EP1SGX25DF1020C5N - Stratix GX FPGA, 25K LEs, 1020-BGA | Intel
MPN: EP1SGX25DF1020C5N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $850 | $850.00 |
| 10 | $798 | $7,980.00 |
| 100 | $745 | $74,500.00 |
| 500 | $695 | $347,500.00 |
| 1,000 | $650 | $650,000.00 |
Drop-in alternatives for EP1SGX25DF1020C5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP1SGX25DF1020C5N Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Logic Elements (LEs) | 25,660 |
| Total RAM Bits | 1,944,576 |
| User I/O Pins | 607 |
| Number of Pins | 1020 |
| Package Type | 1020-BBGA (FineLine BGA), 33 x 33 mm, 1.0 mm pitch |
| Core Supply Voltage | 1.5 V |
| Operating Temperature | 0 C to 85 C (commercial) |
| Logic Family | CMOS |
| Speed Grade | C5 |
| Lead Free | Yes |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount (BGA) |
| Sub-family | EP1SGX25 |
| PLL Count | 4 (max, family-level) |
EP1SGX25DF1020C5N 1020-bbga (fineline bga), 33 x 33 mm, 1.0 mm pitch Pin Configuration Guide
Complete pinout information for EP1SGX25DF1020C5N (1020-bbga (fineline bga), 33 x 33 mm, 1.0 mm pitch package) with 1020 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX25DF1020C5N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 1020 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX25DF1020C5N is suitable for 7 applications: High-Speed Serial Interface Bridging, Telecommunications Backplane Aggregation, ASIC Prototyping and Emulation, Industrial Control and Factory Automation, Custom Protocol Implementation, Test and Measurement Instrumentation, Legacy System Sustaining Engineering.
High-Speed Serial Interface Bridging
The EP1SGX25DF1020C5N's integrated multi-gigabit transceivers (up to 3.1875 Gbps per channel) make it well suited for protocol bridging between PCI Express, Gigabit Ethernet, Serial RapidIO, and Fibre Channel links. The 25,660 logic elements provide sufficient fabric for stateful protocol conversion logic, while the 1,944,576 bits of embedded RAM accommodate packet buffering and flow-control FIFOs. Designers place the part on the line card with controlled-impedance serial traces routed to the BGA balls per the Stratix GX handbook guidelines.
Recommended
Telecommunications Backplane Aggregation
In telecom aggregation cards, the EP1SGX25DF1020C5N aggregates lower-speed serial links onto a higher-speed uplink using its hard transceiver channels, offloading PCS/PMA functions from logic fabric. The 607 user I/O pins support multiple parallel-side interfaces and bus connections to companion AS SPs, while the 4 PLLs provide flexible clock synthesis for non-standard telecom rates. The 1020-FBGA package's 1.0 mm pitch enables dense routing required by multi-channel line cards.
Recommended
ASIC Prototyping and Emulation
The 25,660 logic elements and 1,944,576-bit embedded memory allow the EP1SGX25DF1020C5N to map substantial blocks of ASIC RTL for functional verification before tape-out, particularly designs targeting bus interfaces and standard protocol stacks. The 607 user I/O pins expose the prototype to real-world interfaces, and the embedded multiplier and DSP blocks handle arithmetic-heavy sections of the design. Multiple boards can be cascaded through the high-speed serial transceivers to prototype larger ASICs.
Recommended
Industrial Control and Factory Automation
The EP1SGX25DF1020C5N's commercial 0-85 C operating range and 607 user I/O pins make it suitable for industrial controllers that must interface with many sensors, actuators, and fieldbus networks. Its logic capacity supports custom real-time control algorithms, while the embedded memory buffers data acquisition streams. The 1020-FBGA, while requiring careful PCB layout, is mechanically robust once mounted and supports the vibration and thermal-cycling profiles of factory environments.
Recommended
Custom Protocol Implementation
Designers building proprietary or proprietary-to-standard protocol converters (for example, custom avionics or defense buses mapped to Ethernet) use the EP1SGX25DF1020C5N's transceiver PHY plus logic fabric to implement custom PCS and MAC layers. The 1.5 V core keeps power within board thermal budgets, while the 4 PLLs synthesize the unusual clock rates required by proprietary standards. The 1020-BGA's signal-integrity margin supports the high-speed serial channels at their rated 3.1875 Gbps.
Recommended
Test and Measurement Instrumentation
In high-end test equipment (protocol analyzers, BERT systems, signal integrity testers), the EP1SGX25DF1020C5N's pattern generation, error detection, and real-time response require both fast logic and high-speed serial I/O. The 25,660 LEs support deep pattern memory and state machines, while the integrated transceivers handle physical-layer test access at multi-gigabit rates. The 1,944,576-bit embedded memory captures extended test sequences without external buffering.
