ingested in parallel. The 5 Mbit of TriMatrix memory provides line buffers, frame buffers, and histogram accumulators without external SRAM, while the 18x18 DSP blocks accelerate Bayer demosaic, edge detection, and FFT preprocessing. The 1020-ball BGA's 773 I/Os route directly to camera connectors, DDR SDRAM, and high-speed serializer outputs.
추천
High-Throughput Data Acquisition
For data-acquisition systems (DAS) that aggregate multiple ADC channels into a single processing engine, the EP1S60F1020C7N's high pin count and large memory make it a natural fit. The 1020-ball FC-FBGA brings in 16-bit parallel LVDS ADC buses from several converters simultaneously, while 5 Mbit of embedded memory serves as a deep FIFO between the ADC clock domain and the back-end processing clock. The 6 on-chip PLLs de-skew the ADC clocks and synthesize the back-end processing clocks at independent frequencies, allowing simultaneous sampling and DSP at different rates. Designers use the 18x18 multipliers for FIR filtering and the LABs for custom trigger logic, all on one Stratix die.
추천
Software Defined Radio Baseband
The EP1S60F1020C7N's combination of 5 Mbit embedded memory, 18x18 DSP blocks, and high LVDS bandwidth makes it useful for software-defined radio (SDR) baseband processing, particularly in legacy military radio programs. The DSP blocks implement up to hundreds of taps of polyphase FIR filtering and FFT butterflies, while the LABs handle state-machine control and protocol framing. The 1020-ball FC-FBGA exposes 773 user I/Os to interface with RF front-end ADCs/DACs and back-end Ethernet or Aurora links. Compared to DSP processor clusters, the Stratix approach delivers deterministic latency and higher throughput per watt for the same DSP workload.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1S60F1020C7N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1S60F1020C7 | EP1S60F1020C6N | EP1S60F1020C5N | EP1S60F1020 |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1020-ball FC-FBGA (33x33 mm) | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same |
| Logic Elements | 57,120 | 57,120 | 57,120 | 57,120 | 57,120 |
| Embedded Memory (bits) | 5,215,104 | 5,215,104 | 5,215,104 | 5,215,104 | 5,215,104 |
| Maximum User I/O | 773 | 773 | 773 | 773 | 773 |
| Speed Grade | C7 | C7 | C6 (slower) | C5 (fastest) | Not specified |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Process Technology | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS |
| Terminal Finish Suffix | 'N' (lead-free) | No 'N' (standard) | 'N' (lead-free) | 'N' (lead-free) | Not specified |
주요 차별점
- C7 commercial speed grade - cost-optimized for legacy timing margins (vs EP1S60F1020C6N)
- Lead-free terminal finish ('N' suffix) (vs EP1S60F1020C7)
- High pin-count 1020-ball FC-FBGA - maximizes user I/O to 773 (vs EP1S60F1020C7 in same package)
설계 노트
The 1020-ball FC-FBGA has a 1.0 mm pitch and 33 mm x 33 mm body, which requires a high-layer-count PCB (at least 8-10 layers) with fine-line escape routing and microvia stack-ups (laser-drilled vias are mandatory). Use 50 ohm controlled-impedance routing for LVDS pairs and length-match within 150 mil for high-speed byte lanes. Provide a continuous ground plane under the BGA and stitch vias around the perimeter to suppress return-path discontinuities. The thermal pad/balls on the underside of the FC-FBGA must be soldered to a thermal pad pattern to achieve the 31 C/W theta-JA specification.
Stratix EP1S60 devices have multiple supply rails: VCCINT (1.5 V core), VCCIO (1.5/1.8/2.5/3.3 V per bank), VCC_PLL (1.5 V for PLL analog), VCCA (1.5 V analog) and VCCD_PLL. Estimated: a fully-utilized EP1S60 design with all 57,120 LEs toggling at 200 MHz can pull 3-5 A on VCCINT. Use a star-ground topology, place decoupling capacitors as close as possible to each BGA ball pair, and provide a bulk 330 uF tantalum plus 100 uF ceramic on each rail. Voltage tolerance is +/-5% on VCCINT and +/-3% on VCCA/VCC_PLL per the Stratix Handbook.
Do not migrate EP1S60F1020C7N bitstreams to EP2S60 or EP4CE parts: the silicon is different and the configuration bitstream will not load. Use only Altera Quartus II version 13.0 or earlier for the EP1S60 family - newer Quartus versions removed Stratix 130 nm support. When generating configuration bitstreams, ensure the configuration mode (AS, PS, PPS, PPA, JTAG) matches the EPC or EPCS device on the board; a mismatch will leave the FPGA unconfigured. Always check the 'N' suffix on the part number for lead-free terminal finish if RoHS compliance is required by the end-customer.
LVDS inputs on the EP1S60 require 100 ohm differential termination across each LVDS pair at the receiver BGA ball. Series-coupling capacitors should be placed close to the driver side for AC-coupled interfaces. For DDR SDRAM interfaces, use the Altera DDR controller megafunction and follow the Stratix External Memory Interface Handbook for read/write leveling; failing to enable DQS delay chains results in intermittent read errors. For multi-FPGA designs, Aurora or LVDS-based chip-to-chip links should be length-matched within +/-10 ps to avoid eye-margin degradation.
규정 준수 정보
'N' suffix in part number indicates lead-free terminal finish per Altera/Intel ordering information. RoHS, REACH, halogen-free and conflict-minerals status not explicitly stated in the verified web data - set to 'unknown'. AEC-Q100 not applicable - this is a commercial-grade FPGA.