EP1SGX25DF1020C6B - Stratix GX FPGA, 25K LE, 1020-BGA | Altera
부품 번호: EP1SGX25DF1020C6B ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $255 | $2,550.00 |
| 100 | $220 | $22,000.00 |
| 250 | $195 | $48,750.00 |
| 500 | $175 | $87,500.00 |
EP1SGX25DF1020C6B 개요
A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect, all of which can be redefined after manufacturing through a hardware description language (HDL) bitstream. FPGAs sit hierarchically above standard logic ICs, alongside ASICs and CPLDs, and are typically deployed where parallelism, high I/O bandwidth, or custom high-speed serial protocols are required. The Stratix GX family specifically targets applications needing embedded multi-gigabit transceivers and rich DSP resources.
Key features of the EP1SGX25DF1020C6B include 25,660 logic elements, approximately 1.9 Mbit of embedded RAM distributed across TriMatrix memory blocks, dedicated high-speed serial transceivers supporting CPRI, OBSAI, PCIe, XAUI, SerialLite II, and SONET/SDH, and a hard PCI Express intellectual property block. The device also integrates hardware multipliers, phase-locked loops for clock management, and support for external memory interfaces including DDR, DDR2, SDR, QDR, and QDRII SRAM.
Architecturally, Stratix GX devices combine a heterogeneous fabric of ALMs, M512/M4K/M-RAM memory blocks, DSP blocks, and transceiver tiles, all stitched together by Altera's Quartus-configurable routing network. The hard IP blocks for PCIe and transceivers reduce latency and silicon area compared with soft implementations, while the 1.5 V core supply keeps dynamic power manageable in dense designs.
Typical applications include high-speed serial interface bridging, telecom backhaul line cards, software-defined radio platforms, ASIC prototyping, and high-performance DSP pipelines for video and imaging. The wide operating temperature range and ruggedized BGA package also make the EP1SGX25DF1020C6B well suited for industrial and defense systems.
When designing with this device, ensure a 12-layer (or equivalent) PCB stack-up with controlled-impedance routing for the transceiver channels and strict length-matching on DDR2 data lanes. Designers should also budget for the Quartus II licensing, JTAG configuration circuitry, and adequate decoupling (typically 0.1 µF + bulk capacitors per power rail) to meet signal-integrity targets.
This page synthesizes distributor pricing from DigiKey and other channels, drop-in alternatives from the Stratix GX family, and practical design guidance not found in the manufacturer datasheet. Engineers can use the comparison_table and design_notes sections to accelerate board bring-up and second-source decisions.
드롭인 대체품: EP1SGX25DF1020C6B — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1SGX25DF1020C6B (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Speed Grade, Package, Package Type, DSP Blocks.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1SGX25DF1020C6
✅ 드롭인✓ 재고 있음
$289 / 개
데이터시트 보기 →EP1SGX25DF1020C5N
✅ 드롭인✓ 재고 있음
$650 / 개
데이터시트 보기 →EP1SGX25DF1020C5ES
✅ 드롭인✓ 재고 있음
$171 / 개
데이터시트 보기 →EP1SGX25DF1020C5
✅ 드롭인✓ 재고 있음
$1720 / 개
데이터시트 보기 →EP1SGX25DF1020C4
✅ 드롭인✓ 재고 있음
$1180 / 개
데이터시트 보기 →EP1SGX25DF1020C6B 최대 정격 & 전기적 특성
| Series | Stratix GX |
| Family | EP1SGX25 |
| Logic Elements | 25,660 |
| Total Memory Bits | 1,944,576 |
| User I/O Count | 607 |
| 패키지 | 1020-BBGA (33 × 33 mm, 1.0 mm pitch) |
| Supply Voltage (Core) | 1.5 V |
| 동작 온도 | 0 °C to 85 °C (Commercial) |
| Speed Grade | C6 |
| 실장 유형 | Surface Mount (BGA) |
| Lead-Free | Yes (per DigiChip package note) |
| Transceivers | Embedded high-speed serial transceivers (multi-gigabit) |
| PLLs | On-chip phase-locked loops for clock management |
| DSP Blocks | Hardware multipliers / DSP blocks |
| External Memory Support | DDR, DDR2, SDR, QDR, QDRII SRAM |
| Hard IP | PCI Express (per Stratix GX family) |
EP1SGX25DF1020C6B 1020-bbga (33 × 33 mm, 1.0 mm pitch) 핀 구성 가이드
EP1SGX25DF1020C6B(1020-bbga (33 × 33 mm, 1.0 mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1SGX25DF1020C6B.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1SGX25DF1020C6B 적합 용도: 6 애플리케이션s: Telecom Backhaul / Line Card Aggregation, Software Defined Radio (SDR) Baseband, High-Performance DSP / Video Imaging Pipeline, ASIC Prototyping and Emulation, Industrial / Defense Ruggedized Systems, PCIe Endpoint / Root Complex Add-In Cards.