Recommended
Legacy System Sustaining Engineering
Long-life programs (medical, aerospace, defense) that were designed around the EP1SGX25DF1020C5N require ongoing replacement-part provisioning as the original inventory depletes. Engineers performing board-level repair use same-family drop-in variants (EP1SGX25DF1020C5ES, EP1SGX25DF1020C5) in the identical 1020-FBGA footprint, avoiding expensive board re-spins. This application is purely sustaining; no new firmware or pinout changes are required because the silicon is identical across the 1SGX25 sub-family in this package.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX25DF1020C5N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX25DF1020C5ES | EP1SGX25DF1020C5 | EP1SGX25DF1020C4 | EP1S40F1020C5 |
|---|---|---|---|---|---|
| Package | 1020-BBGA (33x33 mm, 1.0 mm pitch) | 1020-BBGA (33x33 mm, 1.0 mm pitch) - same | 1020-BBGA (33x33 mm, 1.0 mm pitch) - same | 1020-BBGA (33x33 mm, 1.0 mm pitch) - same | 1020-BBGA (33x33 mm, 1.0 mm pitch) - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Family | Stratix GX (1SGX25) | Stratix GX (1SGX25) | Stratix GX (1SGX25) | Stratix GX (1SGX25) | Stratix (1S40, non-GX) |
| Logic Elements (LEs) | 25,660 | 25,660 | 25,660 | 25,660 | 41,250 |
| Embedded RAM | 1,944,576 bits | 1,944,576 bits | 1,944,576 bits | 1,944,576 bits | 3,423,744 bits |
| User I/O Pins | 607 | 607 | 607 | 607 | 715 (in 1020-BGA) |
| Integrated Transceivers | Yes (up to 20 ch, 3.1875 Gbps) | Yes (3.1875 Gbps) | Yes (3.1875 Gbps) | Yes (3.1875 Gbps) | No (Stratix non-GX has no hard transceivers) |
| Speed Grade | C5 | C5 (ES) | C5 | C4 (slower) | C5 |
| Lead-Free (RoHS) | Yes (N suffix) | Yes (ES, RoHS) | No (leaded) | [DATA_NEEDED] | No (leaded) |
| Operating Temperature | 0 C to 85 C (commercial) | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C |
Key Differentiators
- Drop-in identical silicon as same-family C5ES and C5 variants (vs EP1SGX25DF1020C5)
- C4 speed grade available for cooler operation (vs EP1SGX25DF1020C4)
- Higher logic density in same footprint (1S40 non-GX) (vs EP1S40F1020C5)
- Integrated multi-gigabit transceivers (vs EP1S40F1020C5 (Stratix non-GX))
Design Notes
The 1020-FBGA, 1.0 mm pitch package requires a multi-layer PCB with microvia or via-in-pad construction to escape the inner balls. The Stratix GX handbook recommends at least a 6-layer stack-up with continuous reference planes beneath the device to control impedance of the transceiver channels. Per datasheet decoupling guidance, place 0.1 uF and 0.01 uF capacitors as close as possible to every power/ground ball pair to suppress core-supply noise. Differential trace length matching within the receiver's tolerance is mandatory for the 3.1875 Gbps channels.
The 1.5 V core supply must ramp within the Stratix GX datasheet's specified tRAMP window; violation can cause in-rush currents that stress the BGA solder joints and trigger brown-out conditions. Use a soft-start controller or sequence the supplies so VCCINT reaches regulation before VCCPD and VCCIO. Decoupling should include bulk capacitors rated for the maximum transient current expected when all transceivers and DSP blocks are active. Power estimation should be done with the Quartus PowerPlay tool against the actual design utilization, not the device maximum.
Estimated: at 25,660 LEs fully utilized at 500 MHz with all 20 transceivers active, total power is on the order of 10-15 W. The 1020-BGA's thermal performance is highly dependent on PCB copper area and airflow; reference designs typically use a 4-6 square inch copper pour on the top layer plus thermal vias. Configuration scheme (AS, AP, PS, JTAG) selection must match the design's in-system reprogramming needs - using PS mode for production means an external configuration memory device is required.
Receiver channels at 3.1875 Gbps require controlled-impedance (100 ohm differential) traces with continuous reference plane and minimal via transitions. Reference the Stratix GX Handbook's transceiver chapter for eye-diagram mask requirements and recommended pre-emphasis/de-emphasis settings. Cross-talk between adjacent channels is mitigated by ground-signal-signal-ground routing on the BGA break-out layer. For EMI-sensitive applications, consider spread-spectrum clocking on the transceiver reference clocks per the datasheet's EMI reduction techniques section.
Place the configuration memory (EPCS or compatible) within 2 inches of the FPGA to meet configuration clock timing. Route JTAG signals TDI, TDO, TMS, TCK in a daisy-chain if multiple devices share the bus, with 4.7k pull-ups on TCK and TMS per the datasheet. Reserve the CONFIG_DONE, nSTATUS, and nCONFIG pins with proper pull-up/pull-down resistors as specified in the handbook. Keep the clock input pins as short as possible and isolate from switching signals.
Compliance Information
RoHS compliant per the 'N' suffix in the ordering code (lead-free termination on the 1020-FBGA). Operating temperature 0-85 C is commercial, so AEC-Q100 is not applicable. Halogen-free status not explicitly stated in the provided web data; set to unknown per Data Authenticity Rules.
