EP1S80F1508C6AA - Stratix 79K LE FPGA, 1508-FBGA, 7427520 gates | Intel
부품 번호: EP1S80F1508C6AA ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $262 | $2,620.00 |
| 100 | $235 | $23,500.00 |
| 500 | $198 | $99,000.00 |
| 1,000 | $175 | $175,000.00 |
EP1S80F1508C6AA 개요
A Field-Programmable Gate Array (FPGA) is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware blocks such as block RAM, DSP slices, PLLs, and high-speed transceivers. FPGAs occupy the silicon hierarchy between fixed-function ASICs (application-specific) and software-programmable processors (CPUs/DSPs), enabling parallel hardware execution with full design flexibility. The Stratix family sits within the broader taxonomy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. FPGAs are used when deterministic latency, parallelism, or hardware customization is required, and the Stratix family specifically targets high-end communication, signal processing, and compute acceleration workloads.
Key features of the EP1S80F1508C6AA include 79,040 logic elements, 7,427,520 equivalent gates, 1203 maximum user I/O, multiple embedded DSP blocks, TriMatrix on-chip memory, up to 12 PLLs, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The -C6 speed grade places it in the commercial temperature range with a balanced timing closure profile. The 1508-FCBGA (Fine-pitch Chip-Scale Ball Grid Array) package supports the high I/O count and provides adequate power/ground distribution for high toggle-rate designs.
Architecturally, the Stratix device uses an ALM-style adaptive logic module feeding into a multi-tier interconnect fabric. Embedded RAM blocks (M512, M4K, M-RAM) and DSP blocks handle on-chip storage and arithmetic, while dedicated transceivers (where fitted) handle multi-gigabit serial I/O. Configuration is loaded from an external flash or via JTAG, and the device supports in-system programming for field upgrades.
Typical applications include high-speed communication line cards, baseband processing, video broadcast equipment, ASIC prototyping, and high-performance DSP pipelines. The combination of high logic density and high I/O count also makes the EP1S80 well suited to industrial test equipment and military/aerospace subsystems requiring FPGA flexibility with proven silicon.
When designing with this device, pay attention to power distribution on the FCBGA substrate - a minimum 8-layer PCB with dedicated power/ground planes is recommended. Use the Quartus II design software (the supported toolchain for the Stratix family) for synthesis, place-and-route, and timing closure, and follow Intel (Altera) application note AN 224 for signal-integrity and decoupling guidelines.
This page synthesizes distributor pricing, lifecycle status, package-level comparisons, and practical design notes not found in the manufacturer datasheet alone, giving engineers a faster decision-making resource for sourcing or specifying the EP1S80F1508C6AA.
드롭인 대체품: EP1S80F1508C6AA — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1S80F1508C6AA (동일 폼 팩터 및 풋프린트) — 차이점: Package, Mounting Type, PLLs, Process Technology, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1S80F1508C6
✅ 드롭인✓ 재고 있음
$148.2 / 개
데이터시트 보기 →EP1S80F1508C6N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP1S80F1508C7
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$108.4 / 개
데이터시트 보기 →EP1S80F1508C5
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP1S80B956C6AA
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$215 / 개
데이터시트 보기 →EP1S80F1508C6AA 최대 정격 & 전기적 특성
| Series | Stratix |
| Logic Elements | 79,040 |
| Equivalent System Gates | 7,427,520 |
| Maximum User I/O | 1203 |
| 패키지 | 1508-BBGA, FCBGA (40 mm) |
| 실장 유형 | Surface Mount |
| 동작 온도 | 0C to +85C (Commercial) |
| Speed Grade | C6 |
| Process Technology | 0.13 µm CMOS |
| Embedded Memory | TriMatrix (M512, M4K, M-RAM) |
| DSP Blocks | Yes (embedded multipliers) |
| PLLs | Up to 12 |
| Configuration Method | Serial/Parallel/JTAG |
| 습도 민감도 레벨 (MSL) | 3 (168 hours) |
EP1S80F1508C6AA 1508-bbga, fcbga (40 mm) 핀 구성 가이드
EP1S80F1508C6AA(1508-bbga, fcbga (40 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1S80F1508C6AA.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1S80F1508C6AA 적합 용도: 6 애플리케이션s: High-Speed Communication Line Cards, ASIC Prototyping, Video Broadcast Equipment, Industrial Test & Measurement, Military and Aerospace Subsystems, High-Performance DSP Pipelines.
High-Speed Communication Line Cards
The EP1S80F1508C6AA's 79,040 logic elements and 1203 user I/Os fit telecom line-card designs where parallel packet processing, multi-channel SERDES glue logic, and traffic management all run on one device. The 1508-FCBGA provides enough balls for multiple SPI-4.2 / SFI-4 bus interfaces plus external PHY interconnect. Embedded DSP blocks and TriMatrix memory handle queue lookups and protocol parsing. Stratix fabric also supports deterministic latency required for TDM backplanes. Designers targeting line cards should pair the FPGA with external clocked I/O and follow Altera AN 224 for signal-integrity on the BGA breakouts.
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ASIC Prototyping
With 7,427,520 equivalent gates, the EP1S80F1508C6AA is sized to prototype large ASIC designs in a single device. The high logic count maps almost one-to-one with mid-size ASIC gate counts, and the 1203 I/Os accommodate even pad-rich designs. Multiple FPGA boards can be cascaded via LVDS interconnect to emulate larger ASICs. Quartus II design partitioning supports per-block synthesis matching ASIC RTL boundaries. Expect roughly 30-50 MHz operation in the prototyping environment compared to final ASIC speed.