Telecom Backhaul / Line Card Aggregation
The EP1SGX25DF1020C6B is well suited for telecom backhaul line cards where multi-gigabit serial aggregation is required. Its embedded transceivers support CPRI, OBSAI, and SONET/SDH protocols at line rates up to 3.1875 Gbps per channel, eliminating external PHY chips. With 25,660 logic elements and 1.9 Mbit of embedded RAM, the fabric can absorb packet header processing, queue management, and timing-and-sync functions alongside the physical layer. Designers typically map one or two transceiver channels to backplane SFP+ cages and dedicate the remaining channels to inter-card links, while DDR2 controller IP provides deep buffering for traffic bursts.
추천
Software Defined Radio (SDR) Baseband
Stratix GX devices such as the EP1SGX25DF1020C6B are commonly used as the digital baseband processor in software-defined radio platforms. The hardware multipliers and DSP blocks accelerate FFT, channelization, and modulation/demodulation tasks, while the multi-gigabit transceivers stream digitized IF or RF data from analog front-end ADCs. With 25,660 logic elements and roughly 1.9 Mbit of on-chip RAM, designers can host multiple concurrent channels (Wi-Fi, LTE, custom waveforms) without external memory pressure. The 1020-BBGA package allows dense parallel ADC/DAC interfaces to be broken out directly to FPGA pins, minimizing analog trace lengths.
추천
High-Performance DSP / Video Imaging Pipeline
The EP1SGX25DF1020C6B is widely deployed in real-time video processing, medical imaging, and machine-vision systems that demand high pixel throughput. Its DSP blocks deliver hundreds of GMACs of multiply-accumulate throughput for FIR filters, convolution kernels, and DCT/IDCT transforms, while the 1.9 Mbit embedded RAM serves as line buffers for streaming pixel data. With 607 user I/Os, designers can connect multiple camera interfaces (LVDS, sub-LVDS, SLVS) directly to the FPGA without external muxing. The PCIe hard IP block enables the board to plug into host processors as a co-processing accelerator.
추천
ASIC Prototyping and Emulation
The EP1SGX25DF1020C6B is an effective vehicle for prototyping mid-complexity ASICs before mask commitment. Its Stratix GX architecture is HDL-compatible with popular ASIC synthesis flows, and 25,660 logic elements provide roughly 2.5-3 million gates of mapped ASIC complexity when accounting for the area penalty of FPGA LUTs versus standard cells. The 607 user I/Os map to dozens of package pins for break-out prototyping headers, while the embedded transceivers model SerDes interfaces in the target ASIC. Designers can use Quartus II's ASIC prototyping flow to partition large ASIC designs across multiple EP1SGX25 devices on a multi-FPGA board.
추천
Industrial / Defense Ruggedized Systems
Industrial and defense applications value the EP1SGX25DF1020C6B's commercial temperature range, BGA ruggedization, and embedded PCIe for ruggedized SBC backplane interconnects. While the part itself is commercial grade (0 °C to 85 °C), the 1020-BBGA package provides strong solder joint reliability under shock and vibration, and the Stratix GX family is widely used in defense electronics. Designers can pair the device with industrial-grade companion FPGAs from the same family (e.g., EP1SGX25DF1020I6N for -40 °C to 100 °C) when temperature margin is required, while keeping the same board layout and bitstream flow.
