EP1SGX40DF1020I6 - Stratix GX FPGA 41,250 Cells 1020-FBGA | Intel
부품 번호: EP1SGX40DF1020I6 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268 | $2,680.00 |
| 100 | $245 | $24,500.00 |
| 500 | $220 | $110,000.00 |
| 1,000 | $198 | $198,000.00 |
EP1SGX40DF1020I6 개요
A Field Programmable Gate Array (FPGA) is a semiconductor device based around a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit within the programmable logic device (PLD) hierarchy -> PLD -> FPGA -> high-density FPGA, bridging the gap between fixed-function ASICs and software-driven processors. The Stratix GX family extends the generic Stratix architecture by adding embedded transceivers for multi-gigabit serial I/O, making the EP1SGX40DF1020I6 well-suited for communication, signal-processing, and high-bandwidth data-pipeline designs.
Key differentiating features include 624 maximum user I/Os, 41250 logic elements, 3423744 embedded RAM bits, embedded high-speed transceivers (Stratix GX feature), and an operating temperature range suitable for industrial environments. The 1020-ball Fine-pitch Ball Grid Array (FC-FBGA) provides high-density interconnect at 1.0 mm pitch, supporting complex pinout requirements while occupying less board area than equivalent QFP packages.
Architecturally, the EP1SGX40DF1020I6 combines LUT-based logic, TriMatrix embedded memory blocks, DSP blocks for signal processing, and dedicated high-speed transceiver channels. The 130 nm process balances logic density with low static power, while the I6 speed grade provides a tested timing margin consistent with industrial deployment.
Typical applications include high-speed serial interface cards, baseband signal processing, industrial imaging pipelines, networking line cards, and protocol bridging between legacy and modern buses. The combination of high logic density and embedded transceivers makes the part especially attractive in telecom backplane and test equipment designs. When designing with this device, ensure power sequencing and decoupling follow Intel/Altera Stratix GX hardware reference design guidelines, and verify Quartus II device support before committing to layout.
드롭인 대체품: EP1SGX40DF1020I6 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1SGX40DF1020I6 (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Speed Grade, Family, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1SGX40DF1020I6N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1450 / 개
데이터시트 보기 →EP1SGX40DF1020I5N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$388.5 / 개
데이터시트 보기 →EP1SGX40DF1020I5
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1340 / 개
데이터시트 보기 →EP1SGX40CF1020I5
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$370 / 개
데이터시트 보기 →EP1SGX40DF1020C7
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1850 / 개
데이터시트 보기 →EP1SGX40DF1020C7N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$315 / 개
데이터시트 보기 →EP1SGX40DF1020C7ES
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1325 / 개
데이터시트 보기 →EP1SGX40DF1020I6 최대 정격 & 전기적 특성
| Family | Stratix GX |
| Logic Elements | 41,250 |
| Configurable Logic Blocks (CLBs) | 4,125 |
| Embedded Memory Bits | 3,423,744 |
| Maximum User I/Os | 624 |
| Combinatorial Delay (CLB max) | 8.245 ns |
| Core Voltage | 1.5 V |
| Process Technology | 130 nm CMOS |
| 패키지 | 1020-ball FC-FBGA |
| Package Code | BGA |
| Ball Pitch | 1.00 mm |
| Operating Temperature Grade | Industrial (I6) |
| 실장 유형 | Surface Mount |
EP1SGX40DF1020I6 bga 핀 구성 가이드
EP1SGX40DF1020I6(bga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1SGX40DF1020I6.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1SGX40DF1020I6 적합 용도: 6 애플리케이션s: High-Speed Serial Interface Cards, Baseband Signal Processing, Industrial Imaging and Video Pipelines, Telecom Line Cards and Backplane Aggregation, Test and Measurement Instrumentation, Protocol Bridging and Legacy Interfacing.
High-Speed Serial Interface Cards
The EP1SGX40DF1020I6 fits high-speed serial interface cards because its embedded multi-gigabit transceivers (a defining feature of the Stratix GX family) directly drive protocols such as PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI without external PHY chips. The 41,250 logic elements and 3,423,744 bits of TriMatrix embedded memory provide the throughput headroom required for protocol framing, CRC, and packet buffering. Designers place the device on a daughter card with controlled-impedance 100-ohm differential pair routing for the transceiver channels, and use the 624 user I/Os to fan out to a host bus or backplane connector. Compared to discrete PHY plus FPGA solutions, the integrated transceivers reduce board area by 30 to 50 percent and simplify BOM management for telecom line-card designs.
추천
Baseband Signal Processing
The EP1SGX40DF1020I6 fits baseband DSP designs because its logic density (41,250 LEs) plus dedicated DSP blocks support high-throughput FIR filters, FFT engines, and channel-correction algorithms. The 3.4 Mbit embedded memory provides data-line buffering between FFT stages, eliminating many external SRAMs in pipelined designs. Industrial temperature grade makes the part suitable for outdoor base-station equipment. Designers typically instantiate 16- to 64-tap FIR filters at 200-300 MHz clock rates; the 8.245 ns CLB combinatorial delay provides adequate timing margin for these paths. Compared to legacy Stratix devices without DSP blocks, the EP1SGX40 reduces DSP implementation logic by 40 to 60 percent.
추천
Industrial Imaging and Video Pipelines
The EP1SGX40DF1020I6 fits industrial imaging pipelines because its 624 user I/Os directly accept wide parallel Camera Link or LVDS sensor data streams, while the 41,250 logic elements implement real-time color interpolation, gamma correction, and edge detection. The 1020-ball FC-FBGA package provides the high pin count required to receive 80-bit-wide sensor data plus drive HDMI or DVI outputs. Industrial temperature grade supports factory-floor deployment. Designers typically buffer raw frames in the 3.4 Mbit embedded memory and process at 100-150 MHz pixel clock rates. Compared to ASSP alternatives, the FPGA approach allows post-deployment algorithm updates without hardware rework.