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Video Broadcast Equipment
Video broadcast systems (HD-SDI routers, MPEG-TS multiplexers, frame synchronizers) need wide parallel datapaths and deterministic timing - both strong suits of the EP1S80F1508C6AA. The 1203 I/Os can sink multiple HD-SDI inputs plus genlock and housekeeping. Embedded DSP blocks accelerate 2D FIR/clipping and color-space conversion. TriMatrix memory buffers multi-line video frames at low latency. The C6 speed grade hits the 148.5 MHz pixel clock used in 1080p60 with margin. Reference designs in the Stratix handbook show typical broadcast top-down flows.
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Industrial Test & Measurement
ATE platforms, oscilloscope front-ends, and protocol analyzers rely on FPGAs to capture and process data at multi-gigasample rates. The EP1S80F1508C6AA's high I/O count supports wide parallel ADC/DAC interfaces while embedded memory buffers deep captures. PLLs (up to 12) generate the multiple clock domains needed for ADC sampling and SERDES alignment. Industrial users value the part's long-term availability and proven silicon, even though newer parts now exceed its raw performance. Designers should use the deterministic latency of fabric flip-flops for timing-critical triggers.
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Military and Aerospace Subsystems
Although the EP1S80F1508C6AA is a commercial-temperature part, its proven Stratix silicon has been used extensively in defense and aerospace subsystems. The 79,040 LE / 1203 I/O combination supports radar DSP pre-processing, electronic-warfare digital receivers, and mission-computing prototypes. Long-term programs that already have ITAR/qualification data for this part often continue to specify it. Designers should confirm date code, RoHS, and counterfeiting risk before each procurement cycle given the part's obsolete status.
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High-Performance DSP Pipelines
Embedded DSP blocks on the EP1S80F1508C6AA accelerate FIR filters, FFT/iFFT cores, and channelizer banks without consuming logic-element resources. With 1203 I/Os the device can ingest multiple 10-bit ADC lanes at hundreds of MHz, and TriMatrix M-RAM blocks hold FFT windowing coefficients for high-throughput transforms. Quartus II ships optimized DSP IP (MegaCore) targeting Stratix multipliers, including FFT and Reed-Solomon codecs. The C6 speed grade supports 200+ MHz DSP operation; tune placement with DSP-friendly constraints in the fitter settings.
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추천 제품 요약
엔지니어링 참조 데이터: EP1S80F1508C6AA — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1S80F1508C6 | EP1S80F1508C7 | EP1S80F1508C5 | EP1S80B956C6AA |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1508-BBGA, FCBGA (40 mm) | 1508-BBGA, FCBGA (40 mm) - same | 1508-BBGA, FCBGA (40 mm) - same | 1508-BBGA, FCBGA (40 mm) - same | 956-BBGA (smaller package, lower I/O) |
| Logic Elements | 79,040 | 79,040 | 79,040 | 79,040 | 79,040 |
| Equivalent System Gates | 7,427,520 | 7,427,520 | 7,427,520 | 7,427,520 | 7,427,520 |
| Maximum User I/O | 1203 | 1203 | 1203 | 1203 | ~692 (956-ball BGA reduces available I/O) |
| Speed Grade | C6 | C6 | C7 (slower) | C5 (faster) | C6 |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Same die and package across all EP1S80F1508 variants (vs EP1S80F1508C6)
- Highest user I/O count in the Stratix family (vs EP1S80B956C6AA)
- Mid-speed (C6) grade gives balanced timing-closure headroom (vs EP1S80F1508C5)
설계 노트
Use a minimum 8-layer PCB for the 1508-FCBGA with dedicated ground and power planes. Recommended stack-up: signal / ground / signal / power / signal / power / signal / ground. Match microvia aspect ratios per IPC-6012 for the BGA pad pitch (typically 1.0 mm). Use 0402 or 0201 decoupling capacitors placed within 2-3 mm of each power pin to control switching noise on the FPGA core. Follow Intel/Altera AN 224 (High-Speed Board Design) for impedance-controlled routing and ground-return discipline.
Estimated power dissipation at full utilization (79,040 LEs + 1203 I/O toggling at 100 MHz) is roughly 8-12 W with moderate toggle rates; peak design power can exceed 20 W. The 1508-FCBGA relies on thermal vias beneath the die for heat removal. Use a thermal via array of 0.3 mm pitch, plated through to an internal copper plane acting as a heat spreader. Place a heatsink with thermal interface material if junction-to-ambient exceeds 1 C/W. Always simulate thermal behavior with the Altera PowerPlay early in the design cycle.
DDR/DDR2 SDRAM interfaces on the Stratix device require matched-length, 50 ohm impedance traces with fly-by termination. Use IBIS simulation in Quartus II to validate timing and overshoot on high-speed LVDS pairs. Place series damping resistors within 5 mm of the FPGA pin on LVDS outputs exceeding 500 Mbps. Keep differential pairs skew below 20 ps for reliable 1 Gbps operation. The C6 speed grade supports 200+ MHz internal fabric operation but does not relax signal-integrity rules.
Do not mix configuration schemes between prototypes and production without verifying the EPCS or EPC16 companion flash pinout. Confusing MSEL pin settings (00, 01, 10, 11) is a frequent cause of failed configuration. Always check Quartus II's generated .rbf/.pof files against the expected bitstream size for the EP1S80 (typically 23 Mbit uncompressed). Keep a JTAG header accessible for emergency recovery, and consider dual-configuration mode for field-upgrade reliability.
규정 준수 정보
Compliance data not present in the verified web sources for this obsolete part. Confirm RoHS/lead-free status with the distributor on a per-date-code basis before use in regulated applications.