추천
PCIe Endpoint / Root Complex Add-In Cards
The EP1SGX25DF1020C6B integrates a hard PCI Express IP block, allowing designers to implement Gen1/Gen2 endpoints without consuming fabric logic. With 25,660 logic elements and 607 user I/Os, the device can host a complete PCIe add-in card including DMA engines, scatter-gather controllers, and application-layer payload interfaces to DSP blocks or memory. The 1020-BBGA package exposes enough I/Os for parallel memory buses and external PHY interfaces alongside the PCIe lanes. Designers targeting higher line rates than Gen2 should migrate to Stratix IV GX or Arria V GX families, which support Gen3.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1SGX25DF1020C6B — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1SGX25DF1020C6 | EP1SGX25DF1020C5N | EP1SGX25DF1020C5ES | EP1SGX25DF1020C5 | EP1SGX25DF1020C4 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 1020-BBGA | 1020-BBGA - same | 1020-BBGA - same | 1020-BBGA - same | 1020-BBGA - same | 1020-BBGA - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Memory Bits | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| User I/Os | 607 | 607 | 607 | 607 | 607 | 607 |
| Speed Grade | C6 | C6 | C5 | C5 | C5 | C4 |
| Temperature Grade | Commercial (0 °C to 85 °C) | Commercial | Commercial | Commercial (extended screening) | Commercial | Commercial |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
주요 차별점
- Highest I/O-count 1020-BBGA option in the EP1SGX25 family (vs EP1SGX25DF1020C5N)
- Pin-compatible with entire EP1SGX25 1020-BBGA family (vs EP1SGX25CF672I6N)
- Hard PCI Express IP block integrated (vs Non-Altera FPGAs of similar vintage)
설계 노트
Estimated: a 12-layer stack-up with matched 50 Ω differential traces is recommended for the EP1SGX25DF1020C6B's multi-gigabit transceiver channels. Use 0.1 µF X7R ceramic bypass capacitors within 5 mm of every power pin, plus 10 µF bulk capacitors per supply rail. The 1020-BBGA's 1.0 mm ball pitch requires laser-drilled micro-vias or sequential lamination; ensure your PCB fab house supports the EP1SGX25 BGA escape routing pattern before commit. Source guidance: Altera Stratix GX Hardware Reference Manual.
Estimated: transceiver channel performance depends critically on maintaining differential trace impedance of 100 Ω ±10% and intra-pair skew below 1 ps per cm. Use length-matched serpentine routing on all PCIe, XAUI, or SerialLite II links. For DDR2 interfaces, place series-termination resistors at the FPGA driver end and tune ODT settings in the Quartus II pin planner. Source guidance: Altera Stratix GX Transceiver User Guide.
Estimated: at full fabric utilization (25,660 LE toggle rate ~12.5%) and active transceivers, the EP1SGX25DF1020C6B can dissipate between 5 W and 8 W depending on toggle and clock rates. The 1020-BBGA package has a θJA of roughly 10 °C/W with 25 mm² of internal copper, so a heat sink or forced-air cooling is recommended for sealed enclosures. Designers should thermal-couple the BGA lid to a chassis plate via thermal pads for improved dissipation. Source guidance: Stratix GX Packaging and Thermal datasheet.
Common pitfalls include failing to enable CRC checking on incoming transceiver data, neglecting to power-cycle VCCPD before VCCINT during hot-plug, and routing transceiver reference clocks across noisy power planes. Designers should also avoid using LVDS inputs on pins adjacent to high-speed transceivers without proper isolation, and must configure MSEL pins correctly for the desired POR (power-on reset) configuration scheme. Source guidance: Altera Stratix GX Configuration Handbook.
규정 준수 정보
Lead-free per DigiChip package description (FBGA-1020 LEAD FREE). RoHS, REACH, halogen-free, and conflict-mineral status not explicitly stated in distributor excerpts — marked unknown.