추천
Telecom Line Cards and Backplane Aggregation
The EP1SGX40DF1020I6 fits telecom line-card aggregation because its embedded multi-gigabit transceivers support SPI-4.2, SFI-4, and Interlaken interfaces to the backplane, while 624 user I/Os and 3.4 Mbit embedded memory provide packet queueing and traffic shaping. Industrial temperature grade and high logic density allow line cards to consolidate what would otherwise require two or three FPGAs. Designers place the EP1SGX40DF1020I6 as the central aggregation device with external DDR memory for deep packet buffers. Compared with first-generation Stratix devices, the EP1SGX40 reduces board real estate and power consumption by approximately 25 percent in equivalent line-card designs.
추천
Test and Measurement Instrumentation
The EP1SGX40DF1020I6 fits test and measurement instrumentation because its high logic density implements complex stimulus-generation and response-capture state machines, while embedded transceivers drive high-speed serial interfaces to DUTs. The 3.4 Mbit embedded memory captures deep waveform traces for protocol analyzers and logic analyzers. Industrial temperature grade supports laboratory and field-deployed instruments. Designers typically pair the EP1SGX40DF1020I6 with high-speed ADCs and DACs over LVDS, using the 624 I/Os as the digital data bridge. Compared with discrete logic implementations, the FPGA integration reduces instrument cost-of-goods by 30 to 50 percent.
추천
Protocol Bridging and Legacy Interfacing
The EP1SGX40DF1020I6 fits protocol bridging applications because its 624 user I/Os and embedded transceivers handle multiple legacy buses (PCI, ISA, VME) plus modern serial protocols in a single device. The 41,250 logic elements implement bus-master state machines, DMA engines, and protocol translation logic. Industrial temperature grade ensures reliability in industrial automation controllers and defense systems with long field life. Designers use the embedded memory as shared FIFOs between mismatched bus domains. Compared with bridge ASSPs that cover only two protocols, the FPGA approach supports custom or proprietary bridges that ASSPs cannot address.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1SGX40DF1020I6 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1SGX40DF1020I6N | EP1SGX40DF1020I5N | EP1SGX40DF1020I5 | EP1SGX40CF1020I5 | EP1SGX40DF1020C7 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1020-ball FC-FBGA | 1020-ball FC-FBGA | 1020-ball FC-FBGA | 1020-ball FC-FBGA | 1020-ball FC-FBGA | 1020-ball FC-FBGA |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 |
| Speed Grade | I6 (industrial) | I6 (industrial, Pb-free) | I5 (industrial, Pb-free) | I5 (industrial) | I5 (industrial) | C7 (commercial, faster) |
| Embedded Transceivers | Yes (Stratix GX) | Yes | Yes | No (CF variant) | Yes | |
| Embedded Memory Bits | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | |
| Maximum User I/Os | 624 | 624 | 624 | 624 | 624 | |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Process Technology | 130 nm | 130 nm | 130 nm | 130 nm | 130 nm | 130 nm |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Embedded multi-gigabit transceivers (vs EP1SGX40CF1020I5)
- Industrial temperature grade with fast speed bin (vs EP1SGX40DF1020I5)
- Highest temperature-grade speed bin in 1020-ball FC-FBGA package (vs EP1SGX40DF1020C7)
설계 노트
The EP1SGX40DF1020I6 requires a multi-rail power distribution network: 1.5 V core, 3.3 V I/O, and separate analog supply rails for the embedded transceivers. Each rail should be decoupled with a combination of bulk, mid-frequency, and high-frequency capacitors placed close to the power pins. The Stratix GX hardware reference design specifies a minimum of 8 to 12 decoupling capacitors per supply pin region. Designers must sequence the supplies per the Altera Stratix GX Power-Up Sequencing application note to avoid latch-up during hot-plug events.
Embedded multi-gigabit transceiver channels require controlled-impedance 100-ohm differential pair routing with matched trace lengths within 0.13 mm for the EP1SGX40 family. AC-coupling capacitors (typically 100 nF X7R) must be placed in series with each transmit and receive pair, as required by the protocol specification. Reference the Stratix GX Transceiver Layout Guidelines for via count, layer stack-up, and keep-out zones around the BGA field. The 1020-ball FC-FBGA ball array should be routed on a high-layer-count PCB (at least 8 layers) with buried vias to escape the inner ball grid.
Estimated: At full transceiver utilization (typically 20+ active channels) plus 70 percent logic utilization, the EP1SGX40DF1020I6 can dissipate 8-12 W. The 1020-ball FC-FBGA package requires thermal vias under the central die region and a thermal pad pattern on the PCB. Designers should perform thermal simulation using the Stratix GX Thermal Model and plan for airflow if the enclosure exceeds 60 C ambient. Industrial-grade parts (I6) are characterized for operation up to 100 C junction; thermal headroom should be validated with a calibrated test setup.
Avoid configuring the EP1SGX40DF1020I6 with unsupported Quartus II versions - the Stratix GX family requires Quartus II version 7.2 or later for full support. When migrating to a Stratix IV GX replacement, note that the pinout is NOT compatible and a board redesign is required despite shared 1020-ball FC-FBGA footprint - ball assignments differ between generations. Always verify the configuration mode (Passive Serial, Fast Passive Parallel, or JTAG) using the MSEL pins at design finalization.
규정 준수 정보
RoHS, REACH, and lead-free status were not present in the Verified Web Data; consult the original Altera/Intel product declaration letter for definitive compliance information.